CN105137662B - Substrate and preparation method thereof, display device - Google Patents
Substrate and preparation method thereof, display device Download PDFInfo
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- CN105137662B CN105137662B CN201510666827.0A CN201510666827A CN105137662B CN 105137662 B CN105137662 B CN 105137662B CN 201510666827 A CN201510666827 A CN 201510666827A CN 105137662 B CN105137662 B CN 105137662B
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- substrate
- oriented layer
- layer
- dottle pin
- bottom plate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
- G02F1/13378—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
- G02F1/133788—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation by light irradiation, e.g. linearly polarised light photo-polymerisation
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a kind of substrate and preparation method thereof, display device, the substrate includes underlay substrate, and the dottle pin area of oriented layer and corresponding spacer material is provided with the underlay substrate, wherein, the oriented layer is arranged on the region outside the dottle pin area.Substrate provided by the invention, by the region being arranged on oriented layer outside dottle pin area, when the display panel formed is pressed, it can avoid producing friction between the substrate of oriented layer corresponding thereto thereon, and then the generation of PI film chips can be reduced.
Description
Technical field
The present invention relates to display field, more particularly to a kind of substrate and preparation method thereof, display device.
Background technology
Liquid crystal display (Thin Film Transistor Liquid Crystal Display, abbreviation TFT-LCD) has
There is the features such as small volume, low in energy consumption, radiationless, leading position is occupied in current flat panel display market.
Liquid crystal display panel includes the array base palte and color membrane substrates set to box, and is filled in array base palte and color film
Liquid crystal layer between substrate, wherein, thickness of liquid crystal layer (i.e. box is thick) mainly passes through the dottle pin between array base palte and color membrane substrates
Thing is controlled, in addition, to make the liquid crystal molecule in liquid crystal layer be arranged according to default direction, array base palte and color membrane substrates
The superiors are coated with oriented layer (PI films), however, when liquid crystal display panel is pressed, dottle pin is corresponded in liquid crystal display panel
On the position of thing, phase mutual friction can occur between the oriented layer on array base palte and the oriented layer on color membrane substrates, with panel
Being continuously increased for number is pressed, can gradually produce PI film chips, and chip is moved to viewing area and easily causes Zara (light leak)
Etc. bad.
The content of the invention
(1) technical problems to be solved
The technical problem to be solved in the present invention is：How the generation of in liquid crystal display panel PI film chip is reduced.
(2) technical scheme
In order to solve the above technical problems, technical scheme provides a kind of substrate, including underlay substrate, the lining
The dottle pin area of oriented layer and corresponding spacer material is provided with substrate, wherein, the oriented layer be arranged on the dottle pin area it
Outer region.
Preferably, black matrix layer, chromatic filter layer and the spacer material, the dottle pin area are provided with the underlay substrate
To set the region of the spacer material.
Preferably, grid line, data wire and thin film transistor (TFT) are provided with the underlay substrate, the dottle pin area is setting institute
State the region of thin film transistor (TFT).
In order to solve the above technical problems, present invention also offers a kind of display device, including above-mentioned substrate.
In order to solve the above technical problems, present invention also offers a kind of preparation method of substrate, the substrate includes substrate
Substrate, the dottle pin area of oriented layer and corresponding spacer material is provided with the underlay substrate, wherein, the shape on the underlay substrate
Include into the oriented layer：
Region outside the dottle pin area forms the oriented layer.
Preferably, the region outside the dottle pin area forms the oriented layer and included：
The oriented layer is formed using transfer printing board, the transfer plate includes bottom plate, multiple projections is provided with the bottom plate,
It is the multiple it is raised between be provided with gap for storing orientation liquid, the gap be arranged on the bottom plate it is corresponding it is described every
Pad the region outside area.
Preferably, the multiple raised including first raised and the second projection, each first projection is on the bottom plate
Area coverage be more than each second raised area coverage on the bottom plate, first projection is arranged on the bottom plate
The region in the upper correspondence dottle pin area, second projection are arranged on the region corresponded on the bottom plate outside the dottle pin area.
Preferably, the region outside the dottle pin area forms the oriented layer and included：
Alignment films are formed in the underlay substrate；
Photoetching agent pattern is formed in the alignment films, the photoetching agent pattern includes photoresist reserved area and photoresist is gone
Except area, the photoresist removes area and corresponds to the dottle pin area；
The alignment films that the photoresist removes area are removed, form the oriented layer.
Preferably, also include before the oriented layer being formed on the underlay substrate：Formed on the underlay substrate
Black matrix layer, chromatic filter layer and the spacer material.
Preferably, also include before the oriented layer being formed on the underlay substrate：Formed on the underlay substrate
Grid line, data wire and thin film transistor (TFT).
(3) beneficial effect
Substrate provided by the invention, by the region being arranged on oriented layer outside dottle pin area, in the display surface formed
When plate is pressed, it can avoid producing friction between the substrate of oriented layer corresponding thereto thereon, and then it is broken to reduce PI films
The generation of bits.
Brief description of the drawings
Fig. 1 is a kind of schematic diagram for substrate that embodiment of the present invention provides；
Fig. 2 is the schematic diagram for another substrate that embodiment of the present invention provides；
Fig. 3 is a kind of schematic diagram for display device that embodiment of the present invention provides；
Fig. 4 is a kind of schematic diagram for transfer printing board that embodiment of the present invention provides；
Fig. 5 is the schematic cross-section in AA ' directions in Fig. 4；
Fig. 6-10 is a kind of schematic diagram that oriented layer is made on substrate that embodiment of the present invention provides；
Figure 11-15 is another schematic diagram that oriented layer is made on substrate that embodiment of the present invention provides.
Embodiment
With reference to the accompanying drawings and examples, the embodiment of the present invention is described in further detail.Implement below
Example is used to illustrate the present invention, but is not limited to the scope of the present invention.
Embodiment of the present invention provides a kind of substrate, and the substrate includes underlay substrate, is provided with the underlay substrate
The dottle pin area of oriented layer and corresponding spacer material, the oriented layer are arranged on the region outside the dottle pin area.
The substrate that embodiment of the present invention provides, by the region being arranged on oriented layer outside dottle pin area, is being formed
Display panel when being pressed, can avoid producing friction between the substrate of oriented layer corresponding thereto thereon, and then can subtract
The generation of few PI film chips.
Wherein, the substrate in the present invention can be color membrane substrates, or array base palte, dottle pin area thereon is right
After box technique with the region of spacer material face in display panel, for example, because spacer material is typically produced on coloured silk by existing technique
In ilm substrate, the dottle pin area on color membrane substrates is the region for setting spacer material, and for array base palte, to avoid spacer material pair
The influence of display panel aperture opening ratio, its dottle pin area can be the region for setting thin film transistor (TFT) (TFT).
Referring to Fig. 1, Fig. 1 is a kind of schematic diagram for substrate that embodiment of the present invention provides, and the substrate is color membrane substrates, its
Including underlay substrate 110, black matrix layer, chromatic filter layer, spacer material 120 and oriented layer are provided with underlay substrate 110
130, wherein, oriented layer 130 is arranged on the region outside spacer material 120.
Referring to Fig. 2, Fig. 2 is the schematic diagram for another substrate that embodiment of the present invention provides, and the substrate is array base palte,
It includes underlay substrate 210, and grid line, data wire, thin film transistor (TFT) 220 and oriented layer 230 are provided with underlay substrate 210,
Wherein, oriented layer 230 is arranged on the region outside thin film transistor (TFT) 220.
Embodiment of the present invention additionally provides a kind of display device, including above-mentioned substrate.
Referring to Fig. 3, Fig. 3 is a kind of schematic diagram for display device that embodiment of the present invention provides, and the display device includes
The color membrane substrates and array base palte being oppositely arranged；
Wherein, color membrane substrates include underlay substrate 110, and spacer material 120 and oriented layer are provided with underlay substrate 110
130, wherein, oriented layer 130 is arranged on the region outside spacer material 120；
Array base palte includes underlay substrate 210, be provided with underlay substrate 210 oriented layer 230 and with spacer material 120 just
To the thin film transistor (TFT) 220 of setting, wherein, oriented layer 230 is arranged on the region outside thin film transistor (TFT) 220.
Wherein, the display device that embodiment of the present invention provides can be note-book computer display screen, liquid crystal display, liquid
Any product or part with display function such as brilliant TV, DPF, mobile phone, tablet personal computer.For example, the display device can
Think wearing display device.
The display device that embodiment of the present invention provides, by the way that the oriented layer on color membrane substrates and array base palte is set
Region outside dottle pin area, when the display device is pressed, the orientation of the two substrates on the position in dottle pin area can be avoided
Layer phase mutual friction, and then the generation of PI film chips can be reduced, avoid Zara (light leak) bad.
Embodiment of the present invention additionally provides a kind of preparation method of substrate, and the substrate includes underlay substrate, the lining
The dottle pin area of oriented layer and corresponding spacer material is provided with substrate, wherein, the orientation is formed on the underlay substrate
Layer includes：
Region outside the dottle pin area forms the oriented layer.
Include it is for instance possible to use in the following manner makes above-mentioned oriented layer：
The oriented layer is formed using transfer printing board, the transfer plate includes bottom plate, multiple projections is provided with the bottom plate,
It is the multiple it is raised between be provided with gap for storing orientation liquid, the gap be arranged on the bottom plate it is corresponding it is described every
Pad the region outside area.
Referring to Fig. 4, Fig. 4 be embodiment of the present invention provide a kind of transfer printing board (i.e. ARP plates) schematic diagram, the transfer printing board
Including bottom plate 310, the first projection 311 and the second projection 312 are provided with bottom plate 310, wherein, each first projection 311 exists
Area coverage on bottom plate 310 is more than each area coverage of the second projection 312 on bottom plate 310, and the first projection 311 is set
The region in dottle pin area is corresponded on bottom plate, the second projection 312 is arranged on the region corresponded on bottom plate outside dottle pin area；
Fig. 5 is the schematic cross-section in AA ' directions in Fig. 4, is taken as shown in figure 5, being provided between adjacent protrusion for storage
To the gap of liquid, first projection 311 larger by setting up area coverage, so as to change the position in gap on transfer printing board, and then
Orientation liquid can not be formed in transfer process on the raised position of substrate face first to be transferred；
Wherein, each first raised and the second projection area can be configured as the case may be, need to only turned
During print process, the position of dottle pin area face is not provided with gap on transfer printing board and substrate to be transferred, for example, first raised and the
Two it is raised can use height raised for 15um or so cylindrical type, the basal diameter of the first projection can for 70um~
90um, such as can be 80um, the second raised basal diameter can be 30um~50um, such as can be 40um.
Further, it is also possible to form above-mentioned oriented layer using patterned process technique, specifically include：
Alignment films are formed in the underlay substrate；
Photoetching agent pattern is formed in the alignment films, the photoetching agent pattern includes photoresist reserved area and photoresist is gone
Except area, the photoresist removes area and corresponds to the dottle pin area；
The alignment films that the photoresist removes area are removed, form the oriented layer.
For example, for the manufacturing process of color membrane substrates, it is specifically included：
S11：The structures such as black matrix layer, chromatic filter layer and spacer material are formed first on underlay substrate；
S12：As shown in Figure 6 one layer of alignment films 131 are formed on the surface of underlay substrate 110；
S13：One layer of photoresist layer 141 is formed on the surface of alignment films 131 as shown in Figure 7；
S14：Photoresist layer 141 is exposed using mask plate 410 as shown in Figure 8, wherein, it is right in photoresist layer 141
The regional exposure of spacer material 120 is answered, and other regions do not expose；
S15：Developing process is carried out, forms photoetching agent pattern 140 as shown in Figure 9, the photoresist on spacer material 120 is gone
Remove；
S16：The part exposed in alignment films 131 is performed etching, so as to form required oriented layer as shown in Figure 10,
Then get rid of remaining photoresist and form structure shown in Fig. 1.
For example, for the manufacturing process of array base palte, it is specifically included：
S21：The structures such as grid line, data wire and thin film transistor (TFT) are formed first on underlay substrate；
S22：As shown in figure 11 one layer of alignment films 231 are formed on the surface of underlay substrate 210；
S23：One layer of photoresist layer 241 is formed on the surface of alignment films 231 as shown in figure 12；
S24：Photoresist layer 241 is exposed using mask plate 420 as shown in figure 13, wherein, it is right in photoresist layer 241
The regional exposure of thin film transistor (TFT) 220 is answered, and other regions do not expose；
S25：Developing process is carried out, forms photoetching agent pattern 240 as shown in figure 14, the photoetching on thin film transistor (TFT) 220
Glue is removed；
S26：The part exposed in alignment films 231 is performed etching, so as to form required oriented layer as shown in figure 15,
Then get rid of remaining photoresist and form structure shown in Fig. 2.
The preparation method for the substrate that embodiment of the present invention provides, passes through the area being arranged on oriented layer outside dottle pin area
Domain, after to box technique, it can avoid producing friction between the substrate of oriented layer corresponding thereto thereon, and then PI can be reduced
The generation of film chip.
Embodiment of above is merely to illustrate the present invention, and not limitation of the present invention, about the common of technical field
Technical staff, without departing from the spirit and scope of the present invention, it can also make a variety of changes and modification, thus it is all
Equivalent technical scheme falls within scope of the invention, and scope of patent protection of the invention should be defined by the claims.
Claims (3)
1. a kind of preparation method of substrate, the substrate includes underlay substrate, be provided with the underlay substrate oriented layer and
The dottle pin area of corresponding spacer material, it is characterised in that the oriented layer is formed on the underlay substrate to be included：
Region outside the dottle pin area forms the oriented layer；
Region outside the dottle pin area, which forms the oriented layer, to be included：
The oriented layer is formed using transfer printing board, the transfer printing board includes bottom plate, multiple projections, institute are provided with the bottom plate
State it is multiple it is raised between be provided with gap for storing orientation liquid, the gap, which is arranged on the bottom plate, corresponds to the dottle pin
Region outside area；
It is the multiple raised big including first raised and the second projection, each first raised area coverage on the bottom plate
In each the second raised area coverage on the bottom plate, first projection be arranged on the bottom plate it is corresponding it is described every
The region in area is padded, second projection is arranged on the region corresponded on the bottom plate outside the dottle pin area.
2. the preparation method of substrate according to claim 1, it is characterised in that taken described in being formed on the underlay substrate
Also include before to layer：Black matrix layer, chromatic filter layer and the spacer material are formed on the underlay substrate.
3. the preparation method of substrate according to claim 1, it is characterised in that taken described in being formed on the underlay substrate
Also include before to layer：Grid line, data wire and thin film transistor (TFT) are formed on the underlay substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510666827.0A CN105137662B (en) | 2015-10-15 | 2015-10-15 | Substrate and preparation method thereof, display device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510666827.0A CN105137662B (en) | 2015-10-15 | 2015-10-15 | Substrate and preparation method thereof, display device |
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| Publication Number | Publication Date |
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| CN105137662A CN105137662A (en) | 2015-12-09 |
| CN105137662B true CN105137662B (en) | 2018-01-02 |
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| CN201510666827.0A Active CN105137662B (en) | 2015-10-15 | 2015-10-15 | Substrate and preparation method thereof, display device |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107933064B (en) * | 2017-11-10 | 2019-05-07 | 上海天马微电子有限公司 | A kind of transfer substrate and preparation method thereof |
| CN110703505A (en) | 2019-09-23 | 2020-01-17 | 武汉华星光电技术有限公司 | Transfer printing plate, manufacturing method of display panel and display panel |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3058384B2 (en) * | 1993-04-27 | 2000-07-04 | 松下電器産業株式会社 | Alignment film solution transfer plate |
| CN100339752C (en) * | 2002-08-19 | 2007-09-26 | 京东方显示器科技公司 | Transferring plate for forming orientation film |
| CN101441367A (en) * | 2008-12-29 | 2009-05-27 | 昆山龙腾光电有限公司 | Platen for printing distribution film |
| CN104317110A (en) * | 2014-11-21 | 2015-01-28 | 合肥京东方光电科技有限公司 | Transfer printing plate |
| CN104317111A (en) * | 2014-10-14 | 2015-01-28 | 深圳市华星光电技术有限公司 | Liquid crystal display panel |
| CN104678666A (en) * | 2015-03-19 | 2015-06-03 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3433353B2 (en) * | 1994-03-28 | 2003-08-04 | カシオ計算機株式会社 | Orientation material printing plate |
| JPH08194224A (en) * | 1995-01-18 | 1996-07-30 | Matsushita Electric Ind Co Ltd | Transfer plate for oriented film solution |
| JP3315063B2 (en) * | 1997-08-22 | 2002-08-19 | 株式会社 錦精社 | Printing plate for forming a thin film and method for forming a thin film using the printing plate for forming a thin film |
| JP2002293049A (en) * | 2001-03-29 | 2002-10-09 | Komuratekku:Kk | Resin relief printing plate for forming thin film |
| JP6035137B2 (en) * | 2012-12-19 | 2016-11-30 | 株式会社ジャパンディスプレイ | Alignment film printing plate and method of manufacturing liquid crystal display device |
-
2015
- 2015-10-15 CN CN201510666827.0A patent/CN105137662B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3058384B2 (en) * | 1993-04-27 | 2000-07-04 | 松下電器産業株式会社 | Alignment film solution transfer plate |
| CN100339752C (en) * | 2002-08-19 | 2007-09-26 | 京东方显示器科技公司 | Transferring plate for forming orientation film |
| CN101441367A (en) * | 2008-12-29 | 2009-05-27 | 昆山龙腾光电有限公司 | Platen for printing distribution film |
| CN104317111A (en) * | 2014-10-14 | 2015-01-28 | 深圳市华星光电技术有限公司 | Liquid crystal display panel |
| CN104317110A (en) * | 2014-11-21 | 2015-01-28 | 合肥京东方光电科技有限公司 | Transfer printing plate |
| CN104678666A (en) * | 2015-03-19 | 2015-06-03 | 京东方科技集团股份有限公司 | Display panel and preparation method thereof |
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| Publication number | Publication date |
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| CN105137662A (en) | 2015-12-09 |
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