CN105161446A - 半导体mgp塑封模全自动高效排放料饼设备 - Google Patents

半导体mgp塑封模全自动高效排放料饼设备 Download PDF

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CN105161446A
CN105161446A CN201510677610.XA CN201510677610A CN105161446A CN 105161446 A CN105161446 A CN 105161446A CN 201510677610 A CN201510677610 A CN 201510677610A CN 105161446 A CN105161446 A CN 105161446A
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王铁生
徐勇
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SHENZHEN HUALONG PRECISE MOLD CO Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping

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Abstract

本发明公开了一种半导体MGP塑封模全自动高效排放料饼设备，包括机箱，所述机箱上方设置有工作台，所述机箱内设置有储存推送模块，所述工作台上设置有投放机械手和固定夹具，所述投放机械手可沿工作台横向或者纵向移动，所述固定夹具上固定设置有工件，所述储存推送模块将料饼推送至投放机械手后，所述投放机械手自动移动至工件上方在指定位置投放料饼。提高了自动化程度，减少员工生产强度，保护了员工身体健康，提高了生产效率及生产能力，同时避免了产品中因人工操作带来的杂质混入，改善了生产环境；提高产品品质，由于自动排放料装置，可以检测到有无排放料，若少排料时可以及时提醒并自动补充。

Description

半导体MGP塑封模全自动高效排放料饼设备
技术领域
本发明涉及自动放料设备领域，具体涉及一种半导体MGP塑封模全自动高效排放料饼设备。
背景技术
半导体产业景气的上升推动着国内电子封装技术的进步，中国的半导体制造业正慢慢进入成熟阶段，超高速计算机、数字化视听、移动通讯和便携式电子机器的火爆出现，直接带动芯片电子封装技术的进步，制造行业的智能化越来越高。但半导体集成电路塑封的自动化程度还是不高，用人工工作量比较大，工人劳动强度大，效率低，人工成本高，与工业4.0背道而驰。尤其贴片封装的MGP塑封模(多缸注塑模)，根据产品种类的不同，每一模次的料饼数量有2到40个不等。
在工作时，往往是采用完全的手工投料，这样操作起来极为不方便，操作时会出现投料不准、时间耗费大、影响产品品质，同时容易少放料，影响工作效率，一旦少放料造成产品缺封直接降低产品的成品率。
发明内容
针对上述问题，本发明旨在提供一种结构紧凑、空间利用率高且效率高的半导体MGP塑封模全自动高效排放料饼设备。
为实现该技术目的，本发明的方案是：一种半导体MGP塑封模全自动高效排放料饼设备，包括机箱，所述机箱上方设置有工作台，所述机箱内设置有储存推送模块，所述工作台上设置有投放机械手和固定夹具，所述投放机械手可沿工作台横向或者纵向移动，所述固定夹具上固定设置有工件，所述储存推送模块将料饼推送至投放机械手后，所述投放机械手自动移动至工件上方在指定位置投放料饼。
作为优选，所述储存推送模块包括震动料斗、接送管、推送通道、推料杆、气缸、轨道，所述震动料斗内放置有料饼，所述震动料斗下方连接有接送管，所述接送管侧面设置有推送通道，所述气缸可将接送管水平推至与推送通道连接，所述推送通道下方设置有推料杆，所述推料杆设置在轨道上。
作为优选，所述投放机械手包括投放模块、横向驱动模块和纵向驱动模块，所述纵向驱动模块设置在工作台上，所述横向驱动模块设置在纵向驱动模块上，所述投放模块设置在纵向驱动块上。
作为优选，所述投放模块前端设置有用于存放料饼的料仓，所述料仓为空心柱形结构。
作为优选，所述投放模块底部设置有用于检测是否投放料饼的检测传感器。
作为优选，所述推送通道为四个导杆组成的空心柱形结构，所述导杆为高硬度镀铬光杆。
作为优选，所述投放机械手为两轴全密封高精密丝杆模组。
本发明的有益效果，提高了自动化程度，减少员工生产强度，保护了员工身体健康，提高了生产效率及生产能力，同时避免了产品中因人工操作带来的杂质混入，改善了生产环境；提高产品品质，由于自动排放料装置，可以检测到有无排放料，若少排料时可以及时提醒并自动补充。
附图说明
图1为本发明的结构示意图；
图2为本实用的主视图。
具体实施方式
下面结合附图和具体实施例对本发明做进一步详细说明。
如图1、2所示，本发明所述的具体实施例为一种半导体MGP塑封模全自动高效排放料饼设备，包括机箱1，所述机箱1上方设置有工作台2，所述机箱1内设置有储存推送模块3，所述工作台2上设置有投放机械手4和固定夹具5，所述投放机械手4可沿工作台2横向或者纵向移动，所述固定夹具5上固定设置有工件，所述储存推送模块3将料饼推送至投放机械手4后，所述投放机械手4自动移动至工件上方在指定位置投放料饼。
所述储存推送模块3包括震动料斗31、接送管32、推送通道33、推料杆34、气缸35、轨道36，所述震动料斗31内放置有料饼，所述震动料斗31下方连接有接送管32，所述接送管32侧面设置有推送通道33，所述气缸35可将接送管32水平推至与推送通道33连接，所述推送通道33下方设置有推料杆34，所述推料杆34设置在轨道36上。料饼的上料方式为内置，即动力采用专用震动料斗，进入接送管后把料饼一个个按要求排好队，气缸将接送管水平推至推送通道下方，推送杆上升将料饼推至推送通道。推料杆采用圆形棒料设计，并在推杆下方增加防误功能，不但能保证料饼提升过程中快速，平稳。而且能够在料饼异常情况下，能够及时判断并处理。投放机械手一次可以存放1-15颗料饼，可在***待机时自动存料。当***需要排料时，即可在极短的时间内将料饼摆放完成。所述储存推送模块置于工作平台下方，使得料饼存放在工作平台下，设计可以有效节省操作空间，而且使用过程中储存推送模块与投放机械手之间也不会发生冲突；同时再投放机械手投料过程中自动通过震动料斗进行料饼准备工作，投放完后，能够立刻通过推通道进行补料，能够有效提高工作效率。
所述投放机械手4包括投放模块41、横向驱动模块42和纵向驱动模块43，所述纵向驱动模块43设置在工作台2上，所述横向驱动模块42设置在纵向驱动模块43上，所述投放模块41设置在纵向驱动块43上。投放机械手通过纵向横向的移动将料饼投放至相应位置。
所述投放模块41前端设置有用于存放料饼的料仓44，所述料仓44为四个导杆组成的空心柱形结构。所述推送通道33为空心柱形结构，所述导杆37为高硬度镀铬光杆。所述投放模块41底部设置有用于检测是否投放料饼的检测传感器45。由于避免粉尘粘附在检测传感器镜头上。所以在传感器镜头侧面增加吹气清洁镜头功能。
所述投放机械手4为两轴全密封高精密丝杆模组。投放机械手不但能够保证排料时定位的高速稳定，还能降低高速运行中所产生的噪音。并能延长模组的使用寿命一倍以上。
以上所述，仅为本发明的较佳实施例，并不用以限制本发明，凡是依据本发明的技术实质对以上实施例所作的任何细微修改、等同替换和改进，均应包含在本发明技术方案的保护范围之内。

Claims (7)

1.半导体MGP塑封模全自动高效排放料饼设备，包括机箱，所述机箱上方设置有工作台，其特征在于：所述机箱内设置有储存推送模块，所述工作台上设置有投放机械手和固定夹具，所述投放机械手可沿工作台横向或者纵向移动，所述固定夹具上固定设置有工件，所述储存推送模块将料饼推送至投放机械手后，所述投放机械手自动移动至工件上方在指定位置投放料饼。
2.根据权利要求1所述的半导体MGP塑封模全自动高效排放料饼设备，其特征在于：所述储存推送模块包括震动料斗、接送管、推送通道、推料杆、气缸、轨道，所述震动料斗内放置有料饼，所述震动料斗下方连接有接送管，所述接送管侧面设置有推送通道，所述气缸可将接送管水平推至与推送通道连接，所述推送通道下方设置有推料杆，所述推料杆设置在轨道上。
3.根据权利要求2所述的半导体MGP塑封模全自动高效排放料饼设备，其特征在于：所述投放机械手包括投放模块、横向驱动模块和纵向驱动模块，所述纵向驱动模块设置在工作台上，所述横向驱动模块设置在纵向驱动模块上，所述投放模块设置在纵向驱动块上。
4.根据权利要求2所述的半导体MGP塑封模全自动高效排放料饼设备，其特征在于：所述投放模块前端设置有用于存放料饼的料仓，所述料仓为空心柱形结构。
5.根据权利要求2所述的半导体MGP塑封模全自动高效排放料饼设备，其特征在于：所述投放模块底部设置有用于检测是否投放料饼的检测传感器。
6.根据权利要求2所述的半导体MGP塑封模全自动高效排放料饼设备，其特征在于：所述推送通道为四个导杆组成的空心柱形结构，所述导杆为高硬度镀铬光杆。
7.根据权利要求2所述的半导体MGP塑封模全自动高效排放料饼设备，其特征在于：所述投放机械手为两轴全密封高精密丝杆模组。
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CN115744244A (zh) * 2022-11-07 2023-03-07 铜陵富仕三佳机器有限公司 一种高速料饼装载机
CN117558669A (zh) * 2024-01-12 2024-02-13 深圳市杰诺特精密技术有限公司 一种半导体塑封辅助设备应用自动投胶机构

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CN110970336A (zh) * 2018-09-27 2020-04-07 湖南嘉业达电子有限公司 一种用于压电元件的压电陶瓷基片处理装置
CN110970336B (zh) * 2018-09-27 2022-05-03 湖南嘉业达电子有限公司 一种用于压电元件的压电陶瓷基片处理装置
CN111650893A (zh) * 2020-04-01 2020-09-11 安徽大华半导体科技有限公司 一种芯片料饼自动投放控制方法及***
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