CN105038129B - 一种倒装芯片封装的环氧树脂组合物 - Google Patents
一种倒装芯片封装的环氧树脂组合物 Download PDFInfo
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Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN105440588B (zh) * | 2015-12-24 | 2017-11-03 | 江苏中鹏新材料股份有限公司 | 一种高导热模塑型环氧底填料及其制备方法与用途 |
CN105462173A (zh) * | 2015-12-25 | 2016-04-06 | 科化新材料泰州有限公司 | 一种环保型环氧树脂组合物及其制备方法 |
CN106280282B (zh) * | 2016-08-15 | 2019-03-22 | 江苏中鹏新材料股份有限公司 | 一种含磷-氮阻燃剂的模塑型环氧底填料及其制备方法与应用 |
CN110349933A (zh) * | 2019-07-23 | 2019-10-18 | 上海先方半导体有限公司 | 一种晶圆键合堆叠芯片的封装结构及制备方法 |
CN112724599A (zh) * | 2020-12-28 | 2021-04-30 | 江苏科化新材料科技有限公司 | 一种倒装芯片封装的环氧树脂组合物 |
CN114292613A (zh) * | 2022-02-16 | 2022-04-08 | 武汉市三选科技有限公司 | 复合膜、倒装led芯片及其制造方法 |
Citations (3)
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US6054222A (en) * | 1997-02-20 | 2000-04-25 | Kabushiki Kaisha Toshiba | Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet |
CN1288914A (zh) * | 2000-08-30 | 2001-03-28 | 中国科学院化学研究所 | 一种含复合无机填料的环氧树脂组合物 |
CN101851386A (zh) * | 2009-04-01 | 2010-10-06 | 汉高(中国)投资有限公司 | 一种环氧树脂组合物 |
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JP2000109649A (ja) * | 1998-10-08 | 2000-04-18 | Nitto Denko Corp | 半導体封止用エポキシ樹脂組成物およびその製法ならびに半導体装置 |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US6054222A (en) * | 1997-02-20 | 2000-04-25 | Kabushiki Kaisha Toshiba | Epoxy resin composition, resin-encapsulated semiconductor device using the same, epoxy resin molding material and epoxy resin composite tablet |
CN1288914A (zh) * | 2000-08-30 | 2001-03-28 | 中国科学院化学研究所 | 一种含复合无机填料的环氧树脂组合物 |
CN101851386A (zh) * | 2009-04-01 | 2010-10-06 | 汉高(中国)投资有限公司 | 一种环氧树脂组合物 |
Non-Patent Citations (1)
Title |
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"硅芯片封装用球形SiO2与环氧树脂复合材料的制备工艺与性能研究";艾常春;《中国博士学位论文全文数据库 工程科技I辑》;20120715(第07期);第B016-15 * |
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