CN105018979A - Application of sorbitan palmitate - Google Patents
Application of sorbitan palmitate Download PDFInfo
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- CN105018979A CN105018979A CN201510521496.1A CN201510521496A CN105018979A CN 105018979 A CN105018979 A CN 105018979A CN 201510521496 A CN201510521496 A CN 201510521496A CN 105018979 A CN105018979 A CN 105018979A
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- agent
- copper plating
- additive
- sorbitol anhydride
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Abstract
The invention discloses an application of sorbitan palmitate. The sorbitan palmitate is applied to an acid copper plating process to replace one or two of a wetting agent, a leveling agent and a brightening agent used in a traditional process. Traditional additives in the acid copper plating process are subjected to structure-activity analysis, so that sorbitan palmitate molecules, additive molecules with multiple performance, are sought out, the sorbitan palmitate molecules have the characteristics of the three traditional additives simultaneously but do not belong to any one of the wetting agent, the leveling agent and the brightening agent as proved through electrochemical analysis and electroplating experiments. The novel additive molecules can replace components, with higher costs or unstable relative performance, in a traditional bright copper plating system or can constitute a two-agent bright copper plating system, so that use and maintenance costs of a customer can be effectively reduced, the development of a non-dye system bright copper plating process is promoted, and wider potential space is developed for establishment of a new theory mode of the process.
Description
Technical field
The invention belongs to the advanced function electronic chemical product field in semiconductor chip process, be specifically related to a kind of application of sorbitol anhydride cetylate.
Background technology
Along with semiconductor chip process is to the future development of high-density, high function, high integrated and low cost, while semi-conductor chip reduces, electroplate technology is had higher requirement.Plating that is highlighted, high-flatness needs the additive with specific function and benefit, and to the usefulness of additive, stability and purity have high-quality requirement.In addition, the high request of each side also will certainly promote the operation and maintenance cost of electroplating additive.Current industry member conventional additive used can be classified as wetting agent, leveling agent and brightening agent.Need above-mentioned three kinds of additives in general plating system all simultaneously, thus play different functions.The resource input of starting material use and the complexity of Additive analysis not of the same race are not only increased to the demand of multiple different additive, and due to different additive consumption be in use different, this just adds the difficulty that electroplating additive system is safeguarded virtually.The additive types used is more, also can be higher to the cost of the maintenance of plating system and environment maintenance.
If can find a kind of multi-functional additive, can play multiple action, and be not limited only to wetting agent in electroplating process, the one in leveling agent and brightening agent, just likely high degree simplifies electroplating technology, reduces costs.
Summary of the invention
In order to solve the problem, the invention provides a kind of application of sorbitol anhydride cetylate, be intended to the operation and maintenance cost that effectively can reduce client, promote the development of non-dye system bright copper plating technique and open up more wide possibility space for the foundation of its new theory pattern.
For realizing above-mentioned technical purpose, reach above-mentioned technique effect, the present invention is achieved through the following technical solutions:
An application for sorbitol anhydride cetylate, the chemical formula of described sorbitol anhydride cetylate is C
22h
42o
6, described sorbitol anhydride cetylate as additive application in acid copper-plating technique, one or both to replace in the wetting agent S24, leveling agent L26 and the brightening agent A28 that use in traditional technology.
Sorbitol anhydride cetylate (S113) possesses the characteristic of multiple conventional additive simultaneously, the any one in traditional wetting agent S24, leveling agent L26 and brightening agent A28 can be replaced in acid copper-plating technique, with other two kinds of described conventional additive with the use of, form the additive system of three doses.Under certain conditions, also can replace the conventional additive described in two kinds, and coordinate with conventional additive described in another, composition only has the additive system of two doses.
The kind of sorbitol anhydride cetylate (S113) of the present invention is not limited only to itself, but all molecules with sorbitol anhydride cetylate (S113) similar of acute pyogenic infection of finger tip.
The invention has the beneficial effects as follows:
The present invention analyzes by carrying out structure effect to the conventional additive in acid copper-plating technique, seek the additive molecule that this class of sorbitol anhydride cetylate (S113) molecule has multiple performance, it is simultaneously with the characteristic of above-mentioned three kinds of conventional additive (wetting agent S24, leveling agent L26 and brightening agent A28), but prove through electrochemical analysis and electroplating experiments, it can not range again any one in wetting agent, leveling agent or brightening agent.This new additive agent molecule can replace the composition that in traditional bright copper plating system, cost is higher or relative performance is unstable, or two doses of bright copper plating systems can be constructed, effectively can reduce the operation and maintenance cost of client like this, promote the development of non-dye system bright copper plating technique and open up more wide possibility space for the foundation of its new theory pattern.
Above-mentioned explanation is only the general introduction of technical solution of the present invention, in order to better understand technique means of the present invention, and can be implemented according to the content of specification sheets, coordinates accompanying drawing to describe in detail below with preferred embodiment of the present invention.The specific embodiment of the present invention is provided in detail by following examples and accompanying drawing thereof.
Accompanying drawing explanation
Accompanying drawing described herein is used to provide a further understanding of the present invention, and form a application's part, schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
In mother liquor, the electroplating effect figure of leveling agent L26 and brightening agent A28 is only added when Fig. 1 is plating;
Fig. 2 for adding the electroplating effect figure of sorbitol anhydride cetylate (S113), leveling agent L26 and brightening agent A28 in mother liquor during plating;
In mother liquor, the electroplating effect figure of wetting agent S24 and brightening agent A28 is only added when Fig. 3 is plating;
Fig. 4 for adding the electroplating effect figure of sorbitol anhydride cetylate (S113), wetting agent S24 and brightening agent A28 in mother liquor during plating;
In mother liquor, the electroplating effect figure of wetting agent S24 and leveling agent L26 is only added when Fig. 5 is plating;
Fig. 6 for adding the electroplating effect figure of sorbitol anhydride cetylate (S113), wetting agent S24 and leveling agent L26 in mother liquor during plating;
Fig. 7 adds sorbitol anhydride cetylate (S113) for during plating in mother liquor, then adds a kind of electroplating effect figure in wetting agent S24, leveling agent L26 or brightening agent A28.
Embodiment
Below with reference to the accompanying drawings and in conjunction with the embodiments, describe the present invention in detail.
An application for sorbitol anhydride cetylate, the chemical formula of described sorbitol anhydride cetylate is C
22h
42o
6, described sorbitol anhydride cetylate as additive application in acid copper-plating technique, one or both to replace in the wetting agent S24, leveling agent L26 and the brightening agent A28 that use in traditional technology.
Sorbitol anhydride cetylate (S113) possesses the characteristic of multiple conventional additive simultaneously, the any one in traditional wetting agent S24, leveling agent L26 and brightening agent A28 can be replaced in acid copper-plating technique, with other two kinds of described conventional additive with the use of, form the additive system of three doses.Under certain conditions, also can replace the conventional additive described in two kinds, and coordinate with conventional additive described in another, composition only has the additive system of two doses.
The present invention passes through great many of experiments, explore sorbitol anhydride cetylate (S113) and be applied in the feasibility in acid copper-plating technique as new additive agent, have studied its in sour copper plating system with other conventional additive (as wetting agent S24, leveling agent L26 or brightening agent A28) with the use of the impact on quality of coating.Its specific experiment flow process is as follows:
1, the preparation of electroplating chemical solution system;
(1) the mother liquor 500ml needed for plating is prepared:
A. concentration is the CuSO of 200g/L
45H
2o solution;
B. concentration is the H of 100g/L
2sO
4solution;
C. concentration is the Cl of 50ppm
-solution;
By the CuSO of calculated amount
45H
2o deionized water and stirring is fully dissolved, and slowly adds the H of calculated amount
2sO
4and HCl, be diluted to 1L after filtration, get in 500ml to beaker for subsequent use.
(2) additive needed for plating is prepared:
Concentration is the sorbitol anhydride cetylate (S113) of 5mL/L.
Concentration is traditional wetting agent S24 of 10mL/L;
Concentration is traditional leveling agent L26 of 10mL/L;
Concentration is traditional brightening agent A28 of 10mL/L;
Additive solids powder deionized water dissolving is diluted in 50ml volumetric flask for subsequent use.
2, plating conditions and method;
(1) anode: phosphorus-copper anode;
(2) negative electrode: sheet brass, containing 0.1% sodium laurylsulfonate (SDS) the 0.2N NaOH aqueous solution in soaking and washing 3min, clean with deionized water rinsing, in 10% dilute sulphuric acid, immerse 5s take out, by washed with de-ionized water, then for plating;
(3) size of current and the time: 5A, 1min;
(4) alr mode: pneumatic stirring.
(5) electro-plating method: S24, L26, A28 and/or S113 aqueous solution of taking calculated amount adds in the Hull groove at mother liquor place successively, and makes full use of more than pneumatic blending 10min.
3, electroplating experimental results contrast;
(1) using sorbitol anhydride cetylate (S113) as wetting agent;
Contrast experiment 1: in mother liquor, only add leveling agent L26 and brightening agent A28;
Contrast experiment 2: in mother liquor, add sorbitol anhydride cetylate (S113), leveling agent L26 and brightening agent A28;
Shown in Fig. 1 and Fig. 2, Fig. 1 represents the electroplating effect figure of contrast experiment 1, and Fig. 2 represents the electroplating effect figure of contrast experiment 2.
(2) using sorbitol anhydride cetylate (S113) as leveling agent;
Contrast experiment 3: in mother liquor, only add wetting agent S24 and brightening agent A28;
Contrast experiment 4: in mother liquor, add sorbitol anhydride cetylate (S113), wetting agent S24 and brightening agent A28;
Shown in Fig. 3 and Fig. 4, Fig. 3 represents the electroplating effect figure of contrast experiment 3, and Fig. 4 represents the electroplating effect figure of contrast experiment 4.
(3) using sorbitol anhydride cetylate (S113) as brightening agent;
Contrast experiment 5: in mother liquor, only add wetting agent S24 and leveling agent L26;
Contrast experiment 6: in mother liquor, add sorbitol anhydride cetylate (S113), wetting agent S24 and leveling agent L26;
Shown in Fig. 5 and Fig. 6, Fig. 5 represents the electroplating effect figure of contrast experiment 5, and Fig. 6 represents the electroplating effect figure of contrast experiment 6.
(4) sorbitol anhydride cetylate (S113) is replaced two kinds in wetting agent S24, leveling agent L26 or brightening agent A28;
Contrast experiment 7: in mother liquor, add sorbitol anhydride cetylate (S113), then add the one in wetting agent S24, leveling agent L26 or brightening agent A28.
Shown in Figure 7, Fig. 7 represents the electroplating effect figure of contrast experiment 7.
The kind of sorbitol anhydride cetylate (S113) of the present invention is not limited only to itself, but all molecules with sorbitol anhydride cetylate (S113) similar of acute pyogenic infection of finger tip.
As can be seen from above-mentioned data: use sorbitol anhydride cetylate (S113) Series Molecules, it has multi-functional in sour copper plating system, can coordinate to reach with conventional additive and make copper coating light, smooth object, also may be used for two agent addition agent systems simultaneously, obtain homogeneous, smooth, bright copper electrolytic coating equally.Up to now, the application example of this molecule in electroplating additive field is not also found.
Above-described embodiment, just in order to technical conceive of the present invention and feature are described, its objective is and is one of ordinary skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.The change of every equivalence done by the essence of content of the present invention or modification, all should be encompassed in protection scope of the present invention.
Claims (1)
1. an application for sorbitol anhydride cetylate, the chemical formula of described sorbitol anhydride cetylate is C
22h
42o
6, it is characterized in that, described sorbitol anhydride cetylate as additive application in acid copper-plating technique, one or both to replace in the wetting agent S24, leveling agent L26 and the brightening agent A28 that use in traditional technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510521496.1A CN105018979A (en) | 2015-08-24 | 2015-08-24 | Application of sorbitan palmitate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510521496.1A CN105018979A (en) | 2015-08-24 | 2015-08-24 | Application of sorbitan palmitate |
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| Publication Number | Publication Date |
|---|---|
| CN105018979A true CN105018979A (en) | 2015-11-04 |
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|---|---|---|---|
| CN201510521496.1A Pending CN105018979A (en) | 2015-08-24 | 2015-08-24 | Application of sorbitan palmitate |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
| US4990224A (en) * | 1988-12-21 | 1991-02-05 | International Business Machines Corporation | Copper plating bath and process for difficult to plate metals |
| CN103687983A (en) * | 2011-05-19 | 2014-03-26 | 安科有限两合公司 | Wetting agent for electrolytic applications and use thereof |
| CN103924268A (en) * | 2013-12-26 | 2014-07-16 | 苏州昕皓新材料科技有限公司 | Application of acid copper leveling agent |
-
2015
- 2015-08-24 CN CN201510521496.1A patent/CN105018979A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4038161A (en) * | 1976-03-05 | 1977-07-26 | R. O. Hull & Company, Inc. | Acid copper plating and additive composition therefor |
| US4990224A (en) * | 1988-12-21 | 1991-02-05 | International Business Machines Corporation | Copper plating bath and process for difficult to plate metals |
| CN103687983A (en) * | 2011-05-19 | 2014-03-26 | 安科有限两合公司 | Wetting agent for electrolytic applications and use thereof |
| CN103924268A (en) * | 2013-12-26 | 2014-07-16 | 苏州昕皓新材料科技有限公司 | Application of acid copper leveling agent |
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