CN105121171B - 模制打印棒 - Google Patents

模制打印棒 Download PDF

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CN105121171B
CN105121171B CN201380076069.6A CN201380076069A CN105121171B CN 105121171 B CN105121171 B CN 105121171B CN 201380076069 A CN201380076069 A CN 201380076069A CN 105121171 B CN105121171 B CN 105121171B
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chip
fluid
rod
passage
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CN105121171A (zh
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陈健华
M.W.坎比
S.J.蔡
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Hewlett Packard Development Co LP
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Hewlett Packard Development Co LP
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    • B41J2/015—Ink jet characterised by the jet generation process
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Abstract

在一个示例中，一种打印棒包括：多个打印头芯片，其模制到细长的单块电路式主体中。所述芯片总体上沿所述主体的长度端到端布置，所述主体中具有通道，流体能够穿过所述通道直接传送到所述芯片。

Description

模制打印棒
背景技术
喷墨笔或打印棒（打印棒）中的每个打印头芯片（die）均包括将墨输送到喷射腔的细小通道。墨从墨供应器穿过支撑笔或打印棒上的打印头芯片的结构中的通路而分配到芯片通道。可期望的是：缩小每个打印头芯片的尺寸，从而例如减少芯片的成本并因而减少笔或打印棒的成本。不过，使用较小的芯片可能需要对支撑芯片（其包含将墨分配到芯片的通路）的更大结构进行改变。
附图说明
图1/2、3/4、5/6、7/8中的每一对图例示出新式模制流体流动结构的一个示例，其中，微装置嵌入到模体中，模体具有直接通向所述装置的流体流动路径。
图9的块状图例示出实施新式流体流动结构的流体流动***，例如图1－8中所示的示例中的一个。
图10的块状图例示出喷墨打印机，其实施新式流体流动结构的一个示例，用于基底宽幅打印棒中的打印头。
图11－16例示出喷墨打印棒，其实施用于打印头芯片的新式流体流动结构的一个示例，例如可用于图10的打印机中。
图17－21的截面图例示出用于制造新式打印头芯片流体流动结构的工艺的一个示例。
图22是图17－21中所示工艺的流程示意图。
图23－27的立体图例示出用于制造新式喷墨打印棒（例如图11－16中所示打印棒）的晶圆级（wafer level）工艺的一个示例。
图28是图23的细节。
图29－31例示出用于打印头芯片的新式流体流动结构的其它示例。
相同的构件编号贯穿附图表示相同或相似的构件。附图不必按比例。一些构件的相对尺寸被夸大以更清楚地例示出所示的示例。
具体实施方式
已经开发出利用基底宽幅打印棒组件的喷墨打印机协助增加打印速度并减少打印成本。传统的基底宽幅打印棒组件包括多个零件将打印流体从打印流体供应器输送到小的打印头芯片，由此将打印流体喷射到纸或其它打印基底上。虽然减小打印头芯片的尺寸和间隔对于减少成本而言仍然很重要，不过将打印流体从较大的供应部件引导至更小更密排的芯片需要复杂的流动结构和制造工艺，这可能会实际上增加成本。
已开发出新式流体流动结构，其允许使用较小的打印头芯片和更紧凑的芯片电路以助于减少基底宽幅喷墨打印机的成本。实施所述新式结构的一个示例的打印棒包括：多个打印头芯片，其模制到细长的可模制材料的单块电路式（monolithic）主体中。模制到所述主体中的打印流体通道将打印流体直接输送到每个芯片中的打印流体流动通路。所述的模体在效果上增加了每个芯片的尺寸以形成外部流体连接和将芯片附接到其它结构，因而能够使用较小的芯片。打印头芯片和打印流体通道可在晶圆级被模制以形成具有内置打印流体通道的新式复合打印头晶圆，从而不需要在硅基底中形成打印流体通道并能够使用更薄的芯片。
新式流体流动结构不限于打印棒或者其他类型的用于喷墨打印的打印头结构，不过可在其它装置中实施并用于其它流体流动应用。这样，在一个示例中，所述新式结构包括：被嵌入模体中的微装置，所述模体具有通道或其它路径以供流体直接流动到所述装置之中或之上。微装置例如可为：电子装置、机械装置、或微机电***（MEMS）装置。所述流体流动例如可为：流动到微装置之中或之上的冷却流体流动，或流动到打印头芯片或其它流体分配（dispense）微装置中的流体流动。
图中所示的和下文中所述的这些和其它示例是例示而不是限制本发明，本发明在本说明书之后所附权利要求书中限定。
如在本文中所用，“微装置”是指具有小于或等于30mm的一个或多个外尺度的装置；“薄”是指厚度小于或等于650µm；“长条（sliver）”是指长宽比（L/W）至少为3的薄的微装置；而“打印头”和“打印头芯片”是指喷墨打印机或将流体从一个或多个开口分配的其它喷墨类型的分配器的零件。打印头包括一个或多个打印头芯片。“打印头”和“打印头芯片”不限于以墨或其它打印流体打印，而是也可包括其它流体的喷墨类型的分配和/或用于非打印应用。
图1和2是正视和平面截面图，分别例示出一个示例，新式流体流动结构10。参见图1和2，结构10包括：微装置12，其被模制到塑料或其它可模制材料的单块电路式主体14中。模制的主体14在此也被称为模体（molding）14。微装置12例如可为电子装置、机械装置、或微机电***（MEMS）装置。通道或其它适合的流体流动路径16模制到主体14中与微装置12接触，使得通道16中流体可直接流动到装置12之中或之上（或者流体流动通路18之中和之上）。在这一示例中，通道16连接到微装置12中的流体流动通路18，并暴露于微装置12的外表面20。
在图3和4中所示的另一示例中，模体14中的流动路径16允许空气或其它流体沿微装置12的外表面20流动，例如流动到冷却装置12。而且，在此示例中，在电气端子24处连接到装置12的信号迹线（trace）或其它导体22模制到模体14中。在图5和6中所示的另一示例中，微装置12模制到主体14中，具有与通道16相对的外露表面26。在图7和8中所示的另一示例中，微装置12A、12B模制到主体14中，具有流体流动通道16A、16B。在此示例中，流动通道16A接触外侧的（outboard）装置12A的边缘，而流动通道16B接触内侧的（inboard）装置12B的底部。
图9的块状图例示出***28，其实施新式流体流动结构10，例如图1－8中所示流动结构10中的一种。参见图9，***28包括：流体源30，其有效连接到流体移动器32，流体移动器32被构造为将流体移动到结构10中的流动路径16。流体源30可例如包括：大气，作为空气源以冷却电子微装置12或用于打印头微装置12的打印流体供应器。流体移动器32实现为泵、风扇、重力或用于将流体从源30移动到流动结构10的其它适合机构。
图10的块状图例示出喷墨打印机34，其实施基底宽幅打印棒36中的新式流体流动结构10的一个示例。参见图10，打印机34包括：横跨打印基底38的宽度的打印棒36；与打印棒36关联的流动调节器40；基底输送机构42；墨或其它打印流体供应器44；和打印机控制器46。控制器46表示程序、处理器和相关存储器、和控制打印机10的操作元件所需的电子电路和部件。打印棒36包括：打印头37的布置，用于将打印流体分配到纸片或连续纸幅或其它打印基底38。如下文中更详细所述，每个打印头37包括在模体中的一个或多个打印头芯片，模体中具有通道16以将打印流体直接馈送到芯片。每个打印头芯片通过从供应器44进入并穿过流动调节器40和打印棒36中的通道16的流动路径接收打印流体。
图11－16例示出喷墨打印棒36，其实施新式流体流动结构10的一个示例，例如可用于图10中所示的打印机34中。首先参见图11的平面图，打印头37嵌入细长的单块电路式模体14中，并在总体上以交错构造端到端地成行48布置，其中每行中的打印头重叠于该行中的另一打印头。虽然显示四行48的交错的打印头37，例如用于打印四种不同的颜色，不过其它适合的构造也是可以的。
图12是沿图11中的线12－12所取的截面图。图13－15是图12的细节图，图16是显示出图12－14中打印头芯片流动结构10的一些特征的布局的平面视图图表。现在参见图11－15，在所示示例中，每个打印头37包括一对打印头芯片12，每个打印头芯片12具有两行喷射腔50和对应的孔口52，打印流体通过孔口52从腔50中喷射。模体14中的每个通道16将打印流体供应到一个打印头芯片12。打印头37也可使用其它适合构造。例如，更多或更少的打印头芯片12可用于更多或更少的喷射腔50和通道16。（虽然打印棒36和打印头37在图12－15中朝上，不过打印棒36和打印头37在安装到打印机中时通常朝下，如图10的块状图中所示）
打印流体从歧管54流动到每个喷射腔50中，歧管54在两行喷射腔50之间沿每个芯片12沿长度延伸。打印流体通过多个端口56馈送到歧管54中，端口56在芯片表面20处连接到打印流体供应通道16。打印流体供应通道16显著宽于打印流体端口56，如图所示，以将打印流体从流动调节器或者将打印流体输送到打印棒36中的其它零件中的更大的、疏离排布的通道输送到打印头芯片12中的更小的、紧密排布的打印流体端口56。这样，打印流体供应通道16可有助于减少或甚至消除对一些传统打印头中必要的离散式“散开（fan-out）”和其它流体导引结构的需要。此外，打印头芯片表面20的相当大区域直接暴露于通道16，如图所示，允许通道16中的打印流体在打印过程中协助冷却芯片12。
图11－15中的打印头芯片12的理想化体现图示出三个层58、60、62，这仅为了便于清楚显示喷射腔50、孔口52、歧管54、和端口56。实际的喷墨打印头芯片12典型地是在硅基底58上形成的复杂的集成电路（IC）结构，并具有未在图11－15中示出的层和元件。例如，在每个喷射腔50处在基底58上形成的热喷射元件或者压电喷射元件被致动以从孔口52喷射出墨或其它打印流体的滴或流。
模制的流动结构10能够使用长、窄且极薄的打印头芯片12。例如，已经显示出：约26mm长、500µm宽的100µm厚的打印头芯片12可被模制到500µm厚的主体14中，以替代传统的500µm厚的硅打印头芯片。与在硅基底中形成馈送通道相比，不仅在主体14中模制通道16更便宜且更容易，而且在更薄的芯片12中形成打印流体端口56也更便宜且更容易。例如，100µm厚的打印头芯片12中的端口56可通过干法刻蚀和对于较厚基底不实用的其它适合的微加工技术形成。在薄的硅、玻璃或其它基底58中微加工出平直的或略微渐缩的通透端口56的高密度阵列，而不是形成传统的缝，实现更强的基底，而同时仍提供适合的打印流体流动。渐缩的端口56有助于将空气气泡从歧管54和喷射腔50移离，空气气泡例如在施加于基底58的单片或多层孔口板60/62中形成。预计目前的芯片处理设备和微装置模制工具和技术能够适合将芯片12模制得薄至50µm、长宽比高至150，并将通道16模制得窄至30µm。而且，模体14提供有效而不昂贵的结构，其中，多行这样的芯片长条可被支撑在单个的单块电路式主体中。
图17－21例示出制造新式打印头流体流动结构10的一个示例性工艺。图22是图17－21中所示工艺的流程示意图。首先参见图17，具有导电迹线22和保护层66的柔性（flex）电路64层置到具有散热带70的载体68上，或以其它方式施加于载体68（图22中的步骤102）。如图18和19中所示，打印头芯片12孔口侧部向下地安置在载体68上的开口72中（图22中的步骤104），导体22结合到（bond to）芯片12上的电气端子24（图22中的步骤106）。在图20中，模制工具74在模体14中在打印头芯片12周围形成通道16（图22中的步骤108）。渐缩的通道16在一些应用中是所希望的，以利于脱除模制工具74或增大散开（fan-out）（或者二者）。在模制之后，打印头流动结构10从载体68脱除（图22中的步骤110），以形成图21中的完整零件，其中导体22被层66覆盖且被模体14包围。在传递模制工艺中，例如如图20中所示，通道16模制到主体14中。在其它制造过程中，可能希望在主体14在打印头芯片12周围模制之后形成通道16。
虽然在图17－21中显示出模制单个打印头芯片12和通道16，不过也可在晶圆级同时模制多个打印头芯片和打印流体通道。图23－28例示出用于制造打印棒36的一个示例性晶圆级工艺。参见图23，打印头37以多打印棒的样式安置在玻璃或其它适合的载体晶圆68上（虽然“晶圆”有时用于表示圆形基底而“面板”用于表示方形基底，不过在本文中所用的“晶圆”包括任何形状的基底）。打印头37通常将在首先施加或形成导体22和芯片开口72的样式（如前文中参照图17和图22中的步骤102所述）之后安置在载体68上。
在图23中所示的示例中，五组芯片78（每组具有四行打印头37）铺设到载体晶圆66上以形成五个打印棒。用于在信纸或A4尺寸基底上打印的基底宽幅打印棒（例如具有四行打印头37）大约长230mm、宽16mm。这样，五个芯片组78可铺设到单个270mm x 90mm载体晶圆66上，如图23中所示。仍在所示的示例中，导体22的阵列延伸到每行打印头37的边缘近处的结合垫23。导体22和结合垫23在图28的细节中更清晰可见。（通向各个喷射腔或成组的喷射腔的导电信号迹线、例如图21中的导体22，被省略以着重于其它结构特征）。
图24是沿图23中的线24－24所取的一组四行打印头37的特写截面图。为了清楚而省略剖面线。图23和24显示出在完成图23中的步骤102－112之后的处理中的晶圆结构。图25显示出图24在图23中的模制步骤114之后的剖面，其中，具有通道16的主体14在打印头芯片12周围模制。各个打印棒条78在图26中分离，并在图27中从载体68脱除，以形成五个独立的打印棒36（图23中的步骤116）。虽然可使用任意适合的模制技术，不过试验暗示：目前用于半导体器件封装的晶圆级模制工具和技术可在成本上有效适合于制造打印头芯片流体流动结构10，例如图21和27中所示的打印头芯片流体流动结构10。
在希望以刚性的（或至少柔性更小的）打印棒36保持打印头芯片12时，可使用更硬的模体14。在希望采用柔性打印棒36时，例如，在希望以另一支撑结构在单一平面中刚性地保持打印棒时、或者在希望采用非平面式打印棒构造时，可使用较小刚性的模体14。而且，虽然预计被模制的主体14通常将会被模制为单块电路式零件，不过主体14也可被模制为多于一个零件。
图29－31例示用于打印头芯片12的新式流体流动结构10的其它示例。在这些示例中，通道16沿打印头芯片12的每侧模制到主体14中，例如使用传递模制工艺模制，例如如前文中参照图17－21所述。打印流体从通道16沿侧向穿过端口56直接从通道16流动到每个喷射腔50中。在图30的示例中，孔口板62在模制主体14之后施加，以封闭通道16。在图31的示例中盖80形成在孔口板62上以封闭通道16。虽然显示出部分限定通道16的分立的盖80，不过也可使用被模制到主体14中的集成的盖80。
如本说明书开始部分所述，图中所示的和以上所述的示例用于例示而不是限制本发明。其它示例也是可以的。因此，以上描述应被理解为不限制在所附权利要求书中限定的本发明的范围。

Claims (15)

1.一种打印棒，包括：模制到细长的单块电路式主体中的多个打印头芯片，所述芯片总体上沿所述主体的长度端到端地布置，所述主体具有在其内的通道，流体能够穿过所述通道直接传送到所述芯片。
2.如权利要求1所述的打印棒，其中，
每个芯片是薄芯片。
3.如权利要求2所述的打印棒，其中，
每个薄芯片包括芯片长条。
4.如权利要求3所述的打印棒，其中，每个芯片包括：
多个孔，其连接到所述通道，使得打印流体能够从所述通道直接流动到所述孔中；
歧管，其连接到所述孔，使得打印流体能够从所述孔直接流动到所述歧管中；
多个喷射腔，其连接到所述歧管，使得打印流体能够从所述歧管流动到所述喷射腔中。
5.如权利要求4所述的打印棒，其中，
每个孔从所述通道处的较宽部分向所述歧管处的较窄部分渐缩；
所述通道被模制到所述主体中，并从远离所述孔的较宽部分向所述孔处的较窄部分渐缩。
6.如权利要求3所述的打印棒，其中，
所述芯片长条越过所述主体的长度以交错构造而成行地布置，其中每行中的所述芯片长条重叠于该行中的另一芯片长条；
所述通道包括多个通道，每个通道允许流体直接传送到所述芯片长条中的一个或多个。
7.如权利要求6所述的打印棒，其中，
每个芯片长条包括：具有孔口的前部、与所述前部相对的后部、和在所述前部和后部之间的侧部，流体能够通过所述孔口从所述芯片长条分配；
通道沿每个芯片长条的至少一个侧部定位。
8.如权利要求6所述的打印棒，其中，
每个芯片长条包括：具有孔口的前部、与所述前部相对的后部、和在所述前部和后部之间的侧部，流体能够通过所述孔口从所述芯片长条分配；
通道沿每个芯片长条的后部定位。
9.如权利要求6所述的打印棒，其中，所述单块电路式主体在单个平面中支撑所述芯片长条。
10.一种打印棒，包括：主体，其在薄打印头芯片周围模制，模制的所述主体具有在其内的多个通道，流体能够通过所述多个通道而直接传送到所述芯片，所述芯片总体上以交错构造端到端地成行布置，其中，每行中的所述芯片重叠于该行中的另一芯片。
11.如权利要求10所述的打印棒，其中，所述主体包括：单块电路式主体，其将所述主体内的芯片支撑在单个平面中。
12.如权利要求10所述的打印棒，其中，每个芯片包括电气端子，所述打印棒还包括连接到所述端子的导体，所述主体模制在所述导体和所述端子周围。
13.一种打印棒，包括：
多个打印头芯片长条，每个芯片长条包括：喷射腔、通路、具有孔口的前部、和与所述前部相对的后部，其中，流体能够穿过所述通路以传送到所述喷射腔，流体能够从所述喷射腔喷射穿过所述孔口；和
部分地封装所述芯片长条的模体，所述模体具有在其内的多个通道，所述多个通道直接连接到所述芯片长条中的通路。
14.如权利要求13所述的打印棒，其中，
所述通道被模制到所述模体中。
15.一种打印棒，包括：多个薄打印头芯片，其模制在单块电路式模体中，所述模体包括多个通道，流体能够穿过所述通道直接传送到所述芯片。
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