CN105086913A - Adhesive composition - Google Patents
Adhesive composition Download PDFInfo
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- CN105086913A CN105086913A CN201510213931.4A CN201510213931A CN105086913A CN 105086913 A CN105086913 A CN 105086913A CN 201510213931 A CN201510213931 A CN 201510213931A CN 105086913 A CN105086913 A CN 105086913A
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- binder composition
- isocyanate
- binder
- blocked isocyanate
- hydroxyl
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- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
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Abstract
The invention provides an adhesive composition having an end-capping isocyanate, and an acrylic acid series adhesive having a functional group capable of reacting with an isocyanate group. The end-capping isocyanate has a structure protecting the isocyanate group of the isocyanate compound by pryazol series end-capping agent. Therefore, high adhesive force for adhered object is achieved at the indoor temperature; adhesive force can be reduced via heating processing at the temperature of 110 DEG C below; and the adhered object can be easily separated.
Description
Technical field
The present invention relates to binder composition that is high to the bounding force of adherend under room temperature atmosphere, that bounding force can be made to reduce by heating.
Background technology
In the past, in the manufacturing process, the manufacture of use the optical component operation of optical device, the assembling procedure of electronic unit etc. of optical component, such as, in order to pre-fix, sometimes tackiness agent was used.For the tackiness agent for pre-fixing, require sufficient cementability, and the also easy separability that easily can peel off from adherend of requirement.As such tackiness agent, such as, record in patent documentation 1 there is high normal temperature adhesive power, heating after the tackiness agent easily peeled off again.This tackiness agent needs when peeling off from adherend to be heated to about at least 130 DEG C.
But, in adherend, also there is the adherend that can not expose to the open air under high-temperature atmosphere.Therefore, exist for compared with the adherend carrying out heat treated under low temperature, must not using the problem of tackiness agent in the past.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 7-331219 publication
Summary of the invention
Invent problem to be solved
Problem of the present invention is to provide a kind of binder composition, and it is high to the bounding force of adherend under room temperature atmosphere, such bounding force can be made to reduce compared with the heat treated under low temperature, easily can peel off from adherend by less than 110 DEG C.
For solving the means of problem
Binder composition of the present invention contain blocked isocyanate and have can with the acrylic adhesive of the functional group of isocyanic ester radical reaction.Described blocked isocyanate has the isocyanate group of isocyanate compound by the structure of pyrazoles system end-capping reagent protection.
Invention effect
According to binder composition of the present invention, following effect can be obtained: high to the bounding force of adherend under room temperature atmosphere, such bounding force can be made to reduce compared with the heat treated under low temperature by less than 110 DEG C, easily can peel off from adherend.
Embodiment
< binder composition >
Below, the binder composition of an embodiment of the invention is described in detail.The binder composition of present embodiment contains blocked isocyanate and has the acrylic adhesive of the functional group can reacted with isocyanate group (-N=C=O).
(acrylic adhesive)
In the binder composition of present embodiment contained acrylic adhesive if there is cementability and have can with the acrylic acid polymer of the functional group of isocyanic ester radical reaction, be not particularly limited.As such polymkeric substance, (methyl) alkyl acrylate and the multipolymer of other monomer with hydroxyl or carboxyl etc. can be enumerated.It should be noted that, " (methyl) acrylate " refers to " acrylate " or " methacrylic ester ".
As (methyl) alkyl acrylate, such as, (methyl) acrylate etc. that (methyl) 2-EHA, (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) butyl acrylate, (methyl) Isooctyl acrylate monomer, (methyl) vinylformic acid ester in the different ninth of the ten Heavenly Stems etc. have the alkyl of carbon number 1 ~ 12 can be enumerated.These monomers can only be used, or two or more may be used.
As the monomer with hydroxyl, such as, (methyl) acrylate etc. that (methyl) vinylformic acid 2-hydroxyl ethyl ester, (methyl) vinylformic acid 2-hydroxypropyl acrylate, the own ester of (methyl) vinylformic acid 2-hydroxyl etc. have the hydroxyalkyl of carbon number 2 ~ 6 can be enumerated.In addition, as the monomer with carboxyl, such as, vinylformic acid, methacrylic acid, β-crotonic acid, methylene-succinic acid, toxilic acid, fumaric acid etc. can be enumerated.These monomers can only be used, or two or more may be used.
As can with the functional group of isocyanic ester radical reaction, preferred hydroxyl.Therefore, as other monomer forming multipolymer, preferably there is the monomer of hydroxyl.In addition, as can with the functional group of isocyanic ester radical reaction, can be hydroxyl and carboxyl.Therefore, as other monomer forming multipolymer, except the monomer with hydroxyl, the monomer with carboxyl can also be comprised.As the preferred composition of acrylic acid polymer, such as, the multipolymer etc. obtained by making 2-EHA, methyl acrylate and vinylformic acid 2-hydroxyl polymerizable methacrylate can be enumerated.
In the monomer forming acrylic acid polymer, the monomer with hydroxyl or carboxyl etc. is preferably with 1 ~ 30 weight part, more preferably comprise with the ratio of 1 ~ 20 weight part.As the concrete composition of acrylic acid polymer, such as, can enumerate and comprise 2-EHA with the ratio of 30 ~ 90 weight parts, comprise methyl acrylate with the ratio of 0 ~ 60 weight part and comprise the composition etc. of vinylformic acid 2-hydroxyl ethyl ester with the ratio of 1 ~ 30 weight part.
Polymerization process as monomer component is not particularly limited, and such as, can enumerate solution polymerization process, mass polymerization, be suspended polymerization, emulsion polymerization method etc.Such as, when adopting solution polymerization process, by monomer component and solvent, add polymerization starter, chain-transfer agent etc. as required, make it react 2 ~ 10 hours at about 40 ~ 90 DEG C while stirring.
The weight-average molecular weight of acrylic adhesive is not particularly limited, and is preferably 300,000 ~ 1,200,000, is more preferably 400,000 ~ 1,200,000, more preferably 600,000 ~ 900,000.Weight-average molecular weight utilizes gel permeation chromatography (GPC) to measure, and carries out the value after polystyrene conversion to the measured value obtained.
(blocked isocyanate)
In general, isocyanate compound also reacts (crosslinking reaction) with the acrylic adhesive with hydroxyl or carboxyl etc. and solidifies under room temperature (23 DEG C).That is, due at room temperature isocyanate group and hydroxyl or carboxyl also bonding, consequently the bounding force of binder composition reduces.On the other hand, if use the blocked isocyanate that isocyanate group is protected by end-capping reagent, then in binder composition, there is not the isocyanate group that can react, therefore binder composition does not at room temperature solidify.Therefore, the binder composition containing blocked isocyanate at room temperature also can fix adherend because of its cementability.
On the other hand, if blocked isocyanate carries out heating, isocyanate compound is produced.That is, isocyanate group is passed through heating by the blocked isocyanate that end-capping reagent is protected, thus end-capping reagent departs from (deprotection), consequently produces the isocyanate compound with the isocyanate group that can react.This isocyanate compound and acrylic adhesive react (crosslinking reaction), solidify and bounding force reduces.This is containing in the binder composition of blocked isocyanate, at room temperature has bounding force, by heating thus the mechanism of bounding force reduction.
For binder composition in the past, as mentioned above, in order to by heating thus making bounding force reduce, need to be heated to about at least 130 DEG C.That is, if contained blocked isocyanate does not carry out heating with regard to not producing isocyanate compound (not deprotection) at about at least 130 DEG C in binder composition in the past.
On the other hand, in the binder composition of present embodiment, contained blocked isocyanate has the isocyanate group of isocyanate compound by the structure of pyrazoles system end-capping reagent protection.According to such formation, though below 110 DEG C the low temperature of the comparison that (preferably 50 ~ 110 DEG C) are such heating condition under also deprotection, produce isocyanate compound.Therefore, the binder composition of present embodiment by less than 110 DEG C (preferably 50 ~ 110 DEG C) such compared with the heat treated under low temperature, thus bounding force reduction.Therefore, the binder composition of present embodiment also can use for the adherend that can not expose to the open air under high-temperature atmosphere.
As the adherend that can not expose to the open air under high-temperature atmosphere, such as, optical component, electronic unit etc. can be enumerated.As optical component, such as, various lens, speculum, optical filter etc. can be enumerated.As electronic unit, such as, the green sheet material, the laminated ceramic capacitor etc. before roasting that use when the manufacture of laminated ceramic capacitor can be enumerated.Above-mentioned optical component and electronic unit are all not only defined in finished product, are the concepts of the component also comprised in manufacturing processed.
As isocyanate compound, such as, the compound of vulcabond system can be used, specifically, hexamethylene diisocyanate, tolylene diisocyanate, Xylene Diisocyanate, hydrogenated xylene diisocyanate, their biuret variant, adducts variant, isocyanuric acid ester variant etc. can be enumerated.Wherein, preferred hexamethylene diisocyanate, tolylene diisocyanate, Xylene Diisocyanate, hydrogenated xylene diisocyanate.Isocyanate compound only can use one, also can be used in combination two or more.
As pyrazoles system end-capping reagent, if pyrazoles and derivative thereof are not particularly limited, such as, pyrazoles, 3，5-dimethylpyrazole, 3-methylpyrazole etc. can be enumerated.Wherein, preferred 3，5-dimethylpyrazole.Pyrazoles system end-capping reagent only can use one, also can be used in combination two or more.
In the binder composition of present embodiment, contained blocked isocyanate is mixed in isocyanate compound and pyrazoles system end-capping reagent in the inactive solvent of isocyanic ester, carries out stirring obtaining.Such as, when isocyanate compound is vulcabond, by isocyanate compound and pyrazoles system end-capping reagent with 1: 2 ratio (mol ratio) mix.In addition, when isocyanate compound is vulcabond, by isocyanate compound, to contain molar weight with the NCO relative to isocyanate compound be that the pyrazoles system end-capping reagent of 1.01 ~ 1.10 times of molar weights mixes.
In the binder composition of present embodiment, relative to acrylic adhesive 100 weight part, blocked isocyanate is preferably with 0.1 ~ 20 weight part, more preferably contain with 1 ~ 15 weight part, the further preferred ratio with 1 ~ 10 weight part.
In the binder composition of present embodiment, the various additives such as such as linking agent, tackifier, softening agent, antiaging agent, UV light absorber can be added.In addition, the using method of the binder composition of present embodiment is not particularly limited, and binder composition directly can be used as tackiness agent, also can binder composition and solvent be used as required.Or, as described below, the binder composition of present embodiment is processed into adhesive sheet, sealing tape etc. to use.
< adhesive sheet >
The adhesive sheet of present embodiment comprises the binder composition of above-mentioned present embodiment.In addition, the adhesive sheet of present embodiment is without base material.The binder composition of present embodiment is such as coated mold release film and is carried out drying and obtains by the adhesive sheet without base material.Usually, after coating adhesive composition, binder composition pastes mold release film further, therefore adhesive sheet is clamped by mold release film.
As mold release film, such as, the polyethylene terephthalate film etc. being coated with the releasing agents such as organosilicon can be enumerated.Mold release film has preferably 5 ~ 500 μm, the more preferably thickness of 25 ~ 250 μm, peels off when using adhesive sheet.Adhesive sheet has preferably 5 ~ 400 μm, the more preferably thickness of 10 ~ 300 μm.
Coating process is not particularly limited, and such as, can enumerate binder composition and solvent and prepare coating fluid, utilizing the method for the applied coating solution such as coating machine.As coating machine, such as, can enumerate knife coater, roller coating machine, calender courter, comma coater, gravure coater, bar coater etc.
< sealing tape >
When the binder composition of present embodiment is used as sealing tape, the binder layer of the binder composition comprising present embodiment is laminated at least one side of the base material of membranaceous or sheet.Therefore, the sealing tape of present embodiment comprises the base material of membranaceous or sheet and is laminated in the binder layer comprising the binder composition of above-mentioned present embodiment of at least one side of base material.
As base material, such as, the plastic base materials such as polyethylene, polyethylene terephthalate, polypropylene, polyester, polymeric amide, polyimide, polycarbonate, vinyl-vinyl acetate copolymer, ethylene-ethyl acrylate copolymer, ethylene-propylene copolymer, polyvinyl chloride can be enumerated.
Base material can be any one in single layer structure or multilayered structure, usually has about 5 ~ 500 μm, the preferred thickness of about 25 ~ 250 μm.For base material, improving on basis to the adaptation of binder layer, can embodiment as surface treatments such as Corona discharge Treatment, plasma treatment, sandblasting, chemical milling process, primary coat process.
As the method making binder layer be laminated in base material, as mentioned above, coating fluid prepared by binder composition and solvent, with applied coating solution such as coating machines.Binder layer has preferably 5 ~ 400 μm, the more preferably thickness of 10 ~ 300 μm.
When making binder layer be laminated in base material two-sided, the thickness of each binder layer can be identical, also can be different.The composition forming the binder composition of each binder layer can be identical, also can be different.And then if be laminated with the binder layer of the binder composition comprising present embodiment at one side, then another side can be laminated with the binder layer of other tackiness agent beyond the binder composition comprising present embodiment.As other tackiness agent, such as, pressure sensitive adhesive etc. can be enumerated.As pressure sensitive adhesive, such as, natural rubber system tackiness agent, synthetic rubber system tackiness agent, styrene-butadiene latex based adhesive, acrylic adhesive etc. can be enumerated.
And then on the surface of the binder layer of sealing tape, be usually laminated with mold release film, this mold release film is stripped when using sealing tape.As mold release film, the mold release film illustrated in above-mentioned adhesive sheet can be used.
The binder composition of present embodiment plays following effect: high to the bounding force of adherend under room temperature atmosphere, by less than 110 DEG C (preferably 50 ~ 110 DEG C) such bounding force can be made to reduce compared with the heat treated under low temperature, easily can peel off from adherend.
Therefore, the binder composition of present embodiment, in the manufacturing process, the manufacture of use the optical component operation of optical device, the assembling procedure of electronic unit etc. of optical component, can be used as the tackiness agent pre-fixing component etc. aptly.In other words, the binder composition of present embodiment can be suitably used for the pre-fixing of optical component, the pre-fixing of electronic unit.
[embodiment]
Below, enumerate embodiment and comparative example illustrates the present invention, but the present invention does not limit by these embodiments.
(synthesis example 1: the synthesis of acrylic adhesive)
By 2-EHA with 35 weight parts, methyl acrylate is added in reaction vessel with 50 weight parts and by vinylformic acid 2-hydroxyl ethyl ester with the ratio of 10 weight parts.Then, relative to monomer mixture 100 weight part, the solvent of 200 weight parts is added in reaction vessel.As solvent, use ethyl acetate: toluene=85: the mixed solvent of 15 (weight ratios).Stir 4 hours at 55 DEG C, make these monomer copolymerizations, obtain acrylic acid polymer (acrylic adhesive).The weight-average molecular weight of the acrylic adhesive obtained is 700,000.
(embodiment 1 ~ 3)
Relative to acrylic adhesive 100 weight part obtained in synthesis example 1, blocked isocyanate 1 is obtained by mixing mixture with the ratio of 5 weight parts.Blocked isocyanate 1 is the hexamethylene diisocyanate (HDI) utilizing 3，5-dimethylpyrazole (DMP) to protect isocyanate group.Blocked isocyanate 1 is that the HDI of 50 weight parts and the NCO relative to isocyanic ester to be contained molar weight be that the DMP of 1.05 times of molar weights mixes together, become the mode diluted ethyl acetate of 50 % by weight according to solids component after, stir under room temperature (23 DEG C) and obtain for 60 minutes.The isocyanate group of HDI is protected this situation to utilize FT-IR to confirm by DMP.
In the mixture obtained, the mode becoming 30 % by weight according to solids component adds ethyl acetate and has prepared coating fluid.This coating solution is carried out drying in the one side of the polyethylene terephthalate film of thickness 100 μm, obtains the sealing tape of the binder layer being formed with thickness 80 μm.
(embodiment 4 ~ 7 and comparative example 1)
Replace except blocked isocyanate 1, according to the sequential system same with embodiment 1 ~ 3 for coating fluid except using blocked isocyanate 2 ~ 5 shown in table 1.The coating fluid obtained is used to obtain sealing tape according to the order same with embodiment 1 ~ 3.It should be noted that, blocked isocyanate 2 ~ 5 shown in table 1 is as follows, uses following isocyanate compound and end-capping reagent, obtain according to the order same with blocked isocyanate 1 in the ratio (mol ratio) recorded in embodiment 1 ~ 3.
Blocked isocyanate 2: utilize DMP to protect the tolylene diisocyanate (TDI) of isocyanate group.
Blocked isocyanate 3: utilize DMP to protect the Xylene Diisocyanate (XDI) of isocyanate group.
Blocked isocyanate 4: utilize DMP to protect the hydrogenated xylene diisocyanate (HXDI) of isocyanate group.
Blocked isocyanate 5: utilize methyl ethyl ketoxime to protect the hexamethylene diisocyanate (HDI) of isocyanate group.
(comparative example 2)
Except not using blocked isocyanate 1, according to the sequential system same with embodiment 1 ~ 3 for coating fluid.The coating fluid obtained is used to obtain sealing tape according to the order same with embodiment 1 ~ 3.
< evaluates >
For the sealing tape obtained in embodiment 1 ~ 7, comparative example 1 and 2, utilize following method evaluation 180 ° of stripping strengths.Result is shown in Table 1.
(180 ° of stripping strengths)
For the sealing tape obtained in embodiment and comparative example, first, 180 ° of stripping strengths under room temperature (23 DEG C) are measured according to JISZ0237.Specifically, at room temperature polyimide film is pasted on sealing tape, leaves standstill and after 20 minutes, use load cell with the speed 180 ° stripping of 300mm/ minute, measure 180 ° of stripping strengths under room temperature.As shown in Table 1, arbitrary sealing tape all has high-peeling strength, at room temperature has sufficient bounding force.
Then, at room temperature polyimide film is pasted on sealing tape, leaves standstill after 20 minutes and leave standstill 5 minutes under 90 DEG C of atmosphere, measure 180 ° of stripping strengths (before solidification bounding force).It should be noted that, for the sealing tape obtained in embodiment 3 and 5, do not leave standstill under 85 DEG C and 60 DEG C of atmosphere respectively at 90 DEG C and measure.
Then, after heating is cured under the heating condition recorded in Table 1, under 90 DEG C of atmosphere, leave standstill 5 minutes, measure 180 ° of stripping strengths (after solidification bounding force).It should be noted that, for the sealing tape obtained in embodiment 3 and 5, do not leave standstill under 85 DEG C that are cured and 60 DEG C of atmosphere respectively at 90 DEG C and measure.
By bounding force after bounding force before obtained solidification and solidification, following formula is used to calculate bounding force reduced rate.
Bounding force reduced rate (%)={ 1-(after solidification bounding force)/(before solidification bounding force) } × 100
The bounding force reduced rate calculated is evaluated with following benchmark.It should be noted that, bounding force reduced rate represents after hardening lower than time 0% (negative value) (after heating), and bounding force increases.
◎: when bounding force reduced rate is greater than 70%.
Zero: bounding force reduced rate be greater than 40% and be less than 70% time.
△: bounding force reduced rate be greater than 0% and be less than 40% time.
×: when bounding force reduced rate is less than 0%.
[table 1]
Can clearly be learnt by table 1, under the sealing tape of embodiment 1 ~ 7 heating condition all below 110 DEG C, bounding force also reduces, in order to peel off from adherend do not need the hot conditions as in the past more than 130 DEG C under process.On the other hand, known use by beyond pyrazoles system end-capping reagent protection blocked isocyanate comparative example 1 sealing tape and do not use the sealing tape of the comparative example 2 of blocked isocyanate bounding force under the heating condition of 110 DEG C to increase.
Claims (13)
1. a binder composition, it contains
Blocked isocyanate and
Have can with the acrylic adhesive of the functional group of isocyanic ester radical reaction,
Wherein, described blocked isocyanate has the isocyanate group of isocyanate compound by the structure of pyrazoles system end-capping reagent protection.
2. binder composition as claimed in claim 1, wherein, described pyrazoles system end-capping reagent is be selected from least a kind in pyrazoles, 3，5-dimethylpyrazole and 3-methylpyrazole.
3. binder composition as claimed in claim 1, wherein, described pyrazoles system end-capping reagent is 3，5-dimethylpyrazole.
4. binder composition as claimed in claim 1, wherein, described isocyanate compound is be selected from least a kind in hexamethylene diisocyanate, tolylene diisocyanate, Xylene Diisocyanate and hydrogenated xylene diisocyanate.
5. binder composition as claimed in claim 1, wherein, can be hydroxyl with the functional group of described isocyanic ester radical reaction.
6. binder composition as claimed in claim 1, wherein, can be hydroxyl and carboxyl with the functional group of described isocyanic ester radical reaction.
7. binder composition as claimed in claim 1, wherein, described acrylic adhesive is the multipolymer obtained by making 2-EHA, methacrylic ester and vinylformic acid 2-hydroxyl polymerizable methacrylate.
8. binder composition as claimed in claim 1, wherein, relative to described acrylic adhesive 100 weight part, described blocked isocyanate contains with the ratio of 0.1 ~ 20 weight part.
9. binder composition as claimed in claim 1, it is peeled off from adherend by the heat treated of less than 110 DEG C.
10. binder composition as claimed in claim 1, its pre-fixing for optical component.
11. binder compositions as claimed in claim 1, its pre-fixing for electronic unit.
12. 1 kinds of adhesive sheets, it comprises binder composition according to claim 1.
13. 1 kinds of sealing tapes, its comprise membranaceous or sheet base material and at the stacked binder layer comprising binder composition according to claim 1 of at least one side of described base material.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-097374 | 2014-05-09 | ||
| JP2014097374A JP2015214636A (en) | 2014-05-09 | 2014-05-09 | Adhesive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105086913A true CN105086913A (en) | 2015-11-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510213931.4A Pending CN105086913A (en) | 2014-05-09 | 2015-04-29 | Adhesive composition |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2015214636A (en) |
| KR (1) | KR20150128556A (en) |
| CN (1) | CN105086913A (en) |
| TW (1) | TW201544567A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108102571A (en) * | 2017-11-24 | 2018-06-01 | 烟台德邦科技有限公司 | Solar double-glass photovoltaic module laminating edge sealing and adhesive reducing adhesive tape and preparation method thereof |
| CN109371683A (en) * | 2018-08-14 | 2019-02-22 | 江志平 | A kind of rubber product fiber skeleton impregnation material and its preparation and application |
| CN112341985A (en) * | 2019-08-08 | 2021-02-09 | 达兴材料股份有限公司 | Temporary adhesive composition, temporary adhesive film, composite film, and method of using the same |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102590639B1 (en) * | 2018-06-06 | 2023-10-17 | 세키스이가가쿠 고교가부시키가이샤 | adhesive tape |
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| JP2007284576A (en) * | 2006-04-17 | 2007-11-01 | Nitto Denko Corp | Pressure-sensitive adhesive sheet and method for processing adherend by using the same |
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| GB8405320D0 (en) * | 1984-02-29 | 1984-04-04 | Baxenden Chem | Blocked isocyanates |
| DE202007019297U1 (en) * | 2007-10-19 | 2011-11-14 | Nitto Denko Corp. | An adhesive tape |
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2015
- 2015-04-15 TW TW104112041A patent/TW201544567A/en unknown
- 2015-04-16 KR KR1020150053530A patent/KR20150128556A/en unknown
- 2015-04-29 CN CN201510213931.4A patent/CN105086913A/en active Pending
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| JP2007284576A (en) * | 2006-04-17 | 2007-11-01 | Nitto Denko Corp | Pressure-sensitive adhesive sheet and method for processing adherend by using the same |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108102571A (en) * | 2017-11-24 | 2018-06-01 | 烟台德邦科技有限公司 | Solar double-glass photovoltaic module laminating edge sealing and adhesive reducing adhesive tape and preparation method thereof |
| CN109371683A (en) * | 2018-08-14 | 2019-02-22 | 江志平 | A kind of rubber product fiber skeleton impregnation material and its preparation and application |
| CN112341985A (en) * | 2019-08-08 | 2021-02-09 | 达兴材料股份有限公司 | Temporary adhesive composition, temporary adhesive film, composite film, and method of using the same |
| CN112341985B (en) * | 2019-08-08 | 2023-05-02 | 达兴材料股份有限公司 | Temporary adhesive composition, temporary adhesive film, composite film, and methods of use thereof |
| US12043770B2 (en) | 2019-08-08 | 2024-07-23 | Daxin Materials Corporation | Temporary bonding composition, temporary bonding film, composite film, temporary bonding method and semiconductor wafer package |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150128556A (en) | 2015-11-18 |
| TW201544567A (en) | 2015-12-01 |
| JP2015214636A (en) | 2015-12-03 |
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Application publication date: 20151125 |