CN105130274A - High-thermal-stability microwave composite dielectric substrate and preparation method thereof - Google Patents

Abstract

The invention relates to a high-thermal-stability microwave composite dielectric substrate and a preparation method thereof. The composite dielectric substrate includes following raw materials, by mass, 20-70% of an inorganic filling material, 1-10% of glass fibers, 20-80% of a 1,3-butadiene and isoprene polymer system and 0.01-1.5% of a silane coupling agent. The preparation method includes following steps: (1) performing surface modification treatment to the inorganic filling material powder and the glass fiber through the silane coupling agent respectively; (2) fully mixing the treated inorganic filling material powder and glass fiber uniformly; (3) adding the mixture in the step (2) to the 1,3-butadiene and isoprene polymer system solution with addition of an initiator and performing fully stirring and mixing; (4) drying the mixed material solution, and performing extrusion or injection moulding at 50-150 DEG C under 2-20 MPa; (5) combining cut a prepreg with copper foil, and performing hot-press sintering at 80-220 DEG C under 4-20 MPa for 2-4 h to enable the polymer system to be subjected to crosslinking polymerization, thereby moulding the composite dielectric substrate. The composite dielectric substrate is stable in electrical and mechanical performance, is simple in preparation technology and is wide in raw material source.

Description

Microwave composite medium substrate of a kind of high thermal stability and preparation method thereof

Technical field

The present invention relates to a kind of microwave composite medium substrate technical field, particularly a kind of microwave composite medium substrate and preparation technology thereof with high thermal stability.

Background technology

Copper coated foil plate technology and production, experienced by the development history of over half a century, now become the important component part of base mateiral in electronics and IT products.Along with developing rapidly of electronic industry, the copper-clad plate of general property can not meet the demand of the electronic mounting high density interconnect of high speed development in recent years, and has high performance microwave composite medium substrate and obtain very large development in recent years.

At present, along with electronic product is to the developing direction of miniaturization, digitizing, multifunction and high reliability, the device that electric substrate plate carries gets more and more, the heat produced when work runs also increases thereupon, this just has higher requirement to the thermostability of circuit substrate, therefore, microwave composite medium substrate as components and parts carrier not only will have lower dielectric loss, homogeneous specific inductivity, also need that there is lower specific inductivity thermal change rate, and less thermal expansivity, to ensure the stability of sheet fabrication reliability and use.

Summary of the invention

In view of the needs of technical development; microwave composite medium substrate that the invention provides a kind of high thermal stability and preparation method thereof, this microwave composite medium substrate raw material is extensive, and operating procedure is simple; environmental friendliness; be easy to mass-producing batch production, Application Areas is wide, has good market outlook; concrete technical scheme is; a microwave composite medium substrate for high thermal stability, various raw-material massfraction proportioning is

Mineral filler: 20-70wt%,

Wherein, mineral filler be selected from alumina powder, SiO 2 powder, silicon carbide powder, barium titanate powder, calcium sulphate powders, boron nitride powder one or more, and at least comprise Ba ₂ti ₉o ₂₀powder,

Glass fibre: 1-10wt%,

1,3-butadiene, isoprene copolymer system: 20-80wt%,

Wherein, 1,3-butadiene, isoprene copolymer system can be one or more in polyhutadiene, polyisoprene, butadiene isoprene copolymer,

Silane coupling agent: 0.01-1.5wt%.

Initiator Diisopropyl azodicarboxylate accounts for 1.0% of polymeric system quality, because initiator amount is less, is not counted in formula for raw stock.

A preparation method for the microwave composite medium substrate of high thermal stability, comprises the steps:

1. inorganic filler powder, glass fibre are carried out surface modification treatment with silane coupling agent respectively;

2. the inorganic filler powder after surface modification treatment and glass fibre are fully mixed;

3. the mixture in 2. to be joined in 1,3-butadiene, isoprene copolymer system solution and add initiator Diisopropyl azodicarboxylate and be fully uniformly mixed;

4. the material solvent after mixing is dried, then by compound material by temperature 50-150 DEG C, to extrude under pressure 2-20MPa or the mode of injection moulding is shaped, obtain prepreg;

5., after the prepreg cut and Copper Foil being combined, at temperature 80-220 DEG C, hot pressed sintering 2-4h under pressure 4-20MPa, make polymeric system generation crosslinking polymerization, composite medium substrate formalizes.

The invention has the beneficial effects as follows that microwave composite medium substrate has stable electric and mechanical property, sheet fabrication and application aspect reliability high, preparation technology is simple, environmental friendliness, raw material sources are convenient, be conducive to realizing suitability for industrialized production, the high-tech areas such as communication, radar, satellite, high ferro, aircraft and high sophisticated weapons equipment can be widely used in.

Embodiment

The Ba of mineral filler: 46wt% ₂ti ₉o ₂₀the SiO 2 powder of powder, 10wt%, the alumina powder of 0.5wt%,

Glass fibre: 4.0wt%,

Butadiene isoprene copolymer: 39.0wt%,

Silane coupling agent: 0.5wt%.

Initiator Diisopropyl azodicarboxylate accounts for 1.0% of polymeric system quality, because initiator amount is less, is not counted in formula for raw stock.

Preparation process: 1. first by Ba ₂ti ₉o ₂₀powder, SiO 2 powder, alumina powder, glass fibre are dispersed at formic acid solution respectively, add silane coupling agent and carry out being uniformly mixed 2h at 100 DEG C, obtain inorganic powder and the glass fibre of surface modification treatment after oven dry;

2. the inorganic powder after surface modification treatment and glass fibre are fully mixed;

3. mixture being joined again mass concentration is in the toluene solution of the butadiene isoprene copolymer of 7.5wt%, and adds initiator Diisopropyl azodicarboxylate and be fully uniformly mixed;

4. the material solvent after mixing is dried, then by compound material by being shaped in the mode extruded under temperature 50 C, pressure 10MPa, obtain prepreg;

5. last the prepreg cut and Copper Foil are combined after, under temperature 120 DEG C, pressure 10MPa, hot pressed sintering 4h makes polymeric system generation crosslinking polymerization, and composite medium substrate formalizes, after testing, the composite medium substrate specific inductivity prepared is 3.2, and dielectric loss is 2 × 10 ^-3, temperature coefficient of permittivity 30ppm/ DEG C, X/Y/Z tri-axle thermal expansivity 15/15/24ppm/ DEG C, meets the microwave composite medium substrate of high thermal stability.

The microwave composite medium substrate index of high thermal stability: specific inductivity is 2.5-6.5, and temperature coefficient of permittivity is between-40ppm/ DEG C to+40ppm/ DEG C, and thermal expansivity is less than 26ppm/ DEG C.

Claims (2)

1. a microwave composite medium substrate for high thermal stability, is characterized in that: various raw-material massfraction proportioning is,

Mineral filler: 20-70wt%,

Wherein, mineral filler be selected from alumina powder, SiO 2 powder, silicon carbide powder, barium titanate powder, calcium sulphate powders, boron nitride powder one or more, and at least comprise Ba ₂ti ₉o ₂₀powder,

Glass fibre: 1-10wt%,

1,3-butadiene, isoprene copolymer system: 20-80wt%,

Wherein, 1,3-butadiene, isoprene copolymer system can be one or more in polyhutadiene, polyisoprene, butadiene isoprene copolymer,

Silane coupling agent: 0.01-1.5wt%.

2. initiator Diisopropyl azodicarboxylate accounts for 1.0% of polymeric system quality, because initiator amount is less, is not counted in formula for raw stock;

A preparation method for the microwave composite medium substrate of high thermal stability, is characterized in that: comprise the steps,

1. inorganic filler powder, glass fibre are carried out surface modification treatment with silane coupling agent respectively;

2. the inorganic filler powder after surface modification treatment and glass fibre are fully mixed;

3. the mixture in 2. to be joined in 1,3-butadiene, isoprene copolymer system solution and add initiator Diisopropyl azodicarboxylate and be fully uniformly mixed;

4. the material solvent after mixing is dried, then by compound material by temperature 50-150 DEG C, to extrude under pressure 2-20MPa or the mode of injection moulding is shaped, obtain prepreg;

5., after the prepreg cut and Copper Foil being combined, at temperature 80-220 DEG C, hot pressed sintering 2-4h under pressure 4-20MPa, make polymeric system generation crosslinking polymerization, composite medium substrate formalizes.