CN104979451A - LED packaging method, production method of circuit board and display screen - Google Patents
LED packaging method, production method of circuit board and display screen Download PDFInfo
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- CN104979451A CN104979451A CN201510373088.6A CN201510373088A CN104979451A CN 104979451 A CN104979451 A CN 104979451A CN 201510373088 A CN201510373088 A CN 201510373088A CN 104979451 A CN104979451 A CN 104979451A
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- 238000000034 method Methods 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 9
- 238000004806 packaging method and process Methods 0.000 title abstract description 8
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 14
- 239000010410 layer Substances 0.000 claims description 95
- 238000005538 encapsulation Methods 0.000 claims description 40
- 239000003292 glue Substances 0.000 claims description 29
- 239000002346 layers by function Substances 0.000 claims description 16
- 239000000758 substrate Substances 0.000 claims description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 12
- 239000000843 powder Substances 0.000 claims description 12
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 41
- 229920003023 plastic Polymers 0.000 description 10
- 239000004033 plastic Substances 0.000 description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 239000000741 silica gel Substances 0.000 description 2
- 229910002027 silica gel Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000002932 luster Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging method, a production method of a circuit board and a display screen. The LED packaging method includes the following steps that: a circuit board for driving an LED chip is formed; an groove is formed in the circuit board in the formation process of the circuit board; and the LED chip is fixed in the groove. With the above technical schemes of the invention adopted, the realization of small dot spacing of an LED display screen can be benefitted, and damage to the circuit board can be decreased.
Description
Technical field
The present invention relates to LED technology field, particularly relate to a kind of LED encapsulation method, the manufacture method of circuit board and display screen.
Background technology
LED display has that display area is large, brightness is high, bright in luster, assembled easily, the advantage such as maintenance cost is low.But in the early stage of development of LED display, due to technical limitations, make the pel spacing of LED display comparatively large, closely during viewing, picture particle sense is comparatively strong, causes LED display to be difficult to enter indoor middle and high end mainstream applications.And along with the fast development of Display Technique, make the pel spacing of LED display more and more less, resolution is more and more higher, and the display screen of little dot spacing has more obvious advantage, its brightness is higher, it is seamless spliced more easily to realize.
Wherein, when making LED display, the pad of fixed L ED element being normally set on the surface of circuit board, then adopting surface mounting technology (SMT) LED element to be mounted on the pad of circuit board surface, and a glue is carried out to LED element.But, adopt aforesaid way that LED element is installed and be difficult to the little dot spacing realizing LED display.If when the spacing between LED element is too small, such as, when being less than 3mm, when carrying out a glue, the bond area of glue around LED element will become less, glue is easily caused to spread to surrounding, glue between adjacent LED element is easily mixed, affects outward appearance and the display effect of whole LED display.
In prior art, general by slotting on circuit boards, LED element is installed in the groove of circuit board, thus when a glue glue for being filled in groove, can prevent glue from spreading, even if the spacing now between LED element is less, the glue between LED element also can be avoided to mix.But, in aforesaid way, normally drill flute on the circuit board completing making, thus one, easily damage circuit board when fluting.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of LED encapsulation method, the manufacture method of circuit board and LED display, can be conducive to the little dot spacing realizing LED display, can reduce the damage to circuit board simultaneously.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of LED encapsulation method, comprising: form the circuit board being used for driving LED chip, and forms groove on circuit boards in the process forming described circuit board; LED chip is fixed in described groove.
Wherein, described formation is used for the circuit board of driving LED chip, and the step forming groove in the process forming described circuit board on circuit boards comprises: provide a substrate, and described substrate comprises base plate and is formed at the line layer on described base plate; Described line layer forms described groove; Described line layer is formed the drive circuit for driving described LED chip, and on the sidewall of described groove, forms two conductive pads be electrically connected respectively with described drive circuit; Other regions except described groove of described line layer being formed with described drive circuit form the functional layer of described circuit board, to form described circuit board.
Wherein, described formation is used for the circuit board of driving LED chip, and formed described circuit board process on described circuit board, form groove step comprise: provide a substrate, described substrate comprises base plate and is formed at the line layer on described base plate; Described line layer is formed the drive circuit for driving described LED chip, described line layer comprises for the fixing chip area of described LED chip and other regions except described chip area, and described chip area is formed with two conductive pads be electrically connected respectively with described drive circuit; Other regions described in described line layer formed the functional layer of described circuit board and makes described functional layer surround described chip area, to form described circuit board, and forming described groove on described circuit board.
Wherein, before described step LED chip is fixed in described groove, comprising: form LED chip, described LED chip comprises exiting surface, bottom surface and side, and the positive pole of described LED chip and negative pole are positioned on the side of described LED chip; Described by LED chip, the step be fixed in described groove comprises: fixed the bottom of the bottom surface of described LED chip and described groove; The positive pole of described LED chip and negative pole are electrically connected with described two conductive pads respectively by wire, described wire is without the exiting surface of described LED chip.
Wherein, after the step that the positive pole of described LED chip and negative pole are electrically connected with described two conductive pads respectively by wire, comprise: in described groove, fill the transparent glue being mixed with diffusant, to form encapsulation glue-line, described encapsulation glue-line covers described LED chip.
Wherein, in described groove, fill transparent glue, with formed encapsulation glue-line step after, comprising: on described encapsulation glue-line, form phosphor powder layer, and make the edge of described phosphor powder layer and described circuit board contacts.
Wherein, described functional layer is the ink layer of described circuit board, and the thickness of described ink layer is 300 ~ 500 μm.
Wherein, described method also comprises: in the formation reflector, surface of described ink layer.
For solving the problems of the technologies described above, another technical solution used in the present invention is: the manufacture method providing a kind of circuit board for driving LED chip, comprising: in the process forming circuit board, form the groove being used for fixed L ED chip on circuit boards.
For solving the problems of the technologies described above, another technical scheme that the present invention adopts is: provide a kind of LED display, comprises the circuit board of LED chip and the described LED chip of driving; Described circuit board is provided with groove, and described groove is formed in the process forming described circuit board, and described LED chip is fixed in described groove.
The invention has the beneficial effects as follows: the situation being different from prior art, in LED encapsulation method of the present invention, by arranging groove on circuit boards, LED chip is directly fixed in groove, even if the spacing thus between LED chip is less, namely, when the spacing between groove is less, effectively can avoids being diffused into around LED chip glue during LED chip point glue by groove structure, thus be conducive to the little dot spacing realizing LED display.Further, groove structure is formed in the process forming circuit board, compared with the mode of slotting on the circuit board completing making, is conducive to reducing the damage to circuit board in grooving process.
Accompanying drawing explanation
Fig. 1 is the flow chart of LED encapsulation method one execution mode of the present invention;
Fig. 2 is in LED encapsulation method one execution mode of the present invention, forms the circuit board being used for driving LED chip, and forms the flow chart of groove on circuit boards in the process forming circuit board;
Fig. 3 is the encapsulation flow process generalized section of LED encapsulation method one execution mode of the present invention;
Fig. 4 is the encapsulation flow process generalized section of another execution mode of LED encapsulation method of the present invention;
Fig. 5 is in another execution mode of LED encapsulation method of the present invention, forms the circuit board being used for driving LED chip, and forms the flow chart of groove on circuit boards in the process forming circuit board;
Fig. 6 is the encapsulation flow process generalized section of the another execution mode of LED encapsulation method of the present invention;
Fig. 7 is the encapsulation flow process generalized section of the another execution mode of LED encapsulation method of the present invention.
Embodiment
Below in conjunction with drawings and embodiments, the present invention is described in detail.
Consult Fig. 1, in LED encapsulation method one execution mode of the present invention, comprise the steps:
Step S101: form the circuit board being used for driving LED chip, and groove is formed on circuit boards in the process forming circuit board.
Wherein, the process of described formation circuit board refers to the process forming this body structure of circuit board.
Step S102: LED chip is fixed in groove.
By LED chip is fixed in groove, even if the spacing thus between LED chip is less, namely, when the spacing between groove is less, effectively can avoids being diffused into around LED chip glue during LED chip point glue by groove structure, thus be conducive to the little dot spacing realizing LED display.And, to encapsulate compared with mode that the LED lamp bead obtained is fixed on circuit board again with after traditional use package support packaging LED chips, in present embodiment, LED chip is directly fixed in the groove on circuit board, utilize circuit board as the package support of LED chip, thus extra package support can be reduced, the spacing between LED chip can be made less.In addition, the groove for fixing circuit board is formed in the process forming this body structure of circuit board, instead of slot on the circuit board made, and can reduce the damage to circuit board thus.
Consult Fig. 2 and Fig. 3, in an embodiment of LED encapsulation method of the present invention, form the circuit board being used for driving LED chip, and form the step of groove on circuit boards in the process forming circuit board, as shown in Figure 2, specifically comprise:
Step S201: provide a substrate, substrate comprises base plate and is formed at the line layer on base plate.
Particularly, composition graphs 3, substrate 31 comprises base plate 311 and line layer 312.Wherein, first form base plate 311, base plate 311 is insulating barrier.Then on base plate 311, line layer 312 is formed.
Step S202: form groove on line layer.
As shown in Figure 3, line layer 312 forms groove 32.Groove 32 surrounded by line layer 312 and base plate 311, and the bottom of groove 32 is base plate 311, and the two side of groove 32 is line layer 312.The cross sectional shape of groove 32 is trapezoidal, certainly, also can be circular, square or irregularly shaped.
Wherein, the bottom size of groove 32 is slightly larger than the size of LED chip.
Step S203: form the drive circuit being used for driving LED chip on line layer, and on the sidewall of groove, form two conductive pads be electrically connected respectively with drive circuit.
After line layer 312 is slotted form groove 32, printed circuit on line layer 312, to form the drive circuit (not shown) of LED chip on line layer 312, and respectively forming a conductive pad in the two lateral walls of groove 32, is conductive pad 33,34 respectively.Conductive pad 33,34 can be formed on sidewall in heavy copper mode.
Step S204: the functional layer forming circuit board on other regions than grooves of line layer being formed with drive circuit, to form circuit board.
After line layer 312 connects up to form drive circuit, line layer 312 forms the functional layer of circuit board.Wherein, functional layer is ink layer 35; the i.e. ink layer 35 of printed circuit board (PCB) on other regions except groove 32 of line layer 312; both in order to the circuit on protection circuit layer 312; also the degree of depth of groove 32 can be deepened; be beneficial to follow-up some packaging plastic, glue diffusion can be reduced while meeting packaging plastic layer thickness.
Wherein, the thickness of ink layer 35 is 300 ~ 500 μm.Such as, can be 350 μm, 400 μm or 460 μm etc.Certainly, the thickness of ink layer 35 can be arranged according to actual needs, such as, can also be the scope at 100 μm ~ 250 μm.In addition, because groove 32 is formed on line layer 312, therefore groove 32 has had certain degree of depth, can prevent glue from spreading, and therefore in other embodiments, the thickness of ink layer 35 can be general thickness, as being 10 ~ 15 μm, to save ink material.
Further, in order to avoid when brush ink, ink enters in groove 32 and covered by conductive pad 33,34, fixture or dividing plate can be adopted groove 32 and ink layer 35 interval when printing-ink, such as dividing plate can be positioned on the sidewall of groove 32, the part making dividing plate stretch out groove is longer than the thickness of ink layer 35, thus can stop that when printing-ink ink enters in groove 32, takes out fixture or dividing plate after completing ink printing again.
After other regions except groove 32 of line layer 312 form ink layer 35, further, in the formation reflector, surface 36 of ink layer 35, in order to light reflection is gone out.Wherein, reflector 36 can be sub-light dirty oil layer.Thus, circuit board 30 is formed.
After the making of completing circuit plate 30, LED chip 37 is fixed in groove 32.In present embodiment, before LED chip 37 is fixed on groove 32, comprising: form LED chip 37, LED chip 37 comprises exiting surface, bottom surface and side, wherein, the positive pole 371 of LED chip 37 lays respectively on the relative two sides of LED chip 37 with negative pole 372.
When LED chip 37 is fixed in groove 32, the bottom of the bottom surface of LED chip 37 and groove 32 is fixed, then the positive pole 371 of LED chip 37 is electrically connected with conductive pad 33 by wire a, the negative pole 372 of LED chip 37 is electrically connected with conductive pad 34 by wire b, thus realizes the electrical connection of LED chip 37 and drive circuit.Wherein, wire a and wire b is without the exiting surface of LED chip 37.
In present embodiment, by the positive pole 371 of LED chip 37 and negative pole 372 being arranged on the side of LED chip 37, wire a, b of being electrically connected with positive pole 371, negative pole 372 can be made thus without exiting surface, and can reduce wire a, b affects the shading of light, contributes to improving brightness.Further, be arranged on the sidewall of groove 32 by conductive pad 33,34, and conductive pad 33 is with contiguous with the positive pole 371 of LED chip 37, conductive pad 34 is contiguous with negative pole 372, can facilitate line thus.
Certainly, in other embodiments, the both positive and negative polarity of LED chip 37 also can be the bottom being placed on LED chip 37 as conventional design, the wire be electrically connected with its both positive and negative polarity also can be through the exiting surface of LED chip 37 and be electrically connected with both positive and negative polarity, as shown in Figure 4, now conductive pad is positioned at bottom portion of groove.Certainly, for avoiding wire to the shading of light, also the position that wire is electrically connected with both positive and negative polarity can be arranged on the bottom of LED chip.
By in present embodiment, in the process forming circuit board 30, first on line layer 312, form groove 32, drive circuit is formed again on line layer 312, and then LED chip 37 is packaged in groove 32, therefore the drive circuit when forming groove on line layer 312 is not also formed, and can avoid thus damaging line drive circuit when formation groove 32.
Wherein, in the present embodiment, after completing the line of LED chip 37, a glue is carried out to LED chip 37.Particularly, in groove 32, fill the transparent glue being mixed with diffusant, to form encapsulation glue-line 38, wherein encapsulate glue-line 38 and cover LED chip 37.
Transparent glue can be silica gel, or other packaging plastic.By increasing diffusant in transparent glue, be conducive to increasing the scattering of light and transmission, make light evenly.Further, by being filled in groove by glue, the diffusion of glue can be reduced, being conducive to realizing little dot spacing.
In addition, in order to make light have good rising angle, the surface of encapsulation glue-line 38 is for protruding from the cambered surface of circuit board 30.
Wherein, after formation encapsulation glue-line 38, encapsulation glue-line 38 forms phosphor powder layer 39, the cambered surface of surface also for raising up of phosphor powder layer 39.Further, the edge of phosphor powder layer 39 contacts with circuit board 30, in order to heat conduction is extremely outside with circuit board 30, avoids phosphor powder layer 39 heat accumulation.
In other execution modes of LED encapsulation method of the present invention, functional layer can use the material such as acrylic or plastics to be formed, after now forming groove on line layer, perforate is carried out in the position that acrylic board or plastic plate correspond to groove, with when acrylic board or plastic plate being fitted on line layer, expose the groove on line layer.
Consult Fig. 5 and Fig. 6, in another embodiment of LED encapsulation method of the present invention, form the circuit board being used for driving LED chip, and form the step of groove on circuit boards in the process forming circuit board, as shown in Figure 5, specifically comprise:
Step S501: provide a substrate, substrate comprises base plate and is formed at the line layer on base plate.
Composition graphs 6, substrate 61 comprises base plate 611 and line layer 612.Wherein, first form base plate 611, base plate 611 is insulating barrier.Then on base plate 611, line layer 612 is formed.
Step S502: form the drive circuit being used for driving LED chip on line layer, line layer comprises for the chip area of fixed L ED chip and other regions except chip area, and chip area is formed with two conductive pads be electrically connected respectively with drive circuit.
As shown in Figure 6, line layer 612 comprises for the chip area 6121 of fixed L ED chip and other regions 6122 except chip area 6121.Two conductive pads 63,64 for being electrically connected respectively with the drive circuit (not shown) on line layer 612 are formed in chip area 6121.
Step S503: form the functional layer of circuit board and make functional layer surround chip area on other regions of line layer, to form circuit board, and forming groove on circuit boards.
Wherein, functional layer is the ink layer 65 of circuit board.After form the drive circuit being used for driving LED chip on line layer 612, namely line layer 612 determines the fixed position of LED chip, i.e. chip area 6121.On line layer 612 during brush ink, only on other regions 6122, print certain thickness ink, make ink surround chip area 6121, groove 62 can be formed on ink layer 65 thus after formation ink layer 65, the bottom of groove 62 is chip area 6121, and sidewall is ink layer 65.Wherein, when printing-ink, the cross sectional shape of formed groove 62 is made to be trapezoidal.
Wherein, the thickness of ink layer 65 is 300 ~ 500 μm.Such as, can be 350 μm, 400 μm or 460 μm etc.Certainly, the thickness of ink layer 65 can be arranged according to actual needs, such as, can also be the scope at 100 μm ~ 250 μm.
Further, in order to avoid when brush ink, ink can flow into chip area 6121, fixture or dividing plate can be adopted other regions 6122 and chip area 6121 interval when printing-ink, thus the ink that can be blocked in when printing-ink on other regions 6122 enters in chip area 6121, after completing ink printing, take out fixture or dividing plate again.
After forming ink layer 65, further, form one deck reflector 66 on the surface of ink layer 65, in order to be gone out by light reflection.Wherein, reflector 66 can be sub-light dirty oil layer.Thus, circuit board 60 is formed.
In present embodiment, LED chip 67 comprises exiting surface, bottom surface and side, and positive pole 671 and the negative pole 672 of LED chip 67 lay respectively on the relative two sides of LED chip 67.
After the making of completing circuit plate 60, LED chip 67 is fixed in groove 62.Wherein, the bottom of the bottom surface of LED chip 64 and groove 62 is fixed, then the positive pole 671 of LED chip 67 is electrically connected with conductive pad 63 by wire a, the negative pole 672 of LED chip 67 is electrically connected with conductive pad 64 by wire b, thus realizes the electrical connection of LED chip 67 and drive circuit.Wherein, wire a and wire b is without the exiting surface of LED chip 67.
In present embodiment, by the positive pole 671 of LED chip 67 and negative pole 672 being arranged on the side of LED chip 67, wire a, b of being electrically connected with positive pole 671, negative pole 672 can be made thus without exiting surface, wire a, b can be reduced affect the shading of light, contribute to improving brightness, and convenient connection.
By in present embodiment, in the process forming circuit board 60, first on line layer 612, form drive circuit, to determine the chip area 6121 of fixed L ED chip 67, then on other regions 6122 except chip area 6121, certain thickness ink is printed, formed ink layer 65 is made to surround chip area 6121, groove 62 is formed thus on formed ink layer 65, therefore be only at other region 6122 printing-inks in the process forming groove 62, and the process of printing can not cause extruding to the drive circuit on line layer 612, can avoid damaging drive circuit.
In present embodiment, after completing the line of LED chip 67, a glue is carried out to LED chip 67.Particularly, in groove 62, fill the transparent glue being mixed with diffusant, to form encapsulation glue-line 68, wherein encapsulate glue-line 68 and cover LED chip 67.
Transparent glue can be silica gel, or other packaging plastic.By increasing diffusant in transparent glue, be conducive to increasing the scattering of light and transmission, make light evenly.
In addition, in order to make light have good rising angle, the surface of encapsulation glue-line 68 is for protruding from the cambered surface of circuit board 60.
Wherein, after formation encapsulation glue-line 68, encapsulation glue-line 68 forms phosphor powder layer 69, the cambered surface of surface also for raising up of phosphor powder layer 69.Further, the edge of phosphor powder layer 69 contacts with circuit board 60, in order to heat conduction is extremely outside with circuit board 60, avoids phosphor powder layer 69 heat accumulation.
In other execution modes of LED encapsulation method of the present invention, functional layer can use the material such as acrylic or plastics to be formed, now after line layer determination chip area, perforate is carried out in the position that acrylic board or plastic plate correspond to chip area, with when acrylic board or plastic plate being fitted on line layer, chip area place is made to form groove.
In the respective embodiments described above, a LED chip is packaged in a groove, in other embodiments, as shown in Figure 7, multiple LED chip can be packaged in same groove.For the circuit board 30 formed in the execution mode shown in Fig. 3, in groove 32, fix the LED chip 71 of three series connection, the element effect of other identical labels is identical.
The present invention is also provided for an execution mode of the manufacture method of the circuit board of driving LED chip, and described manufacture method is the method for the formation circuit board shown in Fig. 2 or Fig. 5.
The present invention also provides an execution mode of LED display, and described LED display adopts the encapsulation of the LED encapsulation method described in above-mentioned arbitrary execution mode to form, and it comprises LED chip described in above-mentioned arbitrary implementation method and circuit board.
The foregoing is only embodiments of the present invention; not thereby the scope of the claims of the present invention is limited; every utilize specification of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. a LED encapsulation method, is characterized in that, comprising:
Form the circuit board being used for driving LED chip, and form groove on circuit boards in the process forming described circuit board;
LED chip is fixed in described groove.
2. method according to claim 1, is characterized in that, described formation is used for the circuit board of driving LED chip, and the step forming groove in the process forming described circuit board on circuit boards comprises:
There is provided a substrate, described substrate comprises base plate and is formed at the line layer on described base plate;
Described line layer forms described groove;
Described line layer is formed the drive circuit for driving described LED chip, and on the sidewall of described groove, forms two conductive pads be electrically connected respectively with described drive circuit;
Other regions except described groove of described line layer being formed with described drive circuit form the functional layer of described circuit board, to form described circuit board.
3. method according to claim 1, is characterized in that, described formation is used for the circuit board of driving LED chip, and formed described circuit board process on described circuit board, form groove step comprise:
There is provided a substrate, described substrate comprises base plate and is formed at the line layer on described base plate;
Described line layer is formed the drive circuit for driving described LED chip, described line layer comprises for the fixing chip area of described LED chip and other regions except described chip area, and described chip area is formed with two conductive pads be electrically connected respectively with described drive circuit;
Other regions described in described line layer formed the functional layer of described circuit board and makes described functional layer surround described chip area, to form described circuit board, and forming described groove on described circuit board.
4. according to the method in claim 2 or 3, it is characterized in that, before described step LED chip is fixed in described groove, comprising:
Form LED chip, described LED chip comprises exiting surface, bottom surface and side, and the positive pole of described LED chip and negative pole are positioned on the side of described LED chip;
It is described that by LED chip, the step be fixed in described groove comprises:
The bottom of the bottom surface of described LED chip and described groove is fixed;
The positive pole of described LED chip and negative pole are electrically connected with described two conductive pads respectively by wire, described wire is without the exiting surface of described LED chip.
5. method according to claim 4, is characterized in that, after the step positive pole of described LED chip and negative pole are electrically connected with described two conductive pads respectively by wire, comprising:
In described groove, fill the transparent glue being mixed with diffusant, to form encapsulation glue-line, described encapsulation glue-line covers described LED chip.
6. method according to claim 5, is characterized in that, in described groove, fill transparent glue, with formed encapsulation glue-line step after, comprising:
Described encapsulation glue-line forms phosphor powder layer, and makes the edge of described phosphor powder layer and described circuit board contacts.
7. according to the method in claim 2 or 3, it is characterized in that, described functional layer is the ink layer of described circuit board, and the thickness of described ink layer is 300 ~ 500 μm.
8. method according to claim 7, is characterized in that, described method also comprises: in the formation reflector, surface of described ink layer.
9. for a manufacture method for the circuit board of driving LED chip, it is characterized in that, comprising: in the process forming circuit board, form the groove being used for fixed L ED chip on circuit boards.
10. a LED display, is characterized in that, comprises the circuit board of LED chip and the described LED chip of driving;
Described circuit board is provided with groove, and described groove is formed in the process forming described circuit board, and described LED chip is fixed in described groove.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510373088.6A CN104979451A (en) | 2015-06-30 | 2015-06-30 | LED packaging method, production method of circuit board and display screen |
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| CN201510373088.6A CN104979451A (en) | 2015-06-30 | 2015-06-30 | LED packaging method, production method of circuit board and display screen |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN108426178A (en) * | 2018-02-02 | 2018-08-21 | 深圳市奥拓电子股份有限公司 | LED lamp bead and LED show structure |
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
| CN110098213A (en) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | A kind of chip module method for packing and positioning |
| CN110097829A (en) * | 2018-01-30 | 2019-08-06 | 美科米尚技术有限公司 | Display device |
| CN110603576A (en) * | 2017-05-12 | 2019-12-20 | 索尼公司 | Display device |
| CN113056099A (en) * | 2021-03-03 | 2021-06-29 | 研祥智能科技股份有限公司 | LED printed board structure and manufacturing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646776A (en) * | 2012-01-12 | 2012-08-22 | 深圳市瑞丰光电子股份有限公司 | Light-emitting diode module and manufacturing method thereof |
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| CN103296146A (en) * | 2012-02-22 | 2013-09-11 | 太极光光电股份有限公司 | Method for encapsulating unframed LED chip and light-emitting device made with same |
| CN204884446U (en) * | 2015-06-30 | 2015-12-16 | 深圳雷曼光电科技股份有限公司 | LED display screen |
-
2015
- 2015-06-30 CN CN201510373088.6A patent/CN104979451A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102646776A (en) * | 2012-01-12 | 2012-08-22 | 深圳市瑞丰光电子股份有限公司 | Light-emitting diode module and manufacturing method thereof |
| CN103296146A (en) * | 2012-02-22 | 2013-09-11 | 太极光光电股份有限公司 | Method for encapsulating unframed LED chip and light-emitting device made with same |
| CN102916111A (en) * | 2012-10-19 | 2013-02-06 | 杨勇平 | LED (light-emitting diode) integrated light source substrate and producing method thereof |
| CN204884446U (en) * | 2015-06-30 | 2015-12-16 | 深圳雷曼光电科技股份有限公司 | LED display screen |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105810115A (en) * | 2016-05-30 | 2016-07-27 | 深圳市奥蕾达科技有限公司 | Novel chip on board (COB) full color light-emitting diode (LED) light-emitting panel and manufacturing method thereof |
| CN105810115B (en) * | 2016-05-30 | 2019-08-20 | 深圳市奥蕾达科技有限公司 | All-colour LED luminescent panel |
| CN110603576B (en) * | 2017-05-12 | 2021-12-03 | 索尼公司 | Display device |
| CN110603576A (en) * | 2017-05-12 | 2019-12-20 | 索尼公司 | Display device |
| US11222875B2 (en) | 2017-05-12 | 2022-01-11 | Sony Corporation | Display apparatus |
| CN110097829A (en) * | 2018-01-30 | 2019-08-06 | 美科米尚技术有限公司 | Display device |
| CN108426178A (en) * | 2018-02-02 | 2018-08-21 | 深圳市奥拓电子股份有限公司 | LED lamp bead and LED show structure |
| CN108426178B (en) * | 2018-02-02 | 2020-07-28 | 深圳市奥拓电子股份有限公司 | L ED lamp bead and L ED display structure |
| CN108766962A (en) * | 2018-05-25 | 2018-11-06 | 张琴 | Solid state light emitter luminescent system integrated encapsulation structure and production method |
| CN108766962B (en) * | 2018-05-25 | 2020-01-07 | 张琴 | Solid-state light source light-emitting system integrated packaging structure and manufacturing method |
| CN110098213A (en) * | 2019-05-15 | 2019-08-06 | 德淮半导体有限公司 | A kind of chip module method for packing and positioning |
| CN113056099A (en) * | 2021-03-03 | 2021-06-29 | 研祥智能科技股份有限公司 | LED printed board structure and manufacturing method thereof |
| CN113056099B (en) * | 2021-03-03 | 2022-08-16 | 研祥智能科技股份有限公司 | LED printed board structure and manufacturing method thereof |
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