CN105024017A - Flexible substrate, flexible display and manufacturing method thereof - Google Patents
Flexible substrate, flexible display and manufacturing method thereof Download PDFInfo
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- CN105024017A CN105024017A CN201410176735.XA CN201410176735A CN105024017A CN 105024017 A CN105024017 A CN 105024017A CN 201410176735 A CN201410176735 A CN 201410176735A CN 105024017 A CN105024017 A CN 105024017A
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Abstract
The present invention discloses a flexible substrate, a flexible display and manufacturing methods thereof. The flexible display manufacturing method comprises the steps of coating a polymer solution onto a glass substrate; forming a polymer film on a glass substrate by the polymer solution through heating or light exposure at a flowing inert gas atmosphere; forming a water and oxygen blocking layer, a TFT-Array layer, an OLED layer and a packaging layer in turn on the polymer film after forming the polymer film on the glass substrate; and stripping a display using the polymer film as a substrate off the glass substrate to obtain the flexible substrate. According to the technical schemes, non expensive equipment is additionally required, non expensive laser or heating equipment is required to be adopted, the flexible AMOLED can be stripped from the glass substrate without any need for special separating layer materials, and the manufacturing cost of the flexible AMOLED can be effectively lowered.
Description
Technical field
The present invention relates to flexible display apparatus field, particularly relate to a kind of flexible base, board, flexible display and preparation method thereof.
Background technology
Flexible AMOLED (active matric Organic Light Emitting Diode) display unit enjoys people to pay close attention to as display of future generation, especially in Portable movable electronic product, as: the field such as smart mobile phone, panel computer, has bright prospects.Be different from traditional flat-panel monitor, the backing material that flexible AMOLED adopts mainly contains ultra-thin glass, metallic film and polymer plastic cement three class.The water oxygen barrier properties of ultra-thin glass and metallic film is good, but the pliability of ultra-thin glass is poor, crisp, very responsive to crack defect; The film clarity of metal material is poor, and surface roughness is higher, needs extra flatening process, and these all limit the application of metallic film in flexible AMOLED field.Polymeric material PET(PETG), PEN(PEN), PC(Merlon) etc. and glass, it is better that Metal Phase ratio has pliability, quality is lighter, the advantage such as more shock-resistant, be suitable as very much the backing material of flexible AMOLED, but the temperature tolerance of above-mentioned material is all lower than 200 DEG C, limit the active matrix TFT engineering temperature on polymeric material substrate, cause the display being difficult to make high-resolution (PPI:Pixel per inch), compared to above-mentioned polymeric material, polyimides (PI) material temperature tolerance reaches more than 350 DEG C, the TFT preparation of high temperature engineering can be carried out on PI material, therefore other polymeric materials are compared, be easier to the flexible display making high PPI.
But because PI material is in high temperature film forming procedure, react at the interface PI material of glass substrate and glass surface, after fabrication terminates, PI layer is difficult to peel off from glass surface, so adopt high temperature resistant PI macromolecule membrane to be substrate, when making flexible display, need to process between PI layer and glass substrate, current processing method mainly contains following three kinds:
First method as shown in Figure 1, first 500 thick amorphous silicon (a-Si) films (amorphous silicon layer) are formed on the glass substrate, then form PI film, water oxygen barrier layer, TFT-Array layer, oled layer successively on the amorphous silicon thin film, finally device is encapsulated.Water oxygen barrier layer in device architecture decomposes OLED material to prevent the water in air and oxygen from penetrating in display device, reduces the life-span of display.After having encapsulated, irradiate the back side of glass substrate with laser, glass substrate is separated from said structure, this completes the making that PI substrate is the flexible AMOLED of substrate.But this method exists following shortcoming: need expensive laser equipment, and laser will irradiate whole glass substrate, and engineering is consuming time longer; In addition, in order to reuse glass substrate, needing the amorphous silicon on dry etching glass substrate to remain, adds additional the cost of equipment and engineering.
Second method as shown in Figure 2, forms the thick metallic film (metal level) of 500-1000 first on the glass substrate, then on metallic film, forms PI film, water oxygen barrier layer, TFT-Array layer, oled layer successively, finally encapsulate device.After having encapsulated, apply voltage at metal level two ends, electric current is by producing Joule heat during metal level, and PI layer is separated from metal level under the action of heat, this completes the making that PI substrate is the flexible AMOLED of substrate.But this method exists following shortcoming: the equipment needing high price, and when PI film departs from from metal film, PI film easily produces defect; In addition, in order to reuse glass substrate, needing the metal on wet etching glass substrate, adds additional the cost of equipment and engineering.
The third method as shown in Figure 3, first method formation separating layer (DBL:De-bonding Layer) adopting on the glass substrate coating or stick, then on DBL, form PI film, water oxygen barrier layer, TFT-Array layer, oled layer successively, finally device is encapsulated.In manufacture craft, DBL is dimensioned slightly smaller than glass substrate, and is positioned at the center (correspondence four limit of the four back gauge glass substrates of DBL is identical) of glass substrate, and DBL and the glass substrate cementability of use are good.But poor with the cementability of PI, as: Parylene (Parylene), after having encapsulated, adopts cutting mode, isolates the flexible AMOLED that PI substrate is substrate.But this method exists following shortcoming: need special DBL material and film-forming apparatus, in addition, in order to reuse glass substrate, need, with the DBL layer on organic solvent process glass substrate, to adds additional the cost of equipment and engineering.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of flexible base, board, flexible display and preparation method thereof, be intended to the problem solving high, the easy generation quality defect of the cost existed in existing flexible base, board manufacture craft.
Technical scheme of the present invention is as follows:
A manufacture method for flexible base, board, wherein, comprises step:
A, polymer solution is coated on glass substrate;
B, flowing inert gas atmosphere in, polymer solution by heating or light-struck mode, form thin polymer film on the glass substrate, thus complete the making of flexible base, board.
The manufacture method of described flexible base, board, wherein, in described step B, when adopting heating means, the first preheated one-section time, then staged is warmed up to the heat decomposition temperature Tg of polymer, and heat 1 ~ 3 hour under the temperature conditions of Tg, be then cooled to room temperature, complete the making of thin polymer film.
The manufacture method of described flexible base, board, wherein, in staged temperature-rise period, stops 30 minutes under each temperature conditions.
The manufacture method of described flexible base, board, wherein, in described step B, when adopting light illuminating method, the first preheated one-section time, the mode then adopting staged to increase irradiation energy is irradiated, and under the condition of each irradiation energy, irradiate 5 ~ 15 minutes, the highest irradiation energy is to the heat decomposition temperature Tg of emergencing copolymer.
The manufacture method of described flexible base, board, wherein, the described preheated one-section time is: first under the temperature conditions of 80 DEG C, preheat 2 hours.
The manufacture method of described flexible base, board, wherein, adopts infrared ray to irradiate.
The manufacture method of described flexible base, board, wherein, described polymer solution is: mass percent is the PI solution of 10 ~ 20%; Described inert gas is nitrogen or argon gas.
A manufacture method for flexible display, wherein, comprises step:
A, polymer solution is coated on glass substrate;
B, flowing inert gas atmosphere in, polymer solution by heating or light-struck mode, form thin polymer film on the glass substrate, thus complete the making of flexible base, board;
After C, on the glass substrate formation thin polymer film, form water oxygen barrier layer, TFT-Array layer, oled layer and encapsulated layer successively on the polymer film;
D, be that the display device of substrate is peeled off from glass substrate and obtained flexible display by thin polymer film.
A kind of flexible base, board, wherein, adopts manufacture method as above to make.
A kind of flexible display, wherein, applies manufacture method as above and makes.
Beneficial effect: manufacture craft of the present invention does not need the extra equipment adding high price, only arranges the passage of negotiable inert gas on original oven equipment, just can prepare the PI film of function admirable on the glass substrate; And when applying this flexible base, board making flexible display, do not need laser or the firing equipment of high price, also can be that the flexible AMOLED of substrate is separated from glass substrate by PI substrate without the need to adopting special separation layer materials, therefore manufacture craft of the present invention be conducive to the manufacturing cost reducing flexible AMOLED.In addition, by preparation method of the present invention, PI is that after the display device of substrate is peeled off from glass substrate, glass substrate, through the cleaning work of routine, just can reuse, reduce cost.
Accompanying drawing explanation
Structural representation when Fig. 1 is the method making flexible display adopting amorphous silicon membrane in prior art.
Structural representation when Fig. 2 is the method making flexible display adopting metallic film in prior art.
Structural representation when Fig. 3 is the method making flexible display adopting separating layer in prior art.
Fig. 4 is the flow chart of flexible base, board manufacture method of the present invention preferred embodiment.
Fig. 5 is the flow chart of flexible display preparation method of the present invention preferred embodiment.
The structural representation of the baking oven preferred embodiment that Fig. 6 adopts for making flexible base, board of the present invention.
Fig. 7 is the structural representation of preferred embodiment when adopting method of the present invention making flexible display.
Embodiment
The invention provides a kind of flexible base, board, flexible display and preparation method thereof, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Refer to Fig. 4, Fig. 4 is the flow chart of the manufacture method preferred embodiment of a kind of flexible base, board of the present invention, and as shown in the figure, it comprises step:
S1, polymer solution is coated on glass substrate;
S2, flowing inert gas atmosphere in, polymer solution by heating or light-struck mode, form thin polymer film on the glass substrate.
The core part of the embodiment of the present invention is: make in the process of thin polymer film on the glass substrate, inert gas (gas such as nitrogen or argon gas) is passed in film forming chamber (reative cell of baking oven), and the organic solvent volatilized in polymer film forming process outwards discharges by certain flow rate by inert gas, constantly supplement fresh inert gas to film forming chamber indoor simultaneously, when ensureing to form thin polymer film (polymeric layer) under hot conditions more than 200 DEG C, thin polymer film and glass substrate is suppressed to react in interface, after engineering terminates, thin polymer film is just easy to be separated from glass substrate.Doing so avoids film-forming temperature more than 200 DEG C after, the oxygen in environment makes the interface of thin polymer film and glass substrate react, after causing engineering to terminate, thin polymer film be difficult to from glass substrate peel off problem.
The manufacture method preferred embodiment of a kind of flexible display provided by the present invention, as shown in Figure 5, it comprises step:
S1, polymer solution is coated on glass substrate;
S2, flowing inert gas atmosphere in, polymer solution by heating or light-struck mode, form thin polymer film on the glass substrate;
After S3, on the glass substrate formation thin polymer film, form water oxygen barrier layer, TFT-Array layer, oled layer and encapsulated layer successively on the polymer film;
S4, be that the display device of substrate is peeled off from glass substrate and obtained flexible base, board by thin polymer film.
Compared to above-described embodiment, the present embodiment is on the basis of the thin polymer film made, and forms water oxygen barrier layer, TFT-Array layer, oled layer and encapsulated layer; Then the display device taking thin polymer film as substrate is peeled off thus obtained flexible display.
Below the step of the inventive method is described in detail.
In step sl, described polymer solution is preferably PI solution, and PI material has the feature of hot curing or photocuring, and heat decomposition temperature Tg reaches more than 350 DEG C, so be applicable to making high-resolution display.
First preparation quality percentage is the PI solution (being described for PI solution below) of 10-20%, organic solvent wherein generally selects DMSO(dimethyl sulfoxide (DMSO)) or DMAC(dimethylacetylamide) etc., then be coated on glass substrate by PI solution, the method for coating can be the methods such as spin-coating method (Spin), knife coating or silk screen printing.
In step s 2, in the atmosphere of inert gases of flowing, PI solution is by heat or the illumination method such as to penetrate forms PI film on the glass substrate, and PI film thickness is generally at 10-20 μm.Described inert gas is nitrogen or argon gas.
Inert gas shielding mode of the present invention; unconventional inert gas shielding method; traditional nitrogen protection refers to that being full of nitrogen at conventional vacuum baking oven is used for the impact of starvation; but can remain in oven interior after the solvent vaporization at high temperature contained by polyimide solution (PI solution); and once temperature continues rising solvent evaporates thing meeting pyrolysis; its catabolite not only affects the chemical property of PI film itself, and has a strong impact on the transparency of PI film.
In embodiments of the present invention, baking oven maximum temperature is up to 450 DEG C, decompose in order to avoid the solvent evaporates contained by PI solution, the embodiment of the present invention makes flow of nitrogen gas by arranging flow of nitrogen gas device, as shown in Figure 6, in baking oven 100, nitrogen enters from side (being preferably upper end, baking oven 100 side), and flow out from opposite side (being preferably baking oven 100 opposite side lower end) thus form the nitrogen atmosphere of flowing, flow of nitrogen gas not only can the impact of starvation effectively (under high temperature, oxygen and PI material react, PI film fragility is caused to increase, transparency declines, its colour changed into yellow, and firmly cannot peel off bonding with glass substrate is taken off after film forming, affect subsequent technique), and solvent evaporates thing can be taken away by nitrogen in time endlessly, discharge baking oven cavity, avoid dissolvent residual and volatile matter decomposes the adverse effect brought.In addition, common high temperature oven temperature-fall period is very slow, utilizes flow of nitrogen gas effectively can shorten temperature fall time, thus improve process velocity and efficiency in the embodiment of the present invention.Baking oven in the embodiment of the present invention can be oven heat or infrared-ray oven etc.
The flow velocity of nitrogen can be selected according to cavity size in baking oven, and the box sizes as baking oven is:
400mm*450mm*500mm, so its nitrogen flow rate then controls: 5L/min-30L/min, and in heating process, coutroi velocity is 10L/min, and in temperature-fall period, coutroi velocity is 30L/min, ensures the needs meeting heating and cooling.
In step s3, after forming PI film on the glass substrate, PI film is formed water oxygen barrier layer, TFT-Array layer, oled layer, encapsulated layer successively, finally by mechanical cutting method, be that the display device of substrate is peeled off from glass substrate and namely obtained the flexible display made by PI, as shown in Figure 7.Owing to being form PI film in the nitrogen atmosphere of flowing, so PI film is easy to peel off from glass substrate, and the properties of PI film have also been obtained guarantee.
Wherein, in step s 2, when adopting heating means, the first preheated one-section time, then staged is warmed up to the heat decomposition temperature Tg of polymer, and heats 1 ~ 3 hour under the temperature conditions of heat decomposition temperature Tg, such as 2 hours, be then cooled to room temperature, complete the making of thin polymer film.
Specifically, adopt during heating means and first preheat 2 hours at 80 DEG C, be then stepwise warmed up to the heat decomposition temperature Tg of polymeric material, in ladder-elevating temperature process, stop 30 minutes at each temperature.The embodiment of the present invention adopts staged heating mode, the solvent in thin polymer film can be made little by little to volatilize on the one hand, is also conducive to the thermal expansion suppressing thin polymer film on the other hand.Last after heat decomposition temperature Tg heats 2 hours, Temperature fall, to room temperature, completes the manufacturing process of thin polymer film.The film forming procedure of PI carries out all the time in the nitrogen environment of flowing, thus avoids at high temperature, and the oxygen in environment makes the interface of PI layer and glass substrate react.
When adopting light illuminating method, the first preheated one-section time, the mode then adopting staged to increase irradiation energy is irradiated, and under the condition of each irradiation energy, irradiate 5 ~ 15 minutes, such as 10 minutes, the highest irradiation energy was to the heat decomposition temperature Tg of emergencing copolymer.
Specifically, when adopting light illuminating method, first adopting during light illuminating method is also first preheat 2 hours at 80 DEG C, then irradiates infrared ray (IR).About 2 hours infrared radiation time, irradiation energy stepwise becomes large, irradiates about 10 minutes at each temperature, and the highest irradiation energy corresponds to the heat decomposition temperature Tg of polymer.After the highest irradiation energy irradiates 10 minutes, close infrared ray, make chamber temp cool to room temperature, complete the manufacturing process of thin polymer film.Similar with previous embodiment, this stepped mode rising irradiation energy, also can make the solvent of thin polymer film volatilize gradually, and is beneficial to the thermal expansion suppressing thin polymer film, and the film forming procedure of polymer also carries out all the time in the nitrogen environment of flowing.
By the manufacture method of the embodiment of the present invention, PI is after the display device of substrate is peeled off from glass substrate, glass substrate is through the cleaning work of routine, just can reuse, and do not need complicated dry method, wet etching engineering or use organic solvent clean, so decrease operation, reduce cost.
A kind of flexible base, board provided by the present invention, it adopts the manufacture method of described flexible base, board to make.
The present invention also provides a kind of flexible display, and it adopts the manufacture method of described flexible display to make.
In sum, manufacture craft of the present invention does not need the extra equipment adding high price, on original oven equipment, only arranges the passage of negotiable inert gas, just can prepare the PI film of function admirable on the glass substrate; And when applying this flexible base, board making flexible display, do not need laser or the firing equipment of high price, also can be that the flexible AMOLED of substrate is separated from glass substrate by PI substrate without the need to adopting special separation layer materials, therefore manufacture craft of the present invention be conducive to the manufacturing cost reducing flexible AMOLED.In addition, by preparation method of the present invention, PI is that after the display device of substrate is peeled off from glass substrate, glass substrate, through the cleaning work of routine, just can reuse, reduce cost.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (10)
1. a manufacture method for flexible base, board, is characterized in that, comprises step:
A, polymer solution is coated on glass substrate;
B, flowing inert gas atmosphere in, polymer solution by heating or light-struck mode, form thin polymer film on the glass substrate, thus complete the making of flexible base, board.
2. the manufacture method of flexible base, board according to claim 1, it is characterized in that, in described step B, when adopting heating means, the first preheated one-section time, then staged is warmed up to the heat decomposition temperature Tg of polymer, and heats 1 ~ 3 hour under the temperature conditions of Tg, then be cooled to room temperature, complete the making of thin polymer film.
3. the manufacture method of flexible base, board according to claim 2, is characterized in that, in staged temperature-rise period, stops 30 minutes under each temperature conditions.
4. the manufacture method of flexible base, board according to claim 1, it is characterized in that, in described step B, when adopting light illuminating method, the first preheated one-section time, the mode then adopting staged to increase irradiation energy is irradiated, and under the condition of each irradiation energy, irradiate 5 ~ 15 minutes, the highest irradiation energy is to the heat decomposition temperature Tg of emergencing copolymer.
5. the manufacture method of the flexible base, board according to claim 2 or 4, is characterized in that, the described preheated one-section time is: first under the temperature conditions of 80 DEG C, preheat 2 hours.
6. the manufacture method of flexible base, board according to claim 4, is characterized in that, adopts infrared ray to irradiate.
7. the manufacture method of flexible base, board according to claim 1, is characterized in that, described polymer solution is: mass percent is the PI solution of 10 ~ 20%; Described inert gas is nitrogen or argon gas.
8. a manufacture method for flexible display, is characterized in that, comprises step:
A, polymer solution is coated on glass substrate;
B, flowing inert gas atmosphere in, polymer solution by heating or light-struck mode, form thin polymer film on the glass substrate, thus complete the making of flexible base, board;
After C, on the glass substrate formation thin polymer film, form water oxygen barrier layer, TFT-Array layer, oled layer and encapsulated layer successively on the polymer film;
D, be that the display device of substrate is peeled off from glass substrate and obtained flexible display by thin polymer film.
9. a flexible base, board, is characterized in that, adopts the manufacture method as described in any one of claim 1-7 to make.
10. a flexible display, is characterized in that, applies manufacture method as claimed in claim 8 and makes.
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| CN107464893A (en) * | 2017-07-31 | 2017-12-12 | 武汉华星光电半导体显示技术有限公司 | Preparation method, flexible display device and the display of flexible display device |
| CN109253641A (en) * | 2018-08-30 | 2019-01-22 | 桂林电子科技大学 | A kind of polyimide flex flat-plate heat pipe |
| WO2019080241A1 (en) * | 2017-10-27 | 2019-05-02 | 武汉华星光电半导体显示技术有限公司 | Display panel motherboard and method for cutting display panel motherboard |
| WO2019109456A1 (en) * | 2017-12-05 | 2019-06-13 | 武汉华星光电半导体显示技术有限公司 | Method for fabricating flexible oled display panel |
| CN111081743A (en) * | 2019-12-11 | 2020-04-28 | 深圳市华星光电半导体显示技术有限公司 | Display panel manufacturing method and display panel |
| US10658592B2 (en) | 2017-07-31 | 2020-05-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for fabricating flexible display device, flexible display device, and display apparatus |
| CN111243977A (en) * | 2018-11-28 | 2020-06-05 | 上海微电子装备（集团）股份有限公司 | Gallium nitride and sapphire substrate stripping device and method |
| CN112895616A (en) * | 2021-02-03 | 2021-06-04 | 东莞市鸿亿导热材料有限公司 | Aerogel flexible sheet and preparation method thereof |
| US11114628B2 (en) | 2017-12-05 | 2021-09-07 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing a flexible organic light-emitting diode (OLED) display panel by laser lift-off of a glass carrier through a planarization layer |
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| US10658592B2 (en) | 2017-07-31 | 2020-05-19 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method for fabricating flexible display device, flexible display device, and display apparatus |
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| US11114628B2 (en) | 2017-12-05 | 2021-09-07 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Method of manufacturing a flexible organic light-emitting diode (OLED) display panel by laser lift-off of a glass carrier through a planarization layer |
| CN109253641A (en) * | 2018-08-30 | 2019-01-22 | 桂林电子科技大学 | A kind of polyimide flex flat-plate heat pipe |
| CN111243977A (en) * | 2018-11-28 | 2020-06-05 | 上海微电子装备（集团）股份有限公司 | Gallium nitride and sapphire substrate stripping device and method |
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| CN111081743B (en) * | 2019-12-11 | 2022-06-07 | 深圳市华星光电半导体显示技术有限公司 | Display panel manufacturing method and display panel |
| CN112895616A (en) * | 2021-02-03 | 2021-06-04 | 东莞市鸿亿导热材料有限公司 | Aerogel flexible sheet and preparation method thereof |
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