CN105072802A - High-voltage area and low-voltage area isolated PCB manufacture method - Google Patents
High-voltage area and low-voltage area isolated PCB manufacture method Download PDFInfo
- Publication number
- CN105072802A CN105072802A CN201510489890.1A CN201510489890A CN105072802A CN 105072802 A CN105072802 A CN 105072802A CN 201510489890 A CN201510489890 A CN 201510489890A CN 105072802 A CN105072802 A CN 105072802A
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- China
- Prior art keywords
- area
- low
- voltage area
- pressure
- voltage
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
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- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a high-voltage area and low-voltage area isolated PCB manufacture method. The method comprises the following steps: S1) arranging a high-voltage area and a low-voltage area on a PCB, wherein a gap is arranged between the high-voltage area and the low-voltage area; S2) carrying out copper laying processing on power supply areas and grounding areas of the high-voltage area and the low-voltage area respectively, and overlapping of the power supply area and grounding area does not exist in the vertical direction of the high-voltage area; and S3) arranging a plurality of earth holes in the two edges, adjacent to the high-voltage area, of the low-voltage area, thereby preventing the high-voltage area from causing interference to the low-voltage area. Copper laying processing is carried out on power supply area and grounding area of the high-voltage area respectively, and overlapping of the power supply area and grounding area does not exist in the vertical direction of the high-voltage area, thereby improving noise phenomenon of the high-voltage area and reducing disturbance of the noise to the external world; and the earth holes are arranged in the edges, adjacent to the high-voltage area, of the low-voltage area, so that external interference can be shielded, and furthermore, interference caused by the high-voltage area to the low-voltage area is reduced.
Description
Technical field
The invention belongs to printed circuit board make field, specifically design a kind of high-low pressure separate from PCB manufacture method.
Background technology
Along with printed circuit board (PrintedCircuitBoard is called for short PCB) designs the increase of complexity and the progress of board production technology, people are more and more concerned about power supply, Earth noise to the impact of PCB.Especially in high-speed circuit system, noise is a very serious problem, noise Producing reason is high-frequency signal radiated interference normally: High-Speed PCB generally adopts multi-layer sheet to design, at this time power supply, usually adopt plane to process, except for except Power supply, be also provided as reference planes and the return flow line of signal.At this time, the signal that it is reference planes that the noise on power supply, ground can directly seal in it, the digital signal of change at a high speed causes the problems such as ring, reflection, crosstalk and EMI.
Solve the problem of power supply, Earth noise in printed circuit board, be not only consider power supply self stabilization of level problem, or solve the key factor of high speed signal integrity problem.In existing PCB high-low voltage design process, partition method just carries out high-low pressure region separately usually in device blocks layout; For multi-layer sheet, the power supply area of high-pressure area and access area are all at internal layer direct large area paving Copper treatment.There is following problem in said method: there is overlap vertical direction power on source region and access area in higher-pressure region, easily causes interlayer to puncture; Higher-pressure region noise ratio is comparatively large, easily externally produces interference; Low-pressure area is also easily subject to the interference of higher-pressure region simultaneously.
Summary of the invention
For this reason, technical problem to be solved by this invention is that the existing method improving noise easily causes multilayer circuit board interlayer to puncture, and the noise of higher-pressure region is comparatively large, easily to low-pressure area with extraneously produce interference, thus propose a kind of high-low pressure separate from PCB manufacture method.
For solving the problems of the technologies described above, technical scheme of the present invention is:
The invention provides a kind of high-low pressure separate from PCB manufacture method, it comprises the steps:
S1, higher-pressure region and low-pressure area are set on PCB, between described higher-pressure region and described low-pressure area, leave space;
S2, separately spread Copper treatment in the power supply area of described higher-pressure region and described low-pressure area and access area, and higher-pressure region vertical direction can not there be power supply area and access area overlapping;
S3, the both sides edge some ground hole adjacent with described higher-pressure region in described low-pressure area.
As preferably, the gap length between described higher-pressure region and described low-pressure area is 40-200mil.
As preferably, power supply area and the access area of described higher-pressure region separately spread copper.
As preferably, described ground bore dia is 8-32mil.
As preferably, adjacent two described ground pitchs of holes are 50-100mil.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) high-low pressure provided by the present invention separate from PCB manufacture method, higher-pressure region and low-pressure area are kept apart, avoid higher-pressure region to low-pressure area produce interference; In higher-pressure region, VDD-to-VSS separately spreads Copper treatment, makes higher-pressure region there is not VDD-to-VSS overlap in the vertical direction, improves higher-pressure region noise phenomenon, decrease and disturb to external world; In low-pressure area, the side of contiguous higher-pressure region offers hole, ground, can shield external interference, reduces the interference of low-pressure area by higher-pressure region further.
(2) high-low pressure provided by the present invention separate from PCB manufacture method, higher-pressure region VDD-to-VSS separately spreads Copper treatment.
Accompanying drawing explanation
In order to make content of the present invention be more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 be high-low pressure of the present invention separate from PCB manufacture method in the structural representation of high and low nip;
Fig. 2 be high-low pressure of the present invention separate from PCB manufacture method mesolow district cutaway view;
Fig. 3 be high-low pressure of the present invention separate from PCB manufacture method mesohigh district cutaway view.
In figure, Reference numeral is expressed as: 1-higher-pressure region; 2-low-pressure area; 3-space; 4-upper epidermis; 5-layer; 6-internal layer; Hole, 7-ground.
Embodiment
Embodiment
Present embodiments provide a kind of high-low pressure separate from PCB manufacture method, it comprises the steps:
S1, higher-pressure region 1 and low-pressure area 2 are set on PCB, between described higher-pressure region 1 and described low-pressure area 2, leave the space that width is 80mil, avoid low-pressure area 2,1 pair, higher-pressure region and produce interference;
S2, separately spread Copper treatment in the power supply area of described higher-pressure region 1 and described low-pressure area 2 and access area, and to there is not power supply area and access area in the vertical direction overlapping in higher-pressure region 1, improve the noise phenomenon of higher-pressure region 1; Described low-pressure area 2 can spread Copper treatment to internal layer 6 and upper epidermis 4, layer 5 according to the actual requirements;
S3, in the edge some ground hole 7 adjacent with described higher-pressure region 1, described low-pressure area 2, hole, described ground 7 diameter is 10mil, adjacent two described ground pitchs of holes are 60mil, and hole, described ground 7 can shield external interference, reduce the interference of low-pressure area 2 by higher-pressure region 1 further.
Obviously, above-described embodiment is only for clearly example being described, and the restriction not to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without the need to also giving all execution modes.And thus the apparent change of extending out or variation be still among the protection range of the invention.
Claims (5)
1. high-low pressure separate from a PCB manufacture method, it is characterized in that, comprise the steps:
S1, higher-pressure region and low-pressure area are set on PCB, between described higher-pressure region and described low-pressure area, leave space;
S2, separately spread Copper treatment in the power supply area of described higher-pressure region and described low-pressure area and access area, and higher-pressure region vertical direction can not there be power supply area and access area overlapping;
S3, the both sides edge some ground hole adjacent with described higher-pressure region in described low-pressure area.
2. high-low pressure according to claim 1 separate from PCB manufacture method, it is characterized in that, the gap length between described higher-pressure region and described low-pressure area is 40-200mil.
3. high-low pressure according to claim 1 and 2 separate from PCB manufacture method, it is characterized in that, power supply area and the access area of described higher-pressure region separately spread copper.
4. high-low pressure according to claim 3 separate from PCB manufacture method, it is characterized in that, described ground bore dia is 8-32mil.
5. high-low pressure according to claim 4 separate from PCB manufacture method, it is characterized in that, adjacent two described ground pitchs of holes are 50-100mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489890.1A CN105072802A (en) | 2015-08-11 | 2015-08-11 | High-voltage area and low-voltage area isolated PCB manufacture method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510489890.1A CN105072802A (en) | 2015-08-11 | 2015-08-11 | High-voltage area and low-voltage area isolated PCB manufacture method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105072802A true CN105072802A (en) | 2015-11-18 |
Family
ID=54502038
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510489890.1A Pending CN105072802A (en) | 2015-08-11 | 2015-08-11 | High-voltage area and low-voltage area isolated PCB manufacture method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105072802A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106209122A (en) * | 2016-07-18 | 2016-12-07 | 孙海华 | The radio frequency integrated structure of transmitter |
| CN106230043A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | The charging device of mobile terminal and mobile terminal |
| CN107295742A (en) * | 2016-04-13 | 2017-10-24 | 奥迪股份公司 | Circuit board and motor vehicle |
| CN109951948A (en) * | 2019-03-21 | 2019-06-28 | 厦门大学 | A kind of plate grade safety Insulation Scheme |
| CN111615254A (en) * | 2020-06-19 | 2020-09-01 | 苏州浪潮智能科技有限公司 | Printed circuit board and power supply design method thereof |
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| JP2004221400A (en) * | 2003-01-16 | 2004-08-05 | Canon Inc | High density wiring and printed circuit board using the same |
| CN101048033A (en) * | 2006-03-29 | 2007-10-03 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| CN202151005U (en) * | 2011-07-21 | 2012-02-22 | 上海欣丰卓群电路板有限公司 | Circuit board used for preventing breakdown of elevators |
| US20120247825A1 (en) * | 2011-03-28 | 2012-10-04 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
| CN204090301U (en) * | 2014-07-11 | 2015-01-07 | 邯郸美的制冷设备有限公司 | Anti-interference pcb board and air-conditioning equipment |
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2015
- 2015-08-11 CN CN201510489890.1A patent/CN105072802A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004221400A (en) * | 2003-01-16 | 2004-08-05 | Canon Inc | High density wiring and printed circuit board using the same |
| CN101048033A (en) * | 2006-03-29 | 2007-10-03 | 鸿富锦精密工业（深圳）有限公司 | Printed circuit board |
| US20120247825A1 (en) * | 2011-03-28 | 2012-10-04 | Hon Hai Precision Industry Co., Ltd. | Printed circuit board |
| CN202151005U (en) * | 2011-07-21 | 2012-02-22 | 上海欣丰卓群电路板有限公司 | Circuit board used for preventing breakdown of elevators |
| CN204090301U (en) * | 2014-07-11 | 2015-01-07 | 邯郸美的制冷设备有限公司 | Anti-interference pcb board and air-conditioning equipment |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107295742A (en) * | 2016-04-13 | 2017-10-24 | 奥迪股份公司 | Circuit board and motor vehicle |
| CN107295742B (en) * | 2016-04-13 | 2019-07-05 | 奥迪股份公司 | Circuit board and motor vehicle |
| US10488441B2 (en) | 2016-04-13 | 2019-11-26 | Audi Ag | Printed circuit board and motor vehicle equipped with such a printed circuit board |
| CN106209122A (en) * | 2016-07-18 | 2016-12-07 | 孙海华 | The radio frequency integrated structure of transmitter |
| CN106230043A (en) * | 2016-07-28 | 2016-12-14 | 广东欧珀移动通信有限公司 | The charging device of mobile terminal and mobile terminal |
| CN106230043B (en) * | 2016-07-28 | 2018-01-19 | 广东欧珀移动通信有限公司 | The charging device and mobile terminal of mobile terminal |
| CN109951948A (en) * | 2019-03-21 | 2019-06-28 | 厦门大学 | A kind of plate grade safety Insulation Scheme |
| CN111615254A (en) * | 2020-06-19 | 2020-09-01 | 苏州浪潮智能科技有限公司 | Printed circuit board and power supply design method thereof |
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| RJ01 | Rejection of invention patent application after publication | ||
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Application publication date: 20151118 |