CN104975248A - Solution treatment method of third generation nickel-base single crystal high temperature alloy - Google Patents
Solution treatment method of third generation nickel-base single crystal high temperature alloy Download PDFInfo
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Abstract
The invention discloses a solution treatment method of third generation nickel-base single crystal high temperature alloy. According to the solution treatment method, a conventional solution treatment of third generation nickel-base single crystal high temperature alloy is improved so as to avoid incipient melting of alloy in solution treatment processes, improve product mechanical properties, and increase finished product yield. According to the solution treatment method, in solution treatment processes, solution temperature after uphill diffusion is reduced, and the solution temperature is maintained to be lower than an incipient melting temperature which is reduced because of uphill diffusion, so that incipient melting is avoided. The solution treatment method is capable of avoiding incipient melting caused by uphill diffusion, eliminating holes and residual eutectic caused by incipient melting, and improving alloy mechanical properties; and in addition, finished product yield is increased obviously because of avoiding of incipient melting.
Description
Technical field
The present invention relates to third generation nickel-base high-temperature single crystal alloy Field of Heat-treatment, specifically change the solid solution treatment process of alloy, avoid the generation of incipient melting, improve yield rate and the product performance of heat treated article.
Background technology
The massfraction that third generation nickel-base high-temperature single crystal alloy refers to wherein Re element for 4% ~ 6%, and creep rupture life 1100 DEG C, under load 150MPa more than 100h.In recent years, China's space flight and aviation technology achieved the progress of advancing by leaps and bounds, and engine is the core component of space flight and aviation aircraft, and the use temperature therefore improving engine material is imperative to increase its thrust-weight ratio.Nickel-base high-temperature single crystal alloy has good mechanical property under close to the use temperature of fusing point, is thus widely used in engine.China has started research and develop third generation nickel base single crystal high-temperature alloy material energetically and achieve impressive progress at present.Single crystal super alloy is done at dendrite after directional freeze exists segregation with interdendritic, also there is eutectic in interdendritic, and main strengthening phase γ ' size and distribution also very uneven, so before being taken into use all will through the thermal treatment that is made up of solution treatment and ageing treatment to improve the microstructure and property of alloy.And along with the development of alloy, in alloy, refractory element content improves constantly, and significantly improves the mutual diffusion coefficient of each element in alloy, adds the as cast condition segregation of heavy alloy, increases the difficulty of solution treatment subsequently.In addition because as cast condition segregation becomes large, more easily there is incipient melting in interdendritic, reduces heat treatment window.And the spread coefficient of refractory element own exceeds the several order of magnitude of other elements, the time that Homogenization Process needs and temperature increase greatly.
The incipient melting produced in solution treatment process not only can form the stressed area that hole reduces material, and can produce a lot of residual eutectic structure, greatly falls low-alloyed mechanical behavior under high temperature.Traditional technology at present for third generation nickel-base high-temperature single crystal alloy progressively improves solid solubility temperature and soaking time, thus progressively carry heavy alloyed initial melting temperature, and under the prerequisite of the generation of incipient melting, alloy carries out higher temperature solid solution.Even if but solution treatment is divided into the multistep solid solution that solid solubility temperature improves constantly, still may there is incipient melting.
Through finding the literature search of prior art: document " Karunaratne M S A; Cox D C waits the Modelling of the microsegregation in CMSX-4superalloy and itshomogenisation during heat treatment that people delivers at Superalloys 2000 " have studied the problem such as incipient melting and uphill diffusion but and not mentioned relation between the two.
Document " Hegde, S.R., the people such as R.M.Kearsey are at Materials Science and Engineering:A, the 2010.527 Designing homogenization – solution heat treatments for single crystalsuperalloys delivered " find that uphill diffusion can cause the incipient melting produced in solution treatment process, but the not concrete change that just fusing point is discussed, but attempt to avoid uphill diffusion with higher temperature solution treated, this way there is no theoretical foundation, and do not carry out homogenizing at low temperature and probably cause the direct incipient melting in low melting point region in the direct solid solution of higher temperature.
A kind of third generation nickel-base high-temperature single crystal alloy solid solution treatment process is all proposed in Chinese patent CN1966750A, US Patent No. 8696979B2, but and the incipient melting problem that causes of not mentioned uphill diffusion.
Chinese patent CN103352192A mentions solid solution treatment process design problem, but the incipient melting problem that itself and not mentioned uphill diffusion cause.
Summary of the invention
There is incipient melting for overcoming in the solution treatment process that exists in prior art, causing the mechanical property of product and the deficiency of decrease in yield, the present invention proposes a kind of solid solution treatment method of third generation nickel-base high-temperature single crystal alloy.
Concrete steps of the present invention are:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.
Step 2, the time that simulation Al element uphill diffusion occurs and end time thereof.The time that described simulation Al element uphill diffusion occurs and end time thereof are the situations by spreading under the temperature condition of Dictra software simulation third generation nickel-base high-temperature single crystal alloy coupon in multistep solution treatment.
Step 3, determines the temperature of solution treatment.When determining the temperature of solution treatment, first determine the initial melting temperature of alloy in the uphill diffusion time period, and this initial melting temperature is compared with the temperature of Al element uphill diffusion time period in solution treatment, determine according to comparing result the temperature whether adjusting solution treatment.Detailed process is:
The first step. the content of each element at Al constituent content maximum position place in third generation nickel-base high-temperature single crystal alloy coupon at the end of inputting the Al element uphill diffusion obtained by step 2, obtains the melting temperature at this Al constituent content maximum position place according to the criterion of minimization of Gibbs free energy.Using the melting temperature at described Al constituent content maximum position place as the initial melting temperature of Al element uphill diffusion time period alloy.
Second step. the solid solution temperature of Al element uphill diffusion time period in the initial melting temperature obtained and solution treatment is compared, if solid solution temperature is lower than initial melting temperature, then there is not incipient melting, prove that this solid solution temperature is without the need to adjustment, enters step 4 and carries out solution treatment.If higher than described initial melting temperature, then there is incipient melting in solid solution temperature, below the solid solution temperature that need reduce the uphill diffusion time period to described initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature again after inspection reduction is feasible.With the solid solution temperature of uphill diffusion time period in the solid solution temperature replacement step 2 after reduction, the process of repeating step 2, redefine time and the end time thereof of the generation of Al element uphill diffusion, the first step in duplicate step of laying equal stress on and second step, until the initial melting temperature of uphill diffusion time period is lower than this time period solid solution temperature, then choose the solid solution temperature that this temperature is the solution treatment uphill diffusion time period.
Step 4, solution treatment.According to the solid solution temperature determined, solution treatment is carried out to third generation nickel-base high-temperature single crystal alloy coupon.
Described third generation nickel-base high-temperature single crystal alloy coupon is placed in heat treatment furnace.In heat treatment furnace, third generation nickel-base high-temperature single crystal alloy coupon is risen to the solid solution temperature of the conventional the first step from room temperature and is incubated 1h; Be cooled to the solid solubility temperature determined in step 3 after insulation terminates and be incubated 2h; The described solid solubility temperature determined is lower than the solid solution temperature of the first step of described routine 10 DEG C; Be warmed up to the solid solution temperature of second step after insulation terminates and be incubated 2h; Insulation terminates follow-uply continuous be warmed up to the solid solution temperature of the 3rd step and be incubated 3h; Be warmed up to the solid solution temperature of the 4th step after insulation terminates and be incubated 5h; Insulation terminates follow-uply continuous be warmed up to the solid solution temperature of the 5th step and be incubated 10h; Insulation terminates rear blow-on, by described third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, obtains the third generation nickel-base high-temperature single crystal alloy coupon through solution treatment.Described temperature rise rate is 10 DEG C/min.
The object of the invention is to improve a kind of third generation nickel-base high-temperature single crystal alloy solid solution treatment process, avoid alloy, in solution treatment process, incipient melting occurs, thus improve mechanical property and the yield rate of product.
The present invention is by the research to incipient melting mechanism of production, to find that in the process of solution treatment not all elements is all from the large regional diffusion of constituent content to the little region of constituent content, but as Fig. 1 be shown with element from the low region back diffusion of content to the high region of content, in the region making constituent content high, this constituent content rises further, and this phenomenon is called uphill diffusion.Although this phenomenon is found in superalloy, but it is often left in the basket on the impact that solution treatment produces, low melting point element particularly as shown in Figure 1 the uphill diffusion of Al element can reduce the fusing point of interdendritic fusing point very low area originally, thus reduce the first fusing point of whole alloy, just melting temperature may lower than solid solution temperature for this, if and now solid solution temperature still rises or remains unchanged, then incipient melting can be there is.
The present invention adopts and is a kind ofly different from the technique that in traditional multistep solid solution treatment process, solid solution temperature progressively rises, but consider that the reduction situation of rear initial melting temperature occurs uphill diffusion in solution treatment process, initial melting temperature according to reducing reduces solid solution temperature, is not that solution treatment scheme traditionally improves solid solution temperature always.The method of this reduction solid solution temperature makes solid solution temperature lower than the initial melting temperature reduced due to uphill diffusion, avoids the generation of incipient melting.The incipient melting adopting method of the present invention can avoid being caused by uphill diffusion occurs, thus eliminates the hole and remaining eutectic that are produced by incipient melting, and then puies forward heavy alloyed mechanical property, avoiding in addition due to incipient melting, and the yield rate of product will significantly improve.
Organization chart 2 after organization chart 5 after the process of contrast traditional solution, Fig. 6, Fig. 7 and use solution treatment of the present invention, Fig. 3, Fig. 4 are found out, adopt a large amount of holes finding in Fig. 5, Fig. 6, Fig. 7 after traditional solution process significantly to be produced by incipient melting, and adopt Fig. 2, Fig. 3, Fig. 4 of solution treatment of the present invention all incipient melting not to occur.Illustrate that solid solution treatment method of the present invention effectively can avoid the generation of incipient melting.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of uphill diffusion in the solution treatment process obtained by analog calculation, and wherein A segment table shows uphill diffusion section.
Fig. 2 is organization chart after embodiment 1 solution treatment.
Fig. 3 is organization chart after embodiment 2 solution treatment.
Fig. 4 is organization chart after embodiment 3 solution treatment.
Fig. 5 is the organization chart of alloy after traditional solution process in embodiment 1, and wherein A represents the hole that incipient melting produces.
Fig. 6 is the organization chart of alloy after traditional solution process in embodiment 2, and wherein A represents the hole that incipient melting produces.
Fig. 7 is the organization chart of alloy after traditional solution process in embodiment 3, and wherein A represents the hole that incipient melting produces.
Fig. 8 is schema of the present invention.
Embodiment
Embodiment 1
In the present embodiment alloy, Cr is 3.5%, Mo be 1.5%, Al be 6%, Co be 9%, W be 6%, Re be 4%, Ta be 8%, Hf be 1%, C is≤0.02%, and surplus is Ni.Described per-cent is mass percent.
The implementation step of the described third generation nickel-base high-temperature single crystal alloy solution treatment that the present embodiment proposes is:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.By by the Cr of 3.5%, Mo, the Al of 6%, Co, the W of 6%, Re, the Ta of 8%, the Hf ,≤C of 0.02% of 1% of 4% of 9% of 1.5%, and surplus is that the mother alloy of Ni composition becomes third generation nickel-base high-temperature single crystal alloy coupon by the preparation of conventional directional solidification process.
Step 2, the time that simulation Al element uphill diffusion occurs and end time thereof.The time that described simulation Al element uphill diffusion occurs and end time thereof are the situations by spreading under the temperature condition of Dictra software simulation third generation nickel-base high-temperature single crystal alloy coupon in multistep solution treatment.Specifically:
The process of simulation conventional solid solution treatment process and parameter, rise to the solid solution temperature 1290 DEG C insulation 1h of the first step from room temperature by third generation nickel-base high-temperature single crystal alloy coupon; Be warming up to the solid solution temperature 1300 DEG C insulation 2h of second step, after insulation terminates, continue to be warmed up to the solid solution temperature 1310 DEG C of the 3rd step and be incubated 3h; Continue to be warmed up to the solid solution temperature 1320 DEG C of the 4th step and be incubated 5h, after being warmed up to the solid solution temperature 1330 DEG C of the 5th step, being incubated 10h; Insulation terminates rear blow-on, and by third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, described temperature rise rate is 10 DEG C/min.
Obtain the process of all elements phase mutual diffusion in third generation nickel-base high-temperature single crystal alloy coupon by simulation, and in third generation nickel-base high-temperature single crystal alloy coupon, the Al constituent content of position changes with the process generation uphill diffusion of solution treatment.Record the time of described Al constituent content uphill diffusion, the content of each element at Al constituent content maximum position place in third generation nickel-base high-temperature single crystal alloy coupon at the end of obtaining Al element uphill diffusion.
In the present embodiment, after solution treatment to 717.2s, the Al element in third generation nickel-base high-temperature single crystal alloy coupon starts uphill diffusion, and reaches maximum value when 5464.8s, and uphill diffusion terminates subsequently.
Step 3, determines the temperature of solution treatment.When determining the temperature of solution treatment, first determine the initial melting temperature of alloy in the uphill diffusion time period, and this initial melting temperature is compared with the temperature of Al element uphill diffusion time period in solution treatment, determine according to comparing result the temperature whether adjusting solution treatment.Specific practice is:
The first step. the content of each element at Al constituent content maximum position place in third generation nickel-base high-temperature single crystal alloy coupon at the end of inputting the Al element uphill diffusion obtained by step 2, obtains the melting temperature at this Al constituent content maximum position place according to the criterion of minimization of Gibbs free energy.Using the melting temperature at described Al constituent content maximum position place as the initial melting temperature of Al element uphill diffusion time period.
Second step. the solid solution temperature of Al element uphill diffusion time period in the initial melting temperature obtained and solution treatment is compared, if solid solution temperature is lower than initial melting temperature, then there is not incipient melting, prove that this solid solution temperature is without the need to adjustment, enters step 4 and carries out solution treatment.If higher than described initial melting temperature, then there is incipient melting in solid solution temperature, below the solid solution temperature that need reduce the uphill diffusion time period to described initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature again after inspection reduction is feasible.With the solid solution temperature of uphill diffusion time period in the solid solution temperature replacement step 2 after reduction, the process of repeating step 2, redefine time and the end time thereof of the generation of Al element uphill diffusion, the first step in duplicate step of laying equal stress on and second step, until the initial melting temperature of uphill diffusion time period is lower than this time period solid solution temperature, then choose the solid solution temperature that this temperature is the solution treatment uphill diffusion time period.
In the present embodiment, after 5464.8s, the first fusing point of alloy reaches the minimum value 1292.6 DEG C of this time period, but the temperature of now solution treatment in step 1 is 1300 DEG C, and this temperature is greater than initial melting temperature, if therefore will there is incipient melting in traditionally solution treatment scheme alloy.So solid solution temperature was adjusted to below described initial melting temperature 10 DEG C before Al element enters the uphill diffusion time period, namely before Al element enters the uphill diffusion time period, solid solution temperature is adjusted to 1292.6 DEG C-10 DEG C; Round is 1283 DEG C.
Solid solution process when simulation is checked again is: third generation nickel-base high-temperature single crystal alloy coupon is risen to 1290 DEG C of insulation 1h from room temperature; Be cooled to 1283 DEG C of insulation 2h, after insulation terminates, be warmed up to 1300 DEG C and be incubated 2h; Continue be warmed up to 1310 DEG C and be incubated 3h, insulation terminates follow-up continuing be warming up to 1320 DEG C and be incubated 5h; 10h is incubated after continuing to be warmed up to 1330 DEG C; Insulation terminates rear blow-on, and by third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, described temperature rise rate is 10 DEG C/min.
Step 4, solution treatment.According to the solid solution temperature determined, solution treatment is carried out to third generation nickel-base high-temperature single crystal alloy coupon.
Described third generation nickel-base high-temperature single crystal alloy coupon is placed in heat treatment furnace.In heat treatment furnace, third generation nickel-base high-temperature single crystal alloy coupon be elevated to 1290 DEG C from room temperature and be incubated 1h; 2h is incubated after cooling to 1283 DEG C; 1300 DEG C of insulation 2h are warmed up to after insulation terminates; Continue to be warmed up to 1310 DEG C of insulation 3h; Rise insulation to terminate rear temperature to 1320 DEG C and be incubated 5h; Continue to be warmed up to 1330 DEG C of insulation 10h; Insulation terminates rear blow-on, by described third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, obtains the third generation nickel-base high-temperature single crystal alloy coupon through solution treatment.Described temperature rise rate is 10 DEG C/min.Organizing as shown in Figure 2 after solution treatment completes.
Embodiment 2
The present embodiment is a kind of third generation nickel-base high-temperature single crystal alloy solid solution treatment method, described alloy is made up of Cr, Mo, Al, Co, W, Re, Ta, Hf, C and Ni, wherein: Cr is 3%, Mo is 1%, Al is 6%, Co is 12%, W be 6%, Re is 4%, Ta is 7.95%, Hf is 1%, C is≤0.02%, and surplus is Ni.Described per-cent is mass percent.
The implementation step of the described third generation nickel-base high-temperature single crystal alloy solution treatment that the present embodiment proposes is:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.Be 3.2%, Mo be 1.2%, Al will be 6%, Co by Cr be 10%, W is 6%, Re be 4%, Ta is 7.98%, Hf is 0.08%, C is≤0.02%, and surplus is that the alloy bar becoming third generation nickel-base high-temperature single crystal alloy prepared by the mother alloy of Ni composition by conventional directional solidification process.
Step 2, determines the time that Al element uphill diffusion occurs and end time thereof.The time that the described Al of determination element uphill diffusion occurs and end time thereof determine the Al element time that uphill diffusion occurs in traditional solution treatment process and end time thereof.Specific practice is the situation with spreading under the temperature condition of Dictra software simulation third generation nickel-base high-temperature single crystal alloy coupon in traditional multistep solution treatment.Specifically:
The process of simulation conventional solid solution treatment process and parameter, rise to the solid solution temperature 1290 DEG C insulation 1h of the first step from room temperature by third generation nickel-base high-temperature single crystal alloy coupon; Be warming up to the solid solution temperature 1300 DEG C insulation 2h of second step, after insulation terminates, continue to be warmed up to the solid solution temperature 1310 DEG C of the 3rd step and be incubated 3h; Continue to be warmed up to the solid solution temperature 1320 DEG C of the 4th step and be incubated 5h, after being warmed up to the solid solution temperature 1330 DEG C of the 5th step, being incubated 10h; Insulation terminates rear blow-on, and by third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, described temperature rise rate is 10 DEG C/min.
Obtain the process of all elements phase mutual diffusion in third generation nickel-base high-temperature single crystal alloy coupon by simulation, and in third generation nickel-base high-temperature single crystal alloy coupon, the Al constituent content of position changes with the process generation uphill diffusion of solution treatment.Record the time of described Al constituent content uphill diffusion, the content of each element at Al constituent content maximum position place in third generation nickel-base high-temperature single crystal alloy coupon at the end of obtaining Al element uphill diffusion.
In the present embodiment, after solution treatment to 763.9s, the Al element in third generation nickel-base high-temperature single crystal alloy coupon starts uphill diffusion, and reaches maximum value when 5623.8s, and uphill diffusion terminates subsequently.
Step 3, determines the initial melting temperature of alloy in the uphill diffusion time period.Determine the initial melting temperature of alloy in the uphill diffusion time period, and contrast the original solid solution temperature of this initial melting temperature and this uphill diffusion time period, determine according to comparing result the temperature whether adjusting solution treatment.Specific practice is:
The first step. each constituent content in the node that at the end of reading uphill diffusion, described in step 2, Al constituent content is maximum, the melting temperature of above-mentioned node in the above-mentioned moment is calculated according to the criterion of minimization of Gibbs free energy, because this melting temperature is melting temperature lower-most point in uphill diffusion time period upper all nodes, so the initial melting temperature of uphill diffusion time period in this melting temperature is described in step 2 traditional solution treatment process.
Second step. contrast the initial melting temperature of above-mentioned uphill diffusion time period and the traditional solution process described in step 2 solid solution temperature in this time period, if solid solution temperature is lower than initial melting temperature, then there is not incipient melting, prove that this solution treatment scheme is without the need to adjustment, directly jumps to step 4; If solid solution temperature is higher than initial melting temperature, then there is incipient melting, the solid solution temperature that need reduce the uphill diffusion time period to initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature again after inspection reduction is feasible.By the traditional solution treatment temp in the solid solution temperature replacement step 2 after reduction, the process of repeating step 2, redefine time and the end time thereof of the generation of Al element uphill diffusion, the first step in duplicate step of laying equal stress on and second step, until the initial melting temperature of uphill diffusion time period is lower than this time period solid solution temperature, then choose the solid solution temperature that this temperature is the solution treatment uphill diffusion time period of the present invention.
In the present embodiment, after 5623.8s, the first fusing point of alloy reaches the minimum value 1295.7 DEG C of this time period, but the temperature of the traditional multistep solution treatment now listed in step 1 is 1300 DEG C, and this temperature is greater than initial melting temperature, if therefore will there is incipient melting in traditionally solution treatment scheme alloy.So the solid solution temperature of solid solution temperature to lower than initial melting temperature 10 DEG C in adjustment above-mentioned slope section diffusion time, namely 1286 DEG C, repeating step 2 ~ 3 finds to occur without incipient melting.
Step 4, adjusts according to the result described in step 3 and implements whole solution treatment process.In the present embodiment, solid solution treatment method is: in heat treatment furnace, third generation nickel-base high-temperature single crystal alloy coupon is elevated to 1290 DEG C from room temperature, and insulation 1h, cools to 1286 DEG C, insulation 2h, then be warmed up to 1300 DEG C, insulation 2h, be warmed up to 1310 DEG C again, insulation 3h, is warmed up to 1320 DEG C, insulation 5h, be warmed up to 1330 DEG C, insulation 10h, last blow-on, by third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, described temperature rise rate is 10 DEG C/min.Organizing as shown in Figure 3 after solution treatment completes.
Embodiment 3
The present embodiment is a kind of third generation nickel-base high-temperature single crystal alloy solid solution treatment method, described alloy is made up of Cr, Mo, Al, Co, W, Re, Ta, Hf, C and Ni, wherein: alloying constituent is Cr be 3.2%, Mo is 1.2%, Al is 6%, Co is 10%, W be 6%, Re is 4%, Ta is 7.98%, Hf is 0.08%, C is≤0.02%, and surplus is Ni.Described per-cent is mass percent.
The implementation step of the described third generation nickel-base high-temperature single crystal alloy solution treatment that the present embodiment proposes is:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon.Be 3%, Mo be 1%, Al will be 6%, Co by Cr be 12%, W is 6%, Re be 4%, Ta is 7.95%, Hf is 1%, C is≤0.02%, and surplus is that the alloy bar becoming third generation nickel-base high-temperature single crystal alloy prepared by the mother alloy of Ni composition by conventional directional solidification process.
Step 2, the time that simulation Al element uphill diffusion occurs and end time thereof.The time that described simulation Al element uphill diffusion occurs and end time thereof are the situations by spreading under the temperature condition of Dictra software simulation third generation nickel-base high-temperature single crystal alloy coupon in multistep solution treatment.Specifically:
The process of simulation conventional solid solution treatment process and parameter, rise to the solid solution temperature 1290 DEG C insulation 1h of the first step from room temperature by third generation nickel-base high-temperature single crystal alloy coupon; Be warming up to the solid solution temperature 1300 DEG C insulation 2h of second step, after insulation terminates, continue to be warmed up to the solid solution temperature 1310 DEG C of the 3rd step and be incubated 3h; Continue to be warmed up to the solid solution temperature 1320 DEG C of the 4th step and be incubated 5h, after being warmed up to the solid solution temperature 1330 DEG C of the 5th step, being incubated 10h; Insulation terminates rear blow-on, and by third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, described temperature rise rate is 10 DEG C/min.
Obtain the process of all elements phase mutual diffusion in third generation nickel-base high-temperature single crystal alloy coupon by simulation, and in third generation nickel-base high-temperature single crystal alloy coupon, the Al constituent content of position changes with the process generation uphill diffusion of solution treatment.Record the time of described Al constituent content uphill diffusion, the content of each element at Al constituent content maximum position place in third generation nickel-base high-temperature single crystal alloy coupon at the end of obtaining Al element uphill diffusion.
In the present embodiment, after solution treatment to 784.1s, the Al element in third generation nickel-base high-temperature single crystal alloy coupon starts uphill diffusion, and reaches maximum value when 5793.2s, and uphill diffusion terminates subsequently.
Step 3, determines the initial melting temperature of alloy in the uphill diffusion time period.Determine the initial melting temperature of alloy in the uphill diffusion time period, and contrast the original solid solution temperature of this initial melting temperature and this uphill diffusion time period, determine according to comparing result the temperature whether adjusting solution treatment.Specific practice is:
The first step. each constituent content in the node that at the end of reading uphill diffusion, described in step 2, Al constituent content is maximum, the melting temperature of above-mentioned node in the above-mentioned moment is calculated according to the criterion of minimization of Gibbs free energy, because this melting temperature is melting temperature lower-most point in uphill diffusion time period upper all nodes, so the initial melting temperature of uphill diffusion time period in this melting temperature is described in step 2 traditional solution treatment process.
Second step. contrast the initial melting temperature of above-mentioned uphill diffusion time period and the traditional solution process described in step 2 solid solution temperature in this time period, if solid solution temperature is lower than initial melting temperature, then there is not incipient melting, prove that this solution treatment scheme is without the need to adjustment, directly jumps to step 4; If solid solution temperature is higher than initial melting temperature, then there is incipient melting, the solid solution temperature that need reduce the uphill diffusion time period to initial melting temperature 10 DEG C.
3rd step. whether the solid solution temperature again after inspection reduction is feasible.By the traditional solution treatment temp in the solid solution temperature replacement step 2 after reduction, the process of repeating step 2, redefine time and the end time thereof of the generation of Al element uphill diffusion, the first step in duplicate step of laying equal stress on and second step, until the initial melting temperature of uphill diffusion time period is lower than this time period solid solution temperature, then choose the solid solution temperature that this temperature is the solution treatment uphill diffusion time period of the present invention.
In the present embodiment, after 5793.2s, the first fusing point of alloy reaches the minimum value 1297.3 DEG C of this time period, but the temperature of the traditional multistep solution treatment now listed in step 1 is 1300 DEG C, and this temperature is greater than initial melting temperature, if therefore will there is incipient melting in traditionally solution treatment scheme alloy.So the solid solution temperature of solid solution temperature to lower than initial melting temperature 10 DEG C in adjustment above-mentioned slope section diffusion time, namely 1287 DEG C, repeating step 2 ~ 3 finds to occur without incipient melting.
Step 4, adjusts according to the result described in step 3 and implements whole solution treatment process.In the present embodiment, solid solution treatment method is: in heat treatment furnace, third generation nickel-base high-temperature single crystal alloy coupon is elevated to 1290 DEG C from room temperature, and insulation 1h, cools to 1287 DEG C, insulation 2h, then be warmed up to 1300 DEG C, insulation 2h, be warmed up to 1310 DEG C again, insulation 3h, is warmed up to 1320 DEG C, insulation 5h, be warmed up to 1330 DEG C, insulation 10h, last blow-on, by third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, described temperature rise rate is 10 DEG C/min.Organizing as shown in Figure 4 after solution treatment completes.
Claims (3)
1. a solid solution treatment method for third generation nickel-base high-temperature single crystal alloy, is characterized in that, concrete steps are:
Step 1, prepares third generation nickel-base high-temperature single crystal alloy coupon;
Step 2, the time that simulation Al element uphill diffusion occurs and end time thereof; The time that described simulation Al element uphill diffusion occurs and end time thereof are the situations by spreading under the temperature condition of Dictra software simulation third generation nickel-base high-temperature single crystal alloy coupon in multistep solution treatment;
Step 3, determines the temperature of solution treatment; When determining the temperature of solution treatment, first determine the initial melting temperature of alloy in the uphill diffusion time period, and this initial melting temperature is compared with the temperature of Al element uphill diffusion time period in solution treatment, determine according to comparing result the temperature whether adjusting solution treatment;
Step 4, solution treatment; According to the solid solution temperature determined, solution treatment is carried out to third generation nickel-base high-temperature single crystal alloy coupon;
Described third generation nickel-base high-temperature single crystal alloy coupon is placed in heat treatment furnace; In heat treatment furnace, third generation nickel-base high-temperature single crystal alloy coupon is risen to the solid solution temperature of the conventional the first step from room temperature and is incubated 1h; Be cooled to the solid solubility temperature determined in step 3 after insulation terminates and be incubated 2h; The described solid solubility temperature determined is lower than the solid solution temperature of the first step of described routine 10 DEG C; Be warmed up to the solid solution temperature of second step after insulation terminates and be incubated 2h; Insulation terminates follow-uply continuous be warmed up to the solid solution temperature of the 3rd step and be incubated 3h; Be warmed up to the solid solution temperature of the 4th step after insulation terminates and be incubated 5h; Insulation terminates follow-uply continuous be warmed up to the solid solution temperature of the 5th step and be incubated 10h; Insulation terminates rear blow-on, by described third generation nickel-base high-temperature single crystal alloy coupon air cooling to room temperature, obtains the third generation nickel-base high-temperature single crystal alloy coupon through solution treatment; Described temperature rise rate is 10 DEG C/min.
2. the solid solution treatment method of third generation nickel-base high-temperature single crystal alloy as claimed in claim 1, is characterized in that, obtains time that described simulation Al element uphill diffusion occurs and end time thereof by the process of simulation conventional solid solution treatment process and parameter.
3. the solid solution treatment method of third generation nickel-base high-temperature single crystal alloy as claimed in claim 1, is characterized in that, determine that the specific practice of the temperature of solution treatment is:
The first step. the content of each element at Al constituent content maximum position place in third generation nickel-base high-temperature single crystal alloy coupon at the end of inputting the Al element uphill diffusion obtained by step 2, obtains the melting temperature at this Al constituent content maximum position place according to the criterion of minimization of Gibbs free energy; Using the melting temperature at described Al constituent content maximum position place as the initial melting temperature of Al element uphill diffusion time period alloy;
Second step. the solid solution temperature of Al element uphill diffusion time period in the initial melting temperature obtained and solution treatment is compared, if solid solution temperature is lower than initial melting temperature, then there is not incipient melting, prove that this solid solution temperature is without the need to adjustment, enters step 4 and carries out solution treatment; If higher than described initial melting temperature, then there is incipient melting in solid solution temperature, below the solid solution temperature that need reduce the uphill diffusion time period to described initial melting temperature 10 DEG C;
3rd step. whether the solid solution temperature again after inspection reduction is feasible; With the solid solution temperature of uphill diffusion time period in the solid solution temperature replacement step 2 after reduction, the process of repeating step 2, redefine time and the end time thereof of the generation of Al element uphill diffusion, the first step in duplicate step of laying equal stress on and second step, until the initial melting temperature of uphill diffusion time period is lower than this time period solid solution temperature, then choose the solid solution temperature that this temperature is the solution treatment uphill diffusion time period.
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111074332A (en) * | 2019-12-31 | 2020-04-28 | 东莞材料基因高等理工研究院 | Heat treatment method for rapidly eliminating microsegregation in single crystal high-temperature alloy |
| CN111440967A (en) * | 2020-05-08 | 2020-07-24 | 中国科学院金属研究所 | High-thermal-stability high-strength Re-free nickel-based single crystal superalloy and preparation process thereof |
| CN111763897A (en) * | 2020-07-24 | 2020-10-13 | 中国航发北京航空材料研究院 | Method for determining homogenization/solution heat treatment schedule of nickel-based single crystal superalloy |
| CN112935056A (en) * | 2021-02-26 | 2021-06-11 | 华南理工大学 | Spinning solution treatment composite forming method for nickel-based superalloy tubular piece with bottom |
| CN113957365A (en) * | 2021-10-18 | 2022-01-21 | 中国华能集团有限公司 | Heat treatment process for casting precipitation strengthening nickel-based high-temperature alloy |
| CN114250519A (en) * | 2022-01-10 | 2022-03-29 | 西北工业大学 | Solid solution heat treatment method for reducing content of solid solution holes of high-rhenium nickel-based single crystal superalloy |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4582548A (en) * | 1980-11-24 | 1986-04-15 | Cannon-Muskegon Corporation | Single crystal (single grain) alloy |
| JPH0941058A (en) * | 1995-07-31 | 1997-02-10 | Natl Res Inst For Metals | Nickel base single crystal alloy |
| EP2006402A2 (en) * | 2006-03-31 | 2008-12-24 | National Institute for Materials Science | Ni-BASE SUPERALLOY AND METHOD FOR PRODUCING SAME |
| CN103352192A (en) * | 2013-07-11 | 2013-10-16 | 北京航空航天大学 | Method for designing single-crystal superalloy solid solution system |
| CN103866392A (en) * | 2014-01-24 | 2014-06-18 | 南京理工大学 | Low rhenium and nickel-based single crystal high-temperature alloy and preparation method thereof |
| CN104263998A (en) * | 2014-09-18 | 2015-01-07 | 中国华能集团公司 | Heat treatment process for nickel-iron-chromium-boron high-temperature alloy |
-
2015
- 2015-06-30 CN CN201510374344.3A patent/CN104975248B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4582548A (en) * | 1980-11-24 | 1986-04-15 | Cannon-Muskegon Corporation | Single crystal (single grain) alloy |
| JPH0941058A (en) * | 1995-07-31 | 1997-02-10 | Natl Res Inst For Metals | Nickel base single crystal alloy |
| EP2006402A2 (en) * | 2006-03-31 | 2008-12-24 | National Institute for Materials Science | Ni-BASE SUPERALLOY AND METHOD FOR PRODUCING SAME |
| CN103352192A (en) * | 2013-07-11 | 2013-10-16 | 北京航空航天大学 | Method for designing single-crystal superalloy solid solution system |
| CN103866392A (en) * | 2014-01-24 | 2014-06-18 | 南京理工大学 | Low rhenium and nickel-based single crystal high-temperature alloy and preparation method thereof |
| CN104263998A (en) * | 2014-09-18 | 2015-01-07 | 中国华能集团公司 | Heat treatment process for nickel-iron-chromium-boron high-temperature alloy |
Non-Patent Citations (5)
| Title |
|---|
| HON TONG PANG等: "Solution heat treatment optimization of fourth-generation single-crystal nickel base superallloys", 《METELLURGICAL AND MATERIALS TRANSACTIONS A》 * |
| PAUL D.JABLONSKI等: "Homogenizing a nickel-based superalloys:thermodynamics and kinetic simulation and experimental results", 《METALLURGICAL AMD MATERIALS TRANSACTIONS B》 * |
| S.R.HEGDE等: "Designing homogenization-solution heat treatments for single crystal superalloys", 《MATERIALS SCIENCE AND ENGINEERING A》 * |
| 张胜霞等: "固溶处理参数对一种单晶高温合金微观偏析的影响", 《铸造》 * |
| 李嘉荣: "《先进高温结构材料与技术 上》", 30 June 2012, 国防工业出版社 * |
Cited By (8)
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|---|---|---|---|---|
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| CN111440967A (en) * | 2020-05-08 | 2020-07-24 | 中国科学院金属研究所 | High-thermal-stability high-strength Re-free nickel-based single crystal superalloy and preparation process thereof |
| CN111763897A (en) * | 2020-07-24 | 2020-10-13 | 中国航发北京航空材料研究院 | Method for determining homogenization/solution heat treatment schedule of nickel-based single crystal superalloy |
| CN111763897B (en) * | 2020-07-24 | 2021-10-15 | 中国航发北京航空材料研究院 | Method for determining homogenization/solution heat treatment schedule of nickel-based single crystal superalloy |
| CN112935056A (en) * | 2021-02-26 | 2021-06-11 | 华南理工大学 | Spinning solution treatment composite forming method for nickel-based superalloy tubular piece with bottom |
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