CN103547065B - A kind of convex steel structure pcb board and its manufacturing process - Google Patents
A kind of convex steel structure pcb board and its manufacturing process Download PDFInfo
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- CN103547065B CN103547065B CN201310537699.0A CN201310537699A CN103547065B CN 103547065 B CN103547065 B CN 103547065B CN 201310537699 A CN201310537699 A CN 201310537699A CN 103547065 B CN103547065 B CN 103547065B
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Abstract
The present invention discloses a kind of convex steel structure pcb board and its manufacturing process, and the pcb board includes substrate, convex layers of copper, bottom solder mask and bottom.The convex layers of copper is covered in the high current cabling outer surface on bottom solder mask counterpart substrate.The bottom solder mask is covered in bottom surface.Wherein, the convex copper layer thickness requires to arrange according to current load.The present invention determines that big circuit trace position at the initial stage of PCB design, increases convex layers of copper, not only increases pcb board and hold current-carrying ability, prevent pcb board Copper Foil cabling from blowing, and production technology is simplified, only increase convex layers of copper at high current position, it is ensured that the uniformity of finished product.
Description
Technical field
The present invention relates to pcb board technical field, more particularly to a kind of convex steel structure pcb board and its manufacturing process.
Background technology
PCB is the abbreviation of printed circuit board (PCB) (Printed Circuit Board).Printed circuit board (PCB) is assembling electronic component
Substrate, is on common substrate to form connection and the printed board of printed element between point by predetermined design.The product it is main
Function is the connection for making various electronic components form predetermining circuit, plays relay transmission, is the key electricity of electronic product
Sub- cross tie part, the title for having " mother of electronic product ".In motor control design, motor part is needed compared with large-drive-current,
With integrated, the miniaturization of modern product, this requires that we use reduced size pcb board when motor driver is designed,
When in the past using larger current in the design, designer typically can be using by the welding resistance of high current part cabling on pcb board
Remove so as to can be manually tin plating on the Copper Foil top layer of pcb board, so as to increase current carrying capacity, the method is more convenient,
It is daily middle than wide application, but, the current carrying capacity of circuit improves undesirable, and increased Manual operation link,
Homogeneity of product to producing in enormous quantities cannot be ensured.
The content of the invention
It is an object of the invention to by a kind of convex steel structure pcb board and its manufacturing process, solve background above technology
The problem that part is mentioned.
It is that, up to this purpose, the present invention is employed the following technical solutions：
A kind of convex steel structure pcb board, which includes substrate, convex layers of copper, bottom solder mask and bottom；The convex layers of copper is covered in
High current cabling outer surface on bottom solder mask counterpart substrate, the bottom solder mask are covered in bottom surface, wherein, it is described
Convex copper layer thickness requires to arrange according to current load.
Especially, the substrate selects epoxy glass substrate.
Especially, the bottom solder mask selects solder mask.
The invention also discloses a kind of convex steel structure pcb board manufacturing process, which comprises the steps：
A, at the PCB design initial stage, it is determined that manual tin plating part, the i.e. concrete position of high current cabling；
B, the high current cabling outer surface on bottom solder mask counterpart substrate remove solder mask, cover one layer of convex layers of copper,
Increase copper thickness.
Convex steel structure pcb board and its manufacturing process that the present invention is provided improve the carrying electric current energy of pcb board Copper Foil cabling
Power, prevents pcb board Copper Foil cabling from blowing, while simplifying production technology, only increases convex layers of copper at high current position, improves product
The uniformity of product finished product.
Description of the drawings
Fig. 1 is convex steel structure pcb board overlooking the structure diagram provided in an embodiment of the present invention；
Fig. 2 is convex steel structure pcb board cross-sectional view provided in an embodiment of the present invention；
Fig. 3 is convex steel structure pcb board manufacturing process flow diagram provided in an embodiment of the present invention.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples.It is understood that tool described herein
Body embodiment is used only for explaining the present invention, rather than limitation of the invention.It also should be noted that, for the ease of retouching
State, in accompanying drawing, illustrate only part related to the present invention rather than full content.
Refer to shown in Fig. 1 and Fig. 2, the present embodiment convexity steel structure pcb board specifically include substrate 101, convex layers of copper 102,
Bottom solder mask 103 and bottom 104.
The convex layers of copper 102 is covered in the high current cabling outer surface on 103 counterpart substrate 101 of bottom solder mask.Wherein,
102 thickness of convex layers of copper requires to arrange according to current load.The high current cabling refers to the hand for processing in the traditional PCB plate later stage
The tin plating part of work.
The bottom solder mask 103 is covered in 104 surface of bottom.In the present embodiment, the substrate 101 selects expoxy glass
Substrate 101.The bottom solder mask 103 selects solder mask.
As shown in figure 3, Fig. 3 is convex steel structure pcb board manufacturing process flow diagram provided in an embodiment of the present invention.
The present embodiment convexity steel structure pcb board manufacturing process specifically includes following steps：
Step S301, at the PCB design initial stage, it is determined that manual tin plating part, namely the concrete position of high current cabling.
Step S302, the high current cabling outer surface on bottom solder mask counterpart substrate remove solder mask, cover one layer
Convex layers of copper, increases copper thickness.The size of copper thickness requires to arrange according to current load.
Technical scheme determines that big circuit trace position at the initial stage of PCB design, increases convex layers of copper, not only carries
High pcb board holds current-carrying ability, prevents pcb board Copper Foil cabling from blowing, and simplifies production technology, only in high current portion
Position increases convex layers of copper, it is ensured that the uniformity of finished product.
Note, above are only presently preferred embodiments of the present invention and institute's application technology principle.It will be appreciated by those skilled in the art that
The invention is not restricted to specific embodiment described here, can carry out for a person skilled in the art various obvious changes,
Readjust and substitute without departing from protection scope of the present invention.Therefore, although the present invention is carried out by above example
It is described in further detail, but the present invention is not limited only to above example, without departing from the inventive concept, also
More other Equivalent embodiments can be included, and the scope of the present invention is determined by scope of the appended claims.
Claims (4)
1. a kind of convex steel structure pcb board, it is characterised in that including substrate, convex layers of copper, bottom solder mask and bottom；The convex copper
Layer insertion bottom solder mask is simultaneously directly overlayed on the high current cabling on substrate, and the bottom solder mask is covered in bottom table
Face, wherein, the convex copper layer thickness requires to arrange according to current load.
2. convex steel structure pcb board according to claim 1, it is characterised in that the substrate selects epoxy glass substrate.
3. the convex steel structure pcb board according to claim 1 or 2 any one, it is characterised in that the bottom solder mask is selected
Solder mask.
4. a kind of convex steel structure pcb board manufacturing process, it is characterised in that comprise the steps：
A, at the PCB design initial stage, it is determined that manual tin plating part, the i.e. concrete position of high current cabling；
B, the high current cabling outer surface on bottom solder mask counterpart substrate remove solder mask, cover one layer of convex layers of copper, increase
Copper thickness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310537699.0A CN103547065B (en) | 2013-10-31 | 2013-10-31 | A kind of convex steel structure pcb board and its manufacturing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310537699.0A CN103547065B (en) | 2013-10-31 | 2013-10-31 | A kind of convex steel structure pcb board and its manufacturing process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103547065A CN103547065A (en) | 2014-01-29 |
| CN103547065B true CN103547065B (en) | 2017-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310537699.0A Active CN103547065B (en) | 2013-10-31 | 2013-10-31 | A kind of convex steel structure pcb board and its manufacturing process |
Country Status (1)
| Country | Link |
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| CN (1) | CN103547065B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106973494A (en) * | 2017-04-27 | 2017-07-21 | 新华三技术有限公司 | A kind of cabling processing method and printed circuit board (PCB) |
| CN110099506A (en) * | 2019-05-09 | 2019-08-06 | 深圳市锐尔觅移动通信有限公司 | A kind of electronic equipment, printed circuit board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1705104A (en) * | 2004-05-31 | 2005-12-07 | 三洋电机株式会社 | Circuit device and manufacturing method thereof |
| CN201219327Y (en) * | 2008-06-06 | 2009-04-08 | 保锐科技股份有限公司 | Modular structure of circuit board great current area |
| CN203554784U (en) * | 2013-10-31 | 2014-04-16 | 无锡市矽成微电子有限公司 | Convex copper structure PCB |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03283484A (en) * | 1990-03-30 | 1991-12-13 | Furukawa Electric Co Ltd:The | Large current circuit board |
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2013
- 2013-10-31 CN CN201310537699.0A patent/CN103547065B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1705104A (en) * | 2004-05-31 | 2005-12-07 | 三洋电机株式会社 | Circuit device and manufacturing method thereof |
| CN201219327Y (en) * | 2008-06-06 | 2009-04-08 | 保锐科技股份有限公司 | Modular structure of circuit board great current area |
| CN203554784U (en) * | 2013-10-31 | 2014-04-16 | 无锡市矽成微电子有限公司 | Convex copper structure PCB |
Also Published As
| Publication number | Publication date |
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| CN103547065A (en) | 2014-01-29 |
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Effective date of registration: 20190708 Address after: 214000 Jiangsu Province Wuxi Liyuan Development Zone Dicui Road 100 (Creative Park) Standard Factory Building No. 10, West of the second floor Patentee after: Wuxi Xincheng Microtechnology Co., Ltd. Address before: 214000 3rd floor, A2 Building, Standard Office Building, Liyuan Development Zone, Binhu District, Wuxi City, Jiangsu Province Patentee before: Wuxi City Xi Cheng Microtronics A/S |
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