CN104966700A - 一种芯片模组盖板、芯片模组封装结构及电子装置 - Google Patents
一种芯片模组盖板、芯片模组封装结构及电子装置 Download PDFInfo
- Publication number
- CN104966700A CN104966700A CN201510304618.1A CN201510304618A CN104966700A CN 104966700 A CN104966700 A CN 104966700A CN 201510304618 A CN201510304618 A CN 201510304618A CN 104966700 A CN104966700 A CN 104966700A
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- chip module
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- 238000009434 installation Methods 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 7
- 239000000976 ink Substances 0.000 description 41
- 230000012447 hatching Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- Solid State Image Pick-Up Elements (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Description
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510304618.1A CN104966700B (zh) | 2015-06-04 | 2015-06-04 | 一种芯片模组盖板、芯片模组封装结构及电子装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510304618.1A CN104966700B (zh) | 2015-06-04 | 2015-06-04 | 一种芯片模组盖板、芯片模组封装结构及电子装置 |
Publications (2)
Publication Number | Publication Date |
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CN104966700A true CN104966700A (zh) | 2015-10-07 |
CN104966700B CN104966700B (zh) | 2019-02-12 |
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CN201510304618.1A Expired - Fee Related CN104966700B (zh) | 2015-06-04 | 2015-06-04 | 一种芯片模组盖板、芯片模组封装结构及电子装置 |
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CN (1) | CN104966700B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106653708A (zh) * | 2016-12-12 | 2017-05-10 | 苏州科阳光电科技有限公司 | 一种指纹识别模组及其封装方法 |
CN106653707A (zh) * | 2016-12-12 | 2017-05-10 | 苏州科阳光电科技有限公司 | 一种指纹识别模组及其封装方法 |
CN113058833A (zh) * | 2021-04-06 | 2021-07-02 | 深圳市金尚金新材料技术有限公司 | 芯片盖板的钎焊料喷涂工艺 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203350825U (zh) * | 2013-07-02 | 2013-12-18 | 宸鸿科技(厦门)有限公司 | 触控面板及其盖板结构、图案区感测结构 |
CN104183560A (zh) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | 电容式的指纹传感器封装结构及封装的方法 |
CN104182739A (zh) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | 指纹识别装置及其电子设备、封装方法 |
CN204834592U (zh) * | 2015-06-04 | 2015-12-02 | 南昌欧菲生物识别技术有限公司 | 一种芯片模组盖板、芯片模组封装结构及电子装置 |
-
2015
- 2015-06-04 CN CN201510304618.1A patent/CN104966700B/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN203350825U (zh) * | 2013-07-02 | 2013-12-18 | 宸鸿科技(厦门)有限公司 | 触控面板及其盖板结构、图案区感测结构 |
CN104183560A (zh) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | 电容式的指纹传感器封装结构及封装的方法 |
CN104182739A (zh) * | 2014-08-26 | 2014-12-03 | 南昌欧菲生物识别技术有限公司 | 指纹识别装置及其电子设备、封装方法 |
CN204834592U (zh) * | 2015-06-04 | 2015-12-02 | 南昌欧菲生物识别技术有限公司 | 一种芯片模组盖板、芯片模组封装结构及电子装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106653708A (zh) * | 2016-12-12 | 2017-05-10 | 苏州科阳光电科技有限公司 | 一种指纹识别模组及其封装方法 |
CN106653707A (zh) * | 2016-12-12 | 2017-05-10 | 苏州科阳光电科技有限公司 | 一种指纹识别模组及其封装方法 |
CN113058833A (zh) * | 2021-04-06 | 2021-07-02 | 深圳市金尚金新材料技术有限公司 | 芯片盖板的钎焊料喷涂工艺 |
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Publication number | Publication date |
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CN104966700B (zh) | 2019-02-12 |
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CP03 | Change of name, title or address |
Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: Ophiguang Group Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee before: OFilm Microelectronics Technology Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. Address after: 330096 Jiangxi Nanchang Nanchang hi tech Industrial Development Zone, east of six road, south of Tianxiang Avenue. Patentee after: OFilm Microelectronics Technology Co.,Ltd. Patentee after: Nanchang OFilm Tech. Co.,Ltd. Patentee after: OFilm Tech Co.,Ltd. Patentee after: SUZHOU OFILM TECH Co.,Ltd. Address before: 330029 No. 1189 Jingdong Avenue, Nanchang high tech Zone, Jiangxi Patentee before: NANCHANG OFILM BIO-IDENTIFICATION TECHNOLOGY Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Shenzhen OFilm Tech Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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Effective date of registration: 20210630 Address after: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee after: Jiangxi OMS Microelectronics Co.,Ltd. Address before: 330096 No.699 Tianxiang North Avenue, Nanchang hi tech Industrial Development Zone, Nanchang City, Jiangxi Province Patentee before: Jiangxi OMS Microelectronics Co.,Ltd. Patentee before: Nanchang OFilm Tech. Co.,Ltd. Patentee before: Ophiguang Group Co.,Ltd. Patentee before: SUZHOU OFILM TECH Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190212 |