CN105101677A - PCB screw hole manufacturing method - Google Patents
PCB screw hole manufacturing method Download PDFInfo
- Publication number
- CN105101677A CN105101677A CN201510483706.2A CN201510483706A CN105101677A CN 105101677 A CN105101677 A CN 105101677A CN 201510483706 A CN201510483706 A CN 201510483706A CN 105101677 A CN105101677 A CN 105101677A
- Authority
- CN
- China
- Prior art keywords
- screw hole
- size
- pcb
- pad
- internal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09809—Coaxial layout
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a PCB screw hole manufacturing method comprising the steps that (1) an external layer screw hole welding disc is manufactured according to the size of a screw cap; and (2) an internal layer screw hole welding disc is manufactured, and the size of the internal layer screw hole welding disc is reduced in comparison with that of the external layer screw hole welding disc according to the proportion. Compared with an existing screw hole of which the internal and external layer screw hole welding discs are identical in size, the size of the external layer screw hole welding disc is confirmed according to the size of a bolt in the screw hole manufacturing method so that the size of the internal layer screw hole welding disc is reduced, PCB space utilization rate is enhanced, space for wiring and copper laying is larger, the design and manufacturing difficulty is low, production cost is reduced and thus the PCB screw hole manufacturing method is suitable for a multilayer small plate or a high-density plate.
Description
Technical field
The invention belongs to Manufacturing Technology for PCB field, specifically design a kind of PCB and to tighten up a screw the manufacture method in hole.
Background technology
Printed circuit board (PrintedCircuitBoard is called for short PCB) is important electronic unit, is the supporter of electronic devices and components and the carrier of electronic devices and components electrical connection.Therefore, being arranged on electronic devices and components on PCB or fixing PCB to connect, usually needing to screw hole on PCB, along with electronic equipment become increasingly complex, the part that needs gets more and more, the circuit on pcb board and part also more and more intensive.
In prior art, the production method of PCB upper metallization screw hole is generally: in PCB printed circuit board, design slightly larger ectonexine screw hole PAD according to the size of cap nut, and in outer PAD, carry out welding resistance to window process, during production on pad tin, form pad, screwed lock is obtained more firm.But the screw hole that this method is produced takes up room comparatively large, and on the pcb board that density of components is higher, use can increase design difficulty, increases cost, is not even adapted at platelet or high-density plate use.Therefore, at electronic product day by day to today of little, light, thin future development, how effectively to utilize existing design space, realize product greater functionality, more and more by engineer in industry and operator are valued.
Summary of the invention
For this reason, technical problem to be solved by this invention is that PCB screw hole of the prior art takes up space larger, be unsuitable for for platelet or the high pcb board of density of components, thus propose the PCB screw hole manufacture method that a kind of space availability ratio is high, may be used for platelet or high-density plate.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of PCB screw hole manufacture method, it comprises the steps:
(1) outer screw hole pad is made according to the size of cap nut;
(2) make internal layer screw hole pad, described internal layer screw hole pad size proportionally more described outer screw hole pad reduces.
As preferably, described internal layer screw hole pad diameter 1mm more than larger than screw hole diameter.
As preferably, the diameter 4-5mm larger than screw hole diameter of outer screw hole pad.
As preferably, be also included in tin on outer hole ring surface, form the step of pad.
As preferably, described internal layer screw hole pad be the 0.5-0.57 of described outer screw hole pad size doubly.
Technique scheme of the present invention has the following advantages compared to existing technology, and PCB screw hole manufacture method of the present invention, first makes outer screw hole pad according to the size of cap nut; Then the size proportionally reduced makes internal layer screw hole pad.Compared with the screw hole identical with existing inside and outside layer screw hole pad size, in screw hole manufacture method of the present invention, outer screw hole pad size is determined according to Bolt sizes, reduce the size of internal layer screw hole pad, improve the space availability ratio of PCB, make the space of wiring and paving copper larger, designing and making difficulty is low simultaneously, reduce production cost, be applicable in multilayer platelet or high-density plate.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
The screw hole structure schematic diagram that Fig. 1 PCB screw hole of the present invention manufacture method obtains.
In figure, Reference numeral is expressed as: the outer screw hole pad of 1-; 2-internal layer screw hole pad; 3-internal layer screw hole diameter.
Embodiment
Embodiment
Present embodiments provide a kind of PCB screw hole manufacture method, it comprises the steps:
(1) make outer screw hole pad 1 according to the size of cap nut, the diameter 4-5mm larger than screw hole diameter of outer screw hole pad, the present embodiment is large 4.5mm preferably;
(2) internal layer screw hole pad 2 is made, the size of described internal layer screw hole pad 2 proportionally more described outer screw hole pad reduces, as shown in Figure 1, the size of described internal layer screw hole pad 2 is specially the 0.5-0.57 of described outer screw hole pad size doubly, is preferably 0.55 times in the present embodiment;
(3) tin, formation pad in outer eye surface.
Compared with the screw hole identical with existing inside and outside layer pad size, in screw hole manufacture method of the present invention, outer screw hole pad 1 size is determined according to Bolt sizes, reduce the size of internal layer screw hole pad 2, improve the space availability ratio of PCB, make the space of wiring and paving copper larger, designing and making difficulty is low simultaneously, reduce production cost, be applicable in multilayer platelet or high-density plate.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (5)
1. a PCB screw hole manufacture method, is characterized in that, comprises the steps:
(1) outer screw hole pad is made according to the size of cap nut;
(2) make internal layer screw hole pad, described internal layer screw hole pad size proportionally more described outer screw hole pad reduces.
2. PCB screw hole manufacture method according to claim 1, is characterized in that, described internal layer screw hole pad diameter 1mm more than larger than screw hole diameter.
3. PCB screw hole manufacture method according to claim 1 and 2, is characterized in that, the diameter 4-5mm larger than screw hole diameter of outer screw hole pad.
4. PCB screw hole manufacture method according to claim 3, is characterized in that, is also included in tin on outer hole ring surface, forms the step of pad.
5. PCB screw hole manufacture method according to claim 4, is characterized in that, described internal layer screw hole pad is 0.5-0.57 times of described outer screw hole pad size.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510483706.2A CN105101677A (en) | 2015-08-07 | 2015-08-07 | PCB screw hole manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510483706.2A CN105101677A (en) | 2015-08-07 | 2015-08-07 | PCB screw hole manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105101677A true CN105101677A (en) | 2015-11-25 |
Family
ID=54580878
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510483706.2A Pending CN105101677A (en) | 2015-08-07 | 2015-08-07 | PCB screw hole manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105101677A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2698018Y (en) * | 2004-01-16 | 2005-05-04 | 顺德市顺达电脑厂有限公司 | Screw hole welding disc and printed circuit board having same |
| CN101170894A (en) * | 2007-11-23 | 2008-04-30 | 福建星网锐捷网络有限公司 | Single plate structure |
| JP2009289846A (en) * | 2008-05-28 | 2009-12-10 | Funai Electric Co Ltd | Printed circuit board |
| US20130063921A1 (en) * | 2011-09-14 | 2013-03-14 | Mitsubishi Electric Corporation | Semiconductor device |
-
2015
- 2015-08-07 CN CN201510483706.2A patent/CN105101677A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2698018Y (en) * | 2004-01-16 | 2005-05-04 | 顺德市顺达电脑厂有限公司 | Screw hole welding disc and printed circuit board having same |
| CN101170894A (en) * | 2007-11-23 | 2008-04-30 | 福建星网锐捷网络有限公司 | Single plate structure |
| JP2009289846A (en) * | 2008-05-28 | 2009-12-10 | Funai Electric Co Ltd | Printed circuit board |
| US20130063921A1 (en) * | 2011-09-14 | 2013-03-14 | Mitsubishi Electric Corporation | Semiconductor device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151125 |