CN104952780A - Method of manufacturing a flexible device, a flexible device, a flexible device manufacturing apparatus and a resin solution for forming a flexible substrate - Google Patents
Method of manufacturing a flexible device, a flexible device, a flexible device manufacturing apparatus and a resin solution for forming a flexible substrate Download PDFInfo
- Publication number
- CN104952780A CN104952780A CN201510148729.8A CN201510148729A CN104952780A CN 104952780 A CN104952780 A CN 104952780A CN 201510148729 A CN201510148729 A CN 201510148729A CN 104952780 A CN104952780 A CN 104952780A
- Authority
- CN
- China
- Prior art keywords
- board
- support body
- rigid support
- flexible
- flexible base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 67
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- 238000000034 method Methods 0.000 claims abstract description 90
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- 238000000576 coating method Methods 0.000 claims abstract description 29
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- 230000015572 biosynthetic process Effects 0.000 claims description 39
- 238000009434 installation Methods 0.000 claims description 12
- 229920001721 polyimide Polymers 0.000 description 61
- 239000004642 Polyimide Substances 0.000 description 50
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- 238000010438 heat treatment Methods 0.000 description 23
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1262—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate
- H01L27/1266—Multistep manufacturing methods with a particular formation, treatment or coating of the substrate the substrate on which the devices are formed not being the final device substrate, e.g. using a temporary substrate
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Laminated Bodies (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Liquid Crystal (AREA)
- Moulding By Coating Moulds (AREA)
- Thin Film Transistor (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a method of manufacturing a flexible device, a flexible device, a flexible device manufacturing apparatus and a resin solution for forming a flexible substrate. The method is very simple and low in manufacturing cost, can be applied to various resins, a hard support can be easily removed from a flexible substrate having a functional layer. The method of manufacturing the flexible device comprises a process of forming a flexible substrate, a process of forming a functional layer and a process of removing a support. The process of forming the flexible substrate comprises coating a resin solution on a hard support to form a flexible substrate on a hard support. The process of forming the functional layer comprises forming the functional layer on the flexible substrate. The process of removing the support comprises removing the flexible substrate having the functional layer and the functional layer from the hard support. According to the method of manufacturing the flexible device, in the process of forming the flexible substrate, the resin solution is coated after the hard support is heated.
Description
Technical field
The present invention relates to and a kind ofly easily remove the manufacture method of the flexible member of rigid support body, the flexible member manufacturing installation by the flexible member manufactured by described manufacture method and described manufacture method from the flexible base, board defining functional layer.
Background technology
The electronic component of liquid crystal display, organic electroluminescent (Electroluminescence, EL) display, solar cell, touch-screen (touch panel), colored filter (color filter) etc. mainly manufactures using glass as substrate.The flexible base, boards such as plastics are used to replace the electronic component of this glass substrate to be called as so-called flexible member.When manufacturing a kind of flexible display as flexible member, in order to suppress to be increased by the manufacturing cost imported caused by novel device, the manufacturing technology (comprising manufacturing equipment) of existing glass substrate of expecting to apply in a flexible way.
Utilize an example of the manufacture method of the flexible display of existing manufacturing technology to be following methods: first using glass as supporter, described supporter carries flexible base, board, and then carry function element on flexible substrates, form conducting pattern and carry out (following merging are called " functional layer formation process ") such as sealings.Then, from described supporter, flexible base, board is peeled off (hereinafter referred to as " supporter removal step ") together with function element.Therefore, importantly in functional layer formation process, glass baseplate and flexible base, board are not peeled off, and in supporter removal step, are peeled off by flexible base, board and do not cause damage (damage) to flexible base, board self and function element.
In addition, in the manufacturing process of flexible member, usually heat treated (200 DEG C ~ 500 DEG C) and various chemical treatments are carried out to flexible base, board.Therefore, flexible base, board requires thermal endurance and chemical-resistant.As the flexible substrate material of this requirement of reply, just at Study on Polyimide resin (referenced patent document 1 ~ patent documentation 3).This polyimide resin has following characteristics: coefficient of linear thermal expansion (Coefficient of thermal expansion, CTE) low, it controls relatively easy, therefore sometimes expose in manufacturing process at high temperature and the use of product time, not easily produce undesirable condition.
Wherein, describedly Patent Document 1 discloses a kind of manufacture method comprising the flexible member of following operation: by aqueous resin combination coating film forming and form the resin molding of solid shape on carrier substrate, described resin molding forms circuit, and peel off carrier substrate from resin molding, and open in described patent documentation 1: described resin molding is excellent from the fissility carrier substrate, can not make the defects such as described circuit is peeling.But, about the control of the peel strength between carrier substrate-resin molding, then and unexposed.That is, the stripping difficulty of the carrier substrate-resin molding in described functional layer formation process is failed to understand.
In addition, Patent Document 2 discloses following technique (process): on supporter, form polyimides epithelium, and then after forming thin-film component thereon, peel off from supporter and obtain membrane component, and open: being 0.05N/cm ~ 1.5N/cm from the peeling force of the polyimides epithelium supporter.And open: now, unstripped in the membrane component course of processing, and can peel off rapidly after process finishing.But applicable resin is limited to the resin with indoles (benzazole) skeleton in described technique.
In addition, Patent Document 3 discloses following methods: nitride layer is set on substrate, and then oxide skin(coating) is set thereon, formed thus and be stripped layer, and then after forming insulating barrier and element thereon, peeled off in the layer of described oxide skin(coating) or on interface by physical method.But, must arrange on substrate as described be stripped layer, therefore manufacturing process is miscellaneous, causes manufacturing cost to rise.
As the above, expect, functional layer formation time do not peel off flexible base, board from supporter, and, when supporter peels off flexible base, board, damage is not caused to flexible base, board and functional layer afterwards, and can low cost and the means of carrying out easily.
[prior art document]
[patent documentation]
[patent documentation 1] Japanese Patent Laid-Open 2010-202729 publication
[patent documentation 2] Japanese Patent Laid-Open 2012-140560 publication
[patent documentation 3] Japanese Patent Laid-Open 2003-174153 publication
Summary of the invention
[invention institute for solution problem]
Can think from the aspect that can form various functional layer with good precision, the viewpoint such as the aspect of operability excellence when manufacturing, following methods is favourable: as described above, flexible base, board is formed in advance on the rigid support body that glass substrate etc. is such, functional layer is set under the state being fixed wtih flexible base, board on rigid support body, is separated and the method for manufacturing flexible element from rigid support body.But, may cannot be separated well when rigid support body is separated flexible member, cause flexible base, board damaged, functional layer is impacted etc. and produces various puzzlement (trouble).In addition, in described method known at present, from manufacturing cost being suppressed low and can be applicable to the viewpoint of various resin and insufficient, need further to improve.
Therefore, the object of the present invention is to provide a kind of manufacture method of flexible member, it is easy method and low cost of manufacture, and has so-called wide usage and can be applicable to various resin, and easily removes rigid support body from the flexible base, board defining functional layer.
[technological means of dealing with problems]
That is, the present invention is a kind of manufacture method of flexible member, comprises following operation: flexible base, board formation process, coating resin solution on rigid support body and form flexible base, board on rigid support body; Functional layer formation process, described flexible base, board forms functional layer; And supporter removal step, the described flexible base, board defining functional layer is removed from rigid support body together with functional layer, and in the manufacture method of described flexible member: in described flexible base, board formation process, coating resin solution after heat treated is carried out to rigid support body.
In addition, the maximum temperature in heat treated described in the present invention is preferably more than 300 DEG C, is more preferably more than 360 DEG C.
In addition, in the present invention preferably after described heat treated terminates, in 180 minutes on described rigid support body coating resin solution.
In addition, the flexible member of the present invention manufactured by a kind of manufacture method by described flexible member.Especially, preferably flexible member is touch-screen.
In addition, the present invention is a kind of flexible member manufacturing installation of manufacture method of flexible member, wherein: have by rigid support body continuously more than 300 DEG C, preferably more than 360 DEG C carry out the device of heat treated.
In addition, the present invention is the resin solution of the flexible base, board forming described flexible member.
[effect of invention]
The manufacture method of flexible member of the present invention is without the need to complicated procedures of forming such as additional imparting peel plies, and can be applicable to various resin and arrive flexible member, therefore can suppress to be increased by the manufacturing cost imported caused by novel device, the manufacturing technology of existing glass substrate of can applying in a flexible way.Therefore, for electronic components such as liquid crystal display, OLED display, solar cell, touch-screen, colored filters, can promote by the replacement of glass substrate to flexible base, board.
Accompanying drawing explanation
Fig. 1 is the schematic illustration representing flexible member manufacturing installation of the present invention.
[explanation of symbol]
10: flexible base, board manufacturing installation
11: rigid support body
12: flexible base, board
13: the 1 laser heating processing unit
14: resin solution feedway
15: the 2 laser heating processing unit
16: conveyer belt
Embodiment
Below, a form of the manufacture method of flexible member of the present invention is described in detail.
The manufacture method of flexible member of the present invention is the manufacture method of the flexible member possessing the functional layer with set function on flexible substrates, and comprises following 3 operations.
(1) coating resin solution on rigid support body, and on rigid support body, form the flexible base, board formation process of flexible base, board
(2) on described flexible base, board, form the functional layer formation process of functional layer
(3) each operation of the supporter removal step of rigid support body is removed from the described flexible base, board defining functional layer
Therefore, in the present invention, in described flexible base, board formation process, coating resin solution after heat treated is carried out to rigid support body.
First, flexible base, board formation process is illustrated.
As long as rigid support body is inorganic matter, and can guarantee the performance as laminate, then also unrestricted to its kind, such as can enumerate glass or ceramic or metal.Herein, metal can illustrate one or more the metal material in the cohort being selected from and being made up of the alloy of copper, aluminium, stainless steel, iron, silver, palladium, nickel, chromium, molybdenum, tungsten, zirconium, gold, cobalt, titanium, tantalum, zinc, lead, tin, silicon, bismuth, indium or these metals, and also can form rigid support body with glass compound, if above-mentioned, be seen as preferably from the viewpoint of thermal endurance or supporting flexible substrate layer.In addition, pottery can enumerate aluminium oxide, silicon dioxide, silicon wafer.More preferably to the glass of the adaptability excellence of the manufacturing process of existing flexible member.
In addition, about these rigid support bodies, in order to adjust the adhesion etc. of surface texture and raising and flexible base, board, also following process can be implemented to its surface: starching (sizing), chromium plating, nickel plating, chromium plating-nickel, plating copper-zinc alloy, cupric oxide is separated out or aluminum alcoholate, aluminium chelate compound, silane coupling agent, titanate esters system coupling agent, the titanium compounds such as alkoxytitanium, the silane compounds such as alkoxy silane, triazine thiol class, benzotriazole, acetylene alcohols, levulinic ketone, catechol, adjacent benzoquinones class, tannin acids, the chemical surface treatment of oxyquinoline class etc., or the mechanical surface treatment such as top layer roughening treatment.
Coating resin solution on this rigid support body and form flexible base, board on rigid support body.Resin solution is that well-known resin dissolves is formed in well-known solvent.Resin such as can be enumerated: polybenzoxazole, polyamidoimide, polyimides or polyimides predecessor.The preferably polyimides of thermal endurance and good chemical resistance or polyimides predecessor when making flexible base, board.Solvent can be enumerated: 1-METHYLPYRROLIDONE (NMP), dimethyl formamide (DMF), dimethylacetylamide (DMAc), dimethyl sulfoxide (DMSO) (DMSO), dimethyl suflfate, sulfolane, butyrolactone, cresols, phenol, halogenation phenol, cyclohexanone, diox, oxolane, diethylene glycol dimethyl ether system, TRIGLYME system, carbonic ester system (dimethyl carbonate, diethyl carbonate, ethylmethyl carbonate, ethylene carbonate, propylene carbonate etc.) etc.
When resin be polyimides or polyimides predecessor, on rigid support body, the resin solution of coating containing polyimides or polyimides predecessor, carries out heat treated to rigid support body, makes resin solution harden and make flexible base, board thus.Now, the layer of presclerotic resin solution is called " polyimide prepolymer resin bed ".
When described flexible base, board is formed with polyimides, the structure of polyimides can be applied with no particular limitation, from the easy aspect removed from rigid support body, preferably there is in main chain backbone the polyimides (hereinafter referred to as " polyimides containing alicyclic ring ") of alicyclic structure or there is the polyimides (hereinafter referred to as " fluorinated polyimide ") of fluorine atom.Example containing the polyimides of alicyclic ring is: containing 9,9-two (4-aminophenyl) fluorenes (DCHM), cyclohexylamine (CHA) etc. are containing the diamino compounds or 1 of alicyclic structure, 2,4,5-cyclopentanetetracarboxylic dianhydride (CHDA), 1,2,4,5-cyclobutane tetracarboxylic dianhydrides (CBDA) etc. contain more than at least one of the acid anhydrides of alicyclic structure as monomer, and are made into the compound of polyimides.The example of fluorinated polyimide is: containing 4,4 '-diaminourea-2, the fluorine-containing diamino compounds or 2 such as 2 '-bis-(trifluoromethyl) biphenyl (TFMB), 2-two (3, the anhydrous dicarboxyphenyi of 4-) HFC-236fa (6FDA), 9, more than at least one of the two fluorine-containing acid anhydrides such as (trifluoromethyl) xanthene tetracarboxylic dianhydride (6FCDA), 9-phenyl-9-(trifluoromethyl) xanthene tetracarboxylic dianhydride (3FCDA) of 9-as monomer, and be made into the compound of polyimides.More preferably fluorinated polyimide, and then preferably contain TFMB as fluorine-containing diamino compounds and containing the fluorinated polyimide of 6FDA as fluorine-containing acid anhydrides.
The formation of polyimide prepolymer resin bed can use arbitrary coating process.In addition, also multilayer polyimide prepolymer resin bed can be formed on rigid support body.When forming multilayer, preferably the precision of thickness etc. is high, therefore preferred following 3 methods.
Method 1) utilize multiple layers of molds to form polyimide prepolymer resin bed of more than two kinds simultaneously.
Method 2) utilize arbitrary method to form polyimide prepolymer resin bed after, by scraper for coating (knife coat) mode or mould profile etc. and then form other polyimide prepolymer resin beds on its undried coated face.
Method 3) utilize arbitrary method to form polyimide prepolymer resin bed and in addition after drying, its applicator surface utilize arbitrary method to form other polyimide prepolymer resin beds.
So-called scraper for coating mode described here, refers to the method utilizing rod (bar), scraper plate (squeegee), scraper (knife) etc. resin solution to be bulldozed coating.
The method for curing of polyimide prepolymer resin bed can use arbitrary method.After forming polyimide prepolymer resin bed, certain hour is left standstill at high operating temperatures by containing in heat drying stove in batch of the rigid support body of pre-dried polyimide prepolymer resin bed, or control the translational speed of the described laminate in the stove of laser heating processing unit, guaranteeing the time for carrying out drying and sclerosis and temperature, the flexible base, board of the polyimide resin layer comprising single or multiple lift can be formed thus.
When polyimide prepolymer resin bed hardens, polyimide prepolymer resin bed is removed by solvent by heat treated.Especially when using polyimides predecessor resin solution, and then imide bond (hereinafter referred to as " imidizate ") is formed by ring-closure reaction.Curing condition suitably adjusts according to aftermentioned polyimides and the chemical constitution of polyimides predecessor, the structure of heat treatment apparatus etc., if at high temperature carry out heat treated sharp, on resin layer surface, then generate cortex and solvent is difficult to evaporation, or foaming, it is therefore desirable that one side slowly rises to high temperature one side from low temperature carry out heat treated.
When polyimide prepolymer resin bed is polyimides predecessor, about heat treated condition during sclerosis, in order to suppress heat deterioration and the manufacturing cost of the flexible base, board in manufacturing process, heat treatment temperature is advisable with low, and heating treatment time is advisable with short.But if heat treatment temperature is too low or heating treatment time is too short, then may fully not harden, therefore preferably maximum temperature is more than 300 DEG C, and the retention time under this maximum temperature is more than 2 minutes.If this temperature range, then imidizate carries out with good efficiency.In addition, the adsorbate deriving from Atmospheric components, moisture etc. be distributed on the surface of rigid support body fully can be removed.More preferably maximum temperature is more than 320 DEG C, and the retention time under this maximum temperature is more than 2 minutes.And then preferably maximum temperature is more than 360 DEG C, and the retention time under this maximum temperature be more than 2 minutes.
On the other hand, when polyimide prepolymer resin bed is polyimides, hardened by drying.Therefore, heat treatment temperature also can lower than the situation of polyimides predecessor.Heat treatment temperature now preferably maximum temperature is more than 280 DEG C, more preferably more than 300 DEG C.
In addition, sclerosis can be carried out under the arbitrary condition in the inert gas such as nitrogen, argon gas and in air.In addition, also can at ambient pressure, decompression under, add pressure and vacuum under arbitrary condition under carry out.
In addition, laser heating processing unit also can be utilized to carry out the formation of polyimide prepolymer resin bed and the formation of flexible base, board continuously.
In addition, in described flexible base, board formation process, coating resin solution after heat treated is carried out to rigid support body.Also the heat treated of the rigid support body before this coating resin solution is called " front heat treated ".By carrying out front heat treated, in functional layer formation process, flexible base, board can not be peeled off from rigid support body, and in supporter removal step, also can remove rigid support body from flexible base, board when not causing when damage rigid support body, flexible base, board and functional layer.Specifically, when before not carrying out when heat treated, the peel strength of rigid support body-flexible base, board is too high, when removing rigid support body, sometimes breakage, crack equivalent damage are caused to rigid support body, flexible base, board or functional layer, but by carrying out front heat treated, and in functional layer formation process, suppressing the peel strength of rigid support body-flexible base, board with the degree be not peeling, can supporter removal step be carried out and there is not described damage.
The condition of front heat treated is different depending on used rigid support body and resin solution, from the viewpoint impurity rigid support body being removed, maintained in suitable scope the peel strength of rigid support body-flexible base, board, the maximum temperature of front heat treated preferably more than 300 DEG C.The maximum temperature of front heat treated is more preferably more than 360 DEG C.In addition, environment during heating can be any one environment in air, in inert gas, in reduced pressure atmosphere, from the high aspect of removing efficiency suppressing the aspect of manufacturing cost, rigid support surface, in preferred atmosphere.In addition, such as, when using glass as rigid support body, from suppressing the viewpoint of thermal deformation and suppressing the viewpoint of manufacturing cost, the upper limit of the maximum temperature of described front heat treated is essentially 500 DEG C.
In addition, in order to prevent impurity or moisture to the attachment of rigid support body having carried out heat treated, preferably after described heat treated terminates, in 180 minutes on described rigid support body coating resin solution.More preferably within 120 minutes.On the other hand, if after a heating treatment without long time coating resin solution, then may cause flexible base, board by the thermal conductance of rigid support body and produce expansion or deterioration.Therefore, preferably after heat treated, coating resin solution under the state that the temperature of rigid support body is less than 40 DEG C.After so-called heat treated described here terminates, for having started the time point of the cooling carrying out rigid support body after a heating treatment.The method of cooling can illustrate and let cool, by the pressure cooling etc. of blowing.
Then, functional layer formation process is illustrated.Flexible base, board by described flexible base, board formation process gained forms functional layer.Functional layer can apply the well-known element guaranteeing the function of flexible member, such as, can enumerate organic EL thin-film transistor (Thin Film Transistor, TFT), photo-electric conversion element, Electronic Paper driving element, colored filter etc.When manufacturing OLED display as flexible member, functional layer can enumerate the TFT for carrying out image-driven.The material of TFT can enumerate Si semiconductor or oxide semiconductor.When not using the flexible base, board of prior art, the rigid support bodies such as glass sheet arranging the barrier layer of inorganic set member, forming TFT thereon.When it is formed, need high-temperature process (more than 300 DEG C ~ more than 400 DEG C).Therefore, for described flexible base, board, important is also to tolerate this high-temperature process.In addition, such as, when manufacturing touch-screen as flexible member, functional layer can enumerate the electrode layer such as nesa coating, woven wire (metal mesh).One example of nesa coating can be enumerated: mix the indium oxide (tin-doped indium oxide, ITO) of tin, SnO, ZnO, indium zinc oxide (Indium Zinc Oxide, IZO).When forming these electrode layers, by heat-treating more than 200 DEG C, the conductive layer that the resistance value that can be shaped is little.Therefore, for described flexible base, board, importantly this high-temperature process can be tolerated.
Then, supporter removal step is described.Rigid support body is removed from the described flexible base, board defining functional layer.During removing, arbitrary method also can be utilized to form cut line in the Surface Edge edge of the part (hereinafter referred to as " functional layer forming portion ") defining functional layer on flexible substrates, divide framework.By forming cut line, size and the shape of the flexible base, board defining functional layer can be controlled.Such as in order to improve manufacture efficiency, when a flexible base, board forms multiple functional layer, by formed cut line, can make the size of multiple flexible base, board and shape consistent.The area of framework is less, and the area of flexible base, board more becomes large, can increase the functional layer that can be formed on a flexible base, board.Therefore, the area of framework is advisable with little in the scope of the size and shape that can control flexible base, board.
And then, the flexible base, board of the inside region divided through cut line is peeled off from rigid support body together with functional layer, obtains the flexible member possessing functional layer on flexible substrates.Only otherwise the quality of the flexible member of gained is reduced, then described stripping means can use well-known method.The stripping of framework also can use well-known method.The stripping of flexible base, board and the stripping of framework first can carry out any one.When not forming cut line, whole flexible base, board is peeled off together with functional layer.
As above, the manufacture method of flexible member of the present invention suitably can control the peel strength of rigid support body-flexible base, board by the easy method of the heat treated of rigid support body.As a result, when being separated flexible member from rigid support body, rigid support body, flexible base, board and functional layer can not caused and damaging and manufacturing flexible element.Therefore, can expect that fine ratio of product is high by the flexible member manufactured by this manufacture method, life of product is long.
Then, flexible member manufacturing installation of the present invention is illustrated.The feature of described flexible member manufacturing installation is: carry out flexible base, board formation process continuously.Specifically, device rigid support body being carried out continuously more than 300 DEG C heat treated is as shown in FIG. 1 possessed.As an example, below the flexible member manufacturing installation 10 shown in Fig. 1 is illustrated.If place rigid support body 11 on conveyer belt (conveyor) 16, then the direction of rigid support body 11 towards arrow on conveyer belt 16 is moved.In the 1st laser heating processing unit 13, with maximum temperature more than 300 DEG C, rigid support body 11 is heated (front heat treated).After heating, the surface of rigid support body 11 is coated with the resin solution supplied by resin solution feedway 14.Then, carry out heating (rear heat treated) with maximum temperature more than 300 DEG C in the 2nd laser heating processing unit 15, rigid support body 11 is formed flexible base, board 12.
As another example, the flexible member manufacturing installation comprising following operation 1 ~ operation 7 can be enumerated.
(operation 1) extracts rigid support body out from accumulator (stocker) (storage appts), to put in baking oven and to carry out heating (front heat treated) with maximum temperature more than 300 DEG C.
After (operation 2) heating, from baking oven, extract rigid support body out, utilize coating machine coating resin solution on the surface of rigid support body.
(operation 3) utilizes vacuum drier, hot plate or baking oven by dry for the rigid support soma being coated with resin solution, and rigid support body is formed polyimide prepolymer resin bed.
The rigid support body defining polyimide prepolymer resin bed is put in laser heating processing unit by (operation 4), forms flexible base, board (rear heat treated) with maximum temperature more than 300 DEG C heating.Transport with metal conveyer belt or roller in laser heating processing unit.
The rigid support body defining flexible base, board moves in functional layer forming apparatus by (operation 5), forms functional layer with continuous batch.
(operation 6) utilizes stripping machine to be separated with rigid support body by the flexible base, board defining functional layer.
(operation 7), by the rigid support body cleaning through peeling off, moves in accumulator.
In above operation 1 ~ operation 7, the movement of rigid support body etc. can use robot, is also undertaken by manual operations.
[embodiment]
Below, according to embodiment and comparative example, the present invention is specifically described.In addition, the present invention is not by the restriction of these contents.
1. various physical property measurement and method for testing performance
[mensuration of peel strength]
About the peel strength between rigid support body and polyimide resin layer, for laminate, with applicable setting-out line wide (about 1mm ~ 30mm) in polyimide side incision or the processing carrying out pattern, etching in substrate side, use the cupping machine (Strograph-M1) that Toyo Seiki limited company manufactures, resin bed is peeled off towards 180 ° of directions, measures peel strength.In addition, by between processing fine rule and resin boundary surface then firmly and the average evaluation being difficult to peel off is " cannot peel off ".
2. the synthesis of polyamic acid (polyimides predecessor) solution
By the anhydride compound of raw material used during the synthesis of the polyamic acid used in following synthesis example or embodiment and comparative example (polyimides predecessor) solution, aromatic series diamino compounds, aromatic tetracarboxylic acid and be shown in following containing the acid anhydrides of alicyclic structure, solvent.
[aromatic series diamino compounds]
4,4 '-diaminourea-2,2 '-bis-(trifluoromethyl) biphenyl (TFMB)
4,4 '-diamino-diphenyl ether (44DAPE)
[anhydride compound of aromatic tetracarboxylic acid]
Pyromellitic dianhydride (PMDA)
Two (the anhydrous dicarboxyphenyi of 3, the 4-) HFC-236fa (6FDA) of 2,2-
2,3,2 ', 3 '-biphenyl tetracarboxylic dianhydride (BPDA)
[acid anhydrides containing alicyclic structure]
1,2,4,5-cyclopentanetetracarboxylic dianhydride (CHDA)
[solvent]
DMA (DMAc)
Synthesis example 1
Under nitrogen flowing, TFMB (15.8227g) is put into the detachable flask to 300ml, one side stirs simultaneously to be added in the solvent DMAc of 170g and heats, and dissolves at 20 DEG C.Then, 6FDA (7.5660g) and PMDA (6.6113g) is added.Thereafter, solution stirred 4 hours in room temperature with constant and carries out polymerization reaction, obtaining the polyamic acid A varnish of the flaxen thickness of 200g.In addition, this polyamic acid A varnish is hardened under aftermentioned heating condition, obtain polyimide resin A thus.
Synthesis example 2
Be used as the TFMB (16.93g) of aromatic series diamino compounds, as the PMDA (10.12g) of the anhydride compound of aromatic tetracarboxylic acid and 6FDA (2.95g), in addition, the method identical with synthesis example 1 is utilized to obtain the polyamic acid B varnish of the flaxen thickness of 200g.In addition, this polyamic acid B varnish is hardened under aftermentioned heating condition, obtain polyimide resin B thus.
Synthesis example 3
Be used as the TFMB (12.54g) of aromatic series diamino compounds, 6FDA (17.46g) as the anhydride compound of aromatic tetracarboxylic acid, in addition, the method identical with synthesis example 1 is utilized to obtain the polyamic acid C varnish of the flaxen thickness of 200g.In addition, this polyamic acid C varnish is hardened under aftermentioned heating condition, obtain polyimide resin C thus.
Synthesis example 4
Be used as the TFMB (12.31g) of aromatic series diamino compounds, 6FDA (17.69g) as the anhydride compound of aromatic tetracarboxylic acid, in addition, the method identical with synthesis example 1 is utilized to obtain the polyamic acid D varnish of the flaxen thickness of 200g.In addition, this polyamic acid D varnish is hardened under aftermentioned heating condition, obtain polyimide resin D thus.
Synthesis example 5
Be used as the 44DAPE (14.29g) of aromatic series diamino compounds, BPDA (15.65g) as the anhydride compound of aromatic tetracarboxylic acid, in addition, the method identical with synthesis example 1 is utilized to obtain the polyamic acid E varnish of the thickness of the brown of 200g.In addition, this polyamic acid E varnish is hardened under aftermentioned heating condition, obtain polyimide resin E thus.
Synthesis example 6
Be used as the TFMB (17.60g) of aromatic series diamino compounds, as the CHDA (12.37g) of acid anhydrides containing alicyclic structure, in addition, the method identical with synthesis example 1 is utilized to obtain the polyamic acid F varnish of the flaxen thickness of 200g.In addition, this polyamic acid F varnish is hardened under aftermentioned heating condition, obtain polyimide resin F thus.
3. the formation of the polyimide layer on support base material and performance evaluation
The rigid support body used in following embodiment and comparative example is shown in following.
Glass plate ... the alkali-free glass that healthy and free from worry (Corning) company manufactures, trade name " Iger (Eagle) XG ", thickness 500 μm
The polyamide acid varnish be coated on rigid support body is made after drying, to be warming up to 360 DEG C with about 30 minutes and to harden from 100 DEG C on the hot plate of 70 DEG C ~ 100 DEG C.
Embodiment 1
After clean sheet glass (15cm × 15cm) is heated 60 minutes in an oven in an atmosphere at 360 DEG C, cool in an atmosphere, after acetone wipe surfaces, be coated with polyamic acid A varnish on said surface.Time to coating after terminating from heating is 60 minutes.It is heated under described heating condition, forms the flexible base, board that thickness is 25 μm.Then, this flexible base, board uses cutter (cutter) form cut line, in polyimide resin layer, divide the framework of 10mm × 100mm.Then, the flexible base, board of the inside region of being surrounded by cut line is peeled off.Peel strength is shown in Table 1.
Embodiment 2 ~ embodiment 6
As described in Table 1, just to use polyamic acid B varnish to replace polyamic acid A varnish as embodiment 2, all the other are identical with embodiment 1, polyamic acid C varnish is used to replace the polyamic acid A varnish (embodiment 3) of embodiment 1, below in the same manner, when using polyamic acid A varnish (embodiment 4) of polyamic acid D varnish replacement embodiment 1, when using polyamic acid A varnish (embodiment 5) of polyamic acid E varnish replacement embodiment 1, when using polyamic acid A varnish (embodiment 6) of polyamic acid F varnish replacement embodiment 1, the method identical with embodiment 1 is utilized to form the flexible base, board that thickness is 25 μm in addition, and then flexible base, board is peeled off.Peel strength is shown in Table 1.
Embodiment 5
Heat 60 minutes at 300 DEG C in an atmosphere in an oven, in addition, utilize the method identical with embodiment 1 to form the flexible base, board that thickness is 25 μm, and then flexible base, board is peeled off.Peel strength is shown in Table 1.
Embodiment 6
After described heat treated terminates, in 200 minutes, be coated with polyamic acid A varnish on said surface, in addition, utilize the method identical with embodiment 1 to form the flexible base, board that thickness is 25 μm, and then flexible base, board is peeled off.Peel strength is shown in Table 1.
Comparative example 1
Except mode sheet glass not heated, carry out similarly to Example 1 and form flexible base, board and peeled off.Show the result in table 1.
[table 1]
From the result finding of those embodiments, comparative example, after heat treated is carried out to rigid support body, coating resin solution and form flexible base, board, and good peel strength can be obtained.Therefore, if form flexible base, board by this way on rigid support body, then set functional layer can be arranged accurately in follow-up functional layer formation process, and also can easily flexible base, board being removed from rigid support body together with functional layer in supporter removal step, therefore, it is possible to low cost and easily manufacturing flexible element.
Claims (7)
1. a manufacture method for flexible member, comprises following operation: flexible base, board formation process, coating resin solution on rigid support body and form flexible base, board on rigid support body; Functional layer formation process, described flexible base, board forms functional layer; And supporter removal step, the described flexible base, board defining functional layer is removed from rigid support body together with functional layer, and the feature of the manufacture method of described flexible member is:
In described flexible base, board formation process, coating resin solution after heat treated is carried out to rigid support body.
2. the manufacture method of flexible member according to claim 1, is characterized in that: the maximum temperature of described heat treated is more than 300 DEG C.
3. the manufacture method of flexible member according to claim 1 and 2, is characterized in that: after described heat treated terminates, in 180 minutes on described rigid support body coating resin solution.
4. a flexible member, it is manufactured by the manufacture method by flexible member according to any one of claim 1 to 3.
5. flexible member according to claim 4, is characterized in that: described flexible member is touch-screen.
6. a flexible member manufacturing installation, the flexible member manufacturing installation of its manufacture method being flexible member according to any one of claim 1 to 3, and the feature of described flexible member manufacturing installation is: there is device rigid support body being carried out continuously heat treated in more than 300 DEG C.
7., in order to form a resin solution for flexible base, board, it is in order to form the flexible base, board of the flexible member according to claim 4 or 5.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014073833 | 2014-03-31 | ||
| JP2014-073833 | 2014-03-31 |
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| Publication Number | Publication Date |
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| CN104952780A true CN104952780A (en) | 2015-09-30 |
| CN104952780B CN104952780B (en) | 2020-09-29 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510148729.8A Expired - Fee Related CN104952780B (en) | 2014-03-31 | 2015-03-31 | Method for manufacturing flexible element, and flexible element manufacturing apparatus |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6548425B2 (en) |
| KR (1) | KR102365293B1 (en) |
| CN (1) | CN104952780B (en) |
| TW (1) | TWI660847B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106595269A (en) * | 2015-10-19 | 2017-04-26 | 上海绿特丹保温工程有限公司 | Belt type reciprocating dual-stroke drying machine |
| CN107565064A (en) * | 2017-07-28 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible display and the substrate for making flexible display |
| CN109790059A (en) * | 2016-10-05 | 2019-05-21 | 日本电气硝子株式会社 | The manufacturing method and glass resin laminated body of glass resin laminated body |
| CN111620296A (en) * | 2020-05-19 | 2020-09-04 | 中国科学院光电技术研究所 | High-flatness fixing method for adding uniform radial pre-tightening force to flexible film |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111295274A (en) * | 2017-12-15 | 2020-06-16 | 东丽株式会社 | Apparatus and method for producing polymer film |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249475A (en) * | 1988-05-19 | 1990-02-19 | Nitto Denko Corp | Manufacture of amorphous silicon solar cell |
| KR20080073941A (en) * | 2007-02-07 | 2008-08-12 | 엘지전자 주식회사 | Manufacturing method of flexible display device |
| CN101345218A (en) * | 2007-07-11 | 2009-01-14 | 株式会社日立显示器 | Method for manufacturing thin film transistors |
| JP2010010411A (en) * | 2008-06-27 | 2010-01-14 | Seiko Epson Corp | Method of manufacturing thin film device |
| CN102089858A (en) * | 2008-02-20 | 2011-06-08 | 夏普株式会社 | Method for manufacturing flexible semiconductor substrate |
| CN102655119A (en) * | 2011-03-04 | 2012-09-05 | 日东电工株式会社 | Method for manufacturing thin-film substrate |
| CN102683379A (en) * | 2011-03-10 | 2012-09-19 | 三星移动显示器株式会社 | Flexible display device and manufacturing method thereof |
| JP2013168445A (en) * | 2012-02-14 | 2013-08-29 | Kaneka Corp | Support with peeling layer, substrate structure, electronic device, and method for manufacturing electronic device |
| CN103325731A (en) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | Manufacturing method of flexible display device |
| CN103456900A (en) * | 2013-08-20 | 2013-12-18 | Tcl集团股份有限公司 | Flexible display device manufacturing method |
| CN203377205U (en) * | 2013-07-19 | 2014-01-01 | 京东方科技集团股份有限公司 | Production device of flexible display member |
| CN103518262A (en) * | 2011-07-06 | 2014-01-15 | 松下电器产业株式会社 | Flexible device manufacturing method and flexible device |
| CN103545463A (en) * | 2013-09-27 | 2014-01-29 | Tcl集团股份有限公司 | Flexible display device and manufacturing method thereof |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6083815A (en) * | 1983-10-14 | 1985-05-13 | Hitachi Chem Co Ltd | Manufacture of extremely thin film |
| JP2803294B2 (en) * | 1990-02-23 | 1998-09-24 | トヨタ自動車株式会社 | Method for producing water-repellent glass |
| JP4027740B2 (en) | 2001-07-16 | 2007-12-26 | 株式会社半導体エネルギー研究所 | Method for manufacturing semiconductor device |
| JP2010202729A (en) * | 2009-03-02 | 2010-09-16 | Hitachi Chemical Dupont Microsystems Ltd | Polyimide precursor resin composition for flexible device substrates and method for producing flexible device using the same, and flexible device |
| JP5699606B2 (en) * | 2011-01-06 | 2015-04-15 | 東洋紡株式会社 | Polyimide precursor solution for film device manufacturing |
| JP2012213872A (en) * | 2011-03-31 | 2012-11-08 | Fujifilm Corp | Method of forming water-repellent film, nozzle plate, ink jet head and ink jet recording device |
| TWI613089B (en) * | 2012-09-14 | 2018-02-01 | 三井化學股份有限公司 | Transparent polyimido laminate, method for producing the same, optical film, method for producing flecible device, touch panel display, liquid crystal display and organic el display |
-
2015
- 2015-03-30 JP JP2015070167A patent/JP6548425B2/en not_active Expired - Fee Related
- 2015-03-31 KR KR1020150045408A patent/KR102365293B1/en active IP Right Grant
- 2015-03-31 TW TW104110489A patent/TWI660847B/en not_active IP Right Cessation
- 2015-03-31 CN CN201510148729.8A patent/CN104952780B/en not_active Expired - Fee Related
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0249475A (en) * | 1988-05-19 | 1990-02-19 | Nitto Denko Corp | Manufacture of amorphous silicon solar cell |
| KR20080073941A (en) * | 2007-02-07 | 2008-08-12 | 엘지전자 주식회사 | Manufacturing method of flexible display device |
| CN101345218A (en) * | 2007-07-11 | 2009-01-14 | 株式会社日立显示器 | Method for manufacturing thin film transistors |
| CN102089858A (en) * | 2008-02-20 | 2011-06-08 | 夏普株式会社 | Method for manufacturing flexible semiconductor substrate |
| JP2010010411A (en) * | 2008-06-27 | 2010-01-14 | Seiko Epson Corp | Method of manufacturing thin film device |
| CN102655119A (en) * | 2011-03-04 | 2012-09-05 | 日东电工株式会社 | Method for manufacturing thin-film substrate |
| CN102683379A (en) * | 2011-03-10 | 2012-09-19 | 三星移动显示器株式会社 | Flexible display device and manufacturing method thereof |
| CN103518262A (en) * | 2011-07-06 | 2014-01-15 | 松下电器产业株式会社 | Flexible device manufacturing method and flexible device |
| JP2013168445A (en) * | 2012-02-14 | 2013-08-29 | Kaneka Corp | Support with peeling layer, substrate structure, electronic device, and method for manufacturing electronic device |
| CN103325731A (en) * | 2013-05-20 | 2013-09-25 | Tcl集团股份有限公司 | Manufacturing method of flexible display device |
| CN203377205U (en) * | 2013-07-19 | 2014-01-01 | 京东方科技集团股份有限公司 | Production device of flexible display member |
| CN103456900A (en) * | 2013-08-20 | 2013-12-18 | Tcl集团股份有限公司 | Flexible display device manufacturing method |
| CN103545463A (en) * | 2013-09-27 | 2014-01-29 | Tcl集团股份有限公司 | Flexible display device and manufacturing method thereof |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106595269A (en) * | 2015-10-19 | 2017-04-26 | 上海绿特丹保温工程有限公司 | Belt type reciprocating dual-stroke drying machine |
| CN109790059A (en) * | 2016-10-05 | 2019-05-21 | 日本电气硝子株式会社 | The manufacturing method and glass resin laminated body of glass resin laminated body |
| CN109790059B (en) * | 2016-10-05 | 2021-11-16 | 日本电气硝子株式会社 | Method for producing glass resin laminate, and glass resin laminate |
| CN107565064A (en) * | 2017-07-28 | 2018-01-09 | 武汉华星光电半导体显示技术有限公司 | The preparation method of flexible display and the substrate for making flexible display |
| CN107565064B (en) * | 2017-07-28 | 2019-08-13 | 武汉华星光电半导体显示技术有限公司 | The production method of flexible display and the substrate for making flexible display |
| CN111620296A (en) * | 2020-05-19 | 2020-09-04 | 中国科学院光电技术研究所 | High-flatness fixing method for adding uniform radial pre-tightening force to flexible film |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI660847B (en) | 2019-06-01 |
| KR20150113926A (en) | 2015-10-08 |
| JP6548425B2 (en) | 2019-07-24 |
| CN104952780B (en) | 2020-09-29 |
| TW201536556A (en) | 2015-10-01 |
| KR102365293B1 (en) | 2022-02-21 |
| JP2015199349A (en) | 2015-11-12 |
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