CN105177689B - A kind of high speed electroplating process test device - Google Patents
A kind of high speed electroplating process test device Download PDFInfo
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- CN105177689B CN105177689B CN201510450491.4A CN201510450491A CN105177689B CN 105177689 B CN105177689 B CN 105177689B CN 201510450491 A CN201510450491 A CN 201510450491A CN 105177689 B CN105177689 B CN 105177689B
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Abstract
A kind of high speed electroplating process test device disclosed by the invention, including pickling system, purging system, electroplating system, movable cathode system, control system and electroplating power supply；Pickling system includes pickling circulating pump, pickling circulating slot, descaling bath and pickling electrode；Purging system includes clean cycle pump, clean cycle groove and rinse bath；Electroplating system includes plating cycle pump, plating cycle groove, electroplating bath and plating pole plate；Control system controls the startup and stopping of pickling system, purging system, electroplating system and movable cathode system.Certain electric current is inputted by electroplating power supply, negative electrode test piece can move back and forth in electroplating bath, realize high speed electrodeposition.Strip continuous electroplating mode in actual production can be preferably simulated using the present invention, technique guidance is carried out to actual production.
Description
Technical field
The present invention relates to a kind of high speed electroplating process test device, and in particular to a kind of high speed electrodeposition work of movable cathode formula
Skill experimental rig.
Background technology
The high speed electrodeposition difference maximum with Common platings is that high speed electrodeposition employs special equipment so that high
Cathode-current density under the conditions of remain to obtain the electro-plating method of excellent coating, because the cathode-current density of use is common electricity
Even hundreds times of the decades of times of current density so that production efficiency improves even hundred times of decades of times.Simulated and tried by high speed electrodeposition
Test, high speed electrodeposition technique can be best understood from, providing data for process modification supports, and can be new high speed electrodeposition liquid
Exploitation carry out simulated test, save the research and development of products cycle.
The plating of industrial production high speed mainly has steel band high speed electrodeposition, wire rod and electronic product high speed electrodeposition.Patent CN
2327701Y discloses a kind of high speed electroplating process test device, and the anode of the patent is loop type, while negative electrode is cylinder,
Strip is arranged on the rotating cathode of cylinder, and negative electrode rotates at a high speed during plating, actual raw with the linear velocity simulation of high speed rotation
Strip speed in production, because strip needs to be mounted to cylinder, therefore strip be not easy too thick and strip material need compared with
It is soft to be just adapted to.Patent CN2618927Y discloses a kind of high speed electroplating process test device, and the patent uses vertical plating tank, electricity
Parallel anode and negative electrode be installed in coating bath, during plating plating solution from passing through at a high speed between negative electrode and anode so as to simulating electricity at a high speed
Plating.The CN 103882503A of Shanghai University patent discloses a kind of horizontal high speed electrodeposition device, and the device uses water
Flat electroplating bath, parallel positive plate and minus plate are installed in groove, by controlling bath flow rate to carry out high speed electrodeposition.It is several above
Kind unit simulation high speed electrodeposition is by controlling negative electrode to rotate at a high speed or controlling bath flow rate to realize, with strip in steel mill
The form that high-speed mobile carries out high speed electrodeposition has differences, it is impossible to carries out fine simulation to it.
The content of the invention
It is an object of the invention to provide a kind of high speed electroplating process test device, the device is designed with movable cathode system
System, activation, cleaning, the strip high speed electrodeposition processing simulation of plating integration can be achieved.
To achieve these goals, present invention employs following technical scheme：
A kind of high speed electroplating process test device, it is characterised in that the electroplating technology experimental rig includes pickling system, institute
The pickling system stated includes pickling circulating pump, pickling circulating slot, descaling bath and pickling electrode, and pickling electrode is arranged on descaling bath
In, pickling circulating slot is connected with descaling bath by pickling circulating pump, is had overflow pipe in descaling bath and is led to pickling circulating slot, described
Pickling electrode material is stereotype or lead-coated steel plate；The electroplating technology experimental rig includes purging system, described purging system
Including clean cycle pump, clean cycle groove and rinse bath, spray equipment, clean cycle pump and spray equipment are installed in rinse bath
It is connected, rinse bath has overflow pipe and leads to clean cycle groove；The electroplating technology experimental rig includes electroplating system, described plating
System includes plating cycle pump, plating cycle groove, electroplating bath and plating pole plate, and the parallel plating pole of two rows is housed in electroplating bath
Plate, electroplating bath and plating cycle groove are connected by plating cycle pump, and electroplating bath has overflow pipe and leads to plating cycle groove, plating cycle
Built with heating tube and thermocouple, in electroplating system, two rows electroplate the distance between pole plate to groove is 30~70mm, electroplate pole plate
Material can need to change according to actual plating；Pickling circulating slot, clean cycle groove and electricity in described electroplating technology experimental rig
Plating circulating slot is provided with closure；The electroplating technology experimental rig includes movable cathode system, described movable cathode system
Including left slider, right sliding block, left cylinder cylinder, right cylinder cylinder, cross sliding clock, horizontal gas cylinder barrel and specimen holder, left cylinder cylinder and the right side
Cylinder barrel is bolted on the casing of high speed electrodeposition, and horizontal gas cylinder barrel left and right ends are separately fixed at left cunning by bolt
On block and right sliding block, specimen holder is connected by bolt with cross sliding clock；The power source of movable cathode system is compressed air, and is led to
Cross control system and carry out action control；The electroplating technology experimental rig includes control system and electroplating power supply；Control system control
The startup and stopping of pickling system processed, purging system, electroplating system and movable cathode system.
Further, described control system is controlled using PLC, by program be controlled the startup of movable cathode system with
Start and stop, heating tube and the thermocouple start and stop of stopping, pickling circulating pump, clean cycle pump and plating cycle pump,
And the speed of temperature of electroplating solution and movable cathode can be shown.
Further, the negative pole of described electroplating power supply is connected with specimen holder, and positive pole is connected with plating pole plate, and can be according to reality
Border demand, one-side electroplating pole plate is connected respectively and carries out one-side electroplating or connects the two-sided plating of two-sided pole plate progress simultaneously.
Compared with the prior art, the present invention at least has the advantages that：
High speed electroplating process test device is designed with movable cathode system so that test piece realizes what is come and gone back and forth in electroplating bath
Forms of motion, situation during strip high speed electrodeposition in actual production can be preferably simulated, realize activation, cleaning, plating integration
Technique.
Brief description of the drawings
Fig. 1 is the structural representation of high speed electroplating process test device；
Fig. 2 is that high speed electroplating process test device electroplating power supply connects diagrammatic top view；
Fig. 3 is the graphics of high speed electroplating process test device.
Description of symbols in figure：
1- pickling systems
11- pickling circulating pump 12- pickling circulating slot 13- descaling bath 14- pickling electrodes
2- purging systems
21- clean cycle pump 22- clean cycle groove 23- rinse bath 24- spray equipments
3- electroplating systems
31- plating cycle pump 32- plating cycle groove 33- electroplating baths 34- electroplates pole plate 35- heating tube 36- thermocouples
4- movable cathode systems
The right sliding block 43- left cylinders cylinder 44- right cylinders cylinder 45- cross sliding clocks 46- horizontal gas cylinder barrels of 41- left sliders 42-
47- specimen holder 48- samples
5- control systems
6- electroplating power supplies
Embodiment
The structure of device, function and effect for a better understanding of the present invention, current following examples are described in detail.
As shown in figure 1, a kind of high speed electroplating process test device, is including pickling system 1, purging system 2, plating
System 3, movable cathode system 4, control system 5 and electroplating power supply 6.Pickling system 1 includes pickling circulating pump 11, pickling circulating slot
12nd, descaling bath 13 and pickling electrode 14；Purging system 2 includes clean cycle pump 21, clean cycle groove 22 and rinse bath 23；Plating
System 3 includes plating cycle pump 31, plating cycle groove 32, electroplating bath 33 and plating pole plate 34；Control system 5 controls pickling system
1st, the startup and stopping of purging system 2, electroplating system 3 and movable cathode system 4.By control system 5, test piece 48 is set to complete acid
Wash → clean → three process procedures of high speed electrodeposition.
Pickling electrode 14 is arranged in descaling bath 13, and pickling circulating slot 12 and descaling bath 13 are connected by pickling circulating pump 11,
There is overflow pipe in descaling bath 13 and lead to pickling circulating slot 12, the material of pickling electrode 14 is stereotype or lead-coated steel plate.
Spray equipment 24 is installed, clean cycle pump 21 is connected with spray equipment 24, and rinse bath 23 has excessive in rinse bath 23
Flow tube simultaneously leads to clean cycle groove 22.
Equipped with the plating pole plate 34 that two rows are parallel in electroplating bath 33, electroplating bath 33 and plating cycle groove 32 are by plating cycle pump
31 connections, electroplating bath 33 has overflow pipe and leads to plating cycle groove 32, plating cycle groove built with heating tube 35 and thermocouple 36,
It is 30~70mm that two rows, which electroplate the distance between pole plate 34, in electroplating system 3, and the material of plating pole plate 34 can be according to actual plating
Need to change.
Movable cathode system 4 include left slider 41, right sliding block 42, left cylinder cylinder 43, right cylinder cylinder 44, cross sliding clock 45,
Horizontal gas cylinder barrel 46 and specimen holder 47, the left and right ends of horizontal gas cylinder barrel 46 are separately fixed at left slider 41 and right sliding block by bolt
On 42, specimen holder 47 is connected by bolt with cross sliding clock 45；The power source of movable cathode system 4 is compressed air, and is passed through
Control system 5 carries out action control.
Control system 5 is controlled using PLC, is controlled the start and stop of movable cathode system 4 by program, pickling follows
Ring pump 11, the start and stop of clean cycle pump 21 and plating cycle pump 31, heating tube 35 and the start and stop of thermocouple 36, and
The speed of temperature of electroplating solution and movable cathode can be shown.
The negative pole of electroplating power supply 6 is connected with specimen holder 47, positive pole with plating pole plate 34 be connected, and can according to the actual requirements,
Connect one-side electroplating pole plate respectively to carry out one-side electroplating or connect the two-sided plating of two-sided plating pole plate progress simultaneously, such as Fig. 2 institutes
Show.
During experiment, configuration pickle, cleaning fluid and electroplate liquid deposit in respectively pickling circulating slot 12, clean cycle groove 22 and
In plating cycle groove 32, sample 48 is connected by bolt with specimen holder 47, starts heating tube 35, plating system by control system 5
System 3 will be heated to after design temperature and stops heating automatically, start pickling circulating pump 11, clean cycle pump 21 and plating cycle pump
31, tank liquor is circulated, starts the automatic mode in control system 5, movable cathode system 4 is moved from the position 1 of pickling position
Move to position 2, sample 48 enters descaling bath 13 and carries out cathodic pickling, and after pickling, movable cathode system 4 is moved to pickling position
Behind the position 1 put, sample 48 is moved to cleaning positions, and then movable cathode system 4 is moved to the positions 2 of cleaning positions and tried
Sample 48 cleans, and after movable cathode system 4 is moved to the position 1 of cleaning positions after having cleaned, sample 48 is moved to electroplating site, so
After movable cathode system 4 is moved to position 2 afterwards, sample 48 moves back and forth in electroplating bath, starts electroplating power supply 6, input
Required electroplating current, sample 48 start to electroplate, and after electroplating certain time, start the stop button in control system 5, negative electrode moves
After dynamic system 4 is moved to position 2, sample 48 is moved to the position of pickling, and plating finishes.
If carry out one-side electroplating, it is only necessary to the electroplating current needed for an electroplating power supply input, if carried out two-sided
Plating, then need all to input electroplating current to two electroplating power supplies, when such as needing poor thick test piece, then needs defeated to two electroplating power supplies
Enter different electric currents.
Pickling circulating slot 12, descaling bath 13, clean cycle groove 22, rinse bath 23, electroplating bath circulating slot 32 and electroplating bath 33
Using materials such as corrosion resistant PVC or PP, pickling circulating pump 11, clean cycle pump 21 and plating cycle pump 31 are corrosion resistant
The pump of level is lost, heating tube 35 uses stainless steel or titanium material.
The power source of movable cathode system 4 is compressed air, is adjusted by the compressed air pressure regulating valve in control system 5
Save pressure and then control the speed of movable cathode.
Pickling circulating slot 12, clean cycle groove 22 and plating cycle groove 32 are provided with closure, as shown in Figure 3.
Embodiment described above only expresses the embodiment of the present invention, but can not be therefore understands that for the present invention
The limitation of the scope of the claims.Any variation that those skilled in the art is done under the enlightenment of present inventive concept to the present invention falls
Within the scope of the present invention.
Claims (3)
1. a kind of high speed electroplating process test device, it is characterised in that the electroplating technology experimental rig includes pickling system, described
Pickling system include pickling circulating pump, pickling circulating slot, descaling bath and pickling electrode, pickling electrode is arranged in descaling bath,
Pickling circulating slot is connected with descaling bath by pickling circulating pump, is had overflow pipe in descaling bath and is led to pickling circulating slot, described acid
It is stereotype or lead-coated steel plate to wash electrode material；The electroplating technology experimental rig includes purging system, described purging system bag
Clean cycle pump, clean cycle groove and rinse bath are included, spray equipment, clean cycle pump and spray equipment phase are installed in rinse bath
Even, rinse bath has overflow pipe and leads to clean cycle groove；The electroplating technology experimental rig includes electroplating system, described plating system
System includes plating cycle pump, plating cycle groove, electroplating bath and plating pole plate, and the parallel plating pole plate of two rows is housed in electroplating bath,
Electroplating bath is connected with plating cycle groove by plating cycle pump, and electroplating bath has overflow pipe and leads to plating cycle groove, plating cycle groove
It is 30~70mm that built with heating tube and thermocouple, in electroplating system, two rows, which electroplate the distance between pole plate, electroplates the material of pole plate
Material can need to change according to actual plating；Pickling circulating slot, clean cycle groove and plating in described electroplating technology experimental rig
Circulating slot is provided with closure；The electroplating technology experimental rig includes movable cathode system, described movable cathode system bag
Include left slider, right sliding block, left cylinder cylinder, right cylinder cylinder, cross sliding clock, horizontal gas cylinder barrel and specimen holder, left cylinder cylinder and right gas
Cylinder barrel is bolted on the casing of high speed electrodeposition, and horizontal gas cylinder barrel left and right ends are separately fixed at left slider by bolt
And on right sliding block, specimen holder is connected by bolt with cross sliding clock；The power source of movable cathode system is compressed air, and is passed through
Control system carries out action control；The electroplating technology experimental rig includes control system and electroplating power supply；Control system controls
The startup and stopping of pickling system, purging system, electroplating system and movable cathode system.
2. high speed electroplating process test device according to claim 1, it is characterised in that described control system uses
PLC is controlled, and start and stop, pickling circulating pump, clean cycle pump and the plating of movable cathode system are controlled by program
Start and stop, heating tube and the thermocouple start and stop of circulating pump, and the speed of temperature of electroplating solution and movable cathode can be shown
Degree.
3. high speed electroplating process test device according to claim 1, it is characterised in that the negative pole of described electroplating power supply
It is connected with specimen holder, positive pole is connected with plating pole plate, and can connect one-side electroplating pole plate respectively according to the actual requirements and carry out one side
Plating connects the two-sided plating of two-sided pole plate progress simultaneously.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510450491.4A CN105177689B (en) | 2015-07-28 | 2015-07-28 | A kind of high speed electroplating process test device |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510450491.4A CN105177689B (en) | 2015-07-28 | 2015-07-28 | A kind of high speed electroplating process test device |
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| CN105177689B true CN105177689B (en) | 2017-12-29 |
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| CN107287649A (en) * | 2016-03-30 | 2017-10-24 | 上海梅山钢铁股份有限公司 | High-speed plating sheet tin produces simulation test device and test method |
| CN111719154A (en) * | 2020-06-08 | 2020-09-29 | 江苏双环齿轮有限公司 | Etching inspection device for surface tempering after gear grinding |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2414080Y (en) * | 2000-02-03 | 2001-01-10 | *** | High-speed electroplating equipment |
| CN203653724U (en) * | 2013-12-31 | 2014-06-18 | 苏州工业园区恒越自动化科技有限公司 | High speed electroplating line equipment for IC pins |
| CN204058616U (en) * | 2014-08-13 | 2014-12-31 | 江苏省沙钢钢铁研究院有限公司 | A kind of cathode test device of high speed electrodeposition |
| CN204401123U (en) * | 2014-12-22 | 2015-06-17 | 大连华锐重工集团股份有限公司 | A kind of electrolytic manganese negative plate mechanize discrepancy tank systems |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8298395B2 (en) * | 1999-06-30 | 2012-10-30 | Chema Technology, Inc. | Electroplating apparatus |
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- 2015-07-28 CN CN201510450491.4A patent/CN105177689B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2414080Y (en) * | 2000-02-03 | 2001-01-10 | *** | High-speed electroplating equipment |
| CN203653724U (en) * | 2013-12-31 | 2014-06-18 | 苏州工业园区恒越自动化科技有限公司 | High speed electroplating line equipment for IC pins |
| CN204058616U (en) * | 2014-08-13 | 2014-12-31 | 江苏省沙钢钢铁研究院有限公司 | A kind of cathode test device of high speed electrodeposition |
| CN204401123U (en) * | 2014-12-22 | 2015-06-17 | 大连华锐重工集团股份有限公司 | A kind of electrolytic manganese negative plate mechanize discrepancy tank systems |
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