CN105136325B - It is a kind of from encapsulation temperature sensor and preparation method thereof - Google Patents
It is a kind of from encapsulation temperature sensor and preparation method thereof Download PDFInfo
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- CN105136325B CN105136325B CN201510511210.1A CN201510511210A CN105136325B CN 105136325 B CN105136325 B CN 105136325B CN 201510511210 A CN201510511210 A CN 201510511210A CN 105136325 B CN105136325 B CN 105136325B
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Abstract
The invention discloses one kind from encapsulation temperature sensor, the temperature sensor includes flexible base board, lower metal electrode board, graphene layer and upper metal electrode board；Through hole is provided with flexible base board, graphene layer is located in the through hole of flexible base board；Upper metal electrode board is fixedly connected on the upper surface of flexible base board, and lower metal electrode board is fixedly connected on the lower surface of flexible base board, and the top surface of graphene layer is connected with the bottom surface of upper metal electrode board, and the bottom surface of graphene layer is connected with the top surface of lower metal electrode board.The temperature sensor sensitivity is high, and with flexibility, bio-compatibility is good.
Description
Technical field
The present invention relates to a kind of temperature sensor, it particularly relates to a kind of from encapsulation temperature sensor and its preparation side
Method.
Background technology
At present, people have invented various temperature sensors for detection temperature, are based especially on material temperature
The temperature sensor of degree-resistance variation characteristic.Wherein, thermal resistance temperature sensor is the resistance value using conductor or semiconductor
The principle for varying with temperature and changing carries out a kind of sensor temperature meter of thermometric.Current major part thermal resistance type temperature sensor
Made with metal, the most frequently used thermal resistance has platinum resistance thermometer sensor, and copper thermistor, but these sensors use non-flexible material
Material is made, can only the smooth object of measurement surface temperature, bio-compatibility is bad, and needs extra sensor encapsulation.
The content of the invention
Technical problem：In view of this, it is an object of the invention to provide one kind from encapsulation temperature sensor and its preparation side
Method, the temperature sensor sensitivity is high, and with flexibility, bio-compatibility is good.
Technical scheme：In order to solve the above technical problems, the technical scheme that the embodiment of the present invention is used is：
It is a kind of from encapsulation temperature sensor, the temperature sensor include flexible base board, lower metal electrode board, graphene layer and
Upper metal electrode board；Through hole is provided with flexible base board, graphene layer is located in the through hole of flexible base board；Upper metal electrode board is fixed
The upper surface of flexible base board is connected to, lower metal electrode board is fixedly connected on the lower surface of flexible base board, and the top of graphene layer
Face is connected with the bottom surface of upper metal electrode board, and the bottom surface of graphene layer is connected with the top surface of lower metal electrode board.
Preferably, described through hole is located at the middle part of flexible base board.
Preferably, described graphene layer is full of the through hole of flexible base board, and the upper surface of graphene layer and flexible base
The upper surface flush of plate, the lower surface of graphene layer is flushed with the lower surface of flexible base board.
Preferably, described flexible base board is made up of LCP materials.
Preferably, described flexible base board is fabricated to through hole by laser boring.
Preferably, the thickness of described flexible base board is between 50 to 100 micron；The thickness of lower metal electrode board is 12
To between 20 microns；Upper metal electrode board is by magnetron sputtering method formation in the upper surface of flexible base board and graphene layer.
A kind of above-mentioned preparation method from encapsulation temperature sensor, the preparation method comprises the following steps：
The first step：Laser boring is carried out to flexible base board, through hole is formed；
Second step：The surface of flexible base board one and metal foil are bonded using laminating, metal foil constitutes lower metal electrode board；
3rd step：Spin coating graphene oxide layer on flexible substrates, the through hole of the full flexible base board of graphene oxide layer filling,
Simultaneous oxidation graphene layer is covered in another surface of flexible base board；
4th step：It is heated at high temperature, graphene oxide layer is reduced into graphene film layer；
5th step：Scrape off the graphene film layer positioned at flexible base board surface, the graphene in flexible base board through hole
Film layer formation graphene layer；
6th step：Using magnetron sputtering method, layer of metal metal electrode board on flexible base board surface, formation is sputtered, on
Metal electrode board is connected with graphene layer, so that sensor is made.
Preferably, in the described first step：Through hole is located at the middle part of flexible base board；Flexible base board is made up of LCP materials.
Preferably, in the 4th described step：Described heating-up temperature is less than the melting temperature of flexible base board.
Beneficial effect：Compared with existing temperature sensor, the embodiment of the present invention has the advantages that：TEMP
The flexible deformation of device, can be arranged on the body surface detection temperature of arbitrary shape.In the case of flexural deformation, temperature sensor
Still being capable of normal work.The temperature sensor of the present embodiment is with low cost, can be widely used in biomedical and wearable set
The field such as standby.In addition, the temperature-sensing element (device) of temperature sensor is made using graphene, with certain flexibility, and making
On very easily temperature-sensing element (device) can be filled into the through hole of LCP substrates, have between LCP substrates good viscous
It is attached.In the through hole that graphene layer is filled in LCP substrates, without being located in LCP substrate surfaces.This causes graphene layer not only
It can work well in through-holes, and LCP substrates also serve the effect of protection to graphene layer, can then cause lower gold
Category battery lead plate and upper metal electrode board can be packaged to graphene layer.
Brief description of the drawings
Fig. 1 is the sectional view of temperature sensor in the embodiment of the present invention；
Fig. 2 is the structural representation of the preparation method first step in the embodiment of the present invention；
Fig. 3 is the structural representation of preparation method second step in the embodiment of the present invention；
Fig. 4 is the structural representation of the step of preparation method the 3rd in the embodiment of the present invention；
Fig. 5 is the structural representation of the step of preparation method the 4th in the embodiment of the present invention；
Fig. 6 is the structural representation of the step of preparation method the 5th in the embodiment of the present invention；
Fig. 7 is the structural representation of the step of preparation method the 6th in the embodiment of the present invention.
Have in figure：Flexible base board 1, lower metal electrode board 2, graphene layer 3, upper metal electrode board 4, graphene oxide layer 5,
Graphene film layer 6.
Embodiment
Below in conjunction with the accompanying drawings, technical scheme is described in detail.
As shown in figure 1, the embodiment of the present invention is a kind of from encapsulation temperature sensor, it is characterised in that the temperature sensor
Including flexible base board 1, lower metal electrode board 2, graphene layer 3 and upper metal electrode board 4；Through hole, graphite are provided with flexible base board 1
Alkene layer 3 is located in the through hole of flexible base board 1；Upper metal electrode board 4 is fixedly connected on the upper surface of flexible base board 1, lower metal electricity
Pole plate 2 is fixedly connected on the lower surface of flexible base board 1, and the top surface of graphene layer 3 is connected with the bottom surface of upper metal electrode board 4,
The bottom surface of graphene layer 3 is connected with the top surface of lower metal electrode board 2.
The course of work of the flexibility temperature sensor of said structure is：Object under test surface temperature is by lower metal electrode board 2
Graphene layer 3 is transmitted to, causes the resistance of graphene layer 3 to change, resistance variations are by upper metal electrode board 4 and lower metal electrode
Plate 2 is exported, and finally reaches the purpose for measuring body surface temperature value.According in advance to body surface temperature and temperature-sensing element (device)
Resistance carry out data fitting calibrating, obtain resistance temperature relation, then according to the resistance of actually measured temperature-sensing element (device)
Change, the temperature value of measurement point needed for obtaining.
The temperature sensor of said structure has from encapsulation effect.It is used as the graphite of temperature-sensing element (device) in temperature sensor
In alkene layer 3, the through hole for being filled in flexible base board 1, and covered by lower metal electrode 2 and upper metal electrode 4, so graphene layer 3
It is well-protected.In addition, the temperature sensor other parts do not need extra packaging protection.Therefore, this reality
Apply example temperature sensor have carry encapsulation effect.Meanwhile, the temperature sensor includes flexible base board 1, lower metal electrode board
2nd, graphene layer 3 and upper metal electrode board 4.These parts all have certain pliability in itself, so that the TEMP
Device integrally has pliability, can with testee surface Bending Deformation, such as human body skin and some surface irregularities thing
Body, all flexible deformation is attached to testee surface measurement its surface temperature.
In the temperature sensor of said structure, lower metal electrode board 2 and upper metal electrode board 4 can be with used interchangeablies.This reality
In the temperature sensor for applying example, lower metal electrode board 2 plays a part of identical with upper metal electrode board 4.Metal is that the good of heat is led
Body.Temperature from lower metal electrode board 2 and upper metal electrode board 4 any one environment temperature can be passed to graphite well
Alkene layer 3.The resistance variations of graphene layer 3, are exported by lower metal electrode board 2 and upper metal electrode board 4, the lower He of metal electrode board 2
Upper metal electrode board 4 plays a part of identical, and the following metal electrode board 2 of institute and upper metal electrode board 4 can be with used interchangeablies.
In addition, graphene layer 3 is filled in the through hole of flexible base board 1, the surface without being provided in flexible base board 1.This causes stone
While black alkene layer 3 works in through-holes, flexible base board 1 also serves the effect of protection to graphene layer 3, it is not necessary in addition again
Graphene layer 3 is encapsulated.
Preferably, described through hole is located at the middle part of flexible base board 1.
Preferably, described graphene layer 3 be full of flexible base board 1 through hole, and the upper surface of graphene layer 3 with
The upper surface flush of flexible base board 1, the lower surface of graphene layer 3 is flushed with the lower surface of flexible base board 1.Stone can be made by so setting
Black alkene layer 3 links together well with lower metal electrode 2 and upper metal electrode 4.
Preferably, described flexible base board 1 is made up of LCP materials.Polymeric liquid crystal copolymer is (in text referred to as
LCP it is) that a kind of mobility be made up of rigid molecule chain, the existing liquid under certain physical condition has the physical of crystal again
The polymer substance of energy anisotropy (this state is referred to as liquid crystal state).It is many unique that LCP has the advantages that, be for example lost it is small, into
This low, frequency of use scope is big, intensity is high, lightweight, heat resistance and anti-flammability are strong, linear expansion coefficient is small, corrosion resistance and resistance to
Radiance is good, the forming temperature of CP films is low, the excellent moulding processability with flexible and foldability, can be used for
The various products with the complicated shape such as arc and bending.Through hole on flexible base board 1 is made up of laser boring.
Preferably, the thickness of described flexible base board 1 is between 50 to 100 micron；The thickness of lower metal electrode board 2
Spend between 12 to 20 microns；Upper metal electrode board 4 is by magnetron sputtering method formation in the upper of flexible base board 1 and graphene layer 3
Surface.The thickness of flexible base board 1 is more than the thickness of lower metal electrode board 2 and the thickness of upper metal electrode board 4.This just passes temperature
Sensor has good flexibility, and otherwise the pliability of sensor is not good.
A kind of above-mentioned preparation method from encapsulation temperature sensor, the preparation method comprises the following steps：
The first step：Laser boring is carried out to flexible base board 1, through hole is formed；
Second step：The surface of flexible base board 1 one and metal foil are bonded using laminating, metal foil constitutes lower metal electrode board
2；
3rd step：Spin coating graphene oxide layer 5 on a flexible substrate 1, the full flexible base board 1 of filling of graphene oxide layer 5
Through hole, simultaneous oxidation graphene layer 5 is covered in another surface of flexible base board 1；
4th step：It is heated at high temperature, graphene oxide layer 5 is reduced into graphene film layer 6；
5th step：Scrape off the graphene film layer 6 positioned at the surface of flexible base board 1, the graphite in the through hole of flexible base board 1
The formation graphene layer 3 of alkene film layer 6；
6th step：Using magnetron sputtering method, layer of metal metal electrode board 4 on the surface of flexible base board 1, formation is sputtered,
Upper metal electrode board 4 is connected with graphene layer 3, so that sensor is made.
Preferably, in the described first step：Through hole is located at the middle part of flexible base board 1；Flexible base board 1 is by LCP material systems
Into.In the 4th described step：Described heating-up temperature is less than the melting temperature of flexible base board 1.
The embodiment of the present invention, as the Intermediate substrate of temperature sensor, utilizes graphene layer 3 using organic flexible material LCP
As temperature-sensing element (device), when temperature from lower metal electrode board 2 or upper metal electrode board 4 passes to graphene layer 3, graphene layer 3
Resistance occur corresponding change, then resistance variations are exported from lower metal electrode board 2 and upper metal electrode board 4, survey is reached
Go out the purpose of body surface temperature value.
The basic principles, principal features and advantages of the present invention have been shown and described above.Those skilled in the art should
Understand, the present invention do not limited by above-mentioned specific embodiment, the description in above-mentioned specific embodiment and specification be intended merely into
One step illustrate the present invention principle, without departing from the spirit and scope of the present invention, the present invention also have various change and
Improve, these changes and improvements all fall within the protetion scope of the claimed invention.The scope of protection of present invention will by right
Ask book and its equivalent thereof.
Claims (3)
1. a kind of preparation method from encapsulation temperature sensor, it is characterised in that the temperature sensor includes flexible base board
(1), lower metal electrode board (2), graphene layer (3) and upper metal electrode board (4)；Through hole, graphene are provided with flexible base board (1)
Layer (3) is located in the through hole of flexible base board (1)；Upper metal electrode board (4) is fixedly connected on the upper surface of flexible base board (1), under
Metal electrode board (2) is fixedly connected on the lower surface of flexible base board (1), and the top surface and upper metal electrode board of graphene layer (3)
(4) bottom surface connection, the bottom surface of graphene layer (3) is connected with the top surface of lower metal electrode board (2)；
The temperature sensor preparation method comprises the following steps：
The first step：Laser boring is carried out to flexible base board (1), through hole is formed；
Second step：The surface of flexible base board (1) one and metal foil are bonded using laminating, metal foil constitutes lower metal electrode board
(2)；
3rd step：The spin coating graphene oxide layer (5) on flexible base board (1), the full flexible base board of graphene oxide layer (5) filling
(1) through hole, simultaneous oxidation graphene layer (5) is covered in another surface of flexible base board (1)；
4th step：It is heated at high temperature, graphene oxide layer (5) is reduced into graphene film layer (6)；
5th step：Scrape off the graphene film layer (6) positioned at flexible base board (1) surface, the stone in flexible base board (1) through hole
Black alkene film layer (6) forms graphene layer (3)；
6th step：Using magnetron sputtering method, layer of metal metal electrode board (4) on flexible base board (1) surface, formation is sputtered,
Upper metal electrode board (4) is connected with graphene layer (3), so that sensor is made.
2. according to described in claim 1 from encapsulation temperature sensor preparation method, it is characterised in that in the described first step：
Through hole is located at the middle part of flexible base board (1)；Flexible base board (1) is made up of LCP materials.
3. according to the preparation method from encapsulation temperature sensor described in claim 1, it is characterised in that the 4th described step
In：Described heating-up temperature is less than the melting temperature of flexible base board (1).
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Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105571738A (en) * | 2015-12-21 | 2016-05-11 | 清华大学 | Water temperature sensing device adopting woven net-shaped structure |
| CN105841836B (en) * | 2016-03-18 | 2019-12-27 | 南京邮电大学 | Novel transient temperature sensor |
| CN107655398B (en) * | 2017-09-13 | 2020-06-19 | 中国科学院深圳先进技术研究院 | High-sensitivity stretchable flexible strain sensor and preparation method thereof |
| CN108801535B (en) * | 2018-05-29 | 2020-11-13 | 浙江大学 | Self-packaging method of sheet-shaped flexible piezoresistive sensor |
| CN108801489B (en) * | 2018-06-22 | 2020-07-24 | 苏州大学 | Temperature sensor and preparation method thereof |
| CN109115366B (en) * | 2018-07-23 | 2020-05-26 | 放生（重庆）科技有限公司 | Preparation method of ear temperature detector and prepared ear temperature detector |
| CN110487438B (en) * | 2019-08-22 | 2021-05-18 | 中南大学 | Preparation method of sandwich-shaped flexible temperature sensor |
| CN110702248B (en) * | 2019-09-17 | 2020-12-18 | 江苏大学 | Thermoelectric sensor based on graphene material and preparation method thereof |
| CN113091939A (en) * | 2021-03-29 | 2021-07-09 | 哈尔滨工业大学 | Preparation method of high-sensitivity temperature sensor based on graphene/barium strontium titanate heterojunction |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103148952A (en) * | 2013-03-12 | 2013-06-12 | 上海第二工业大学 | Surface temperature test circuit based on graphene nanobelt and test method |
| CN103630254A (en) * | 2013-11-18 | 2014-03-12 | 西安电子科技大学 | Graphene temperature sensor and preparing process thereof |
| CN104374486A (en) * | 2014-11-13 | 2015-02-25 | 中国科学院重庆绿色智能技术研究院 | Flexible temperature sensor based on graphene nanometer wall and preparing method thereof |
| CN104390720A (en) * | 2014-12-03 | 2015-03-04 | 东南大学 | Graphene oxide based capacitive temperature sensor and production method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9178129B2 (en) * | 2012-10-15 | 2015-11-03 | The Trustees Of The Stevens Institute Of Technology | Graphene-based films in sensor applications |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103148952A (en) * | 2013-03-12 | 2013-06-12 | 上海第二工业大学 | Surface temperature test circuit based on graphene nanobelt and test method |
| CN103630254A (en) * | 2013-11-18 | 2014-03-12 | 西安电子科技大学 | Graphene temperature sensor and preparing process thereof |
| CN104374486A (en) * | 2014-11-13 | 2015-02-25 | 中国科学院重庆绿色智能技术研究院 | Flexible temperature sensor based on graphene nanometer wall and preparing method thereof |
| CN104390720A (en) * | 2014-12-03 | 2015-03-04 | 东南大学 | Graphene oxide based capacitive temperature sensor and production method thereof |
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