CN105164824B - Open reel - Google Patents

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Publication number
CN105164824B
CN105164824B CN201480021178.2A CN201480021178A CN105164824B CN 105164824 B CN105164824 B CN 105164824B CN 201480021178 A CN201480021178 A CN 201480021178A CN 105164824 B CN105164824 B CN 105164824B
Authority
CN
China
Prior art keywords
resin
phosphor resin
fluorophor
rope form
reel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201480021178.2A
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Chinese (zh)
Other versions
CN105164824A (en
Inventor
幡俊雄
小西正宏
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Publication of CN105164824A publication Critical patent/CN105164824A/en
Application granted granted Critical
Publication of CN105164824B publication Critical patent/CN105164824B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H55/00Wound packages of filamentary material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H75/00Storing webs, tapes, or filamentary material, e.g. on reels
    • B65H75/02Cores, formers, supports, or holders for coiled, wound, or folded material, e.g. reels, spindles, bobbins, cop tubes, cans, mandrels or chucks
    • B65H75/04Kinds or types
    • B65H75/08Kinds or types of circular or polygonal cross-section
    • B65H75/14Kinds or types of circular or polygonal cross-section with two end flanges
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008Processes
    • H01L2933/0033Processes relating to semiconductor body packages
    • H01L2933/0041Processes relating to semiconductor body packages relating to wavelength conversion elements

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  • Led Device Packages (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Luminescent Compositions (AREA)
  • Storage Of Web-Like Or Filamentary Materials (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)

Abstract

The open reel (1) of the present invention has:Reel (30) and be wound in reel (30) rope form (20) containing phosphor resin.

Description

Open reel
Technical field
The present invention relates to the open reels (open reel) that keeping/carrying is carried out containing phosphor resin to rope form.
Background technology
In the past, be utilized LED chip and with LED chip it is luminous come excite and the fluorophor of discharging fluorescence shine In device, LED chip is sealed by sealing resin, and fluorophor is dispersed in the sealing resin.
Here, for sealed LED chip units of micrometers fluorophor in order to prevent moisture etc. attachment and absorption and It disperses, needs to keep properly.For this purpose, fluorophor is enclosed, and then be put into anti-wet tank in keeping bottle or keeping bag etc. in the past In take care of/carrying.
About the sealing resin for including this fluorophor, propose in patent document 1 will be dispersed with fluorophor containing glimmering Body of light sealing resin is shaped to laminar scheme.According to patent document 1, due to so that the state that fluorophor is scattered in resin is come Keeping/carrying is possibly realized, therefore is had the advantages that without keeping properly fluorophor etc. in safe deposit box or keeping bottle etc..
Citation
Patent document
Patent document 1:Japanese Laid-Open Patent Publication " Japanese Unexamined Patent Publication 2011-138831 bulletins (on 07 14th, 2011 public affairs Open) "
Invention content
The subject that the invention solves
However, in the laminar sealing resin containing fluorophor of patent document 1, since appearance and size becomes larger, tool Have that Portability is low, is difficult to the subject carried.
The present invention be exactly in view of above-mentioned existing subject and complete, it is intended that providing a kind of improve containing fluorophor The open reel of the operability of resin.
Means for solving the problems
In order to solve the above problems, the open reel involved by a form of the invention, which is characterized in that have reel With the rope form that is wound in the reel containing phosphor resin.
Invention effect
A form according to the present invention plays the open reel for being capable of providing and improving the operability containing phosphor resin This effect.
Description of the drawings
Fig. 1 is to represent the stereogram that the appearance of the open reel involved by embodiment 1 is formed.
Fig. 2 is the conceptual viscosity characteristics containing the silicone resin included in phosphor resin for representing rope form shown in FIG. 1 Chart.
Fig. 3 (a)~Fig. 3 (d) is the brief of an example for the forming method containing phosphor resin for representing rope form shown in FIG. 1 Figure.
Fig. 4 is represented the brief diagram of an example of the method that reel is wound in containing phosphor resin of rope form.
Fig. 5 is the appearance composition represented using the luminescent device produced containing phosphor resin of rope form shown in FIG. 1 Stereogram.
Fig. 6 (a)~Fig. 6 (d) is among the manufacturing process for representing luminescent device shown in fig. 5, is sent out in chamber indoor location The brief diagram of the process of optical element.
Fig. 7 (a)~Fig. 7 (c) is among the manufacturing process for representing luminescent device shown in fig. 5, with rope form containing fluorescence Body resin seals the brief diagram of the process of light-emitting component.
Fig. 8 is the process of the multi-joint chamber circuits substrate of segmentation among the manufacturing process for representing luminescent device shown in fig. 5 Brief diagram.
Fig. 9 (a) is the stereogram for the variation for representing open reel shown in FIG. 1, and Fig. 9 (b) is its perspective view above.
Figure 10 (a)~Figure 10 (d) is to represent the rope form involved by embodiment 2 processing flakiness containing phosphor resin The brief diagram of the forming method of shape.
Figure 11 (a) and Figure 11 (b) is laminar the shining containing phosphor resin for representing to be utilized shown in Figure 10 (d) The sectional view of the manufacturing method of device.
Figure 12 is to represent the stereogram that the appearance of the open reel involved by embodiment 3 is formed.
Figure 13 (a)~Figure 13 (d) is an example for the forming method containing phosphor resin for representing the rope form shown in Figure 12 Brief diagram.
Figure 14 is to represent caused by the presence or absence of addition of plasticizer shown in Figure 13, silicone resin viscosity and elasticity The table of the variation of modulus.
Specific embodiment
(embodiment 1)
Illustrated and the open relevant embodiment of reel according to the present invention, then following institute based on Fig. 1~Fig. 9 It states.Open reel involved by present embodiment is equipped on the light-emitting components such as the LED chip of luminescent device for sealing.
<The composition of open reel 1>
First, illustrate present embodiment with reference to Fig. 1 and Fig. 2 involved by open reel 1 composition.
Fig. 1 is to represent the stereogram that the appearance of the open reel 1 involved by present embodiment is formed.As shown in Figure 1, it opens Formula reel 1 is put to have:Containing phosphor resin 20 and reel 30.
(the containing phosphor resin 20 of rope form)
Rope form seals the light-emitting component for being equipped on luminescent device containing phosphor resin 20.Specifically, containing for rope form is glimmering Body of light resin 20 has the thermoplastic resin molded for rope form of the i.e. fluorophor of wavelength conversion substance by homodisperse.
As fluorophor, such as oxynitride system fluorophor (Sialon fluorophor etc.) or iii-v chemical combination can be utilized Object semi-conductor nano particles fluorophor (indium phosphide:InP etc.) or YAG fluorophor.But fluorophor is not limited in above-mentioned Appearance or other fluorophor (KSF fluorophor or KTF fluorophor etc.) such as nitride phosphor.
In addition, in the present embodiment, fluorophor is although utilized, but other can also be utilized as wavelength conversion substance Wavelength conversion substance.As long as wavelength conversion substance releases difference with transformation from the wavelength of light that light-emitting component irradiates The substance of the function of the light of wavelength.
In addition, as the thermoplastic resin of the fluorophor is dispersed with, it is as long as can be used in sealing light-emitting component, then not special Do not limit, but the temperature preferably at a temperature of less than given crosslinking temperature with thermoplasticity and more than the crosslinking temperature with The resin of the characteristic of irreversible hardening.
In the present embodiment, the silicone resin with above-mentioned characteristic is utilized as thermoplastic resin.In silicone resin 1 crosslinking is formed, suitably depressurizes and removes molten by BTX (benzenetoluenexylene, benzene-toluene) etc. The quantity of solvent of semi-solid preparation material after dilution agent, thus to obtain.The silicone resin (is handed over less than aftermentioned given 2 crosslinking temperatures Join temperature) at a temperature of there is thermoplasticity, the characteristic at the temperature more than 2 crosslinking temperatures with irreversible hardening.
Fig. 2 is that the conceptual viscosity containing the silicone resin included in phosphor resin 20 for representing rope form shown in FIG. 1 is special The chart of property.As shown in Fig. 2, the silicone resin is in room temperature T0Viscosity under (about 25 DEG C) is viscosity V0(with reference to P in figure0).Viscosity V0It is the viscosity for the shape containing phosphor resin 20 that can maintain rope form.
By silicone resin from room temperature T0It is heated to silicone resin and forms 2 crosslinked 2 crosslinking temperature T1(about 125 DEG C) In the case of nearby, the viscosity of silicone resin declines, 2 crosslinking temperature T1The viscosity of tight front becomes viscosity V1(with reference in figure P1).Viscosity V1It is that silicone resin is molten into flowable viscosity.
Room temperature T0To less than 2 crosslinking temperature T1Temperature region in silicone resin variation be thermal reversibility variation. Thus, make temperature from 2 crosslinking temperature T1Nearby drop to room temperature T0In the case of, the viscosity of silicone resin increases, in room temperature T0Under be back to original viscosity V0.Therefore, by room temperature T0To less than 2 crosslinking temperature T1Temperature region in make temperature Variation, so as in viscosity V0To viscosity V1Between adjust the viscosity of silicone resin repeatedly.
On the other hand, with 2 crosslinking temperature T1In the case that above temperature carrys out heating silicone resin, in silicone resin It is middle to form 2 crosslinkings and harden.It is false in addition, although the viscosity of silicone resin after hardening can not be substantially defined It is fixed that the viscosity of silicone resin after hardening is conceptually defined as viscosity V2In the case of, the viscosity of silicone resin is from viscosity V1 Rise to viscosity V2(with reference to P in figure2).Viscosity V2Conceptually define 2 crosslinking temperature when silicone resin forms 2 crosslinkings Spend T1Under viscosity.
For the silicone resin after 2 crosslinkings, make temperature from 2 crosslinking temperature T1In the case of rising or declining, Although 2 crosslinking temperature T1Under viscosity and the physical property of elasticity modulus etc. can change (polymer characteristics), but compared to 2 Silicone resin before secondary crosslinking, viscosity and elasticity modulus but relatively increase the (P in figure3, for convenience's sake, will remember It carries to maintain viscosity V2Situation).
In addition, so-called 2 times are crosslinked, refer to the cross-linking reaction etc. caused by the reaction catalyst different from during such as synthesis So that hardening further develops, refer to due to temperature to occur as described above the state of reversible viscosity change.
In rope form is containing phosphor resin 20, various fluorescence are included according to the optical characteristics of the needs of luminescent device Body, although the concentration (containing ratio) of adjustable fluorophor, but if using the silicone resin, as long as the then shape before 2 crosslinkings State just can adjust its viscosity repeatedly.For this purpose, as described later, the uniform rope form of dispersity of fluorophor can be obtained Containing phosphor resin 20.
According to rope form containing phosphor resin 20, due to can be so that fluorophor be scattered in the state of silicone resin and protects Pipe, therefore numerous and diverse degree of the individually existing operation of keeping powdery fluorescent body and fluid resin can be eliminated.
(reel 30)
Reel 30 be used to winding rope form containing phosphor resin 20.Reel 30 is by core and is located in parallel to one another at this Two flange parts at the both ends of core are formed.The core that reel 30 is wound in containing phosphor resin 20 of rope form.The reel 30 It is made of a variety of materials of metal or resin etc..
In this way, in open reel 1, rope form is wound in reel 30 containing phosphor resin 20, so as to reduce The rope form is managed concentratedly containing phosphor resin 20.Thus, it is possible to it improves the Portability containing phosphor resin 20 and easily takes Band.
In addition, in open reel 1, by by be wound in the rope form of reel 30 containing phosphor resin 20 block for Desired length, so as to be easy to get necessary deal containing phosphor resin 20.
In addition, rope form is set as by the way that phosphor resin 20 will be contained, so as to the tensile strength increase containing phosphor resin 20.Cause And rope form is difficult to tear up containing phosphor resin 20, can easily be wound in reel 30.
In addition, the diameter containing phosphor resin 20 of rope form can be selected suitably.For example, can fluorescence be contained according to rope form The diameter containing phosphor resin 20 of rope form is set as hundreds of μm~tens mm degree by body resin 20 using form etc..
<The manufacturing method of open reel 1>
Next, illustrate the manufacturing method of open reel 1 with reference to Fig. 3 and Fig. 4.
Fig. 3 (a)~Fig. 3 (d) is the letter of an example for the forming method containing phosphor resin 20 for representing rope form shown in FIG. 1 Scheme.As shown in Fig. 3 (a), first, the powder progress of powder and fluorophor 22 to being formed with 1 crosslinked silicone resin 21 Dry mixing, until admixture becomes uniformly, so as to obtain mixture of powders 24.
Next, as shown in Fig. 3 (b), mixture of powders 24 is put into twin-screw extruder device 37, to be less than 2 times Crosslinking temperature T1Temperature carry out heating fusing and mixing.
Twin-screw extruder device 37 has two screw rod 37a being arranged parallel to each other, the two screw rods 37a difference in cylinder Rotate in the opposite direction, so as to melting silicone resin 21, and mixing mixture of powders 24 by heating.
By the heating and mixing, as shown in Fig. 3 (c), mixture of powders 24 becomes in the silicone resin 21 of fusing The even homomixture 25 for being dispersed with fluorophor 22.By the way that the homomixture 25 is squeezed from the outlet 37b of twin-screw extruder device 37 For rope form, so as to as shown in Fig. 3 (d), can be formed fluorophor 22 be dispersed in silicone resin 21 rope form containing fluorophor Resin 20.Then, it is open so as to manufacture by by the core that reel 30 is wound in containing phosphor resin 20 of the rope form Reel 1.
Fig. 4 is represented the brief diagram of an example of the method that reel 30 is wound in containing phosphor resin 20 of rope form.Such as Fig. 4 It is shown, it can also utilize on the directly volume of reel 30 from the outlet 37b of twin-screw extruder device 37 rope forms squeezed out containing glimmering Body of light resin 20.In the case, be arranged to by using the rotary driving part of motor etc. can be in figure for reel 30 The side of arrow rotates up.
At this point, it is preferred that the rotary speed of control reel 30 so that the rope form that reel 30 is rolled up per unit time contains fluorescence The length (amount) of body resin 20 and the length containing phosphor resin 20 from the outlet 37b rope forms squeezed out per unit time (amount) is equal or slightly shorter than its.Alternatively, it is preferred that the rotary speed of control screw rod 37a so that from outlet 37b per units Containing for the rope form that the length (amount) containing phosphor resin 20 for the rope form that time squeezes out is rolled up per unit time with reel 30 is glimmering The length (amount) of body of light resin 20 is equal or slightly longer than its.Thereby, it is possible to inhibit being torn containing phosphor resin 20 for rope form It is broken, and automatically rolled up by reel 30 rope form containing phosphor resin 20.
According to the open reel 1 so produced, by being blocked rope form for identical degree containing phosphor resin 20, So as to be readily available equal multiple containing phosphor resin 20 of fluorophor amount.Thus, contain fluorophor using these Resin 20 seals each light-emitting component, so as to make the fluorophor amount equalization between luminescent device, reduces the inclined of coloration Difference.
In addition, rope form is set as by the way that phosphor resin 20 will be contained, so as to compared to for example big block-like situation, improve The melting efficiency of silicone resin 21 during heating.
Thus, to be less than 2 crosslinking temperature T1Temperature come heat fusing rope form containing phosphor resin 20 so that fluorescence Body 22 does not deposit, and in the state of uniformly dispersing in maintenance silicone resin 21 and having fluorophor 22, rope form is contained fluorescence Body resin 20 is readily processible to shape desired.
In addition, in the present embodiment, although the twin-screw extruder device 37 for having two screw rod 37a is utilized, Twin-screw extruder device 37 can be replaced and utilize the single screw rod pressurizing unit for having a screw rod 37a.Alternatively, it can also replace Twin-screw extruder device 37 and utilize have 3 or more screw rod 37a multiscrew pressurizing unit.Thereby, it is possible to improve powder The blending efficiency of mixture 24 and the extruding efficiency of homomixture 25.Quantity, the size of the outlet 37b of these pressurizing units And shape is not particularly limited, and can be suitably changed as needed.Thereby, it is possible to easily change formed rope form Diameter containing phosphor resin 20 etc..For example, the diameter of the outlet 37b of pressurizing unit being capable of containing according to the rope form formed The thickness (diameter) of phosphor resin 20 and be set as hundreds of μm~tens mm degree.
In addition, in the present embodiment, although using twin-screw extruder device 37 form rope form containing phosphor resin 20, but can also by other methods come formed rope form containing phosphor resin 20.
<The manufacturing method of luminescent device>
Next, illustrate to be utilized the manufacturer of the luminescent device containing phosphor resin 20 of rope form with reference to Fig. 5~Fig. 8 Method.
Fig. 5 is the solid for representing the appearance composition using the luminescent device 40 produced containing phosphor resin 20 of rope form Figure.As shown in figure 5, luminescent device 40 is in MID (Molded Interconnection of the one side for the rectangular-shape of 1mm degree Device, projecting three-dimensional wiring shaping substrate) i.e. circuit board 11 is formed with the chamber 12 for the rectangle being open upward.Change speech It, chamber 12 is the recess portion for the upper surface for being formed in circuit board 11.The luminous member of LED chip etc. is installed in the chamber 12 Part 13.
The lower surface of light-emitting component 13 connects (die bond) set on the bottom of chamber 12 by conductive adhesive 15 The assembling in portion is on wiring pattern 14.
In addition, the upper surface of light-emitting component 13 by the conductor wire 17 that is made of gold thread etc. and with set on the bottom of chamber 12 Connecting wiring pattern 16 connect (wire bonding).
Then, it is sealed in the chamber 12 of the circuit board 11 by containing phosphor resin 20.
In addition, the inner face of the chamber 12 of circuit board 11 can also have reflector function.Thereby, it is possible to improve photophore The utilization ratio of light in part 40.In addition, the method that light-emitting component 13 is installed on circuit board 11 is not particularly limited, Terminal conjunction method can be replaced and light-emitting component 13 is installed on circuit board 11 such as by flint glass.
Fig. 6 (a)~Fig. 6 (d) is among the manufacturing process for representing luminescent device 40 shown in fig. 5, pacifies in chamber 12 Fill the brief diagram of the process of light-emitting component 13.
Use multiple chambers 12 on longitudinal direction and transverse direction in rectangular formation in the manufacture of luminescent device 40 Multi-joint chamber circuits substrate 10.By using the multi-joint chamber circuits substrate 10, so as to manufacture multiple luminescent devices simultaneously 40.Multi-joint chamber circuits substrate 10 such as thickness is 1mm, and the depth of each chamber 12 is 0.6mm.
First, it as shown in Fig. 6 (a), arranges setting assembling wiring pattern 14 respectively in the bottom of each chamber 12 and connects It connects with wiring pattern 16.
Secondly, as shown in Fig. 6 (b), in the assembling set on the bottom of each chamber 12 electric conductivity is coated on wiring pattern 14 Bonding agent 15.
Next, as shown in Fig. 6 (c), coated on assembling on the conductive adhesive 15 on wiring pattern 14, tube core Weld light-emitting component 13.Then, as shown in Fig. 6 (d), by the conductor wire 17 that is made of gold thread etc. come wire bonding light-emitting component 13 upper surface and the connecting wiring pattern 16 set on the bottom of chamber 12.
In this way, in each chamber 12 of multi-joint chamber circuits substrate 10, it is mounted with by die bond and wire bonding After light-emitting component 13, sealed by containing phosphor resin 20 in each chamber 12.
Fig. 7 (a)~Fig. 7 (d) is among the manufacturing process for representing luminescent device 40 shown in fig. 5, with rope form containing glimmering Body of light resin 20 seals the brief diagram of the process of light-emitting component 13.
As shown in Fig. 7 (a), mounting is equipped with the multi-joint chamber circuits substrate 10 of light-emitting component 13 on heater plates 31, It is equal length containing phosphor resin 20 that configuration, which is truncated, in each chamber 12.It is truncated the tree containing fluorophor for equal length Fat 20 seals each light-emitting component 13 since fluorophor amount is roughly equal, using these containing phosphor resin 20, from And the fluorophor amount equalization between luminescent device 40 can be made, reduce the deviation of coloration.
After each chamber 12 is configured with containing phosphor resin 20, as shown in Fig. 7 (b), by heater plates 31 with 2 friendships Join temperature T1(such as 125 DEG C) are heated, to melt containing phosphor resin 20.
It as a result, as shown in Fig. 7 (c), is filled up in chamber 12 containing phosphor resin 20, a part for silicone resin 21 is formed 2 times crosslinking and start to harden.At this point, in chamber 12 containing phosphor resin 20 due to heater plates 31 and from the bottom of chamber 12 Play hardening in portion side.Thus, it is possible to make the stress distribution caused by the curing shrinkage containing phosphor resin 20 in containing phosphor resin The opening portion side of 20 top, i.e. chamber 12, therefore the generation of crackle etc. can be inhibited, improve the reliability of luminescent device 40.
Then, multi-joint chamber circuits substrate 10 is heated to 2 crosslinking temperature T using oven etc.1Above (such as 125 DEG C Above and less than 170 DEG C), thus make silicone resin 21 fully hardened.Later, multi-joint chamber circuits substrate is taken out from oven etc. 10, temperature is made to drop to room temperature T0
Fig. 8 is among the manufacturing process for representing luminescent device 40 shown in fig. 5, the multi-joint chamber circuits substrate 10 of segmentation The brief diagram of process.As shown in figure 8, if the light-emitting component 13 for being installed on each chamber 12 is crosslinked containing fluorophor by being formed with 2 times Resin 20 seals, then divides multi-joint chamber circuits substrate 10 according to each chamber 12.Thereby, it is possible to manufacture fluorescence simultaneously The uniform multiple luminescent devices 40 of body amount.
Colour range between the luminescent device 40 so produced disclosure satisfy that the color of MacAdam's ellipse 2- steps Spend management standard.So-called MacAdam's ellipse refers to represent the standard deviation changed relative to the identification of specific center color For xy chromatic diagrams, the level of the deviation of human eye None- identified coloration can be realized.
In this way, light-emitting component 13 is sealed containing phosphor resin 20 by using rope form, so as to make luminescent device Fluorophor amount equalization between 40 reduces the deviation (range of Colour) of coloration.
In addition, in the present embodiment, although being seal-installed on multi-joint chamber containing phosphor resin 20 using rope form Each light-emitting component 13 of circuit board 10, but the present invention is not limited to this.For example, it is also possible to the tree containing fluorophor using rope form Fat 20 come be seal-installed on respectively segmentation after circuit board 11 light-emitting component 13.
<The effect of embodiment 1>
As more than, the open reel 1 involved by present embodiment has:Reel 30 and the rope for being wound in reel 30 Shape contains phosphor resin 20.
In open reel 1, rope form is wound in reel 30 containing phosphor resin 20, so as to by the rope form It concentrates to take care of smaller containing phosphor resin 20.Thus, it is possible to improve the Portability containing phosphor resin 20 and easy to carry.
In addition, in open reel 1, by the way that being blocked containing phosphor resin 20 for the rope form of reel 30 will be wound in For desired length, so as to be easy to get necessary deal containing phosphor resin 20.
Therefore, according to open reel 1, the operability containing phosphor resin 20 can be improved.
And then in open reel 1, by being blocked rope form for identical length containing phosphor resin 20, so as to Equal multiple containing phosphor resin 20 of fluorophor amount can be easy to get.Thus, by using these trees containing fluorophor Fat 20 seals each light-emitting component 13, so as to make the fluorophor amount equalization between luminescent device 40, reduces coloration Deviation.
Therefore, according to the present embodiment, following open reel 1 can be realized, i.e.,:It can improve containing phosphor resin 20 operability, and make the fluorophor amount equalization between luminescent device 40, to reduce the deviation of coloration.
In addition, rope form can also have glimmering containing phosphor resin 20 along the axis direction containing phosphor resin 20 The mutually different part of body of light amount.As a result, by using rope form containing the fluorophor amount among phosphor resin 20 Different parts seals each light-emitting component 13, a side is made to become nature white and becomes the opposing party so as to can for example manufacture Warm white etc., luminescent device 40 that the characteristics of luminescence is different.Alternatively, can also containing containing phosphor resin 20 along this for rope form is glimmering The axis direction of body of light resin 20 and with the mutually different part of thixotropy.
In addition it is also possible to 20 quilt containing phosphor resin of the identical or different rope form of 2 or more of fluorophor amount It is wound in reel 30.Thereby, it is possible to multiple rope forms are concentrated on a reel 30 containing phosphor resin 20 to take care of, therefore energy It is enough easily to carry out multiple keeping/carryings containing phosphor resin 20 etc..
<Variation>
In the present embodiment, although rope form is set as 1 type containing the fluorophor 22 included in phosphor resin 20, But fluorophor 22 more than 2 different types such as illuminant colour, grain size or proportion can also be utilized.For example, it is also possible to it is formed The rope form of combination comprising red light-emitting phosphor and green-emitting phosphor body containing phosphor resin 20 come seal blue Light-emitting component 13.In addition it is also possible to form the rope form of the combination comprising blue-light-emitting fluorescent material and yellow luminescent phosphor The light-emitting component 13 of bluish violet is sealed containing phosphor resin 20.
Even if in this case, the also fluorescence to being formed with more than the powder and 2 types of 1 crosslinked silicone resin 21 The powder of body 22 carries out dry mixing, until admixture becomes uniformly, so as to obtain mixture of powders 24.
Then, mixture of powders 24 is put into twin-screw extruder device 37, to be less than 2 crosslinking temperature T1Temperature Carry out heating fusing and mixing.
By the heating and mixing, have 2 so as to which mixture of powders 24 becomes to uniformly disperse in the silicone resin 21 of fusing The homomixture 25 of fluorophor 22 more than a type.Pass through the outlet 37b by the homomixture 25 from twin-screw extruder device 37 Squeeze as rope form, so as to formed fluorophor 22 more than 2 types be dispersed in silicone resin 21 rope form containing glimmering Body of light resin 20.
Fig. 9 (a) is the stereogram for the variation for representing open reel 1 shown in FIG. 1, and Fig. 9 (b) is its upper perspective Figure.As shown in Fig. 9 (a) and Fig. 9 (b), by changing the width of reel 30, so as to can also form opening for such as monovolume mode Put formula reel 1a.In the case, the length (that is, interval of flange part) of the core of adjustment reel 30 so that than containing for rope form The diameter of phosphor resin 20 is bigger.
By using monovolume mode, so as to preventing the winding containing phosphor resin 20 of rope form, and rope form contains The surplus management of phosphor resin 20 becomes easy.
(embodiment 2)
Based on Figure 10 and Figure 11 come illustrate with other relevant embodiments of open reel according to the present invention, It is then as described below.In addition, for convenience of description, it is identical for the attached drawing for having the function of with illustrating in above-mentioned embodiment Component assigns identical symbol, and the description thereof will be omitted.
Present embodiment is sealing hair using by the resin being processed into containing phosphor resin 20 after other shapes of rope form 13 this point of optical element, different from above-mentioned embodiment.
<The laminar forming method containing phosphor resin 20>
First, illustrate rope form being processed into laminar forming method containing phosphor resin 20 with reference to Figure 10.
Figure 10 (a)~Figure 10 (d) is to represent rope form being processed into laminar forming method containing phosphor resin 20 Brief diagram.Hereinafter, rope form is processed into laminar forming method by explanation by hot pressing containing phosphor resin 20.
First, as shown in Figure 10 (a), rope form is configured at heater plates 31 containing phosphor resin 20.Then, such as Figure 10 (b) shown in, to be less than 2 crosslinking temperature T1Temperature come heat fusing rope form containing phosphor resin 20, make silicone resin 21 Viscosity drop to do not make fluorophor 22 deposit degree.
Next, as shown in Figure 10 (c), by be less than 2 crosslinking temperature T1Temperature heated after pressure plate 39 It pressurizes to containing phosphor resin 20.At this point, it is adjusted by the spacer 38 being configured between heater plates 31 and pressure plate 39 The whole thickness containing phosphor resin 20.Then, make to be down to room temperature T at a temperature of containing phosphor resin 200, so as to such as Figure 10 (d) Shown such, can obtain to uniformly disperse has the laminar containing phosphor resin 20 of fluorophor 22.
In this way, for rope form containing phosphor resin 20, the melting efficiency of the silicone resin 21 during heating is high, and by with Less than 2 times crosslinking temperature T1Temperature come heat fusing rope form containing phosphor resin 20 so that fluorophor 22 does not deposit, so as to It can be in a state that maintenance silicone resin 21 uniformly disperses and has fluorophor 22, by being easily worked containing phosphor resin 20 for rope form Into shape desired.
In addition, in the present embodiment, it is thin although the description of being processed into rope form containing phosphor resin 20 by hot pressing The forming method of sheet, but can also utilize the other methods such as T-shaped mould method that rope form is processed flakiness containing phosphor resin 20 Shape.
<The manufacturing method of luminescent device 41>
Next, illustrate to be utilized the manufacturer of the laminar luminescent device 41 containing phosphor resin 20 with reference to Figure 11 Method.
Figure 11 (a) and Figure 11 (b) is the laminar hair containing phosphor resin 20 for representing to be utilized shown in Figure 10 (d) The sectional view of the manufacturing method of optical device 41.The planar circuit substrate with flat surfaces is used in the manufacture of luminescent device 41 10a, light-emitting component 13 are in the rectangular flat surfaces mounted on planar circuit substrate 10a on longitudinal direction and transverse direction.Pass through Using this planar circuit substrate 10a, so as to manufacture multiple luminescent devices 41 simultaneously.
As shown in Figure 11 (a), the plane in rectangular installation a plurality of light-emitting elements 13 is stacked gradually on heater plates 31 Circuit board 10a and it is laminar contain phosphor resin 20.Then, planar circuit substrate 10a is carried out by heater plates 31 Heating, thus to be less than 2 crosslinking temperature T1Temperature it is laminar containing phosphor resin 20 to heat fusing.Then, make silicon The viscosity of ketone resin 21 drops to the degree not deposited containing the fluorophor 22 included in phosphor resin 20, and by be less than 2 crosslinking temperature T1The pressure plate 39 that is heated of temperature and to laminar containing glimmering on the direction of planar circuit substrate 10a Body of light resin 20 pressurizes.Thereby, it is possible to make the laminar upper surface that light-emitting component 13 is close contact in containing phosphor resin 20 And side.
Then, in this state, by heater plates 31 with 2 crosslinking temperature T1Contain phosphor resin 20 to laminar It is heated, so that silicone resin 21 forms 2 crosslinkings and hardens.And then using oven etc. with 2 crosslinking temperature T1With On temperature planar circuit substrate 10a is heated, so as to make silicone resin 21 it is fully hardened after take out planar circuit base Plate 10a makes temperature drop to room temperature T0Until.
Then, as shown in Figure 11 (b), distinguish segmentation plane circuit board 10a according to each light-emitting component 13, so as to Fluorophor amount can be manufactured by multiple luminescent devices 41 of equalization.
In addition, using laminar (thin to seal the method for the present embodiment of light-emitting component 13 containing phosphor resin 20 Piece method), the sealing of each light-emitting component 13 luminescent device before the segmentation being connected suitable for multiple luminescent devices.The opposing party Face seals the method for the embodiment 1 of light-emitting component 13, before being applicable not only to segmentation using rope form containing phosphor resin 20 Luminescent device in each light-emitting component 13 sealing, apply also for each light-emitting component in the luminescent device after being divided respectively 13 sealing.
<The effect of embodiment 2>
As more than, according to rope form containing phosphor resin 20, such as compared to big block-like situation, when can improve heating Silicone resin 21 melting efficiency.Thus, being processed into shape desired according to purposes becomes easy.Thus, by by rope form Containing phosphor resin 20 be processed into flake, using this it is laminar seal light-emitting component 13 containing phosphor resin 20, from And the fluorophor amount equalization between luminescent device 41 can be made.
So according to the present embodiment, the fluorophor amount equalization between luminescent device 41 can be made, reduce coloration Deviation.
In addition, it in the present embodiment, although rope form is processed into flake containing phosphor resin 20, can also incite somebody to action Rope form containing phosphor resin 20 processing granulate wait others desirable shapes.
(embodiment 3)
Based on Figure 12~Figure 14 come illustrate with other relevant embodiments of open reel according to the present invention, then As described below.In addition, for convenience of description, for the identical portion of the attached drawing for having the function of with illustrating in above-mentioned embodiment Part assigns identical symbol, and the description thereof will be omitted.
Present embodiment adds plasticizer this point in the forming process containing phosphor resin of rope form, different from above-mentioned Embodiment.
<The composition of open reel 101>
First, illustrate present embodiment with reference to Figure 12 involved by open reel 101 composition.
Figure 12 is to represent the stereogram that the appearance of the open reel 101 involved by present embodiment is formed.Such as Figure 12 institutes Show, open reel 101 has:Rope form contains phosphor resin 120 and reel 30.
(the containing phosphor resin 120 of rope form)
Rope form seals the light-emitting component 13 for being equipped on luminescent device containing phosphor resin 120.Specifically, rope form contains Phosphor resin 120 has the wavelength conversion substance i.e. silicone resin 21 of fluorophor 22 to be shaped to rope form by homodisperse.In the rope Shape contains in phosphor resin 120, as described later, added with the silicone resin 21 made 2 times after being crosslinked in its formation process The plasticizer that elasticity modulus declines.
<The forming method containing phosphor resin 120 of rope form>
Next, illustrate the forming method containing phosphor resin 120 of rope form with reference to Figure 13.
Figure 13 (a)~Figure 13 (d) is an example for the forming method containing phosphor resin 120 for representing the rope form shown in Figure 12 Brief diagram.
As shown in Figure 13 (a), first, to being formed with the powder of 1 crosslinked silicone resin 21 and the powder of fluorophor 22 Dry mixing is carried out, until admixture becomes uniformly, so as to obtain mixture of powders 24.
Secondly, as shown in Figure 13 (b), the elasticity of the silicone resin 21 after making 2 crosslinkings is added in mixture of powders 24 Modulus declines the plasticizer 23 of (secondary strategic point declines viscosity).In addition, will be described later in detail about plasticizer 23.So Afterwards, the mixture of powders 24 added with plasticizer 23 is put into twin-screw extruder device 37, to be less than 2 crosslinking temperature T1 Temperature carry out heating fusing and mixing.
By the heating and mixing, as shown in Figure 13 (c), mixture of powders 24 becomes in the silicone resin 21 of fusing The even homomixture 125 for being dispersed with fluorophor 22.By the way that the homomixture 125 is squeezed from the outlet 37b of twin-screw extruder device 37 Press as rope form, so as to as shown in Figure 13 (d), can be formed fluorophor 22 be dispersed in silicone resin 21 rope form containing fluorescence Body resin 120.
<The detailed content of plasticizer 23>
Next, illustrate the plasticizer added in the formation process containing phosphor resin 120 of rope form with reference to Figure 14 23 detailed content.
By the silicone resin 21 after 1 crosslinking in room temperature T0It is lower that there is higher viscosity, heat caused melting It is low, (attachment) property is sticked together in addition and wettability is also low.Thus, the insufficient fusion each other of silicone resin 21 when heated becomes State more than gap.Silicone resin 21 forms 2 crosslinkings in the case of hardening in this state, seals light-emitting component 13 Easily cracked containing phosphor resin 120.In order to inhibit the generation of crackle, preferably make the silicone resin after 2 crosslinkings 21 elasticity modulus declines.
So it in the present embodiment, is obtained carrying out dry mixing to the powder of silicone resin 21 and the powder of fluorophor 22 Mixture of powders 24 in, add the increasing of liquid that a small amount of elasticity modulus for making the silicone resin 21 after 2 crosslinkings declines Mould agent 23.
The plasticizer 23 can also decline the crosslink density of silicone resin 21.Thereby, it is possible to make the silicone after being crosslinked 2 times The elasticity modulus of resin 21 suitably declines, and inhibition seals being cracked containing phosphor resin 120 for light-emitting component 13.
In addition, plasticizer 23 can also decline the viscosity for being formed with 1 crosslinked silicone resin 21.Rope form as a result, Processing containing phosphor resin 120 etc. becomes easy, in addition by the way that mixture of powders 24 is made to have intermiscibility, so as to continuously Silicone resin 21 is easy to be grouped as one by unoccupied place.
It, can be suitably using no function mafic silicone oil or single official as this plasticizer 23, such as using silicon as principal component Energy mafic silicone oil etc., can also react with matrix organosilicon (Matrix silicone), can not also react.Plasticizer 23 with The characteristic of luminescent device matchingly suitably selects.
Figure 14 be represent caused by the presence or absence of addition of plasticizer 23 shown in Figure 13, silicone resin 21 viscosity and The table of the variation of elasticity modulus.The viscosity and 2 of the silicone resin 21 of (1 cross-linked state) before being crosslinked is shown in FIG. 14 2 times The elasticity modulus of silicone resin 21 after secondary crosslinking.
As shown in figure 14, by adding (11 weight %) plasticizer 23 to silicone resin 21, before making 2 crosslinkings 25 DEG C of silicone resin 21 at viscosity drop to 1/3 degree until.Furthermore it is possible to make the silicone resin 21 before 2 crosslinkings 120 DEG C at viscosity drop to 1/100 degree until.
It is 1 substantially at 25 DEG C although the value of the viscosity of silicone resin 21 changes according to the additive amount of plasticizer 23 ×104Pas~1 × 105Pas is 1 × 10 at 120 DEG C2Pas~1 × 104Pa·s.In addition, plasticizer 23 adds If dosage is represented with plasticizer 23 relative to the weight ratio of silicone resin 21, preferably 5~20 weight %, more preferably 8 ~15 weight %, further preferably 11 weight % degree.
And then by adding plasticizer 23 to silicone resin 21, so as to make 25 of the silicone resin 21 after 2 crosslinkings Elasticity modulus at DEG C is from~5 × 107Pa drops to~1 × 107Pa.Furthermore it is possible to make the silicone resin 21 after 2 crosslinkings Elasticity modulus at 125 DEG C is from~1 × 107Pa drops to~2 × 106Pa。
In this way, by increasing plasticizer 23, so as to decline the viscosity of the silicone resin 21 before 2 crosslinkings, therefore Processing containing phosphor resin 120 for being formed with 1 crosslinked rope form etc. becomes easy.
In addition, by adding plasticizer 23, decline so as to the crosslink density of silicone resin 21, thus can make 25 DEG C and The elasticity modulus of the silicone resin 21 after 2 crosslinkings at 125 DEG C declines.Thereby, it is possible to inhibit to seal light-emitting component 13 It is cracked containing phosphor resin 120.
<The effect of embodiment 3>
As more than, the open reel 101 involved by present embodiment have be added in formation process make 2 times crosslinking The rope form for the plasticizer 23 that the elasticity modulus of silicone resin 21 afterwards declines contains phosphor resin 120.
Make the plasticizer 23 of the elasticity modulus decline of the silicone resin 21 after 2 crosslinkings by addition, so as to inhibit Seal being cracked containing phosphor resin 120 for light-emitting component 13.
Therefore, according to the present embodiment, can obtain the rope form for the reliability that can improve luminescent device contains fluorophor Resin 120.
<Variation>
In the present embodiment, although foring rope form using the twin-screw extruder device 37 for having two screw rod 37a It, can also containing phosphor resin 120, but for quantitative in the mixture of powders 24 and equably plasticizer 23 of mixing liquid Using batch processing mode.For example, the kneader of batch processing mode can be used, but particularly preferably use the high speed of internal feedback formula Cut agitating device.
Specifically, in the case of the high-speed cropping agitating device that the internal feedback formula for having a screw rod is utilized, The mixture of powders 24 and plasticizer 23 put into cylinder from the rear end side of screw rod are in the front end side of screw rod in being moved in cylinder It is dynamic.Then, between the front end of screw rod and the inner wall of cylinder, shear strength is added, and be stirred to mixture of powders 24.At this point, Mixture of powders 24 in cylinder is to be less than 2 crosslinking temperature T1Temperature heated, the rotating speed of screw rod is guaranteed to 2500rpm Above and below 3000rpm.Mixture of powders 24 and plasticizer 23 after being stirred are by being set on the feedback section of inside screw Path and the rear end side for being moved to screw rod.
By the cycle repeatedly within certain period, so as to which mixture of powders 24 and plasticizer 23 are fully stirred For homomixture 125.Then, homomixture 125 is squeezed as rope form by the outlet from cylinder, so as to form fluorophor 22 Be dispersed in the rope form of silicone resin 21 contains phosphor resin 120.
(embodiment 4)
As above-mentioned embodiment 1~3 containing the fluorophor included in phosphor resin 20/120, in present embodiment Middle selection is by Mn4+Complex fluoride phosphor after activation.As the complex fluoride phosphor, such as can use following Substance.
<The concrete example of complex fluoride phosphor>
(1)A2[MF5]:Mn4+
(wherein, A is from Li, Na, K, Rb, Cs, NH4And combinations thereof in select, M is selected from Al, Ga, In and combinations thereof.)
(2)A3[MF6]:Mn4+
(wherein, A is selected from Li, Na, K, Rb, Cs, NH4 and combinations thereof, and M is selected from Al, Ga, In and combinations thereof.)
(3)Zn2[MF7]:Mn4+
(wherein, M is selected from Al, Ga, In and combinations thereof.)
(4)A[In2F7]:Mn4+
(wherein, A is from Li, Na, K, Rb, Cs, NH4And combinations thereof in select.)
(5)A2[MF6]:Mn4+
(wherein, A is selected from Li, Na, K, Rb, Cs, NH4 and combinations thereof, and M is from Ge, Si, Sn, Ti, Zr and combinations thereof Selection.)
(6)E[MF6]:Mn4+
(wherein, E is selected from Mg, Ca, Sr, Ba, Zn and combinations thereof, and M is selected from Ge, Si, Sn, Ti, Zr and combinations thereof It selects.)
(7)Ba0.65Zr0.35F2.70:Mn4+
(8)A3[ZrF7]:Mn4+
(wherein, A is from Li, Na, K, Rb, Cs, NH4And combinations thereof in select.).
<The effect of embodiment 4>
As more than, in the present embodiment, by silicone resin 21 mixing by Mn4+Composite fluoride after activation Fluorophor, so as to be taken care of for a long time in the case where deteriorating fluorophor 22.
Especially, which contains fluorine, is dissolved in water (solubility is 1% degree) and generates fluorine Sour (HF).If in addition, drawing powder, harmful effect can be generated to human body, therefore operates powder needs and pays close attention to.
So by the way that being formed as rope form containing phosphor resin 20/120 and twining for this complex fluoride phosphor will be included Reel 30 is around in, so as to can also ensure that the safety of carrying and operation etc..
Therefore, according to the present embodiment, following effect is played, that is, can safely and chronically take care of comprising compound fluorination Object fluorophor contains phosphor resin 20/120 etc..
(summary)
Open reel involved by the form 1 of the present invention, which is characterized in that have:Reel and it is wound in the volume The rope form of disk contains phosphor resin.
In above-mentioned composition, rope form is wound in reel containing phosphor resin, so as to contain phosphor resin It concentrates to take care of smaller.Thus, it is possible to it improves containing the Portability of phosphor resin and easily carries.
In addition, in above-mentioned composition, by the way that being blocked containing phosphor resin to wish for the rope form of reel will be wound in Length, so as to be easy to get necessary deal containing phosphor resin.
Therefore, according to above-mentioned composition, the open reel for improving the operability containing phosphor resin can be realized.
In addition, in the open reel involved by form 2 of the invention, preferably on the basis of above-mentioned form 1, Described fluorophor at least to be made to be scattered in thermoplastic resin (silicone resin 21) containing phosphor resin, the thermoplastic resin is low In given crosslinking temperature (2 crosslinking temperature T1) at a temperature of there is thermoplasticity, at the temperature more than the crosslinking temperature It irreversibly harden.
In above-mentioned composition, the thermoplastic resin for being dispersed with fluorophor has the property that, i.e.,:Less than given friendship At a temperature of joining temperature there is thermoplasticity, irreversibly harden at the temperature more than the crosslinking temperature.Thus, by less than Make temperature change in the temperature region of given crosslinking temperature, so as to adjust the viscosity of thermoplastic resin repeatedly.
As a result, in the thermoplastic resin during mixing fluorophor, by being by mixing by the viscosity control of thermoplastic resin The degree that fluorophor afterwards does not deposit, so as to which fluorophor is made to be dispersed in thermoplastic resin.
Therefore, according to above-mentioned composition, can obtain the dispersibility for improving fluorophor rope form containing phosphor resin.
In addition, in the open reel involved by form 3 of the invention, on the basis of above-mentioned form 2, the friendship It can be 120 DEG C or more and less than 170 DEG C to join temperature.
In addition, in the open reel involved by form 4 of the invention, on the basis of above-mentioned form 2 or 3, institute Thermoplastic resin is stated also containing the solvent being made of benzene, toluene and dimethylbenzene.
In addition, in the open reel involved by form 5 of the invention, it is preferably any in above-mentioned form 1 to 4 On the basis of, it is described containing phosphor resin along the axis direction containing phosphor resin and with fluorophor amount mutually not Identical part.
In above-mentioned composition, since rope form has containing phosphor resin along the axis direction containing phosphor resin Have a mutually different part of fluorophor amount, thus for example by using containing the fluorophor amount among phosphor resin not With part seal each light-emitting component, so as to manufacturing the different luminescent device of the characteristics of luminescence.
Therefore, according to above-mentioned composition, being manufactured with a variety of luminous spies containing phosphor resin for rope form is utilized The luminescent device of property.
In addition, in the open reel involved by form 6 of the invention, it is preferably any in above-mentioned form 1 to 4 On the basis of, identical or different more than two of fluorophor amount described are wound in an institute containing phosphor resin State reel.
In above-mentioned composition, the rope form of 2 or more is wound in reel containing phosphor resin, therefore can will be multiple A reel is concentrated on containing phosphor resin to take care of.Therefore, it according to above-mentioned composition, can easily carry out multiple containing fluorescence Keeping/carrying of body resin etc..
The present invention is not limited to above-mentioned each embodiments, and various changes can be carried out in the range shown in claim More, disclosed technological means and the embodiment that obtains also are contained in the technology of the present invention to appropriately combined different embodiments respectively In the range of.
In addition, in above-mentioned each embodiment, although by the sealing that light-emitting component is used for containing phosphor resin of rope form, But the purposes containing phosphor resin of rope form is not limited to the sealing of light-emitting component, can be used for other purposes.For example, In LED light bulb, when containing phosphor resin is coated in the light bulb of the LED light bulb, the tree containing fluorophor of rope form can also be used Fat.Phosphor resin is contained by the light bulb coating in LED light bulb, so as to which the heat of fluorophor is put into light bulb.Thus, If fluorophor is excited, light and heat are transformed to, but because the heat can be reached to light bulb and from light bulb to entire surface (in air), Or it conducts heat from light bulb to framework, therefore thermal diffusivity is excellent.
(supplement)
In addition, open reel according to the present invention can also show as follows.That is, volume according to the present invention It coils around sealing resin, which is characterized in that by reel and the structure of sealing resin containing fluorophor for the rope form for being wound in the reel Into.
In addition, in coil-winding sealing resin according to the present invention, it is preferred that the sealing resin containing fluorophor Including at least thermoplastic resin and fluorophor, the thermoplastic resin has thermoplastic at a temperature of less than given crosslinking temperature Property is irreversibly harden at the temperature more than the crosslinking temperature.
In addition, in coil-winding sealing resin according to the present invention, it is preferred that the crosslinking temperature is 120 DEG C Above and less than 170 DEG C.
In addition, in coil-winding sealing resin according to the present invention, it is preferred that the thermoplastic resin contain by The solvent that benzene, toluene and dimethylbenzene are formed.
In addition, in coil-winding sealing resin according to the present invention, it is preferred that the rope form containing fluorophor it is close Envelope resin partly (by each region) makes the amount of fluorophor variable.
In addition, in coil-winding sealing resin according to the present invention, it is preferred that the fluorophor of two or more is contained The resin of the identical or different rope form for the amount of having ties together and is wound in reel.
Industrial availability
The present invention can be used in the back of the body using LED etc. as the display device, luminaire, display of light source etc. extensively In manufactures of luminescent device utilized such as light lamp, semaphore, the giant display of outdoor, billboard etc..
Symbol description
1 open reel
The open reels of 1a
20 contain phosphor resin
21 silicone resins (thermoplastic resin)
22 fluorophor
23 plasticizer
24 mixture of powders
25 homomixtures
30 reels
37 twin-screw extruder devices
37a screw rods
37b outlets
101 open reels
120 contain phosphor resin
125 homomixtures
T12 crosslinking temperatures (crosslinking temperature)

Claims (5)

1. a kind of open reel, which is characterized in that have:
Reel;With
Rope form contains phosphor resin, is wound in the reel,
The phosphor resin that contains is at least fluorophor to be made to be scattered in obtained from thermoplastic resin,
The thermoplastic resin is that have thermoplasticity at a temperature of less than given crosslinking temperature, more than the crosslinking temperature At a temperature of the silicone resin that irreversibly harden,
It is described along the axis direction containing phosphor resin and mutually different with fluorophor amount containing phosphor resin Part.
2. open reel according to claim 1, which is characterized in that
The crosslinking temperature is 120 DEG C or more and less than 170 DEG C.
3. open reel according to claim 1, which is characterized in that
The thermoplastic resin contains the solvent being made of benzene, toluene and dimethylbenzene.
4. open reel according to claim 1, which is characterized in that
Identical or different more than two of fluorophor amount described are wound in a reel containing phosphor resin.
5. a kind of open reel, which is characterized in that have:
Reel;With
Rope form contains phosphor resin, is wound in the reel,
It is described along the axis direction containing phosphor resin and mutually different with fluorophor amount containing phosphor resin Part.
CN201480021178.2A 2013-04-15 2014-03-24 Open reel Expired - Fee Related CN105164824B (en)

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JPWO2014171268A1 (en) 2017-02-23

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