CN104979096A - Multilayer ceramic capacitor, manufacturing method thereof, and plate with the same - Google Patents
Multilayer ceramic capacitor, manufacturing method thereof, and plate with the same Download PDFInfo
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- CN104979096A CN104979096A CN201410736333.0A CN201410736333A CN104979096A CN 104979096 A CN104979096 A CN 104979096A CN 201410736333 A CN201410736333 A CN 201410736333A CN 104979096 A CN104979096 A CN 104979096A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
Abstract
The invention provides a multilayer ceramic capacitor, a manufacturing method thereof, and a plate with the same. The multilayer ceramic capacitor comprises a ceramic body, a plurality of first internal electrodes, a plurality of second internal electrodes, first external electrodes, second external electrodes, an insulation layer, first bulged electrodes and second bulged electrodes, wherein a plurality of dielectric layers are stacked in the ceramic body along the thickness direction; the plurality of first internal electrodes and the plurality of second internal electrodes are arranged in the ceramic body so as to be exposed to the two end surfaces of the ceramic body alternatively; at least one dielectric layer is arranged between the first internal electrodes and the second internal electrodes; the two end parts of the ceramic body are covered by the first external electrodes and the second external electrodes; the insulation layer is arranged on the ceramic body and the circumferential surfaces of the first external electrodes and the second external electrodes; and the first bulged electrodes and the second bulged electrodes are respectively arranged on the mounting surfaces of the first external electrodes and the second external electrodes.
Description
This application claims the rights and interests of the 10-2014-0044165 korean patent application submitted in Korean Intellectual Property Office on April 14th, 2014, the disclosure of this korean patent application is contained in this by reference.
Technical field
The disclosure relates to a kind of multilayer ceramic capacitor, its manufacture method and has the plate of this multilayer ceramic capacitor.
Background technology
Because multilayer ceramic capacitor (MLCC) (multilayer sheet type electronic building brick) has, such as size is little, electric capacity is high, easy-to-install advantage, and therefore multilayer ceramic capacitor can be used in various electronic installation.
Such as, multilayer ceramic capacitor can as be arranged on such as display unit (such as liquid crystal display (LCD) and plasma display (PDP) etc.), computer, personal digital assistant (PDA) and mobile phone etc. various electronic products plate on the capacitor of plate shape, for charge or discharge.
Such multilayer ceramic capacitor can have such structure: wherein, and multiple dielectric layer is alternately arranged with the interior electrode with opposed polarity, and is inserted with at least one dielectric layer between interior electrode.
In this case, because dielectric layer has piezoelectric effect, therefore when direct current (DC) or interchange (AC) voltage are applied to multilayer ceramic capacitor, the phenomenon of piezoelectricity can be produced between multiple interior electrode, thus while the volume of ceramic main body to expand according to frequency and shrinks generation periodic vibration.
Such vibration can be passed to plate by the external electrode of multilayer ceramic capacitor and the solder being connected external electrode and plate, makes whole plate to become sound reflective surfaces, thus produces rattle (noise).
This rattle can have the 20Hz to 20 corresponding to making people's discomfort, the audio frequency in the region of 000Hz.The rattle of people's discomfort is made to be called as acoustic noise as above.
The solder that external electrode and plate are connected to each other can be formed with predetermined altitude, tilts from the side surface of ceramic main body or end surfaces with the near surface at external electrode.
In this case, owing to increasing volume and the height of solder, therefore the vibration of multilayer ceramic capacitor can be easier to be delivered to plate, causes the level of acoustic noise to increase.
[prior art document]
(patent documentation 1) No. 1058697 Korean Patent
Summary of the invention
Recently, because the acoustic noise produced in multilayer ceramic capacitor can be obviously significant, the assembly of the electronic installation of the noise with reduction will therefore be developed.
The multilayer ceramic capacitor that exemplary embodiment in the disclosure can provide a kind of acoustic noise effectively to reduce.
According to the exemplary embodiment in the disclosure, a kind of multilayer ceramic capacitor can comprise: ceramic main body, and multiple dielectric layer through-thickness is stacked in ceramic main body; Electrode and multiple the second inner electrode in multiple first, be arranged on to be alternately exposed to two end surfaces of ceramic main body in ceramic main body, and at least one dielectric layer to be placed in first between electrode and the second inner electrode; The first external electrode and the second external electrode, be set to two ends covering ceramic main body; Insulating barrier, is arranged on the outer surface of ceramic main body and the first external electrode and the second external electrode; First convex electrode and the second convex electrode, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode.
According to another exemplary embodiment in the disclosure, a kind of plate with multilayer ceramic capacitor can comprise: circuit board, arranges the first electrode pad and the second electrode pad thereon; Multilayer ceramic capacitor, install on circuit boards, wherein, multilayer ceramic capacitor comprises: ceramic main body, and multiple dielectric layer through-thickness is stacked in ceramic main body; Electrode and multiple the second inner electrode in multiple first, be arranged on to be alternately exposed to two end surfaces of ceramic main body in ceramic main body, and at least one dielectric layer to be placed in first between electrode and the second inner electrode; The first external electrode and the second external electrode, be set to two ends covering ceramic main body; Insulating barrier, is arranged on the outer surface of ceramic main body and the first external electrode and the second external electrode; First convex electrode and the second convex electrode, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode.
First convex electrode and the second convex electrode can comprise: the first nickel (Ni) coating and the second nickel (Ni) coating, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode; First tin (Sn) coating and the second tin (Sn) coating, be separately positioned on the first nickel (Ni) coating and the second nickel (Ni) coating.
First convex electrode and the second convex electrode can comprise: the first bronze medal (Cu) coating and the second bronze medal (Cu) coating, be respectively formed in the mounting surface of the exposure of the first external electrode and the second external electrode; First nickel (Ni) coating and the second nickel (Ni) coating, be respectively formed on the first bronze medal (Cu) coating and the second bronze medal (Cu) coating; First tin (Sn) coating and the second tin (Sn) coating, be respectively formed on the first nickel (Ni) coating and the second nickel (Ni) coating.
First convex electrode and the second convex electrode can have 50 μm or larger thickness.
The first external electrode and the second external electrode can comprise: the first pontes and the second coupling part, are separately positioned on two end surfaces of ceramic main body, and are connected respectively to electrode and the second inner electrode in first; First end and the second end, extend to a part for the mounting surface of ceramic main body respectively from the first pontes and the second coupling part, and the first convex electrode and the second convex electrode are separately positioned on first end and the second end.
Insulating barrier can be formed by epoxy resin.
According to another exemplary embodiment in the disclosure, a kind of method manufacturing multilayer ceramic capacitor can comprise: by alternately stacking respectively and multilayer main body prepared by the multiple potsherds suppressing electrode and the second inner electrode in formation first on it, make electrode and the second inner electrode in first be set to facing with each other, and at least one potsherd to be placed in first between electrode and the second inner electrode; By cutting according to the region corresponding to single capacitor and sintered multilayer main body, in preparation first, electrode and the second inner electrode are alternately exposed to the ceramic main body of two end surfaces of ceramic main body; Two ends of ceramic main body form the first external electrode and the second external electrode, to be electrically connected to electrode and the second inner electrode in first; In ceramic main body and first electrode and the second inner electrode outer surface on form insulating barrier; Perform plating by the mounting surface of the exposure to the first external electrode and the second external electrode and form the first convex electrode and the second convex electrode.
Can by electronickelling in the mounting surface of the exposure of the first external electrode and the second external electrode and subsequently thereon electrotinning form the first convex electrode and the second convex electrode.
Can by electro-coppering, subsequently electronickelling thereon in the mounting surface of the exposure of the first external electrode and the second external electrode, electrotinning forms the first convex electrode and the second convex electrode thereon subsequently.
First convex electrode and the second convex electrode can be formed as having 50 μm or larger thickness.
Insulating barrier can be formed by applying and solidify insulating resin on the outer surface of ceramic main body and the first external electrode and the second external electrode.
Insulating resin can be epoxy resin.
Accompanying drawing explanation
By the detailed description of carrying out below in conjunction with accompanying drawing, above and other aspects, features and advantages of the present disclosure will be more clearly understood, in the accompanying drawings:
Fig. 1 is the perspective view schematically shown under the state that is oriented upwards in its mounting surface according to the multilayer ceramic capacitor of the exemplary embodiment in the disclosure;
Fig. 2 is the cutaway view of the line A-A ' intercepting along Fig. 1;
Fig. 3 A to Fig. 3 C is the perspective view of the method for the manufacture multilayer ceramic capacitor sequentially illustrated according to the exemplary embodiment in the disclosure; And
Fig. 4 schematically shows the sectional view with the plate of multilayer ceramic capacitor according to the exemplary embodiment in the disclosure.
Embodiment
The exemplary embodiment in the disclosure is described in detail now with reference to accompanying drawing.
But the disclosure can illustrate with much different forms, should not be construed as limited to specific embodiment set forth herein.On the contrary, provide these embodiments, make the disclosure to be thoroughly with complete, and these embodiments will convey to those skilled in the art fully the scope of the present disclosure.
In the accompanying drawings, for clarity, the shape and size of element can be exaggerated, and will identical Reference numeral be used all the time to represent same or analogous element.
Fig. 1 is the perspective view schematically shown under the state that is oriented upwards in its mounting surface according to the multilayer ceramic capacitor of the exemplary embodiment in the disclosure, and Fig. 2 is the cutaway view of the line A-A ' intercepting along Fig. 1.
See figures.1.and.2, electrode 121 in ceramic main body 110, multiple first, multiple the second inner electrode 122, the first external electrode 131, the second external electrode 132, insulating barrier 140, first convex electrode 151 and the second convex electrode 152 can be comprised according to the multilayer ceramic capacitor 100 of the exemplary embodiment in the disclosure.
Ceramic main body 110, by the stacking multiple dielectric layer 111 of through-thickness, then sinters stacking dielectric layer 111 and is formed.
In this case, contiguous in ceramic main body 110 dielectric layer 111 can integration make the border between dielectric layer 111 not be apparent.
In addition, ceramic main body 110 can have hexahedral shape, but is not limited thereto.
In the present example embodiment, for convenience of explanation, the surface of ceramic main body 110 through-thickness respect to one another on the stacking direction of dielectric layer 111 is defined as upper surface and the lower surface of ceramic main body 110; The surface its among upper surface and lower surface of ceramic main body 110 being formed with the first convex electrode 151 and the second convex electrode 152 is defined as mounting surface; Ceramic main body 110 upper surface and lower surface are connected to each other and surfaces opposite to each other are defined as the end surfaces of ceramic main body 110 in the longitudinal direction; Ceramic main body 110 intersect vertically with end surfaces and surfaces opposite to each other are defined as the side surface of ceramic main body 110 in the direction of the width.
In addition, the size of ceramic main body 110 is not particularly limited.Such as, ceramic main body 110 can have 1.0mm × 0.5mm or similar size, to form the multilayer ceramic capacitor 100 with high capacitance.
In addition, if needed, in the upper part that the cover layer 112 and 113 with predetermined thickness can be formed in ceramic main body 110 and lower part, the outmost surface of ceramic main body 110 is become.
The thickness of single dielectric layer 111 can change according to the target capacitance of multilayer ceramic capacitor 100.The thickness after the sintering of dielectric layer 111 can be about 1.0 μm, but is not limited thereto.
In addition, dielectric layer 111 can comprise such as BaTiO
3the ceramic material with high-k at based ceramic powder end etc., but be not limited thereto.
BaTiO
3based ceramic powder end can be such as (Ba
1-xca
x) TiO
3, Ba (Ti
1-yca
y) O
3, (Ba
1-xca
x) (Ti
1-yzr
y) O
3or Ba (Ti
1-yzr
y) O
3, wherein, Ca, Zr etc. are partly solid-solubilized in BaTiO
3deng in, but to be not limited thereto.
Meanwhile, ceramic additive, organic solvent, plasticizer, binding agent, dispersant etc. can also join dielectric layer 111 together with ceramic powders.
Such as transition metal oxide or carbide, rare earth element, magnesium (Mg), aluminium (Al) etc. can be used as ceramic additive.
In first electrode 121 and the second inner electrode 122 be formed in form dielectric layer 111 potsherd on and after being stacked, in first, electrode 121 and the second inner electrode 122 can alternately be arranged in ceramic main body 110, and each dielectric layer 111 is placed in first between electrode 121 and the second inner electrode 122, and sinters.
In first, electrode 121 and the second inner electrode 122 (having the pair of electrodes of opposed polarity each other) can be set on the stacking direction of dielectric layer 111 facing with each other, and can be electrically insulated from each other by the dielectric layer 111 arranged between which.
In first, one end of electrode 121 and the second inner electrode 122 can be exposed to two end surfaces of ceramic main body 110 respectively.
Alternately be exposed to two end surfaces of ceramic main body 110 first in the end of electrode 121 and the second inner electrode 122 can be electrically connected to the first external electrode 131 and the second external electrode 132 respectively at the end surfaces place of ceramic main body 110 respectively.
In this case, in first, electrode 121 and the second inner electrode 122 can be formed by the conducting metal of such as nickel (Ni), nickel (Ni) alloy etc., but are not limited thereto.
By above-mentioned structure, when applying predetermined voltage to the first external electrode 131 and the second external electrode 132, electric charge can gather between electrode 121 and the second inner electrode 122 in facing with each other first.
In this case, multilayer ceramic capacitor 100 electric capacity can and along the stacking direction of dielectric layer 111 stacked on top of each other first in stacked area between electrode 121 and the second inner electrode 122 proportional.
The first external electrode 131 and the second external electrode 132 are formed by sintering the conductive paste comprising copper (Cu) for external electrode, with the reliability providing the heat-resisting cyclicity of such as excellence, moisture resistance contour while having excellent electrical property, but the disclosure is not limited thereto.
The first external electrode 131 can comprise the first connecting portion 131a and first end 131b, and the second external electrode 132 can comprise the second connecting portion 132a and the second end 132b.
First connecting portion 131a and the second connecting portion 132a can be respectively formed on two end surfaces of ceramic main body 110, and is electrically connected to the end of the exposure of electrode 121 and the second inner electrode 122 in first respectively.
First end 131b and the second end 132b can extend to a part for the mounting surface of ceramic main body 110 respectively from the end of the first connecting portion 131a and the second connecting portion 132a.
First end 131b and the second end 132b (mounting portion of external electrode) can make the first convex electrode 151 and the second convex electrode 152 be respectively formed on it.
Simultaneously, if needed, the first external electrode 131 and the second external electrode 132 can also comprise be formed in ceramic main body 110 its among upper surface and lower surface on do not form end on the surface of convex electrode, to correspond to first end 131b and the second end 132b, make multilayer ceramic capacitor can be constructed to have the sheet of vertical symmetry structure.
When end is formed on the upper surface of the ceramic main body 110 in vertical symmetry structure as above and lower surface, there is no need when multilayer ceramic capacitor 100 is installed on plate or analog to consider upward direction and in downward direction between difference.
Insulating barrier 140 by such as being formed for the non-conductive insulating resin of epoxy resin, phenylol thermosetting resin, acrylic resin, acrylic acid thermoplastic resin etc., but can be not limited thereto.
When multilayer ceramic capacitor 100 is installed onboard, on the outer surface that insulating barrier 140 may be used for preventing solder to be formed in the ceramic main body 110 except the first convex electrode 151 and the second convex electrode 152 and on the outer surface of the first external electrode 131 and the second external electrode 132.
In addition, narrow plate installs multiple, even if when the sheet installed contacts with each other, insulating barrier 140 also may be used for preventing short circuit, thus increases the circuit stability of whole product.
First convex electrode 151 and the second convex electrode 152 can be formed by performing plating to the first end 131b of the first external electrode 131 and the second external electrode 132 and the second end 132b respectively.
In this case, the first convex electrode 151 and the second convex electrode 152 can have 50 μm or larger thickness.
Table 1 below illustrates the acoustic noise of the thickness according to the first convex electrode and the second convex electrode.
Here, the size of the multilayer ceramic capacitor of use is 1.0mm × 0.5mm × 0.5mm (length x width x thickness), the acoustic noise of each sample recorded under DC 4V and AC 1Vrms@4Khz.
[table 1]
| # | Convex electrode thickness (μm) | Acoustic noise (dB) |
| 1 | - | 33 |
| 2 | 10 | 31 |
| 3 | 30 | 29 |
| 4 | 50 | 20 |
| 5 | 80 | 17 |
| 6 | 120 | 14 |
With reference to table 1, when there is no the multilayer ceramic capacitor of sample 1 of convex electrode, acoustic noise high (33dB).
On the contrary, can find out when according to this exemplary embodiment there is the multilayer ceramic capacitor of sample 2 to sample 6 of convex electrode, compared to sample 1, the level of acoustic noise is decreased to and is less than 32dB.
Particularly, when convex electrode is formed as having the sample 4 to 6 of 50 μm or larger thickness, compared to sample 1, acoustic noise significantly reduces 13dB or larger.
Simultaneously, exemplarily, first convex electrode 151 and the second convex electrode 152 can comprise and be respectively formed at the first nickel (Ni) coating on first end 131b and the second end 132b and the second nickel (Ni) coating, and the first tin (Sn) coating be respectively formed on the first nickel (Ni) coating and the second nickel (Ni) coating and the second tin (Sn) coating.
In addition, as another example, the first convex electrode 151 and the second convex electrode 152 can comprise and be respectively formed at the first bronze medal (Cu) coating on first end 131b and the second end 132b and the second bronze medal (Cu) coating, be respectively formed at the first nickel (Ni) coating on the first bronze medal (Cu) coating and the second bronze medal (Cu) coating and the second nickel (Ni) coating and the first tin (Sn) coating be respectively formed on the first nickel (Ni) coating and the second nickel (Ni) coating and the second tin (Sn) coating.
According to this exemplary embodiment, owing to forming convex electrode by plating as above, the thickness adjusting convex electrode therefore can be easy to.
Fig. 3 A to Fig. 3 C is the perspective view of the method for the manufacture multilayer ceramic capacitor sequentially illustrated according to the exemplary embodiment in the disclosure.
Below, with reference to Fig. 3 A to Fig. 3 C, the method according to the manufacture multilayer ceramic capacitor of the exemplary embodiment in the disclosure is described.
First, multiple potsherd can be prepared.
Potsherd is for the formation of the dielectric layer 111 of ceramic main body 110.
Prepare slurry by hybrid ceramic powder, polymer and solvent, and by using scraping blade method etc. to make the slurry of preparation be formed as having the sheet of the thickness of some μm, can potsherd be manufactured.
Next, can by each potsherd at least one on the surface with predetermined thickness printing conductive paste form electrode 121 and the second inner electrode 122 in first.
In this case, the end of electrode 121 and the second inner electrode 122 can be exposed to two end surfaces respect to one another of potsherd respectively in first.
Silk screen print method, woodburytype etc. can be used as the method for printing conductive paste, but printing process is not limited thereto.
Then, can alternately stacking on it in formation first multiple potsherds of electrode 121 and the second inner electrode 122 to form multilayer main body, make the end of electrode 121 and the second inner electrode 122 in first be exposed to two end surfaces of multilayer main body respectively.
Multiple stacking potsherd can be suppressed along stacking direction, make multiple potsherd and be formed in electrode 121 and the second inner electrode 122 in first on multiple potsherd to be compressed, thus form multilayer main body.
Next, multilayer main body can be cut according to the area corresponding to single capacitor, thus formation sheet.
Then, can at high temperature sintered chip multilayer main body, thus form ceramic main body 110, wherein, in multiple first, electrode 121 and multiple the second inner electrode 122 are set to two end surfaces being alternately exposed to ceramic main body 110.
Next, can respectively the conductive paste comprising copper (Cu) etc. be applied and be sintered to the part of the exposure of two ends at ceramic main body 110 being electrically connected to electrode 121 and the second inner electrode 122 in first, thus form the first external electrode 131 and the second external electrode 132 that extend to a part for mounting surface from two end surfaces of ceramic main body 110 as shown in fig. 3.
Below, as shown in Figure 3 B, can the outer surface of ceramic main body 110 and in the first external electrode 131 and the second external electrode 132 except the first end 131b in the mounting surface being formed in ceramic main body 110 of the first external electrode 131 and the second external electrode 132 and the part except the second end 132b form insulating barrier 140.
In this case, insulating barrier 140 can be formed by the first connecting portion 131a and the second connecting portion 132a insulating resin being coated to ceramic main body 110 and the first external electrode 131 and the second external electrode 132, and make it solidify.
The material of such as epoxy resin can be used as insulating resin, but not limited.
Next, as shown in FIG. 3 C, plating can be performed by the first end 131b of the exposure to the first external electrode 131 and the second external electrode 132 and the second end 132b and form the first convex electrode 151 and the second convex electrode 152.
First convex electrode 151 and the second convex electrode 152 can be formed as having 50 μm or larger thickness, but its thickness is not limited thereto.
In addition, exemplarily, can by electronickelling on the first end 131b and the second end 132b of the exposure of the first external electrode 131 and the second external electrode 132 respectively, electrotinning forms the first convex electrode 151 and the second convex electrode 152 thereon subsequently.
In addition, as another example, can by electro-coppering, subsequently electronickelling thereon on the first end 131b and the second end 132b of the exposure of the first external electrode 131 and the second external electrode 132 respectively, then electrotinning forms the first convex electrode 151 and the second convex electrode 152 thereon.
Fig. 4 schematically shows the sectional view with the plate of multilayer ceramic capacitor according to the exemplary embodiment in the disclosure.
With reference to Fig. 4, can comprise according to the plate 200 with multilayer ceramic capacitor of this exemplary embodiment the printed circuit board (PCB) 210 of it being installed multilayer ceramic capacitor 100 and formation makes the first spaced electrode pad 221 and the second electrode pad 222 on the printed circuit board 210.
Under the first convex electrode 151 on the lower surface (mounting surface of ceramic main body 110) being formed in ceramic main body 110 and the second convex electrode 152 are arranged to the first electrode pad 221 of difference contact circuit plate 210 and the state of the second electrode pad 222, multilayer ceramic capacitor 100 can be electrically connected to circuit board 210 by solder 231 and 232.
At this moment, on the surface of the first convex electrode 151 and the second convex electrode 152 when electrotinning, when installing multilayer ceramic capacitor 100 on circuit board 210, the tin raw material be formed on the surface of the first convex electrode 151 and the second convex electrode 152 dissolves, thus is connected to the first electrode pad 221 and the second electrode pad 222.
Meanwhile, if needed, such as, when the mounting surface of circuit board 210 is not smooth, the first convex electrode 151 and the second convex electrode 152 can use solder 231 and 232 to be connected to the first electrode pad 221 and the second electrode pad 222.
Under the state that multilayer ceramic capacitor 100 is arranged on circuit board 210 as described above, when the voltage with opposed polarity is applied to be formed in the first external electrode 131 on two ends of multilayer ceramic capacitor 100 and the second external electrode 132 time, ceramic main body 110 can be expanded by the inverse piezoelectric effect through-thickness of dielectric layer 111 and shrink, and two ends of the first external electrode 131 and the second external electrode 132 can due to poisson effect with the expansion of ceramic main body 110 through-thickness with shrink and carry out pucker & bloat on the contrary.
Pucker & bloat as described above can produce vibration.In addition, vibration can be delivered to circuit board 210 from the first external electrode 131 and the second external electrode 132, and from circuit board 210 reflect sound, thus produce acoustic noise.
According to this exemplary embodiment, acoustic noise can be reduced by utilizing the elasticity of the first convex electrode 151 and the second convex electrode 152 to absorb the piezoelectric vibration being delivered to plate by the first external electrode 131 of multilayer ceramic capacitor 100 and the second external electrode 132.
In addition, according in the plate 200 with multilayer ceramic capacitor of this exemplary embodiment, insulating barrier 140 is formed on the outer surface of ceramic main body 110 and the first external electrode 131 and the second external electrode 132, and ceramic main body 110 can separate predetermined distance by the first electrode pad 221 of the first convex electrode 151 and the second convex electrode 152 and circuit board 210 and the second electrode pad 222.
When according to this exemplary embodiment use solder 231 and 232, different from the multilayer ceramic capacitor according to correlation technique, solder 231 and 232 does not contact the ceramic main body 110 of multilayer ceramic capacitor 100 and the first external electrode 131 and the second external electrode 132, but can only be formed on the mounting surface of the first convex electrode 151 and the second convex electrode 152 and outer surface to have minimum height.
Therefore, according in the multilayer ceramic capacitor 100 of this exemplary embodiment, due to solder 231 and 232 highly significant reduce, therefore the elasticity of the first convex electrode 151 and the second convex electrode 152 can work effectively, make to produce from multilayer ceramic capacitor 100 vibration being delivered to circuit board 210 can reduce, thus cause the reduction of acoustic noise.
Meanwhile, according to for the miniaturization of electronic product and the recent trend of slimming, the plate of electronic product is miniaturized, and makes to require high densification when installing electronic building brick.
Particularly, when the quantity of the multiduty passive block installed increases, erection space increases, and makes to increase further for highdensity standard when installing electronic building brick.
According to this exemplary embodiment, the mounting surface of external electrode is formed on a surface of ceramic main body through-thickness (dislocation of ceramic main body is little and vibrate bad transmission), makes it possible to the area reducing mounting portion.
In addition the volume of solder, due to convex electrode, makes can not use solder on the outer surface of external electrode, even if or when using solder, also can reduce significantly, makes the area of the welding disk pattern formed onboard to reduce.Therefore, when the mechanical strength of the such as adhesion strength not destroying external electrode etc., high-density installation can be performed.
In addition, even if when installing multiple multilayer ceramic capacitor with thin space on circuit board 210, do not form the solder bridging (solder bridge) that each multilayer ceramic capacitor is connected to each other yet, thus the reliability of assembly can be improved.
As explained above, according to the exemplary embodiment in the disclosure, time by installing multilayer ceramic capacitor onboard, the mounting surface of external electrode forming convex electrode to absorb the vibration being delivered to plate from external electrode, can acoustic noise be reduced.
Although below illustrate and describe exemplary embodiment, being apparent that for those skilled in the art, when not departing from the scope of the present invention as claims restriction, amendment and distortion can being made.
Claims (18)
1. a multilayer ceramic capacitor, described multilayer ceramic capacitor comprises:
Ceramic main body, multiple dielectric layer through-thickness is stacked in ceramic main body;
Electrode and multiple the second inner electrode in multiple first, be arranged on to be alternately exposed to two end surfaces of ceramic main body in ceramic main body, and at least one dielectric layer to be placed in first between electrode and the second inner electrode;
The first external electrode and the second external electrode, be set to two ends covering ceramic main body;
Insulating barrier, is arranged on the outer surface of ceramic main body and the first external electrode and the second external electrode; And
First convex electrode and the second convex electrode, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode.
2. multilayer ceramic capacitor according to claim 1, wherein, the first convex electrode and the second convex electrode comprise:
First nickel coating and the second nickel coating, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode; And
First tin coating and the second tin coating, be separately positioned on the first nickel coating and the second nickel coating.
3. multilayer ceramic capacitor according to claim 1, wherein, the first convex electrode and the second convex electrode comprise:
First copper coating and the second copper coating, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode;
First nickel coating and the second nickel coating, be separately positioned on the first copper coating and the second copper coating; And
First tin coating and the second tin coating, be separately positioned on the first nickel coating and the second nickel coating.
4. multilayer ceramic capacitor according to claim 1, wherein, the first convex electrode and the second convex electrode have 50 μm or larger thickness.
5. multilayer ceramic capacitor according to claim 1, wherein, the first external electrode and the second external electrode comprise:
The first pontes and the second coupling part, be separately positioned on two end surfaces of ceramic main body, and be connected respectively to electrode and the second inner electrode in first; And
First end and the second end, extend to a part for the mounting surface of ceramic main body respectively from the first pontes and the second coupling part, and
First convex electrode and the second convex electrode are separately positioned on first end and the second end.
6. multilayer ceramic capacitor according to claim 1, wherein, insulating barrier is formed by epoxy resin.
7. manufacture a method for multilayer ceramic capacitor, described method comprises;
By alternately stacking respectively and multilayer main body prepared by the multiple potsherds suppressing electrode and the second inner electrode in formation first on it, make electrode and the second inner electrode in first be set to facing with each other, and at least one potsherd to be placed in first between electrode and the second inner electrode;
By cutting according to the region corresponding to single capacitor and sintered multilayer main body, in preparation first, electrode and the second inner electrode are alternately exposed to the ceramic main body of two end surfaces of ceramic main body;
Two ends of ceramic main body form the first external electrode and the second external electrode, to be electrically connected to electrode and the second inner electrode in first;
In ceramic main body and first electrode and the second inner electrode outer surface on form insulating barrier; And
Perform plating by the mounting surface of the exposure to the first external electrode and the second external electrode and form the first convex electrode and the second convex electrode.
8. method according to claim 7, wherein, by electronickelling in the mounting surface of the exposure of the first external electrode and the second external electrode and subsequently thereon electrotinning form the first convex electrode and the second convex electrode.
9. method according to claim 7, wherein, by electro-coppering in the mounting surface of the exposure of the first external electrode and the second external electrode, electronickelling thereon subsequently, electrotinning forms the first convex electrode and the second convex electrode thereon subsequently.
10. method according to claim 7, wherein, the first convex electrode and the second convex electrode are formed as having 50 μm or larger thickness.
11. methods according to claim 7, wherein, form insulating barrier by applying and solidify insulating resin on the outer surface of ceramic main body and the first external electrode and the second external electrode.
12. methods according to claim 11, wherein, insulating resin is epoxy resin.
13. 1 kinds of plates with multilayer ceramic capacitor, described plate comprises:
Circuit board, arranges the first electrode pad and the second electrode pad thereon; And
Multilayer ceramic capacitor, installs on circuit boards,
Wherein, multilayer ceramic capacitor comprises:
Ceramic main body, multiple dielectric layer through-thickness is stacked in ceramic main body;
Electrode and multiple the second inner electrode in multiple first, be arranged on to be alternately exposed to two end surfaces of ceramic main body in ceramic main body, and at least one dielectric layer to be placed in first between electrode and the second inner electrode;
The first external electrode and the second external electrode, be set to two ends covering ceramic main body;
Insulating barrier, is arranged on the outer surface of ceramic main body and the first external electrode and the second external electrode; And
First convex electrode and the second convex electrode, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode.
14. plates according to claim 13, wherein, the first convex electrode and the second convex electrode comprise:
First nickel coating and the second nickel coating, be separately positioned in the mounting surface of the exposure of the first external electrode and the second external electrode; And
First tin coating and the second tin coating, be separately positioned on the first nickel coating and the second nickel coating.
15. plates according to claim 13, wherein, the first convex electrode and the second convex electrode comprise:
First copper coating and the second copper coating, be respectively formed in the mounting surface of the exposure of the first external electrode and the second external electrode;
First nickel coating and the second nickel coating, be respectively formed on the first copper coating and the second copper coating; And
First tin coating and the second tin coating, be respectively formed on the first nickel coating and the second nickel coating.
16. plates according to claim 13, wherein, the first convex electrode and the second convex electrode have 50 μm or larger thickness.
17. plates according to claim 13, wherein, the first external electrode and the second external electrode comprise:
The first pontes and the second coupling part, be separately positioned on two end surfaces of ceramic main body, and be connected respectively to electrode and the second inner electrode in first; And
First end and the second end, extend to a part for the mounting surface of ceramic main body respectively from the first pontes and the second coupling part, and
First convex electrode and the second convex electrode are separately positioned on first end and the second end.
18. plates according to claim 13, wherein, insulating barrier is formed by epoxy resin.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0044165 | 2014-04-14 | ||
| KR1020140044165A KR20150118385A (en) | 2014-04-14 | 2014-04-14 | Multi-layered ceramic capacitor, manufacturing method for the same and board having the same mounted thereon |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104979096A true CN104979096A (en) | 2015-10-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410736333.0A Pending CN104979096A (en) | 2014-04-14 | 2014-12-04 | Multilayer ceramic capacitor, manufacturing method thereof, and plate with the same |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2015204451A (en) |
| KR (1) | KR20150118385A (en) |
| CN (1) | CN104979096A (en) |
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Also Published As
| Publication number | Publication date |
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| KR20150118385A (en) | 2015-10-22 |
| JP2015204451A (en) | 2015-11-16 |
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