CN104975332A - Method for adjusting ion concentration of plating solution - Google Patents
Method for adjusting ion concentration of plating solution Download PDFInfo
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- CN104975332A CN104975332A CN201510457761.4A CN201510457761A CN104975332A CN 104975332 A CN104975332 A CN 104975332A CN 201510457761 A CN201510457761 A CN 201510457761A CN 104975332 A CN104975332 A CN 104975332A
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- plating solution
- concentration
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- anode
- metal ions
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Abstract
The invention discloses a method for adjusting the ion concentration of a plating solution. According to the method, in non-cyanide alloy electroplating, metals share a complexing agent, and the required content of coated metal is obtained by adjusting the ion concentration of the plating solution; and the ion concentration is controlled through double rectifiers and double anodes. The double-rectifier and double-anode control means that in the electroplating process, the double soluble anodes are connected with a power source, and when two ion concentrations of the plating solution change and cannot meet a requirement, by adjusting the current ratio of the double soluble anodes, different anode solution rates are changed, so that different ion concentrations are provided, and it is guaranteed that the ion concentration of the plating solution meets the requirement. The double soluble anodes are connected with the power source through the rectifiers respectively. The different anode solution rates are changed by adjusting the current ratio of the double soluble anodes, so that different ion concentrations are provided. Cost is low, and operation is convenient.
Description
Technical field
The invention belongs to field of electroplating, relate to a kind of electro-plating method, specifically a kind of method adjusting plating solution intermediate ion concentration.
Background technology
Current alloy plating is still based on cyanide electroplating, and in coating, each metal content has come by controlling complexing of metal ion dosage in plating solution, and shortcoming is: cyanide ion severe toxicity, is unfavorable for safety in production.
Summary of the invention
The object of this invention is to provide a kind of method adjusting plated ionic concn in plating solution, the method changes different anode dissolution speed by regulating soluble anode current ratio, thus provides different ions concentration.
Object of the present invention is achieved through the following technical solutions:
Adjust a method for plated concentration of metal ions in plating solution, it is characterized in that: the method is in non-cyanogen alloy plating, and metal shares complexing agent, obtain by adjustment plating solution intermediate ion concentration the coated metal content needed; Plated concentration of metal ions is controlled by two rectifier double anode.
In the present invention, two rectifier double anode controls to refer to: in electroplating process, two soluble anodes are connected with power supply respectively, when in plating solution, two plated concentration of metal ions change, when not meeting the demands, by regulating two soluble anode current ratios to change different anode dissolution speed, thus providing different ions concentration, ensureing that in plating solution, plated concentration of metal ions meets the requirements.Two soluble anodes are connected with power supply respectively by rectifier.
The present invention is non-cyanogen alloy plating technology, because metal shares complexing agent, is therefore obtained the coated metal content of needs by the mode of adjustment plating solution intermediate ion concentration.The method of supplementing by two rectifier double anode control of ionic concn, by regulating soluble anode current ratio to change different anode dissolution speed in electroplating process, thus provides different plated concentration of metal ions.
Embodiment
Adjust a method for plated concentration of metal ions in plating solution, the method is in non-cyanogen alloy plating, and metal shares complexing agent, obtains by plated concentration of metal ions in adjustment plating solution the coated metal content needed; Plated concentration of metal ions is controlled by two rectifier double anode.
Two rectifier double anode controls to refer to: in electroplating process, two soluble anodes are connected with power supply respectively, when in plating solution, two plated concentration of metal ions change, when not meeting the demands, different anode dissolution speed is changed by regulating two soluble anode current ratios, thus different plated concentration of metal ions is provided, ensure that in plating solution, plated concentration of metal ions meets the requirements.Two soluble anodes are connected respectively to two positive poles of two rectifiers.
Two soluble anodes are connected with power supply respectively by rectifier.By adjusting the electric current of two rectifiers, regulating two soluble anode current ratios to change different anode dissolution speed, thus different ions concentration is provided, meeting the demands.
Claims (4)
1. adjust a method for plating solution intermediate ion concentration, it is characterized in that: the method is in non-cyanogen alloy plating, and metal shares complexing agent, obtain by plated concentration of metal ions in adjustment plating solution the coated metal content needed; Plated concentration of metal ions is controlled by two rectifier double anode.
2. the method for plated concentration of metal ions in adjustment plating solution according to claim 1, it is characterized in that: two rectifier double anode controls to refer to: in electroplating process, two soluble anodes are connected with the positive pole of power supply respectively, and two of rectifier negative poles are connected on plating piece negative electrode simultaneously, when in plating solution, two ionic concns change, when not meeting the demands, by changing the anode dissolution speed that two soluble anode current ratios reach different, thus different ions concentration is provided, ensure that plating solution intermediate ion concentration meets the requirements.
3. the method for plated concentration of metal ions in adjustment plating solution according to claim 2, is characterized in that: two soluble anodes are connected with power supply respectively by rectifier.
4. the method for plated concentration of metal ions in adjustment plating solution according to claim 3, is characterized in that: by adjusting the electric current of two rectifiers, regulating two soluble anode current ratios to change different anode dissolution speed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510457761.4A CN104975332A (en) | 2015-07-30 | 2015-07-30 | Method for adjusting ion concentration of plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510457761.4A CN104975332A (en) | 2015-07-30 | 2015-07-30 | Method for adjusting ion concentration of plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104975332A true CN104975332A (en) | 2015-10-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510457761.4A Pending CN104975332A (en) | 2015-07-30 | 2015-07-30 | Method for adjusting ion concentration of plating solution |
Country Status (1)
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| CN (1) | CN104975332A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023496A (en) * | 2018-06-26 | 2018-12-18 | 南通汇丰电子科技有限公司 | It is a kind of for controlling the method and system of electroplated Sn-Bi alloy |
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| CN2175238Y (en) * | 1993-09-29 | 1994-08-24 | 北京科技大学 | Positive plate of electroplating bath made of zinc-nickel alloy |
| JPH11209900A (en) * | 1998-01-23 | 1999-08-03 | Ebara Corp | Alloy plating device |
| JP2003055799A (en) * | 2001-08-15 | 2003-02-26 | Furukawa Electric Co Ltd:The | Alloy plating method, and alloy plating liquid manufacturing device used in the alloy plating method |
| US20050189231A1 (en) * | 2004-02-26 | 2005-09-01 | Capper Lee D. | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
| JP2006213956A (en) * | 2005-02-02 | 2006-08-17 | Nomura Plating Co Ltd | Fe-W ALLOY ELECTROPLATING DEVICE USING CATION EXCHANGE MEMBRANE, CONTINUOUS PLATING METHOD USING THE DEVICE AND COATING FILM |
| JP2006257492A (en) * | 2005-03-17 | 2006-09-28 | Nec Corp | Alloy plating method and alloy plating device |
| JP2010065255A (en) * | 2008-09-09 | 2010-03-25 | Nec Corp | Alloy plating method and alloy plating apparatus |
| CN103781944A (en) * | 2011-09-09 | 2014-05-07 | 麦克德米德尖端有限公司 | Electrodeposition of hard magnetic coatings |
| WO2014147180A1 (en) * | 2013-03-21 | 2014-09-25 | Atotech Deutschland Gmbh | Apparatus and method for electrolytic deposition of metal layers on workpieces |
| CN204174295U (en) * | 2014-07-29 | 2015-02-25 | 葛婕 | Be configured with bianode Acidic zinc-nickel alloy electroplanting device |
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2015
- 2015-07-30 CN CN201510457761.4A patent/CN104975332A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2175238Y (en) * | 1993-09-29 | 1994-08-24 | 北京科技大学 | Positive plate of electroplating bath made of zinc-nickel alloy |
| JPH11209900A (en) * | 1998-01-23 | 1999-08-03 | Ebara Corp | Alloy plating device |
| JP2003055799A (en) * | 2001-08-15 | 2003-02-26 | Furukawa Electric Co Ltd:The | Alloy plating method, and alloy plating liquid manufacturing device used in the alloy plating method |
| US20050189231A1 (en) * | 2004-02-26 | 2005-09-01 | Capper Lee D. | Articles with electroplated zinc-nickel ternary and higher alloys, electroplating baths, processes and systems for electroplating such alloys |
| JP2006213956A (en) * | 2005-02-02 | 2006-08-17 | Nomura Plating Co Ltd | Fe-W ALLOY ELECTROPLATING DEVICE USING CATION EXCHANGE MEMBRANE, CONTINUOUS PLATING METHOD USING THE DEVICE AND COATING FILM |
| JP2006257492A (en) * | 2005-03-17 | 2006-09-28 | Nec Corp | Alloy plating method and alloy plating device |
| JP4725145B2 (en) * | 2005-03-17 | 2011-07-13 | 日本電気株式会社 | Alloy plating method and alloy plating apparatus |
| JP2010065255A (en) * | 2008-09-09 | 2010-03-25 | Nec Corp | Alloy plating method and alloy plating apparatus |
| CN103781944A (en) * | 2011-09-09 | 2014-05-07 | 麦克德米德尖端有限公司 | Electrodeposition of hard magnetic coatings |
| WO2014147180A1 (en) * | 2013-03-21 | 2014-09-25 | Atotech Deutschland Gmbh | Apparatus and method for electrolytic deposition of metal layers on workpieces |
| CN204174295U (en) * | 2014-07-29 | 2015-02-25 | 葛婕 | Be configured with bianode Acidic zinc-nickel alloy electroplanting device |
Non-Patent Citations (1)
| Title |
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| 马克: "《纺织物的化学整理》", 31 May 1984, 纺织工业出版社 * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109023496A (en) * | 2018-06-26 | 2018-12-18 | 南通汇丰电子科技有限公司 | It is a kind of for controlling the method and system of electroplated Sn-Bi alloy |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20151014 |