CN104980118A - Laminated-type ceramic radio-frequency low pass filter and preparation method therefor - Google Patents

Laminated-type ceramic radio-frequency low pass filter and preparation method therefor Download PDF

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Publication number
CN104980118A
CN104980118A CN201410133483.2A CN201410133483A CN104980118A CN 104980118 A CN104980118 A CN 104980118A CN 201410133483 A CN201410133483 A CN 201410133483A CN 104980118 A CN104980118 A CN 104980118A
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ceramic
frequency
low pass
pass filter
filter
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Inventor
罗洪梁
刘季超
樊应县
李建辉
林亚梅
徐鹏飞
庞岩
王智会
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China Zhenhua Group Science and Technology Co Ltd
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Shenzhen Zhenhua Ferrite and Ceramic Electronics Co Ltd
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Priority to CN201710536457.8A priority Critical patent/CN107465395A/en
Priority to CN201410133483.2A priority patent/CN104980118A/en
Publication of CN104980118A publication Critical patent/CN104980118A/en
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H1/0007—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network of radio frequency interference filters
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/62218—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products obtaining ceramic films, e.g. by using temporary supports
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/626—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B
    • C04B35/63—Preparing or treating the powders individually or as batches ; preparing or treating macroscopic reinforcing agents for ceramic products, e.g. fibres; mechanical aspects section B using additives specially adapted for forming the products, e.g.. binder binders
    • C04B35/638—Removal thereof
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
    • H03H7/01—Frequency selective two-port networks
    • H03H7/0115—Frequency selective two-port networks comprising only inductors and capacitors
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
    • H03H2001/0021—Constructional details
    • H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets

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  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Power Engineering (AREA)
  • Filters And Equalizers (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

The invention discloses a laminated-type ceramic radio-frequency low pass filter and a preparation method therefor. The low pass filter comprises four leading-out terminal electrodes and an inner circuit, wherein the electrodes are the input terminal positive electrode, the output terminal positive electrode and two common grounding terminals in sequence; and the inner circuit comprises an inner electrode which is formed by a plurality of built-in capacitors and a plurality of built-in inductors located in the three-dimensional spaces of different dielectric layers. The inductors are in vertical three-dimensional helical structure; and the dielectric layers of the inductors and the capacitors utilize high-frequency low-loss ceramic materials. According to the filter, the dielectric material layers are the high-frequency ceramic material layers; the capacitance and inductance of inner components can achieve minimal adjustment, and a monolithic structure can be realized easily; the preparation technology is mature; consistency is good; the filter is suitable for volume production; and therefore, the low pass filter has the advantages of high cut-off frequency, wide operating frequency range, high out-of-band rejection, good rectangular degree, high reliability and good radio-frequency usage consistency and the like.

Description

A kind of lamination sheet type ceramic RF low pass filter and preparation method thereof
Technical field
The invention belongs to wave filter technology field, more specifically, relate to a kind of lamination sheet type ceramic RF low pass filter and preparation method thereof.
Background technology
Filter is that one has optionally two-port network to frequency, and it all plays very important role in the communications industry always.
Lamination sheet type radio frequency low pass filter is a kind of Novel Filter, along with the development of mechanics of communication, its operating frequency range is more and more wider, frequency of utilization is also more and more higher, the trend that miniaturized, high frequency develops clearly (the product frequency of utilization in some field reaches 40GHz, even higher).A new generation's appearance of mobile communication technology and the demand of new-type weapon and equipment, make the market demand rapid growth of the small size lamination sheet type radio-frequency filter of working band wide ranges, frequency of utilization high (reaching tens GHz).
Lamination sheet type ceramic RF (microwave) filter is the high frequency filter being printed the various technical processes such as stack technology and low-temperature sintering technology by electron ceramic material casting molding processes, high accuracy and made.It has the characteristics such as volume is little, Insertion Loss is low, be widely used in the systems such as microwave communication, radar navigation, electronic countermeasures, satellite communication, VHF/UHF emitter/receiver, harmonic shutter, digital-to-analogue converter and test instrumentation, be indispensable important devices in microwave system, the quality of its performance often directly affects the performance index of whole communication system.
At present, research and production small size lamination sheet type low pass filter is mainly adopted in two ways: pure inductance or pure capacitive based unit piece form and LC version, and its technology maturation is unit piece form, but this kind of small size lamination sheet type wave filter is all based on low cut-off frequency, and it is not high to have Out-of-band rejection performance, the features such as rectangular degree difference.
Although traditional LC version filter utilizes area small-scale production and its inband flatness is fine, poor in the consistency of the use of radio band, be also difficult to batch production simultaneously.
At present, comparatively ripe lamination sheet type wave filter major part adopts simple π type, the T-type structure such as " two electric capacity+mono-inductance " or " single capacitor+bis-inductance ", filter inband flatness and the Out-of-band rejection characteristic of such design are all better, but cut-off frequency is lower, cause its frequency of utilization limited, be difficult to high frequency future development.
In addition, always there is some deficiency in the low pass filter of the lamination multilayer ceramic structure announced, be CN1578129 if prior art 1 is publication number, denomination of invention is the patent application document of " a kind of multilayer sheet type pottery low pass filter ", wherein low pass filter adopts planar spiral inductor structure, and in the filter of small size microwave section, the introducing parasitic capacitance of the inductance of this kind of structure is very large on frequency characteristic impact, and along with its volume less, its influence degree is more and more darker.
Prior art 2 is publication numbers is CN101404485A, denomination of invention is the patent application document of " a kind of lamination sheet type wave filter and preparation method thereof ", its median filter adopts ferrite and ceramic co-fired mode to prepare, though have the advantages such as small size, Out-of-band rejection is large, rectangular degree is large, operating frequency is wide, but cut-off frequency is relatively low, and the problem such as the reliability of filter is poor.The reason of poor reliability: between ferrite with ceramic material, special-shaped material not easily mates.Especially when environment for use is comparatively harsh, the stress between special section inevitably produces, and easily causes interiors of products to occur slight crack, and then has influence on its use.
Prior art 3 publication number is CN10216396A, denomination of invention is the patent application document of " a kind of multilayer chip filter and preparation method thereof ", wherein prepare filter by the mode of punching injection Ferrite Material in ceramic medium material, though alleviating patent publication No. is to a certain extent that the dissimilar materials coupling of CN101404485A median filter causes the problem of dependability, but still cannot avoid completely, still there is the hidden danger of test reliability.
Summary of the invention
For the defect of prior art, the invention provides a kind of lamination sheet type ceramic RF low pass filter, the cut-off frequency of this filter be high, operating frequency range is wide, Out-of-band rejection is high, rectangular degree is good, reliability is high, radio band use consistency good.
The invention provides a kind of lamination sheet type ceramic RF low pass filter, there are four exit electrodes, comprise input anode (16), output head anode (15) and two common ground ends (14), the internal circuit of described lamination sheet type ceramic RF low pass filter comprise be in different medium layer three dimensions on the interior electrode (13) that forms of multiple built-in capacitance (17) and multiple built-in induct (10); Described inductance (10) is vertical three-dimensional helical structure; The dielectric layer of described inductance (10) and described electric capacity (17) adopts ceramic material.
Present invention also offers a kind of preparation method of lamination sheet type ceramic RF low pass filter, comprise the steps:
(1) casting slurry is obtained by after ceramic powder, organic solvent, plasticizer, binding agent and dispersant; And after described casting slurry is carried out ball milling and curtain coating process, form the diaphragm that thickness is 5 microns ~ 100 microns; Wherein the mass percent of ceramic powder, organic solvent, plasticizer, binding agent and dispersant is followed successively by (40 ~ 60) wt%, (40 ~ 60) wt%, (1.0 ~ 4.0) wt%, (4.5 ~ 8.5) wt%, (0.09 ~ 0.5) wt%;
(2) according to the needs connected between the needs be connected between inductance with electric capacity, inductance, described diaphragm is punched, filling perforation, then carry out conductor printing, lamination, pressing, isostatic pressed process successively;
(3) chip-type filter ceramic chips after isostatic pressed process is carried out binder removal and sintering processes; Sintering temperature is 800 DEG C ~ 950 DEG C;
(4) lamination sheet type ceramic RF low pass filter is formed after painting silver, end-blocking, termination process being carried out successively to the chip-type filter ceramic chips after sintering.
What filter medium material of the present invention adopted is high-frequency ceramic material, capacity, the sensibility reciprocal of inner member can realize minor adjustments, and be easier to realize monolithic structure, mature preparation process, the good suitable batch of consistency is produced, therefore, this filter has the advantages such as cut-off frequency is high, operating frequency range is wide, Out-of-band rejection is high, rectangular degree is good, reliability is high, radio band use consistency is good.
Accompanying drawing explanation
Fig. 1 is the equivalent electric circuit of the lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides, and wherein Fig. 1 (a) is a kind of LC equivalent circuit structure, and Fig. 1 (b) is another kind of LC equivalent circuit structure;
Fig. 2 (a) is the composition structural representation of the lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides;
Fig. 2 (b) is the vertical view of the lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides;
Fig. 3 is the internal electrode composition structural representation of the lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides; (front view)
Fig. 4 is induction structure schematic diagram in the lamination sheet type ceramic RF low pass filter that provides of the embodiment of the present invention; (front view)
Fig. 5 is capacitance structure schematic diagram in the lamination sheet type ceramic RF low pass filter that provides of the embodiment of the present invention; (front view)
Fig. 6 is that in the preparation method of the lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides, lamination sheet type wave filter middle side edge is coated with silver-colored structural representation;
Fig. 7 is the insertion loss characteristic curve schematic diagram of the lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides;
Fig. 8 is the damage curve schematic diagram that cut-off frequency that the embodiment of the present invention provides is respectively the lamination sheet type ceramic RF low pass filter of 4850MHz, 7600MHz and 9100MHz;
Fig. 9 is the damage curve schematic diagram of the lamination sheet type ceramic RF low pass filter of the cut-off frequency 30800MHz that the embodiment of the present invention provides;
Wherein, 13 is interior electrode, and 14 is common ground end, and 15 is output head anode, and 16 is input anode, and 10 is inductance, and 11 is electrode connection points, and 17 is electric capacity, and 21 is filter, and 22 is terminal electrode paste, and 23 for being coated with silver-colored roller.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides can be applied to radio frequency in harmonic shutter, VHF/UHF emitter/receiver, DC circuit plate to be suppressed or in the device such as digital-to-analogue converter; The fields such as microwave communication, radar navigation, electronic countermeasures, satellite communication can also be applied to.
For above problem, the invention provides a kind of novel laminated chip ceramic RF low pass filter and preparation method thereof.What filter medium material of the present invention adopted is high-frequency ceramic material, capacity, the sensibility reciprocal of inner member can realize minor adjustments, and be easier to realize monolithic structure, mature preparation process, the good suitable batch of consistency is produced, therefore, this filter has cut-off frequency high (radio frequency), operating frequency range is wide, Out-of-band rejection is high, rectangular degree is good, reliability is high, radio band uses the advantages such as consistency is good.Meanwhile, the preparation technology of filter of the present invention and the technique of conventional chip components and parts and LTCC (LTCC) technique mutually compatible, do not need again to add other equipment more.
Filter of the present invention adopts LC version (equivalent circuit Fig. 1), inner built-up circuit forms (see Fig. 2, Fig. 3 primarily of the multiple built-in capacitance 17 be on the three dimensions of different medium layer with multiple built-in induct 10, wherein Fig. 3 is only the one in filter construction of the present invention, and the exponent number of its filter is 7).The present invention is by ratio (certainly also considering parasitic parameter) between each inductance value of adjustment and each capacitance, and by high density on three-dimensional space, multiple electric capacity 17 is carried out ingenious layout with multiple inductance 10 highly integratedly, (carry out authentic analog simulation by electromagnetic field simulation software, adjustment inductance 10, the electrode shape of electric capacity 17, structure dislocation etc. between the two, reduce " ghost effect " of stray inductance and parasitic capacitance, the impact of the multiple coupling that is associated is there is) between each inner member of matching, the radio-frequency filter design of different performance parameter request can be realized.By the number (and corresponding proportioning) of adjustment internal capacitance, inductance, realize the setting of different filter order, in conjunction with the layout cleverly of 3 D stereo circuit connection structure, the present invention can realize the adjustable range of cut-off frequency: 30MHz ~ 40000MHz.
Filter internal inductance 10 of the present invention adopts vertical three-dimensional helical structure (being structure known in this field), decreases parasitic capacitance.Under identical effective inductance value, vertical spin structure inductance 10 element has higher self-resonant frequency (SRF) and quality factor (Q) than planar spiral-type structure, and is conducive to the size of reduction of device.Because the general capacity of radio-frequency filter is less, built-in capacitance 17 adopts conventional metals-dielectric-metal form capacity plate antenna structure to achieve the goal.
In addition, inductance 10 all adopts the ceramic material of high-frequency low-consumption with the dielectric layer of electric capacity 17, avoids the integrity problem caused because dissimilar materials does not mate completely, greatly improves the reliability of product.
In embodiments of the present invention, according to the requirement of wave filter technology index, based on compatible principle of electromagnetism, in conjunction with LTCC technology, electromagnetic simulation software HFSS radio frequency low pass filter is adopted to carry out structural design.
The common engineering step of radio-frequency filter design:
First, approximation theory is utilized to find attainable approximating function;
Secondly, the amplitude square function using approximating function as filter;
Then, its attenuation function is drawn by the amplitude square function of filter;
Subsequently, combination technology index (insertion-loss method is mainly by nominal frequency and cut-off frequency parameter index) determines the exponent number of filter, goes normalized, obtain L, C initial parameter value of each element to lowpass prototype filter;
When transfer function (approximating function) using Butterworth function as filter, filter approximating function of the present invention, by the series of computation to its amplitude square function, derivation, obtaining it, to insert attenuation function as follows:
α = - 101 g [ 1 1 + ( ω ω c ) 2 n ] = 101 g [ 1 + ( ω ω c ) 2 n ]
Wherein, ω cfor cut-off frequency.Filter parameter technical indicator parameter " nominal frequency (1dB dot frequency), cut-off frequency (3dB dot frequency) " is substituted into above derivation formula, tentatively can find the exponent number of filter.
Gone out the parameter value of the exponent number of filter, built-in induct 10, electric capacity 17 by theoretical calculate after, 3 D electromagnetic field simulation software HFSS radio-frequency filter is utilized to emulate.The situation of binding isotherm result of calculation and emulation, carries out optimal design repeatedly, completes product design.
Finally, carry out filter inner electrode and product three-dimensional structure (adopting three dimensional wiring technology) design, in design process, thermal design and reliability design are taken into account.
Through the checking repeatedly of Design and optimization and test, finally obtain the perfect structure of filter of the present invention.
The lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides is two-terminal network, there are four exit electrodes, comprise two termination electrodes (representing input anode 16, output head anode 15 respectively) and two central electrodes (common ground end 14), concrete as shown in Fig. 2 (b).
The internal circuit of lamination sheet type ceramic RF low pass filter of the present invention, comprise electrode 13(in being made up of the multiple built-in capacitance 17 be on the three dimensions of different medium layer and multiple built-in induct 10 and see Fig. 2, Fig. 3, wherein Fig. 3 is only the one in filter construction of the present invention, the exponent number of its filter is 7), inductance 10 is identical with the dielectric material of electric capacity 17, all adopts the ceramic material of high-frequency low-consumption.
Inductance 10 and electric capacity 17 layout type 1: dielectric layer comprises the upper laminated portions, the first separator, intermediate laminate part, the second separator and the lower laminated portions that stack gradually layout, intermediate laminate part is composed in series by some circles (number of turns is adjustable as required) four inductance 10, is drawn out to input anode 16 and output head anode 15 respectively.Upper laminated portions and lower laminated portions comprise the lamination sheet type electric capacity 17 be made up of ceramic material of the same race, adopt parallel, each electric capacity 17 is all: an end is connected on the tie point place (realizing being connected by the mode separator penetrated between inductance 10 with electric capacity 17 of " punching/fill electrode ") of a two series connection inductance 10, or be connected to described input anode 16 or output head anode 15, other end ground connection.Adopt relatively thick high-frequency ceramic dielectric layer to separate between inductance 10 and electric capacity 17, object reduces inductance 10 and being coupled between electric capacity 17, interference.
Inductance 10 and electric capacity 17 layout type 2: dielectric layer comprises the upper laminated portions, separator and the lower laminated portions that stack gradually layout, upper laminated portions includes multiple inductance 10 be connected in series, lower laminated portions includes multiple described electric capacity 17 respectively, one end of each described electric capacity 17 is through described separator, and be connected to the tie point of inductance 10 docking described in two, the other end ground connection of each described electric capacity 17.Electric capacity 17 penetrates the connection between separator realization with inductance 10 by the mode of " punching or filling electrode ".The similar layout type 1 of connected mode between inductance 10 and electric capacity 17.
Inductance 10 and electric capacity 17 layout type 3: the inductance 10 being distributed with multiple arranged in series in output head anode 15 and described input anode 16 respectively, multiple described electric capacity 17 is distributed with in common ground end 14, one end of electric capacity 17 is connected to the tie point of inductance 10 docking described in two, the other end ground connection of described electric capacity 17, the similar layout type 1 of the connected mode between inductance 10 and electric capacity 17.
Wherein, built-in induct 10 electrode (see Fig. 4, wherein Fig. 4 is only the one in filter construction of the present invention, and the exponent number of its filter the is 7) wiring on three dimensions, makes its electrode relative to the axial symmetry of horizontal, longitudinal center line.
The electrode of built-in capacitance 17 is also similar sees Fig. 5 with inductance 10(, and wherein Fig. 5 is only the one in filter construction of the present invention, and the exponent number of its filter is 7), adopt the axisymmetric mode making its electrode relative to horizontal, longitudinal center line.
Like this, just can ensure the crash consistency moved towards at the electrode of input anode 16, output head anode 15 at inductance 10 and electric capacity 17, input anode 16, output head anode 15 can be exchanged completely, easy to install.
After the structural design of filter and technological design complete, on LTCC production line, through processing steps such as slurry preparation, curtain coating, cutting, punching, conductor layer printing, lamination, isostatic pressed, cutting, binder removal, sintering, Tu Yin, silver ink firing, plating, tests, carry out the product development of radio frequency low pass filter.
The specific implementation flow process of the preparation method of the lamination sheet type ceramic RF low pass filter that the embodiment of the present invention provides comprises the following steps:
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.First, the tangent value of the dielectric loss angle of high-frequency ceramic material must be less than or equal to 6*10 -4.Secondly, the interior electrode of radio-frequency filter should not adopt silver-palladium inner electrode slurry, and therefore, the sintering temperature of ceramic material will lower than less than 900 DEG C.Then, the range of choice of dielectric constant is: 3 ~ 100.
The optimum condition of dielectric constant: prepare the filter of cut-off frequency lower than 460MHz, dielectric constant is advisable at the material of 20 ~ 50; Cut-off frequency 460 ~ 1300MHz's, dielectric constant is advisable at the material of 10 ~ 20; Cut-off frequency 1300 ~ 3600MHz's, dielectric constant is advisable at the material of 6 ~ 10; More than cut-off frequency 3600MHz's, select the material of dielectric constant below 6 more satisfactory.
Certainly, can this ceramic material be selected, and also needing to investigate performance parameter has: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then the ratio optimization design of each organic additive is carried out, object is that the casting slurry making to make is uniformly dispersed, does not reunite, good stability, guarantees that its bubble-free, easily demoulding, easily bonding, ductility when folded film are moderate etc. simultaneously.
Table 1 casting slurry proportioning
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is adjustable at 5 ~ 100 microns.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode with the ceramics green ceramic diaphragm that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 5 ~ 12 micrometer ranges.
Step 6: lamination, pressing.The ceramics green ceramic diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressing process Parameter Conditions: pressure 20 ~ 40MPa, temperature 50 ~ 90 DEG C, pressurize 5 ~ 30Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 200 DEG C ~ 500 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product 800 ~ 950 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
The glassy phase that filter silver ink firing follower head silver layer of the present invention can produce with impurity or silver ink firing, can have influence on galvanization coating effect, first product be carried out the residue that product surface is removed in surface treatment before plating.Then, according to the coating requirement of product, select suitable electroplating technical conditions to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
In order to further description filter provided by the invention and preparation method thereof, now in conjunction with instantiation, details are as follows:
Embodiment 1 ~ 3: preparing cut-off frequency is respectively 145MHz, 350MHz, 459MHz radio frequency low pass filter
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.The tangent value of the dielectric loss angle of high-frequency ceramic material is selected to be less than 6*10 -4, the sintering temperature of the material of pottery is 860 DEG C.
Dielectric constant corresponding to three embodiments selects situation as shown in table 2.
Table 2 dielectric constant selection scheme table
Embodiment 1 2 3
Cut-off frequency (MHz) 145 350 430
Material dielectric constant 50 36 20
Certainly, also investigate ceramic material property parameter: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then carry out the ratio optimization design of each organic additive.
Table 3 casting slurry proportioning
Raw material Ceramic powder Organic solvent Plasticizer Binding agent Dispersant
Ratio (wt%) 45.0 45.0 3.8 6.1 0.1
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is at 35 microns, and control errors is in ± 0.5 micron.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode by the ceramic dielectric films that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 6 ± 0.5 micrometer ranges.
Step 6: lamination, pressing.The diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressed preferred parameter: pressure 18MPa, temperature 70 C, pressurize 30Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 430 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product about 860 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
After product silver ink firing in step 10, according to the coating requirement of product, suitable electroplating technical conditions is selected to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
Test cut-off frequency is that the insertion loss figure of the filter of 350MHz is shown in Fig. 7.
Embodiment 4 ~ 6: prepare cut-off frequency and be respectively 460MHz, 700MHz, 1200MHz radio frequency low pass filter
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.The tangent value of the dielectric loss angle of high-frequency ceramic material is selected to be less than 6*10 -4, the sintering temperature of the material of pottery is 880 DEG C.
Dielectric constant corresponding to three embodiments selects situation as shown in table 4.
Table 4 dielectric constant selection scheme table
Embodiment 4 5 6
Cut-off frequency (MHz) 460 700 1200
Material dielectric constant 18 16.7 13.3
Certainly, also investigate ceramic material property parameter: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then carry out the ratio optimization design of each organic additive.
Table 5 casting slurry proportioning
Raw material Ceramic powder Organic solvent Plasticizer Binding agent Dispersant
Ratio (wt%) 48.0 43.3 2.5 6.1 0.1
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is at 30 microns, and control errors is in ± 0.5 micron.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode by the ceramic dielectric films that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 7 ± 0.5 micrometer ranges.
Step 6: lamination, pressing.The diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressed preferred parameter: pressure 20MPa, temperature 65 DEG C, pressurize 25Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 500 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product about 880 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
After product silver ink firing in step 10, according to the coating requirement of product, suitable electroplating technical conditions is selected to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
Test cut-off frequency is that the insertion loss figure of the filter of 700MHz is shown in Fig. 7.
Embodiment 3: preparing cut-off frequency is 1750MHz radio frequency low pass filter
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.The tangent value of the dielectric loss angle of high-frequency ceramic material is selected to be less than 6*10 -4, the sintering temperature of the material of pottery is 880 DEG C.
Table 6 dielectric constant selection scheme table
Embodiment 7 8 9
Cut-off frequency (MHz) 1300 1750 3500
Material dielectric constant 9.8 8.5 6.3
Certainly, also investigate ceramic material property parameter: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then carry out the ratio optimization design of each organic additive.
Table 7 casting slurry proportioning
Raw material Ceramic powder Organic solvent Plasticizer Binding agent Dispersant
Ratio (wt%) 48.0 43.3 2.4 6.2 0.1
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is at 30 microns, and control errors is in ± 0.5 micron.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode by the ceramic dielectric films that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 8 ± 0.5 micrometer ranges.
Step 6: lamination, pressing.The diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressed preferred parameter: pressure 28MPa, temperature 70 C, pressurize 18Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 450 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product about 880 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
After product silver ink firing in step 10, according to the coating requirement of product, suitable electroplating technical conditions is selected to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
Test cut-off frequency is that the insertion loss figure of the filter of 1750MHz is shown in Fig. 7.
Embodiment 10 ~ 11: preparing cut-off frequency is respectively 3600MHz, 4850MHz radio frequency low pass filter
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.The tangent value of the dielectric loss angle of high-frequency ceramic material is selected to be less than 6*10 -4, the sintering temperature of the material of pottery is 900 DEG C.
In the selection of dielectric constant, the cut-off frequency of filter is respectively the filter of 3600MHz, 4850MHz, and the dielectric constant of the dielectric material of selection is respectively 5.7,4.3.
Certainly, also investigate ceramic material property parameter: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then carry out the ratio optimization design of each organic additive.
Table 8 casting slurry proportioning
Raw material Ceramic powder Organic solvent Plasticizer Binding agent Dispersant
Ratio (wt%) 48.3 43.1 2.3 6.2 0.1
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is at 25 microns, and control errors is in ± 0.5 micron.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode by the ceramic dielectric films that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 8 ± 0.5 micrometer ranges.
Step 6: lamination, pressing.The diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressed preferred parameter: pressure 30MPa, temperature 60 C, pressurize 10Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 460 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product about 900 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
After product silver ink firing in step 10, according to the coating requirement of product, suitable electroplating technical conditions is selected to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
Test cut-off frequency is that the insertion loss figure of the filter of 4850MHz is shown in Fig. 8.
Embodiment 12: preparing cut-off frequency is 7600MHz radio frequency low pass filter
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.The tangent value of the dielectric loss angle of high-frequency ceramic material is selected to be less than 6*10 -4, the sintering temperature of the material of pottery is 900 DEG C.
In the selection of dielectric constant, the cut-off frequency of filter is the filter of 7600MHz, and cut-off frequency is at more than 3600MHz, and the dielectric constant of the dielectric material that this place is selected is 4.0.
Certainly, also investigate ceramic material property parameter: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then carry out the ratio optimization design of each organic additive.
Table 9 casting slurry proportioning
Raw material Ceramic powder Organic solvent Plasticizer Binding agent Dispersant
Ratio (wt%) 47.9 43.2 2.6 6.2 0.1
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is at 35 microns, and control errors is in ± 0.5 micron.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode by the ceramic dielectric films that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 8 ± 1 micrometer ranges.
Step 6: lamination, pressing.The diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressed preferred parameter: pressure 25MPa, temperature 60 C, pressurize 18Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 450 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product about 900 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
After product silver ink firing in step 10, according to the coating requirement of product, suitable electroplating technical conditions is selected to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
The insertion loss figure testing this filter is shown in Fig. 8.
Embodiment 13: preparing cut-off frequency is 9100MHz radio frequency low pass filter
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.The tangent value of the dielectric loss angle of high-frequency ceramic material is selected to be less than 6*10 -4, the sintering temperature of the material of pottery is 900 DEG C.
In the selection of dielectric constant, the cut-off frequency of filter is the filter of 9100MHz, and cut-off frequency is at more than 3600MHz, and the dielectric constant of the dielectric material that this place is selected is 3.7.
Certainly, also investigate ceramic material property parameter: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then carry out the ratio optimization design of each organic additive.
Table 10 casting slurry proportioning
Raw material Ceramic powder Organic solvent Plasticizer Binding agent Dispersant
Ratio (wt%) 47.9 43.2 2.5 6.3 0.1
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is at 35 microns, and control errors is in ± 0.5 micron.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode by the ceramic dielectric films that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 8 ± 1 micrometer ranges.
Step 6: lamination, pressing.The diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressed preferred parameter: pressure 20MPa, temperature 60 C, pressurize 20Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 450 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product about 900 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
After product silver ink firing in step 10, according to the coating requirement of product, suitable electroplating technical conditions is selected to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
The insertion loss figure testing this filter is shown in Fig. 8.
Embodiment 14: preparing cut-off frequency is 30800MHz radio frequency low pass filter
Step 1: the selection of high-frequency ceramic material.According to the needs of filter performance parameters, select suitable high-frequency ceramic material.The tangent value of the dielectric loss angle of high-frequency ceramic material is selected to be less than 6*10 -4, the sintering temperature of the material of pottery is 890 DEG C.
In the selection of dielectric constant, the cut-off frequency of filter is the filter of 30800MHz, and cut-off frequency is at more than 3600MHz, and the dielectric constant of the dielectric material that this place is selected is 3.5.
Certainly, also investigate ceramic material property parameter: the dielectric strength of material, capacitance temperature factor, itself and silver-colored matching of starching, its frequency of utilization etc. aspect.
Step 2: preparation casting slurry.According to specific surface and the electrically charged characteristic of selected ceramic powder particle, select suitable solvent system (comprising organic solvent, plasticizer, binding agent and dispersant), then carry out the ratio optimization design of each organic additive.
Table 11 casting slurry proportioning
Raw material Ceramic powder Organic solvent Plasticizer Binding agent Dispersant
Ratio (wt%) 47.9 43.2 2.5 6.3 0.1
Step 3: ball milling, curtain coating.The casting slurry that step 2 prepares, after selecting suitable ball-milling technology slurrying, according to the needs of design diaphragm, go out the ceramics green ceramic diaphragm of desired thickness in casting machine curtain coating, diaphragm thickness is at 45 microns, and control errors is in ± 0.5 micron.
Step 4: punching, filling perforation.The needs carried out by the part ceramics green ceramic diaphragm of step 3 gained according to being connected between inductance with electric capacity, connecting between inductance punch.Then silver slurry is utilized to carry out filling perforation.
Step 5: conductor printing.Carry out inductor conductor printing with the ceramics green ceramic diaphragm of filling perforation, carry out the knot positive electrode of built-in capacitance and the printing of grounding electrode by the ceramic dielectric films that part is not punched, the THICKNESS CONTROL of printing silver slurry is within 8 ± 1 micrometer ranges.
Step 6: lamination, pressing.The diaphragm ceramics green ceramic diaphragm and part that print electrode not printed electrode, according to the structure designed by the present invention, carries out lamination, pressing.
Step 7: isostatic pressed.The chip-type filter ceramic chips completing lamination is contained in and is placed in isostatic pressing machine in the sealing bag vacuumized and carries out isostatic pressed, isostatic pressed preferred parameter: pressure 20MPa, temperature 60 C, pressurize 20Min.
Step 8: binder removal.Binder removal process is organic bond gasification and the process of burn off, be also before sintering must through process, its temperature is located at 450 DEG C.The quality of binder removal process to low temperature co-fired type radio-frequency filter (LTCC radio-frequency filter) has a serious impact, if binder removal is insufficient, after sintering, polylayer forest just can bubble, be out of shape or layering etc.; If binder removal is excessive, metallization pattern may be made again to come off.Therefore to strictly control in binder removal process, especially to the assurance of heating rate.
Step 9: after completing binder removal, just enters sintering process, and sintering is under certain atmospheric condition, allows the process of LTCC product densification under the high temperature conditions, the sintering temperature of this product 890 DEG C.In sintering process, sintering mechanism is comparatively complicated, and how to ensure that the contraction of Metal slurry and band material degree of the same race is the key of sintering process, its technological parameter mainly contains the rate of heat addition, heating time, temperature retention time, temperature fall time etc., and these all need strict control.Such as, occurring the phenomenon that aperture " is heaved " outward in LTCC filter sample, is also caused by Metal slurry and the contraction in various degree of band material.
Step 10: Tu Yin, end-blocking.Being coated with silver-colored position is middle side edge, and end-blocking position is the two ends of product, and as shown in three-view diagram in Fig. 2, black part is divided into electrode.Radio-frequency filter of the present invention has 4 exits, and intermediate ends electrode adopts to roll and is coated with silver-colored (see figure 6), and both sides termination electrode adopts the end-blocking mode of sticky silver to carry out.The painting silver of intermediate ends electrode is one of difficult point of filter of the present invention preparation realization, must design be coated with silver wheel, to ensure the overall dimension of termination electrode and the precision of thickness according to shape of product and size.
Step 11: termination processes.
After product silver ink firing in step 10, according to the coating requirement of product, suitable electroplating technical conditions is selected to electroplate on plating line.
After having electroplated, just can obtain lamination sheet type ceramic RF low pass filter of the present invention.
The insertion loss figure testing this filter is shown in Fig. 9.
Those skilled in the art will readily understand; the foregoing is only preferred embodiment of the present invention; not in order to limit the present invention, all any amendments done within the spirit and principles in the present invention, equivalent replacement and improvement etc., all should be included within protection scope of the present invention.

Claims (9)

1. a lamination sheet type ceramic RF low pass filter, there are four exit electrodes, comprise input anode (16), output head anode (15) and two common ground ends (14), it is characterized in that, the internal circuit of described lamination sheet type ceramic RF low pass filter comprise be in different medium layer three dimensions on the interior electrode (13) that forms of multiple built-in capacitance (17) and multiple built-in induct (10); Described inductance (10) is vertical three-dimensional helical structure; The dielectric layer of described inductance (10) and described electric capacity (17) adopts ceramic material.
2. lamination sheet type ceramic RF low pass filter as claimed in claim 1, it is characterized in that, described dielectric layer comprises the upper laminated portions stacking gradually layout, first separator, intermediate laminate part, second separator and lower laminated portions, described upper laminated portions and lower laminated portions include described electric capacity (17) respectively, described electric capacity (17) is made up of ceramic material of the same race, described middle laminated portions includes multiple described inductance (10) be connected in series, one end of described electric capacity (17) is connected to the tie point (11) that inductance described in two (10) docks, or be connected to described input anode (16) or output head anode (15), the other end ground connection of described electric capacity (17).
3. lamination sheet type ceramic RF low pass filter as claimed in claim 1, it is characterized in that, described dielectric layer comprises the upper laminated portions, separator and the lower laminated portions that stack gradually layout,
Described upper laminated portions includes multiple inductance (10) be connected in series, described lower laminated portions includes multiple described electric capacity (17) respectively, one end of each described electric capacity (17) is through described separator, and be connected to the tie point that inductance described in two (10) docks, the other end ground connection of each described electric capacity (17).
4. lamination sheet type ceramic RF low pass filter as claimed in claim 1, it is characterized in that, the described inductance (10) of multiple arranged in series is distributed with respectively in described output head anode (15) and described input anode (16), multiple described electric capacity (17) is distributed with in described common ground end (14), one end of described electric capacity (17) is connected to the tie point that inductance described in two (10) docks, the other end ground connection of described electric capacity (17).
5. the lamination sheet type ceramic RF low pass filter as described in any one of claim 1-4, it is characterized in that, the tangent value of the dielectric loss angle of the ceramic material of described high-frequency low-consumption is less than or equal to 6*10 -4, sintering temperature is lower than 900 DEG C, and dielectric constant is 3 ~ 100.
6. a preparation method for lamination sheet type ceramic RF low pass filter, is characterized in that, comprises the steps:
(1) casting slurry is obtained by after ceramic powder, organic solvent, plasticizer, binding agent and dispersant; And after described casting slurry is carried out ball milling and curtain coating process, form the diaphragm that thickness is 5 microns ~ 100 microns; Wherein the mass percent of ceramic powder, organic solvent, plasticizer, binding agent and dispersant is followed successively by (40 ~ 60) wt%, (40 ~ 60) wt%, (1.0 ~ 4.0) wt%, (4.5 ~ 8.5) wt%, (0.09 ~ 0.5) wt%;
(2) according to the needs connected between the needs be connected between inductance with electric capacity, inductance, described diaphragm is punched, filling perforation, then carry out conductor printing, lamination, pressing, isostatic pressed process successively;
(3) chip-type filter ceramic chips after isostatic pressed process is carried out binder removal and sintering processes; Sintering temperature is 800 DEG C ~ 950 DEG C;
(4) lamination sheet type ceramic RF low pass filter is formed after painting silver, end-blocking, termination process being carried out successively to the chip-type filter ceramic chips after sintering.
7. preparation method as claimed in claim 5, it is characterized in that, in step (1), the tangent value of the dielectric loss angle of described ceramic powder material is less than or equal to 6*10 -4, sintering temperature is less than 900 DEG C, and dielectric constant is 3 ~ 100.
8. the preparation method as described in any one of claim 5-7, is characterized in that, the cut-off frequency of described lamination sheet type ceramic RF low pass filter is lower, and the dielectric constant of described ceramic powder is higher.
9. preparation method as claimed in claim 8, is characterized in that, in step (1), when needing to prepare the lamination sheet type ceramic RF low pass filter of cut-off frequency lower than 460MHz, adopts dielectric constant to be the ceramic powder of 20 ~ 50; When need to prepare cut-off frequency be the lamination sheet type ceramic RF low pass filter of 460 ~ 1300MHz time, adopt dielectric constant be the ceramic powder of 10 ~ 20; When need to prepare cut-off frequency be the lamination sheet type ceramic RF low pass filter of 1300 ~ 3600MHz time, adopt dielectric constant 6 ~ 10 ceramic powder; When needing to prepare cut-off frequency and being greater than the lamination sheet type ceramic RF low pass filter of 3600MHz, adopt the ceramic powder of dielectric constant below 6.
CN201410133483.2A 2014-04-03 2014-04-03 Laminated-type ceramic radio-frequency low pass filter and preparation method therefor Pending CN104980118A (en)

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