CN104975248B - Solution treatment method of third generation nickel-base single crystal high temperature alloy - Google Patents
Solution treatment method of third generation nickel-base single crystal high temperature alloy Download PDFInfo
- Publication number
- CN104975248B CN104975248B CN201510374344.3A CN201510374344A CN104975248B CN 104975248 B CN104975248 B CN 104975248B CN 201510374344 A CN201510374344 A CN 201510374344A CN 104975248 B CN104975248 B CN 104975248B
- Authority
- CN
- China
- Prior art keywords
- temperature
- solid solution
- solution treatment
- single crystal
- uphill diffusion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Crystals, And After-Treatments Of Crystals (AREA)
Abstract
The invention discloses a solution treatment method of third generation nickel-base single crystal high temperature alloy. According to the solution treatment method, a conventional solution treatment of third generation nickel-base single crystal high temperature alloy is improved so as to avoid incipient melting of alloy in solution treatment processes, improve product mechanical properties, and increase finished product yield. According to the solution treatment method, in solution treatment processes, solution temperature after uphill diffusion is reduced, and the solution temperature is maintained to be lower than an incipient melting temperature which is reduced because of uphill diffusion, so that incipient melting is avoided. The solution treatment method is capable of avoiding incipient melting caused by uphill diffusion, eliminating holes and residual eutectic caused by incipient melting, and improving alloy mechanical properties; and in addition, finished product yield is increased obviously because of avoiding of incipient melting.
Description
Technical field
The present invention relates to third generation nickel-base high-temperature single crystal alloy Field of Heat-treatment, specifically change the solution treatment work of alloy
Skill, it is to avoid the generation of incipient melting, improves yield rate and the properties of product of heat treated article.
Background technology
Third generation nickel-base high-temperature single crystal alloy refers to that the mass fraction of wherein re element is 4%～6%, and creep rupture life
More than 100h under 1100 DEG C, load 150mpa.In recent years, China's space flight and aviation technology achieved the progress advanced by leaps and bounds, and
Engine is the core component of space flight and aviation aircraft, therefore improves increasing it using temperature and having an high regard for specific potential of engine material
Must go.Nickel-base high-temperature single crystal alloy is having good mechanical property at a temperature of the use of fusing point, thus extensive
It is applied to engine.China have begun at present to research and develop energetically third generation nickel base single crystal high-temperature alloy material and achieve important enter
Exhibition.Single crystal super alloy is done in dendrite after directional solidification has segregation with interdendritic, and interdendritic also has eutectic, and main
Hardening constituent γ ' size and distribution are also very uneven, so before being taken into use will be through by solution treatment and Ageing Treatment
The organization and performance to improve alloy for the heat treatment of composition.And the development with alloy, in alloy, refractory element content constantly carries
Height, significantly improves the interdiffusion coefficient of each element in alloy, increases the as cast condition segregation of alloy, increases the difficulty of subsequent solution treatment
Degree.Become big additionally, due to as cast condition segregation, interdendritic is easier incipient melting, reduces heat treatment window.And refractory element itself
Diffusion coefficient exceeds the several order of magnitude of other elements, and the time that Homogenization Process needs and temperature greatly increase.
The incipient melting producing during solution treatment not only can form the lifting surface area that hole reduces material, and can produce very
Many residual eutectic structures, substantially reduce the mechanical behavior under high temperature of alloy.Biography currently for third generation nickel-base high-temperature single crystal alloy
System technique is to step up solid solubility temperature and temperature retention time, thus step up the initial melting temperature of alloy, in the generation of incipient melting
Under the premise of higher temperature solid solution is carried out to alloy.Even if but the multistep that solution treatment is divided into solid solubility temperature continuous improvement is admittedly
Molten, still it may happen that incipient melting.
Through to prior art literature search find: document " karunaratne m s a, cox d c, et al.
The modelling of the microsegregation in cmsx-4superalloy that superalloys 2000 delivers
And its homogenisation during heat treatment " have studied the problems such as incipient melting and uphill diffusion but not
Refer to relation between the two.
Document " hegde, s.r., r.m.kearsey et al. in materials science and engineering:a,
The designing homogenization solution heat treatments for single that 2010.527 deliver
Crystal superalloys " is found that the incipient melting that uphill diffusion produces during leading to solution treatment, but does not specifically beg for
By the change of just fusing point, but attempt to avoid uphill diffusion with higher temperature solution treated, this way there is no theoretical foundation,
And do not homogenized in low temperature and likely result in the direct incipient melting in low melting point region in the higher direct solid solution of temperature.
A kind of third generation nickel-based monocrystal is all proposed high in Chinese patent cn1966750a, United States Patent (USP) us8696979b2
Temperature alloy solid solution treatment process, but do not refer to the incipient melting problem that uphill diffusion causes.
Chinese patent cn103352192a refers to solid solution treatment process design problem, but it does not refer to that uphill diffusion causes
Incipient melting problem.
Content of the invention
There is incipient melting for during overcoming solution treatment present in prior art, lead to mechanical property and the finished product of product
The deficiency that rate declines, the present invention proposes a kind of solid solution treatment method of third generation nickel-base high-temperature single crystal alloy.
The present invention comprises the concrete steps that:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.
Step 2, time and its end time that simulation al element uphill diffusion occurs.Described simulation al element uphill diffusion
The time occurring and its end time are to simulate third generation nickel-base high-temperature single crystal alloy coupon in multistep admittedly by dictra software
The situation of diffusion under temperature conditionss in molten process.
Step 3, determines the temperature of solution treatment.When determining the temperature of solution treatment, it is first determined the uphill diffusion time
The initial melting temperature of alloy in section, and this initial melting temperature is compared with the temperature of al element uphill diffusion time period in solution treatment,
Decide whether to adjust the temperature of solution treatment according to comparing result.Detailed process is:
The first step. input third generation nickel-base high-temperature single crystal alloy at the end of the al element uphill diffusion obtaining by step 2
The content of each element at al constituent content maximum position in coupon, obtains this al unit according to the criterion of minimization of Gibbs free energy
Melting temperature at cellulose content maximum position.Gone up a slope using the melting temperature at described al constituent content maximum position as al element
The initial melting temperature of diffusion time section alloy.
Second step. by the solid solution temperature of the initial melting temperature obtaining and al element uphill diffusion time period in solution treatment
It is compared, if solid solution temperature is less than initial melting temperature, incipient melting does not occur it was demonstrated that this solid solution temperature need not adjust,
Enter step 4 and carry out solution treatment.If solid solution temperature is higher than described initial melting temperature, there is incipient melting, upward slope need to be reduced and expand
The solid solution temperature of scattered time period is to described initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature after inspection reduces again is feasible.Replaced with the solid solution temperature after reducing
Change the solid solution temperature of uphill diffusion time period in step 2, the process of repeat step 2, redefine al element uphill diffusion
The time occurring and its end time, the first step and the second step laid equal stress in duplicate step, until the uphill diffusion time period is first
Melting temperatur is less than this time period solid solution temperature, then choose the solution treatment that this temperature is the solution treatment uphill diffusion time period
Temperature.
Step 4, solution treatment.Solid solution temperature according to determining is carried out to third generation nickel-base high-temperature single crystal alloy coupon
Solution treatment.
Described third generation nickel-base high-temperature single crystal alloy coupon is placed in heat-treatment furnace.In heat-treatment furnace, by the third generation
Nickel-base high-temperature single crystal alloy coupon rises to the solid solution temperature of the first step of routine and is incubated 1h from room temperature；Insulation is dropped after terminating
The warm solid solubility temperature determining to step 3 is simultaneously incubated 2h；The solid solubility temperature of described determination is than the solid solution of the described conventional first step
Treatment temperature is low 10 DEG C；Insulation is warmed up to the solid solution temperature of second step after terminating and is incubated 2h；Insulation terminates follow-up of continuing rising
The warm solid solution temperature to the 3rd step is simultaneously incubated 3h；Insulation is warmed up to the solid solution temperature of the 4th step after terminating and is incubated
5h；Insulation terminates follow-up continuous to be warmed up to the solid solution temperature of the 5th step and be incubated 10h；Insulation terminates rear blow-on, by described the
Three generations's nickel-base high-temperature single crystal alloy coupon is air cooled to room temperature, obtains the third generation nickel-base high-temperature single crystal alloy examination through solution treatment
Rod.Described heating rate is 10 DEG C/min.
The purpose of the present invention is to improve a kind of third generation nickel-base high-temperature single crystal alloy solid solution treatment process, it is to avoid alloy is solid
There is incipient melting, thus improving mechanical property and the yield rate of product in molten processing procedure.
The present invention, by the research to incipient melting mechanism of production, finds that not all elements are all during solution treatment
From the big regional diffusion of constituent content to the little region of constituent content, but as the be shown with element of Fig. 1 is anti-from the low region of content
It is diffused into the high region of content, makes this constituent content in the high region of constituent content further up, this phenomenon is referred to as going up a slope
Diffusion.Although this phenomenon in high temperature alloy advantageously, it has been found that but its to solution treatment produce impact be often ignored, low
The uphill diffusion of melting element al element particularly as shown in Figure 1 can reduce the fusing point of interdendritic fusing point script very low area, from
And reducing the just fusing point of whole alloy, this just fusing point temperature is likely lower than solid solution temperature, and now solid solution temperature
If still rising or remaining unchanged, incipient melting can occur.
The present invention is using a kind of work gradually rising different from solid solution temperature in traditional multistep solid solution treatment process
Skill, but consider the reduction situation of initial melting temperature after uphill diffusion generation during solution treatment, according to the incipient melting temperature reducing
Degree, to reduce solid solution temperature, is not to improve solid solution temperature always according to traditional solution treatment scheme.This fall
The method of low solid solution temperature makes solid solution temperature be less than the initial melting temperature reducing due to uphill diffusion, it is to avoid incipient melting
Produce.It is avoided that using the method for the present invention and is occurred by the incipient melting that uphill diffusion causes, thus eliminating the hole being produced by incipient melting
And remnants eutectic, and then put forward heavy alloyed mechanical property, and avoiding additionally, due to incipient melting, the yield rate of product will significantly improve.
Organizing Fig. 5, Fig. 6, Fig. 7 and using the tissue Fig. 2 after solution treatment of the present invention, figure after contrast traditional solution process
3rd, Fig. 4 finds out, finds a large amount of holes significantly being produced by incipient melting using traditional solution in Fig. 5, Fig. 6, the Fig. 7 after processing, and
All there is not incipient melting in Fig. 2, Fig. 3, Fig. 4 using solution treatment of the present invention.Illustrate that the solid solution treatment method of the present invention can be effective
The generation avoiding incipient melting.
Brief description
Fig. 1 is the schematic diagram by uphill diffusion during the calculated solution treatment of simulation, and wherein a segment table shows upward slope
Diffuser.
Fig. 2 is organization chart after embodiment 1 solution treatment.
Fig. 3 is organization chart after embodiment 2 solution treatment.
Fig. 4 is organization chart after embodiment 3 solution treatment.
Fig. 5 is alloy in embodiment 1 organization chart after traditional solution process, and wherein a represents the hole that incipient melting produces
Hole.
Fig. 6 is alloy in embodiment 2 organization chart after traditional solution process, and wherein a represents the hole that incipient melting produces
Hole.
Fig. 7 is alloy in embodiment 3 organization chart after traditional solution process, and wherein a represents the hole that incipient melting produces
Hole.
Fig. 8 is the flow chart of the present invention.
Specific embodiment
Embodiment 1
In the present embodiment alloy, cr be 3.5%, mo be 1.5%, al be 6%, co be 9%, w be 6%, re be 4%, ta
For 8%, hf be 1%, c be≤0.02%, balance of ni.Described percentage is mass percent.
The implementation steps of the described third generation nickel-base high-temperature single crystal alloy solution treatment that the present embodiment proposes are:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.By by 3.5% cr, 1.5% mo, 6% al,
9% co, 6% w, 4% re, 8% ta, 1% hf ,≤0.02% c, and the foundry alloy of balance of ni composition passes through
Conventional directional freeze method preparation becomes third generation nickel-base high-temperature single crystal alloy coupon.
Step 2, time and its end time that simulation al element uphill diffusion occurs.Described simulation al element uphill diffusion
The time occurring and its end time are to simulate third generation nickel-base high-temperature single crystal alloy coupon in multistep admittedly by dictra software
The situation of diffusion under temperature conditionss in molten process.Specifically:
The process of simulation conventional solid solution processing method and parameter, by third generation nickel-base high-temperature single crystal alloy coupon from room temperature liter
1290 DEG C of insulation 1h of solid solution temperature to the first step；It is warming up to 1300 DEG C of insulation 2h of solid solution temperature of second step, protect
After temperature terminates, continue to be warmed up to 1310 DEG C of the solid solution temperature of the 3rd step and be incubated 3h；Continue to be warmed up to the solid solution of the 4th step
1320 DEG C for the treatment of temperature is simultaneously incubated 5h, is incubated 10h after being warmed up to 1330 DEG C of the solid solution temperature of the 5th step；Insulation is opened after terminating
Stove, third generation nickel-base high-temperature single crystal alloy coupon is air cooled to room temperature, described heating rate is 10 DEG C/min.
Obtain the process of all elements phase counterdiffusion in third generation nickel-base high-temperature single crystal alloy coupon, Yi Ji by simulation
In three generations's nickel-base high-temperature single crystal alloy coupon, the al constituent content of position occurs uphill diffusion to become with the process of solution treatment
Change.Record the time of described al constituent content uphill diffusion, at the end of obtaining al element uphill diffusion, third generation nickel-based monocrystal is high
The content of each element at al constituent content maximum position in temperature alloy coupon.
Al element in the present embodiment, after solution treatment to 717.2s, in third generation nickel-base high-temperature single crystal alloy coupon
Start uphill diffusion, and reach maximum when 5464.8s, subsequent uphill diffusion terminates.
Step 3, determines the temperature of solution treatment.When determining the temperature of solution treatment, it is first determined the uphill diffusion time
The initial melting temperature of alloy in section, and this initial melting temperature is compared with the temperature of al element uphill diffusion time period in solution treatment,
Decide whether to adjust the temperature of solution treatment according to comparing result.Specific practice is:
The first step. input third generation nickel-base high-temperature single crystal alloy at the end of the al element uphill diffusion obtaining by step 2
The content of each element at al constituent content maximum position in coupon, obtains this al unit according to the criterion of minimization of Gibbs free energy
Melting temperature at cellulose content maximum position.Gone up a slope using the melting temperature at described al constituent content maximum position as al element
The initial melting temperature of diffusion time section.
Second step. by the solid solution temperature of the initial melting temperature obtaining and al element uphill diffusion time period in solution treatment
It is compared, if solid solution temperature is less than initial melting temperature, incipient melting does not occur it was demonstrated that this solid solution temperature need not adjust,
Enter step 4 and carry out solution treatment.If solid solution temperature is higher than described initial melting temperature, there is incipient melting, upward slope need to be reduced and expand
The solid solution temperature of scattered time period is to described initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature after inspection reduces again is feasible.Replaced with the solid solution temperature after reducing
Change the solid solution temperature of uphill diffusion time period in step 2, the process of repeat step 2, redefine al element uphill diffusion
The time occurring and its end time, the first step and the second step laid equal stress in duplicate step, until the uphill diffusion time period is first
Melting temperatur is less than this time period solid solution temperature, then choose the solution treatment that this temperature is the solution treatment uphill diffusion time period
Temperature.
In the present embodiment, after 5464.8s, the just fusing point of alloy reaches 1292.6 DEG C of the minimum of a value of this time period, but
Now in step 1, the temperature of solution treatment is 1300 DEG C, and this temperature is more than initial melting temperature, if therefore according to traditional solution process side
Case alloy will occur incipient melting.So before al element enters the uphill diffusion time period by solid solution temperature adjust to described just
10 DEG C below melting temperatur, that is, al element enter the uphill diffusion time period before by solid solution temperature adjust to 1292.6 DEG C-
10℃；Round as 1283 DEG C.
Solid solution process when simulation is checked again is: third generation nickel-base high-temperature single crystal alloy coupon is risen to 1290 from room temperature
DEG C insulation 1h；It is cooled to 1283 DEG C of insulation 2h, after insulation terminates, be warmed up to 1300 DEG C and be incubated 2h；Continue to be warmed up to 1310 DEG C
And it is incubated 3h, insulation is continuously heating to 1320 DEG C after terminating and is incubated 5h；It is incubated 10h after continuing to be warmed up to 1330 DEG C；Insulation knot
Blow-on after bundle, third generation nickel-base high-temperature single crystal alloy coupon is air cooled to room temperature, described heating rate is 10 DEG C/min.
Step 4, solution treatment.Solid solution temperature according to determining is carried out to third generation nickel-base high-temperature single crystal alloy coupon
Solution treatment.
Described third generation nickel-base high-temperature single crystal alloy coupon is placed in heat-treatment furnace.By third generation nickel in heat-treatment furnace
Based single-crystal high-temperature alloy coupon is increased to 1290 DEG C from room temperature and is incubated 1h；It is incubated 2h after cooling to 1283 DEG C；After insulation terminates
It is warmed up to 1300 DEG C of insulation 2h；Continue to be warmed up to 1310 DEG C of insulation 3h；Rise temperature after insulation terminates and to 1320 DEG C and be incubated 5h；Continue
It is warmed up to 1330 DEG C of insulation 10h；Insulation terminates rear blow-on, and described third generation nickel-base high-temperature single crystal alloy coupon is air cooled to room
Temperature, obtains the third generation nickel-base high-temperature single crystal alloy coupon through solution treatment.Described heating rate is 10 DEG C/min.Solid solution
Tissue after the completion of process is as shown in Figure 2.
Embodiment 2
The present embodiment is a kind of third generation nickel-base high-temperature single crystal alloy solid solution treatment method, described alloy by cr, mo, al,
Co, w, re, ta, hf, c and ni form, wherein: cr be 3%, mo be 1%, al be 6%, co be 12%, w be 6%, re be 4%,
Ta is 7.95%, hf is≤0.02% for 1%, c, balance of ni.Described percentage is mass percent.
The implementation steps of the described third generation nickel-base high-temperature single crystal alloy solution treatment that the present embodiment proposes are:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.Will by cr be 3.2%, mo be 1.2%, al be 6%,
Co be 10%, w be 6%, re be 4%, ta be 7.98%, hf be 0.08%, c be≤0.02%, female conjunction of balance of ni composition
Gold becomes the alloy bar of third generation nickel-base high-temperature single crystal alloy by conventional directional freeze method preparation.
Step 2, determines time and its end time of the generation of al element uphill diffusion.Described determination al element uphill diffusion
Occur time and its end time be to determine al element in traditional solution processing method uphill diffusion occur time and its
End time.Specific practice is to simulate third generation nickel-base high-temperature single crystal alloy coupon at traditional multistep solid solution with dictra software
The situation of diffusion under temperature conditionss in reason.Specifically:
The process of simulation conventional solid solution processing method and parameter, by third generation nickel-base high-temperature single crystal alloy coupon from room temperature liter
1290 DEG C of insulation 1h of solid solution temperature to the first step；It is warming up to 1300 DEG C of insulation 2h of solid solution temperature of second step, protect
After temperature terminates, continue to be warmed up to 1310 DEG C of the solid solution temperature of the 3rd step and be incubated 3h；Continue to be warmed up to the solid solution of the 4th step
1320 DEG C for the treatment of temperature is simultaneously incubated 5h, is incubated 10h after being warmed up to 1330 DEG C of the solid solution temperature of the 5th step；Insulation is opened after terminating
Stove, third generation nickel-base high-temperature single crystal alloy coupon is air cooled to room temperature, described heating rate is 10 DEG C/min.
Obtain the process of all elements phase counterdiffusion in third generation nickel-base high-temperature single crystal alloy coupon, Yi Ji by simulation
In three generations's nickel-base high-temperature single crystal alloy coupon, the al constituent content of position occurs uphill diffusion to become with the process of solution treatment
Change.Record the time of described al constituent content uphill diffusion, at the end of obtaining al element uphill diffusion, third generation nickel-based monocrystal is high
The content of each element at al constituent content maximum position in temperature alloy coupon.
Al element in the present embodiment, after solution treatment to 763.9s, in third generation nickel-base high-temperature single crystal alloy coupon
Start uphill diffusion, and reach maximum when 5623.8s, subsequent uphill diffusion terminates.
Step 3, determines the initial melting temperature in the uphill diffusion time period for the alloy.Determine alloy in the uphill diffusion time period just
Melting temperatur, and contrast the original solid solution temperature of this initial melting temperature and this uphill diffusion time period, determined according to comparing result
Whether adjust the temperature of solution treatment.Specific practice is:
The first step. each element content in the maximum node of al constituent content described in step 2 at the end of reading uphill diffusion, root
Calculate the melting temperature in the above-mentioned moment for the above-mentioned node according to the criterion of minimization of Gibbs free energy, because this melting temperature is to go up a slope
Melting temperature minimum point in all nodes in diffusion time section, so this melting temperature is at the traditional solution described in step 2
The initial melting temperature of uphill diffusion time period in reason method.
Second step. the traditional solution described in the initial melting temperature of contrast above-mentioned uphill diffusion time period and step 2 is processed at this
, if solid solution temperature is less than initial melting temperature, there is not incipient melting it was demonstrated that this solution treatment side in the solid solution temperature of time period
Case need not adjust, and jumps directly to step 4；If solid solution temperature is higher than initial melting temperature, there is incipient melting, upward slope need to be reduced and expand
The solid solution temperature of scattered time period is to initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature after inspection reduces again is feasible.Solid solution temperature after reducing is replaced
Change the traditional solution treatment temperature in step 2, the process of repeat step 2, redefine the time of al element uphill diffusion generation
And its end time, the first step and the second step laid equal stress in duplicate step, until the initial melting temperature of uphill diffusion time period is less than
This time period solid solution temperature, then choose the solution treatment temperature that this temperature is the solution treatment uphill diffusion time period of the present invention
Degree.
In the present embodiment, after 5623.8s, the just fusing point of alloy reaches 1295.7 DEG C of the minimum of a value of this time period, but
The temperature of the traditional multistep solution treatment now listed in step 1 be 1300 DEG C, this temperature be more than initial melting temperature, if therefore according to
Traditional solution processing scheme alloy will occur incipient melting.So adjusting the solid solution temperature of above-mentioned slope diffusion time section to than first
The solid solution temperature that low 10 DEG C of melting temperatur, that is, 1286 DEG C, repeat step 2～3 finds that no incipient melting occurs.
Step 4, adjusts and implements whole solution treatment process according to the result described in step 3.At solid solution in the present embodiment
Reason method is: in heat-treatment furnace, from room temperature, third generation nickel-base high-temperature single crystal alloy coupon is increased to 1290 DEG C, is incubated 1h, fall
Temperature, to 1286 DEG C, is incubated 2h, then is warmed up to 1300 DEG C, is incubated 2h, then is warmed up to 1310 DEG C, is incubated 3h, is warmed up to 1320 DEG C, protects
Warm 5h, is warmed up to 1330 DEG C, is incubated 10h, last blow-on, third generation nickel-base high-temperature single crystal alloy coupon is air cooled to room temperature, institute
State heating rate and be 10 DEG C/min.Tissue after the completion of solution treatment is as shown in Figure 3.
Embodiment 3
The present embodiment is a kind of third generation nickel-base high-temperature single crystal alloy solid solution treatment method, described alloy by cr, mo, al,
Co, w, re, ta, hf, c and ni form, wherein: alloying component be cr be 3.2%, mo be 1.2%, al be 6%, co be 10%, w
For 6%, re be 4%, ta be 7.98%, hf be 0.08%, c be≤0.02%, balance of ni.Described percentage is quality
Percentage.
The implementation steps of the described third generation nickel-base high-temperature single crystal alloy solution treatment that the present embodiment proposes are:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.By cr for 3%, mo for 1%, al for 6%, co will be
12%, w be 6%, re be 4%, ta be 7.95%, hf be 1%, c be≤0.02%, the foundry alloy of balance of ni composition often passes through
The directional freeze method preparation of rule becomes the alloy bar of third generation nickel-base high-temperature single crystal alloy.
Step 2, time and its end time that simulation al element uphill diffusion occurs.Described simulation al element uphill diffusion
The time occurring and its end time are to simulate third generation nickel-base high-temperature single crystal alloy coupon in multistep admittedly by dictra software
The situation of diffusion under temperature conditionss in molten process.Specifically:
The process of simulation conventional solid solution processing method and parameter, by third generation nickel-base high-temperature single crystal alloy coupon from room temperature liter
1290 DEG C of insulation 1h of solid solution temperature to the first step；It is warming up to 1300 DEG C of insulation 2h of solid solution temperature of second step, protect
After temperature terminates, continue to be warmed up to 1310 DEG C of the solid solution temperature of the 3rd step and be incubated 3h；Continue to be warmed up to the solid solution of the 4th step
1320 DEG C for the treatment of temperature is simultaneously incubated 5h, is incubated 10h after being warmed up to 1330 DEG C of the solid solution temperature of the 5th step；Insulation is opened after terminating
Stove, third generation nickel-base high-temperature single crystal alloy coupon is air cooled to room temperature, described heating rate is 10 DEG C/min.
Obtain the process of all elements phase counterdiffusion in third generation nickel-base high-temperature single crystal alloy coupon, Yi Ji by simulation
In three generations's nickel-base high-temperature single crystal alloy coupon, the al constituent content of position occurs uphill diffusion to become with the process of solution treatment
Change.Record the time of described al constituent content uphill diffusion, at the end of obtaining al element uphill diffusion, third generation nickel-based monocrystal is high
The content of each element at al constituent content maximum position in temperature alloy coupon.
Al element in the present embodiment, after solution treatment to 784.1s, in third generation nickel-base high-temperature single crystal alloy coupon
Start uphill diffusion, and reach maximum when 5793.2s, subsequent uphill diffusion terminates.
Step 3, determines the initial melting temperature in the uphill diffusion time period for the alloy.Determine alloy in the uphill diffusion time period just
Melting temperatur, and contrast the original solid solution temperature of this initial melting temperature and this uphill diffusion time period, determined according to comparing result
Whether adjust the temperature of solution treatment.Specific practice is:
The first step. each element content in the maximum node of al constituent content described in step 2 at the end of reading uphill diffusion, root
Calculate the melting temperature in the above-mentioned moment for the above-mentioned node according to the criterion of minimization of Gibbs free energy, because this melting temperature is to go up a slope
Melting temperature minimum point in all nodes in diffusion time section, so this melting temperature is at the traditional solution described in step 2
The initial melting temperature of uphill diffusion time period in reason method.
Second step. the traditional solution described in the initial melting temperature of contrast above-mentioned uphill diffusion time period and step 2 is processed at this
, if solid solution temperature is less than initial melting temperature, there is not incipient melting it was demonstrated that this solution treatment side in the solid solution temperature of time period
Case need not adjust, and jumps directly to step 4；If solid solution temperature is higher than initial melting temperature, there is incipient melting, upward slope need to be reduced and expand
The solid solution temperature of scattered time period is to initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature after inspection reduces again is feasible.Solid solution temperature after reducing is replaced
Change the traditional solution treatment temperature in step 2, the process of repeat step 2, redefine the time of al element uphill diffusion generation
And its end time, the first step and the second step laid equal stress in duplicate step, until the initial melting temperature of uphill diffusion time period is less than
This time period solid solution temperature, then choose the solution treatment temperature that this temperature is the solution treatment uphill diffusion time period of the present invention
Degree.
In the present embodiment, after 5793.2s, the just fusing point of alloy reaches 1297.3 DEG C of the minimum of a value of this time period, but
The temperature of the traditional multistep solution treatment now listed in step 1 be 1300 DEG C, this temperature be more than initial melting temperature, if therefore according to
Traditional solution processing scheme alloy will occur incipient melting.So adjusting the solid solution temperature of above-mentioned slope diffusion time section to than first
The solid solution temperature that low 10 DEG C of melting temperatur, that is, 1287 DEG C, repeat step 2～3 finds that no incipient melting occurs.
Step 4, adjusts and implements whole solution treatment process according to the result described in step 3.At solid solution in the present embodiment
Reason method is: in heat-treatment furnace, from room temperature, third generation nickel-base high-temperature single crystal alloy coupon is increased to 1290 DEG C, is incubated 1h, fall
Temperature, to 1287 DEG C, is incubated 2h, then is warmed up to 1300 DEG C, is incubated 2h, then is warmed up to 1310 DEG C, is incubated 3h, is warmed up to 1320 DEG C, protects
Warm 5h, is warmed up to 1330 DEG C, is incubated 10h, last blow-on, third generation nickel-base high-temperature single crystal alloy coupon is air cooled to room temperature, institute
State heating rate and be 10 DEG C/min.Tissue after the completion of solution treatment is as shown in Figure 4.
Claims (3)
1. a kind of solid solution treatment method of third generation nickel-base high-temperature single crystal alloy is it is characterised in that comprise the concrete steps that:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon；
Step 2, time and its end time that simulation al element uphill diffusion occurs；Described simulation al element uphill diffusion occurs
Time and its end time be by dictra software simulate third generation nickel-base high-temperature single crystal alloy coupon at multistep solid solution
The situation of diffusion under temperature conditionss in reason；
Step 3, determines the temperature of solution treatment；When determining the temperature of solution treatment, it is first determined in the uphill diffusion time period
The initial melting temperature of alloy, and this initial melting temperature is compared with the temperature of al element uphill diffusion time period in solution treatment, according to
Comparing result decides whether to adjust the temperature of solution treatment；
Step 4, solution treatment；Solid solution temperature according to determining carries out solid solution to third generation nickel-base high-temperature single crystal alloy coupon
Process；
Described third generation nickel-base high-temperature single crystal alloy coupon is placed in heat-treatment furnace；In heat-treatment furnace, the third generation is Ni-based
Single crystal super alloy coupon rises to the solid solution temperature of the first step of routine and is incubated 1h from room temperature；Insulation is cooled to after terminating
In step 3 determine solid solubility temperature and be incubated 2h；The solid solubility temperature of described determination is than the solution treatment of the described conventional first step
Temperature is low 10 DEG C；Insulation is warmed up to the solid solution temperature of second step after terminating and is incubated 2h；Insulation terminates follow-up continuous be warmed up to
The solid solution temperature of the 3rd step is simultaneously incubated 3h；Insulation is warmed up to the solid solution temperature of the 4th step after terminating and is incubated 5h；Protect
Temperature terminates follow-up continuous to be warmed up to the solid solution temperature of the 5th step and be incubated 10h；Insulation terminates rear blow-on, by described third generation nickel
Based single-crystal high-temperature alloy coupon is air cooled to room temperature, obtains the third generation nickel-base high-temperature single crystal alloy coupon through solution treatment；Institute
State heating rate and be 10 DEG C/min.
2. the solid solution treatment method of third generation nickel-base high-temperature single crystal alloy as claimed in claim 1 is it is characterised in that pass through simulation
The process of conventional solid solution processing method and parameter obtain time and its end time that described simulation al element uphill diffusion occurs.
3. the solid solution treatment method of third generation nickel-base high-temperature single crystal alloy as claimed in claim 1 is it is characterised in that determine solid solution
The specific practice of the temperature processing is:
The first step. input third generation nickel-base high-temperature single crystal alloy coupon at the end of the al element uphill diffusion obtaining by step 2
The content of each element at middle al constituent content maximum position, obtains this al element according to the criterion of minimization of Gibbs free energy and contains
Melting temperature at amount maximum position；Using the melting temperature at described al constituent content maximum position as al element uphill diffusion
The initial melting temperature of time period alloy；
Second step. the solid solution temperature of the initial melting temperature obtaining and al element uphill diffusion time period in solution treatment is carried out
Relatively, if solid solution temperature is less than initial melting temperature, there is not incipient melting it was demonstrated that this solid solution temperature need not adjust, enter
Step 4 carries out solution treatment；If solid solution temperature is higher than described initial melting temperature, there is incipient melting, when need to reduce uphill diffusion
Between section solid solution temperature to 10 DEG C below described initial melting temperature；
3rd step. whether the solid solution temperature after inspection reduces again is feasible；Step is replaced with the solid solution temperature after reducing
The solid solution temperature of uphill diffusion time period in rapid 2, the process of repeat step 2, redefine al element uphill diffusion and occur
Time and its end time, the first step and the second step laid equal stress in duplicate step, until the uphill diffusion time period incipient melting temperature
Degree is less than this time period solid solution temperature, then choose the solution treatment temperature that this temperature is the solution treatment uphill diffusion time period
Degree.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510374344.3A CN104975248B (en) | 2015-06-30 | 2015-06-30 | Solution treatment method of third generation nickel-base single crystal high temperature alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510374344.3A CN104975248B (en) | 2015-06-30 | 2015-06-30 | Solution treatment method of third generation nickel-base single crystal high temperature alloy |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104975248A CN104975248A (en) | 2015-10-14 |
| CN104975248B true CN104975248B (en) | 2017-01-25 |
Family
ID=54272206
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510374344.3A Active CN104975248B (en) | 2015-06-30 | 2015-06-30 | Solution treatment method of third generation nickel-base single crystal high temperature alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104975248B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111074332B (en) * | 2019-12-31 | 2022-08-02 | 东莞材料基因高等理工研究院 | Heat treatment method for rapidly eliminating microsegregation in single crystal high-temperature alloy |
| CN111440967B (en) * | 2020-05-08 | 2021-12-31 | 中国科学院金属研究所 | High-thermal-stability high-strength Re-free nickel-based single crystal superalloy and preparation process thereof |
| CN111763897B (en) * | 2020-07-24 | 2021-10-15 | 中国航发北京航空材料研究院 | Method for determining homogenization/solution heat treatment schedule of nickel-based single crystal superalloy |
| CN112935056B (en) * | 2021-02-26 | 2023-01-06 | 华南理工大学 | Spinning solution treatment composite forming method for nickel-based high-temperature alloy cylinder with bottom |
| CN113957365A (en) * | 2021-10-18 | 2022-01-21 | 中国华能集团有限公司 | Heat treatment process for casting precipitation strengthening nickel-based high-temperature alloy |
| CN114250519B (en) * | 2022-01-10 | 2023-05-23 | 西北工业大学 | Solution heat treatment method for reducing content of solution holes of high-rhenium nickel-based single crystal superalloy |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4582548A (en) * | 1980-11-24 | 1986-04-15 | Cannon-Muskegon Corporation | Single crystal (single grain) alloy |
| EP2006402A2 (en) * | 2006-03-31 | 2008-12-24 | National Institute for Materials Science | Ni-BASE SUPERALLOY AND METHOD FOR PRODUCING SAME |
| CN103352192A (en) * | 2013-07-11 | 2013-10-16 | 北京航空航天大学 | Method for designing single-crystal superalloy solid solution system |
| CN103866392A (en) * | 2014-01-24 | 2014-06-18 | 南京理工大学 | Low rhenium and nickel-based single crystal high-temperature alloy and preparation method thereof |
| CN104263998A (en) * | 2014-09-18 | 2015-01-07 | 中国华能集团公司 | Heat treatment process for nickel-iron-chromium-boron high-temperature alloy |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0941058A (en) * | 1995-07-31 | 1997-02-10 | Natl Res Inst For Metals | Nickel base single crystal alloy |
-
2015
- 2015-06-30 CN CN201510374344.3A patent/CN104975248B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4582548A (en) * | 1980-11-24 | 1986-04-15 | Cannon-Muskegon Corporation | Single crystal (single grain) alloy |
| EP2006402A2 (en) * | 2006-03-31 | 2008-12-24 | National Institute for Materials Science | Ni-BASE SUPERALLOY AND METHOD FOR PRODUCING SAME |
| CN103352192A (en) * | 2013-07-11 | 2013-10-16 | 北京航空航天大学 | Method for designing single-crystal superalloy solid solution system |
| CN103866392A (en) * | 2014-01-24 | 2014-06-18 | 南京理工大学 | Low rhenium and nickel-based single crystal high-temperature alloy and preparation method thereof |
| CN104263998A (en) * | 2014-09-18 | 2015-01-07 | 中国华能集团公司 | Heat treatment process for nickel-iron-chromium-boron high-temperature alloy |
Non-Patent Citations (4)
| Title |
|---|
| Designing homogenization-solution heat treatments for single crystal superalloys;S.R.Hegde等;《Materials Science and Engineering A》;20100820;第527卷(第21-22期);全文 * |
| Homogenizing a nickel-based superalloys:thermodynamics and kinetic simulation and experimental results;Paul D.Jablonski等;《Metallurgical amd Materials Transactions B》;20090430;第40卷(第2期);全文 * |
| Solution heat treatment optimization of fourth-generation single-crystal nickel base superallloys;Hon Tong Pang等;《Metellurgical and Materials Transactions A》;20120411;第43卷(第9期);全文 * |
| 固溶处理参数对一种单晶高温合金微观偏析的影响;张胜霞等;《铸造》;20120131;第61卷(第1期);全文 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104975248A (en) | 2015-10-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104975248B (en) | Solution treatment method of third generation nickel-base single crystal high temperature alloy | |
| CN107745093B (en) | Fine casting module and casting method for preparing nickel-based single crystal guide vane with precisely controllable crystal orientation by utilizing fine casting module | |
| CN104928604B (en) | Nickel-base high-temperature single crystal alloy solid solution treatment method | |
| CN103276333B (en) | GH4738 nickel base superalloy casting ingot homogenization treatment method | |
| JP5652730B1 (en) | Ni-base superalloy and manufacturing method thereof | |
| CN102732750B (en) | Nickel base single crystal superalloy with low cost and low density | |
| CN106702295B (en) | A method of improving GH4698 disk forging tissues and the smooth fatigue behaviour of high temperature | |
| CN104404418B (en) | A kind of heat treatment method of nickel base superalloy | |
| CN106636759B (en) | A kind of high thermal stability high-strength nickel based single-crystal high-temperature alloy that platinum family element is strengthened | |
| CN107250416A (en) | The manufacture method of Ni base superalloy | |
| CN105349842B (en) | A kind of high temperature heat-resistant corrodes high-temperature alloy casting | |
| CN104858399B (en) | A kind of functionally gradient single crystal blade material be combined into by two kinds of alloys and preparation method thereof with realize equipment | |
| CN113308655B (en) | Heat treatment method for regulating microstructure of nickel-based powder superalloy | |
| CN103382536A (en) | Fourth-generation single-crystal high temperature alloy with high strength and stable structure and preparation method thereof | |
| CN105506387A (en) | High-specific-creep-strength nickel base single crystal high-temperature alloy and preparation method and application thereof | |
| CN110373620A (en) | A method of improving the Ni-based precipitation strength type high temperature alloy hot-working character of high γ ' phase volume fraction | |
| CN108396269B (en) | A kind of enhancing polycrystalline Ni3The heat treatment method of Al based high-temperature alloy deformation stability | |
| CN107034388A (en) | The preparation technology of nickel-base high-temperature single crystal alloy turbo blade | |
| CN102418147A (en) | High strength and completely antioxidative third generation monocrystalline high temperature alloy and preparation method thereof | |
| CN110344049B (en) | Repair method and application of single crystal/directional solidification nickel-based superalloy | |
| CN113584413B (en) | Heat treatment method for reducing microstructure level difference of nickel-based superalloy forged bar difficult to deform | |
| Fang et al. | Study on the thermal deformation behavior and microstructure of FGH96 heat extrusion alloy during two-pass hot deformation | |
| JP2014070230A (en) | METHOD FOR PRODUCING Ni-BASED SUPERALLOY | |
| JP6428116B2 (en) | Die for forging and manufacturing method thereof | |
| CN103132148B (en) | A kind of low density, low cost, strength nickel-base single crystal super alloy |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |