CN105130274B

CN105130274B - A kind of microwave composite medium substrate of high thermal stability and preparation method thereof

Info

Publication number: CN105130274B
Application number: CN201510414457.1A
Authority: CN
Inventors: 王丽婧; 张立欣; 宋永要; 庞子博; 徐永宽; 程红娟; 武聪
Original assignee: CETC 46 Research Institute
Current assignee: CETC 46 Research Institute
Priority date: 2015-07-15
Filing date: 2015-07-15
Publication date: 2017-07-21
Anticipated expiration: 2035-07-15
Also published as: CN105130274A

Abstract

The present invention relates to a kind of microwave composite medium substrate with high thermal stability and preparation method thereof, the mass fraction of raw material, which is matched, is, the wt% of inorganic filler 20 70, the wt% of glass fibre 1 10,1,3 butadiene, the wt% of isoprene copolymer system 20 80, the wt% of silane coupler 0.01 1.5；1. inorganic filler powder, glass fibre are carried out surface modification treatment by preparation method with silane coupler respectively；2. the inorganic filler powder and glass fibre after processing are sufficiently mixed uniformly；3. the mixture in 2. is added in 1,3 butadiene, isoprene copolymer system solution and adds initiator and be thoroughly mixed；4. mixed material solvent is dried, then by being extruded or injection molded under 50 150 DEG C of temperature, the MPa of pressure 2 20, obtains prepreg；5. after the prepreg cut and copper foil being combined, the h of hot pressed sintering 24 makes polymeric system crosslink polymerization under 80 220 DEG C of temperature, the MPa of pressure 4 20, composite medium substrate shapes, and beneficial effect is that substrate has stable electrically and mechanically performance, and preparation technology is simple.

Description

A kind of microwave composite medium substrate of high thermal stability and preparation method thereof

Technical field

It is more particularly to a kind of micro- with high thermal stability the present invention relates to a kind of microwave composite medium substrate technical field Ripple composite medium substrate and its preparation technology.

Background technology

Copper coated foil plate technology and production, have been subjected to the development history of over half a century, as in electronics and IT products The important component of basic material.With developing rapidly for electronics industry, the copper-clad plate of general performance can not have been met in recent years Carry out the demand of the electronic mounting high density interconnection of high speed development, and obtained in recent years with high performance microwave composite medium substrate Very big development.

At present, with electronic product to miniaturization, digitlization, multifunction and high reliability developing direction, electric base The device carried on plate plate is more and more, and the heat produced during work operation also increases therewith, and this is just to the hot steady of circuit substrate It is qualitative to propose higher requirement, therefore, not only there is relatively low Jie as the microwave composite medium substrate of component carrier Electrical loss, homogeneous dielectric constant, in addition it is also necessary to relatively low dielectric constant thermal change rate, and less thermal coefficient of expansion, With the stability for ensureing sheet fabrication reliability and using.

The content of the invention

In view of the need for technology development, the present invention provides microwave composite medium substrate and its preparation of a kind of high thermal stability Method, extensively, operating procedure is simple, environment-friendly, it is easy to large-scale production for the microwave composite medium substrate raw material, application Field is wide, with good market prospects, and concrete technical scheme is, a kind of microwave composite medium substrate of high thermal stability and Its preparation method, it is characterised in that：The mass fraction of various raw material is matched, inorganic filler：20-70 wt%, wherein, it is inorganic Filler is selected from alumina powder, SiO 2 powder, silicon carbide powder, barium titanate powder, calcium sulphate powders, boron nitride powder One or more, and including at least Ba₂Ti₉O₂₀Powder, glass fibre：1-10 wt%, 1,3-butadiene, isoprene copolymer System：20-80 wt%, wherein, 1,3-butadiene, isoprene copolymer system can be polybutadiene, polyisoprene, fourth two One or more in alkene-isoprene copolymer, silane coupler：0.01-1.5 wt%, initiator azodiisobutyronitrile is accounted for 1.0 % of polymeric system quality, because initiator amount is less, are not counted in formula for raw stock；Its preparation method, including it is as follows Step, 1. carries out surface modification treatment with silane coupler respectively by inorganic filler powder, glass fibre；2. by surface-active Inorganic filler powder and glass fibre after processing are sufficiently mixed uniformly；3. by the mixture in 2. be added to 1,3- butadiene, In isoprene copolymer system solution and add initiator azodiisobutyronitrile and be thoroughly mixed；4. it will mix equal After even material solvent drying, then by compound material by under 50-150 DEG C of temperature, pressure 2-20 MPa extrude or be molded Mode shapes, and obtains prepreg；5. after combining the prepreg cut and copper foil, in 80-220 DEG C of temperature, pressure Hot pressed sintering 2-4 h make polymeric system crosslink polymerization, composite medium substrate setting under power 4-20 MPa.

There is stable electrically and mechanically performance the beneficial effects of the invention are as follows microwave composite medium substrate, in sheet fabrication High with application aspect reliability, preparation technology is simple, environment-friendly, and raw material sources are convenient, are advantageously implemented industrialized production, can It is widely used in the high-tech areas such as communication, radar, satellite, high ferro, aircraft and high sophisticated weapons equipment.

Embodiment

Inorganic filler：46 wt% Ba₂Ti₉O₂₀Powder, 10 wt% SiO 2 powder, 0.5 wt% alumina powder End,

Glass fibre：4.0 wt%,

Butadiene isoprene copolymer：39.0 wt%,

Silane coupler：0.5 wt%,

Initiator azodiisobutyronitrile accounts for 1.0 % of polymeric system quality, because initiator amount is less, is not counted in original Material prescription.

Preparation process：1. first by Ba₂Ti₉O₂₀Powder, SiO 2 powder, alumina powder, glass fibre are respectively in first Acid solution is dispersed, adds silane coupler and mixing 2h is stirred at 100 DEG C, the nothing of surface modification treatment is obtained after drying Machine powder and glass fibre；

2. the inorganic powder and glass fibre after surface modification treatment are sufficiently mixed uniformly；

3. mixture is then added to the toluene solution for the butadiene isoprene copolymer that mass concentration is 7.5 wt% In, and add initiator azodiisobutyronitrile and be thoroughly mixed；

4. the material solvent after will be well mixed is dried, and compound material then is passed through into 50 DEG C of temperature, the MPa of pressure 10 Under shaped in the way of extrusion, obtain prepreg；

5. after finally the prepreg cut and copper foil being combined, the hot pressing under 120 DEG C of temperature, the MPa of pressure 10 Sintering 4 h makes polymeric system crosslink polymerization, and composite medium substrate shapes, after testing, the composite medium substrate prepared Dielectric constant is 3.2, and dielectric loss is 2 × 10^-3, ppm/ DEG C of temperature coefficient of permittivity 30, the axle thermal coefficient of expansions of X/Y/Z tri- 15/15/24 ppm/ DEG C, meet the microwave composite medium substrate of high thermal stability.

The microwave composite medium substrate index of high thermal stability：Dielectric constant is 2.5-6.5, temperature coefficient of permittivity - 40 ppm/ DEG C to+40 between ppm/ DEG C, thermal coefficient of expansion is less than 26 ppm/ DEG C.

Claims

1. microwave composite medium substrate of a kind of high thermal stability and preparation method thereof, it is characterised in that：The matter of various raw material Amount fraction, which is matched, is,

Inorganic filler：20-70 wt%,

Wherein, inorganic filler is selected from alumina powder, SiO 2 powder, silicon carbide powder, barium titanate powder, sulfuric acid calcium powder End, the one or more of boron nitride powder, and including at least Ba₂Ti₉O₂₀Powder,

Glass fibre：1-10 wt%,

1,3- butadiene, isoprene copolymer system：20-80 wt%,

Wherein, 1,3-butadiene, isoprene copolymer system can be polybutadiene, polyisoprene, butadiene-isoprene One or more in copolymer,

Silane coupler：0.01-1.5 wt%,

Initiator azodiisobutyronitrile accounts for 1.0 % of polymeric system quality, because initiator amount is less, is not counted in raw material Formula, said components weight sum is 100 %；

Its preparation method, comprises the following steps,

1. inorganic filler powder, glass fibre are subjected to surface modification treatment with silane coupler respectively；

2. the inorganic filler powder and glass fibre after surface-active-treatment are sufficiently mixed uniformly；

3. the mixture in 2. is added in 1,3- butadiene, isoprene copolymer system solution and to add initiator even Nitrogen bis-isobutyronitrile is thoroughly mixed；

4. the material solvent after will be well mixed is dried, and compound material then is passed through into 50-150 DEG C of temperature, pressure 2-20 The mode extruded or be molded under MPa shapes, and obtains prepreg；

5. after combining the prepreg cut and copper foil, hot pressing is burnt under 80-220 DEG C of temperature, pressure 4-20 MPa Knot 2-4 h make polymeric system crosslink polymerization, composite medium substrate setting.