CN104952761A - Method and system for processing semiconductor device technical processing abnormity - Google Patents
Method and system for processing semiconductor device technical processing abnormity Download PDFInfo
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- CN104952761A CN104952761A CN201410119427.3A CN201410119427A CN104952761A CN 104952761 A CN104952761 A CN 104952761A CN 201410119427 A CN201410119427 A CN 201410119427A CN 104952761 A CN104952761 A CN 104952761A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
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Abstract
The invention discloses a method and system for processing semiconductor device technical processing abnormity. The method includes detecting occurrence of abnormity in a technical processing process, stopping the current process step and giving off blocking type alarm when the abnormity in the technical processing process occurs, and executing corresponding operations according to a selected preset abnormity processing mode. A plurality of preset abnormity processing modes are provided, and different preset abnormity processing modes have different operation step combinations. The situation that single manual processing mode has to be conducted by technical processing personnel in the prior art is changed, the automation and convenience of operation flow after abnormity occurrence are improved, and unnecessary manual error can be prevented.
Description
Technical field
The present invention relates to technical field of semiconductors, particularly relate to a kind of method system of semiconductor equipment processes abnormality processing.
Background technology
Become increasingly complex along with semiconductor integrated circuit technique process becomes, Material Cost is more and more higher, extremely the requirement that technical process in production process is occurred to for the processing method after is also more and more stricter, can ensure that material does not go out of use after not only requiring process abnormality as far as possible, also will allow more easy and convenient further process being done to the material after process abnormality thus completes the processing of this material of technologist.
When occurring abnormal in process, traditional solution is process ends and indicative warning of dishing out, according to actual conditions, manual handle is done to subsequent step by technologist, recipe as new in manual editing complete for the technique do not completed, or directly manually spread out of material etc.And in actual production process, cause technique perform failed situation have a variety of, subsequent treatment is also had nothing in common with each other, such as can continue in some cases execution etc., and in conventional art all unification be treated to process ends; For the material that can remedy, manually can only again write technique list (recipe), re-execute technique, lack convenience, and affect production efficiency.
Summary of the invention
Based on this, be necessary to provide one effectively can solve abnormality processing convenience in explained hereafter poor, the method and system of the semiconductor equipment processes abnormality processing of the problem hindering production efficiency to improve.
For realizing the method for a kind of semiconductor equipment processes abnormality processing that the object of the invention provides, comprise the following steps:
Whether the characterization processes course of processing there is exception;
When described processes process occurs abnormal, stop current process step, and obstructive type of dishing out is reported to the police;
Corresponding operation is performed according to selected default abnormality processing pattern;
Described default abnormality processing pattern is multiple, and different described default abnormality processing patterns comprises different operating procedure combinations.
As a kind of embodiment of the method for semiconductor equipment processes abnormality processing, described default abnormality processing pattern comprises first and presets abnormality processing pattern, second presets abnormality processing pattern, 3rd presets abnormality processing pattern, 4th presets abnormality processing pattern, 5th presets abnormality processing pattern, 6th presets abnormality processing pattern, 7th presets abnormality processing pattern, 8th presets abnormality processing pattern, 9th presets abnormality processing pattern, and more than one the combination in the tenth default abnormality processing pattern;
Default abnormality processing pattern selected by described basis performs corresponding operation, comprises the following steps:
When selected default abnormality processing pattern is the first default abnormality processing pattern, control to continue to perform next processing step in technique list;
When selected default abnormality processing pattern is the second default abnormality processing pattern, control to re-execute current process step;
When selected default abnormality processing pattern is the 3rd default abnormality processing pattern, control to continue to perform current process step;
When selected default abnormality processing pattern is the 4th default abnormality processing pattern, controls the stop process course of processing, wait pending;
When selected default abnormality processing pattern is the 5th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and spread out of material by technical process normal termination;
When selected default abnormality processing pattern is the 6th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and spread out of material by specified path;
When selected default abnormality processing pattern is the 7th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control;
When selected default abnormality processing pattern is the 8th default abnormality processing pattern, control to spread out of material by technical process normal termination;
When selected default abnormality processing pattern is the 9th default abnormality processing pattern, control to spread out of material by specified path;
When selected default abnormality processing pattern is the tenth default abnormality processing pattern, control material directly to transmit Aligning control.
As a kind of embodiment of the method for semiconductor equipment processes abnormality processing, further comprising the steps of:
When described processes process does not occur abnormal, control to continue to perform next processing step, until complete all processing steps in described technique list according to technique list.
As a kind of embodiment of the method for semiconductor equipment processes abnormality processing, described default abnormality processing pattern also comprises the 11 and presets abnormality processing pattern, default abnormality processing pattern selected by described basis performs corresponding operation, further comprising the steps of:
When selected default abnormality processing pattern is the 11 default abnormality processing pattern, control to terminate the current process course of processing.
As a kind of embodiment of the method for semiconductor equipment processes abnormality processing, it is described when selected default abnormality processing pattern is the 6th default abnormality processing pattern, control to perform the processing step removing chuck absorption, and spread out of material by specified path, comprise the following steps:
Arranging current process step number is processing step sequence number corresponding to described releasing chuck absorbing process step, and it is effective to arrange specified path output identification;
Described releasing chuck absorbing process step and subsequent process steps is performed according to the processing step execution sequence in technique list;
After completing all processing steps in described technique list, judge that whether described specified path output identification is effective, if so, then spread out of material by specified path;
Described when selected default abnormality processing pattern is the 7th default abnormality processing pattern, control to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control, comprise the following steps:
Arranging current process step number is processing step sequence number corresponding to described releasing chuck absorbing process step, and arranges that to pass initial point mark back effective;
Described releasing chuck absorbing process step and subsequent process steps is performed according to the processing step execution sequence in technique list;
After completing all processing steps in described technique list, whether effectively pass initial point mark described in judgement back, if so, then material is directly transmitted Aligning control.
Based on the system of a kind of semiconductor equipment processes abnormality processing of same inventive concept, comprise detection module, alarm module, and mode control module, wherein:
Whether described detection module, there is exception for the characterization processes course of processing;
Described alarm module, for when described processes process occurs abnormal, stops current process step, and obstructive type of dishing out is reported to the police;
Described mode control module, for performing corresponding operation according to selected default abnormality processing pattern;
Described default abnormality processing pattern is multiple, and different described default abnormality processing patterns comprises different operating procedure combinations.
As a kind of embodiment of system of semiconductor equipment processes abnormality processing, described default abnormality processing pattern comprises first and presets abnormality processing pattern, second presets abnormality processing pattern, 3rd presets abnormality processing pattern, 4th presets abnormality processing pattern, 5th presets abnormality processing pattern, 6th presets abnormality processing pattern, 7th presets abnormality processing pattern, 8th presets abnormality processing pattern, 9th presets abnormality processing pattern, and more than one the combination in the tenth default abnormality processing pattern;
Described mode control module comprises first mode implementation sub-module, second pattern implementation sub-module, three-mode implementation sub-module, four-mode implementation sub-module, the 5th pattern implementation sub-module, 6th pattern implementation sub-module, 7th pattern implementation sub-module, the 8th pattern implementation sub-module, the 9th pattern implementation sub-module, and the tenth pattern implementation sub-module, wherein:
Described first mode implementation sub-module, during for being the first default abnormality processing pattern when selected default abnormality processing pattern, controls to continue to perform next processing step in technique list;
Described second pattern implementation sub-module, during for being the second default abnormality processing pattern when selected default abnormality processing pattern, controls to re-execute current process step;
Described three-mode implementation sub-module, during for being the 3rd default abnormality processing pattern when selected default abnormality processing pattern, controls to continue to perform current process step;
Described four-mode implementation sub-module, during for being the 4th default abnormality processing pattern when selected default abnormality processing pattern, controlling the stop process course of processing, waiting pending;
Described 5th pattern implementation sub-module, during for being the 5th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and spreading out of material by technical process normal termination;
Described 6th pattern implementation sub-module, during for being the 6th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and spreading out of material by specified path;
Described 7th pattern implementation sub-module, during for being the 7th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control;
Described 8th pattern implementation sub-module, during for being the 8th default abnormality processing pattern when selected default abnormality processing pattern, controls to spread out of material by technical process normal termination;
Described 9th pattern implementation sub-module, during for being the 9th default abnormality processing pattern when selected default abnormality processing pattern, controls to spread out of material by specified path;
Described tenth pattern implementation sub-module, during for being the tenth default abnormality processing pattern when selected default abnormality processing pattern, controls material directly to transmit Aligning control.
As a kind of embodiment of system of semiconductor equipment processes abnormality processing, also comprise technique Executive Module, for when described processes process does not occur abnormal, control to continue to perform next processing step, until complete all processing steps in described technique list according to technique list.
As a kind of embodiment of system of semiconductor equipment processes abnormality processing, described default abnormality processing pattern also comprises the 11 and presets abnormality processing pattern, described mode control module also comprises the 11 pattern implementation sub-module, during for being the 11 default abnormality processing pattern when selected default abnormality processing pattern, control to terminate the current process course of processing.
As a kind of embodiment of system of semiconductor equipment processes abnormality processing, described 6th pattern implementation sub-module comprises the first setting unit, the first performance element, and the first detecting unit, wherein:
Described first setting unit be processing step sequence number corresponding to described releasing chuck absorbing process step for arranging current process step number, and it is effective to arrange specified path output identification;
Described first performance element, for performing described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list;
Described first detecting unit, after completing all processing steps in described technique list, judges that whether described specified path output identification is effective, if so, then spreads out of material by specified path;
Described 7th pattern implementation sub-module comprises the second setting unit, the second performance element, and the second detecting unit, wherein:
Described second setting unit is processing step sequence number corresponding to described releasing chuck absorbing process step for arranging current process step number, and arranges that to pass initial point mark back effective;
Described second performance element, for performing described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list;
Whether effective described second detecting unit, after completing all processing steps in described technique list, pass initial point mark back, if so, then material directly transmitted Aligning control described in judgement.
Beneficial effect of the present invention comprises:
The method and system of a kind of semiconductor equipment processes abnormality processing provided by the invention, by selecting the multiple abnormality processing patterns pre-set, process abnormality situation is processed, processes process can automatically perform corresponding processes step according to selection, or directly process ends process, changing must by the single-mode of processes personnel manual handle in conventional art.Improve automaticity and the convenience of the operating process after process abnormality, and unnecessary mistake can be avoided.
Accompanying drawing explanation
Fig. 1 is the flow chart of a specific embodiment of the method for a kind of semiconductor equipment processes of the present invention abnormality processing;
Fig. 2 is the flow chart of another specific embodiment of the method for a kind of semiconductor equipment processes of the present invention abnormality processing;
Fig. 3 is the System's composition schematic diagram of a specific embodiment of the system of a kind of semiconductor equipment processes of the present invention abnormality processing;
Fig. 4 is that the 6th pattern implementation sub-module of a specific embodiment of the method for a kind of semiconductor equipment processes of the present invention abnormality processing forms schematic diagram;
Fig. 5 is that the 7th pattern implementation sub-module of a specific embodiment of the method for a kind of semiconductor equipment processes of the present invention abnormality processing forms schematic diagram.
Embodiment
In order to make object of the present invention, technical scheme and advantage clearly understand, be described below in conjunction with the embodiment of accompanying drawing to the method and system of semiconductor equipment processes abnormality processing of the present invention.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The method of the semiconductor equipment processes abnormality processing of the embodiment of the present invention, as shown in Figure 1, comprises the following steps:
S100, whether the characterization processes course of processing there is exception.After processes starts, whether the real-time characterization processes course of processing there are abnormal conditions, and described abnormal conditions may appear in arbitrary processing step of processes.
S200, when described processes process occurs abnormal, stops current process step, and obstructive type of dishing out is reported to the police.Different from traditional processes abnormal conditions process, the embodiment of the present invention sends obstructive type and reports to the police instead of traditional indicative warning.Obstructive type in the embodiment of the present invention is reported to the police while sending warning, is suspended current processes step, and selects to the process abnormality processing mode prompting processes personnel that processes personnel provide plurality of optional to select.
S300, performs corresponding operation according to selected default abnormality processing pattern.Described default abnormality processing pattern is multiple, and different described default abnormality processing patterns comprises different operating procedure combinations.Processes personnel select suitable abnormality processing mode according to processes step and actual process process requirements.As for needing the material re-starting processes, directly can select to send material back to initial point and re-starting processes; Can select to continue to perform next processes step etc. to the technique can ignoring current process step.
The method of the semiconductor equipment processes abnormality processing of the embodiment of the present invention, by selecting the multiple abnormality processing patterns pre-set, process abnormality situation is processed, processes process can automatically perform corresponding processes step according to selection, or directly process ends process, changing must by the single-mode of processes personnel manual handle in conventional art.Improve automaticity and the convenience of the operating process after process abnormality, and unnecessary mistake can be avoided, likely compiling mistake etc. as updated technique list recipe.
In the embodiment of the method for a semiconductor equipment processes abnormality processing wherein, described default abnormality processing pattern comprises first and presets abnormality processing Mode A 1, second presets abnormality processing Mode A 2,3rd presets abnormality processing Mode A 3,4th presets abnormality processing Mode A 4,5th presets abnormality processing Mode A 5,6th presets abnormality processing Mode A 6,7th presets abnormality processing Mode A 7,8th presets abnormality processing Mode A 8,9th presets abnormality processing Mode A 9, and more than one the combination in the tenth default abnormality processing Mode A 10; Step S300, performs corresponding operation according to selected default abnormality processing pattern, comprises the following steps:
S310, when selected default abnormality processing pattern is the first default abnormality processing pattern, controls to continue to perform next processing step in technique list.
S320, when selected default abnormality processing pattern is the second default abnormality processing pattern, controls to re-execute current process step.
S330, when selected default abnormality processing pattern is the 3rd default abnormality processing pattern, controls to continue to perform current process step.
S340, when selected default abnormality processing pattern is the 4th default abnormality processing pattern, controls the stop process course of processing, waits pending.
S350, when selected default abnormality processing pattern is the 5th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and spreads out of material by technical process normal termination.
S360, when selected default abnormality processing pattern is the 6th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and spreads out of material by specified path.
S370, when selected default abnormality processing pattern is the 7th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control.
S380, when selected default abnormality processing pattern is the 8th default abnormality processing pattern, controls to spread out of material by technical process normal termination.
S390, when selected default abnormality processing pattern is the 9th default abnormality processing pattern, controls to spread out of material by specified path.
S3100, when selected default abnormality processing pattern is the tenth default abnormality processing pattern, controls material directly to transmit Aligning control.
As shown in Figure 2, first read the technique list of processes, the step obtaining processes adds up to n, and to arrange initial processes step be 1, is expressed as step=1.Processes is carried out according to the processes sequence of steps in technique list.Often complete a step process procedure of processing, the value of corresponding step number step increases 1, until complete the processing of n step process.And reception exception reporting is detected in real time in processes process, point out the suitable default abnormality processing pattern of processes personnel selection to carry out abnormality processing when abnormal conditions appear in equipment.As when processes personnel selection Mode A 1, stop current processing step, directly perform next processing step, now the value of another step parameter step increases 1, and performs corresponding processing step and follow-up processing step, until complete processes process.For other patterns, according to the setting of operator scheme, directly can jump to corresponding processes step, described step parameter step is set to maximum n and then can exits processes step, enter follow-up material transferring step or direct end operation.Processes personnel directly can select according to the tupe preset, and only have and just proceed to manual operation process if desired, otherwise all can selectively automatically process.
In the embodiment of the method for a semiconductor equipment processes abnormality processing wherein, further comprising the steps of:
When described processes process does not occur abnormal, control to continue to perform next processing step, until complete all processing steps in described technique list according to technique list.
When described processes process does not occur abnormal, then complete each the processes step in technique list according to normal procedure (identical with conventional art processing mode) order.As shown in Figure 2, after completing a step process procedure of processing, the value of another step parameter step increases 1, thus proceeds next processes step, until end operation after completing all processes steps.
In the embodiment of the method for a semiconductor equipment processes abnormality processing wherein, described default abnormality processing pattern also comprises the 11 and presets abnormality processing Mode A 11, step S300, performs corresponding operation according to selected default abnormality processing pattern, further comprising the steps of:
S3110, when selected default abnormality processing pattern is the 11 default abnormality processing pattern, controls to terminate the current process course of processing.For the processes process not having material, can the direct process ends course of processing for some abnormal conditions, without the need to other operations.
In conjunction with aforesaid 10 kinds of default abnormality processing patterns, described by 11 kinds of default abnormality processing patterns going out meet the processing demands of various processing step exception, to cover comprehensively, accurately.
Process comparatively simple when there are abnormal conditions for there is no the processes process of material.Following four kinds of modes can be adopted to process, except the Mode A 11 described in the embodiment of the present invention, also comprise aforesaid A1, A2, A3 pattern, can be referred to as these four kinds of patterns is without material abnormality processing pattern.And aforesaid A1 ~ A10 can be configured with material abnormality processing pattern jointly.The transmitting step of material can be ignored under without material abnormality processing pattern.
Preferably, in the embodiment of the method for a semiconductor equipment processes abnormality processing wherein, step S360, when selected default abnormality processing pattern is the 6th default abnormality processing pattern, control to perform the processing step removing chuck absorption (De-chuck), and spread out of material by specified path, as shown in Figure 2, comprise the following steps:
S361, arranging current process step number is processing step sequence number corresponding to described releasing chuck absorbing process step, even the value of step parameter step is the step number that De-chuck processing step is corresponding, and it is effective to arrange specified path output identification, even specified path output identification f1=1.
S362, performs described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list.Perform the step parameter determining step in Fig. 2 after step S361 is provided with, parameter judges, by rear, to perform corresponding processing step, is also De-chuck step.
S363, after completing all processing steps in described technique list, judges that whether described specified path output identification is effective, if so, then spreads out of material by specified path.Just can relate to spreading out of of material after completing all processing steps, therefore, in the end the mode that spreads out of of material be detected, and spread out of material when satisfying condition by specified path.Described specified path be set before processes starts abnormal for generating process time material transferring path, the path that when it is different from the normal termination of processes process, material spreads out of.
Similar, step S370, when selected default abnormality processing pattern is the 7th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control, comprise the following steps:
S371, arranging current process step number is processing step sequence number corresponding to described releasing chuck absorbing process step, even the value of step parameter step is the step number that De-chuck processing step is corresponding, and setting passes initial point mark back effectively, even pass initial point mark f2=1 back.
S372, performs described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list.
Whether effective S373, after completing all processing steps in described technique list, pass initial point mark back, if so, then material directly transmitted Aligning control described in judgement.
By arranging the mode of different material transmission path flag bit in the embodiment of the present invention, to the judgement in material transferring path be adjusted to after processes step completes, make the embodiment of the present invention do less change on the basis that original processes processing procedure controls, be more convenient for understanding and using.Meanwhile, the judgement in material transferring path and the demand of adjustment also realistic processes is finally carried out in processes process.
Based on same inventive concept, the embodiment of the present invention provides a kind of system of semiconductor equipment processes abnormality processing, the principle of dealing with problems due to this system is similar to the method for aforementioned a kind of semiconductor equipment processes abnormality processing, therefore, the enforcement of this system can realize according to the concrete steps of preceding method, repeats part and repeats no more.
The system of the semiconductor equipment processes abnormality processing of the embodiment of the present invention, as shown in Figure 3, comprises detection module 100, alarm module 200, and mode control module 300.Wherein: whether described detection module 100, occur exception for the characterization processes course of processing; Described alarm module 200, for when described processes process occurs abnormal, stops current process step, and obstructive type of dishing out is reported to the police; Described mode control module 300, for performing corresponding operation according to selected default abnormality processing pattern; Described default abnormality processing pattern is multiple, and different described default abnormality processing patterns comprises different operating procedure combinations.
It should be noted that herein, in described operating procedure combination, an operating procedure may be comprised, as direct process ends procedure of processing; Also may comprise several operating procedure, then perform by the order preset the multiple operating procedures comprised.
The system of the semiconductor equipment processes abnormality processing of the embodiment of the present invention, by selecting the multiple abnormality processing patterns pre-set, process abnormality situation is processed, processes process can automatically perform corresponding processes step according to selection, or directly process ends process, changing must by the single-mode of processes personnel manual handle in conventional art.Improve automaticity and the convenience of the operating process after process abnormality, and unnecessary mistake can be avoided, likely compiling mistake as updated technique list recipe.
In the embodiment of the system of a semiconductor equipment processes abnormality processing wherein, described default abnormality processing pattern comprises first and presets abnormality processing pattern, second presets abnormality processing pattern, 3rd presets abnormality processing pattern, 4th presets abnormality processing pattern, 5th presets abnormality processing pattern, 6th presets abnormality processing pattern, 7th presets abnormality processing pattern, 8th presets abnormality processing pattern, 9th presets abnormality processing pattern, and more than one the combination in the tenth default abnormality processing pattern.
Described mode control module 300 comprises first mode implementation sub-module 310, second pattern implementation sub-module 320, three-mode implementation sub-module 330, four-mode implementation sub-module 340, the 5th pattern implementation sub-module the 350, six pattern implementation sub-module 360,7th pattern implementation sub-module 370,8th pattern implementation sub-module the 380, nine pattern implementation sub-module 390, and the tenth pattern implementation sub-module 3100.Wherein: described first mode implementation sub-module 310, during for being the first default abnormality processing pattern when selected default abnormality processing pattern, control to continue to perform next processing step in technique list; Described second pattern implementation sub-module 320, during for being the second default abnormality processing pattern when selected default abnormality processing pattern, controls to re-execute current process step; Described three-mode implementation sub-module 330, during for being the 3rd default abnormality processing pattern when selected default abnormality processing pattern, controls to continue to perform current process step; Described four-mode implementation sub-module 340, during for being the 4th default abnormality processing pattern when selected default abnormality processing pattern, controlling the stop process course of processing, waiting pending; Described 5th pattern implementation sub-module 350, during for being the 5th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and spreading out of material by technical process normal termination; Described 6th pattern implementation sub-module 360, during for being the 6th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and spreading out of material by specified path; Described 7th pattern implementation sub-module 370, during for being the 7th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control; Described 8th pattern implementation sub-module 380, during for being the 8th default abnormality processing pattern when selected default abnormality processing pattern, controls to spread out of material by technical process normal termination; Described 9th pattern implementation sub-module 390, during for being the 9th default abnormality processing pattern when selected default abnormality processing pattern, controls to spread out of material by specified path; Described tenth pattern implementation sub-module 3100, during for being the tenth default abnormality processing pattern when selected default abnormality processing pattern, controls material directly to transmit Aligning control.
In the embodiment of the present invention, processes personnel directly can select according to the multiple tupe preset, and only have and just proceed to manual operation process if desired, otherwise all selectively automatically can process abnormality processing.
In the embodiment of the system of a semiconductor equipment processes abnormality processing wherein, also comprise technique Executive Module 400, for when described processes process does not occur abnormal, control to continue to perform next processing step, until complete all processing steps in described technique list according to technique list.
In the embodiment of the system of a semiconductor equipment processes abnormality processing wherein, described default abnormality processing pattern also comprises the 11 and presets abnormality processing pattern, described mode control module 300 also comprises the 11 pattern implementation sub-module 3110, during for being the 11 default abnormality processing pattern when selected default abnormality processing pattern, control to terminate the current process course of processing.
In conjunction with aforesaid 10 kinds of default abnormality processing patterns, described by 11 kinds of default abnormality processing patterns going out meet the processing demands of various processing step exception, to cover comprehensively, accurately.
In the embodiment of the system of a semiconductor equipment processes abnormality processing wherein, as shown in Figure 4, described 6th pattern implementation sub-module 360 comprises the first setting unit 361, first performance element 362, and the first detecting unit 363.Wherein: described first setting unit 361, be processing step sequence number corresponding to described releasing chuck absorbing process step for arranging current process step number, and it is effective to arrange specified path output identification; Described first performance element 362, for performing described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list; Described first detecting unit 363, after completing all processing steps in described technique list, judges that whether described specified path output identification is effective, if so, then spreads out of material by specified path.
Similar, as shown in Figure 5, described 7th pattern implementation sub-module 370 comprises the second setting unit 371, second performance element 372, and the second detecting unit 373.Wherein: described second setting unit 371, be processing step sequence number corresponding to described releasing chuck absorbing process step for arranging current process step number, and arrange that to pass initial point mark back effective; Described second performance element 372, for performing described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list; Whether effective described second detecting unit 373, after completing all processing steps in described technique list, pass initial point mark back, if so, then material directly transmitted Aligning control described in judgement.
By arranging the mode of different material transmission path flag bit in the embodiment of the present invention, to the judgement in material transferring path be adjusted to after processes step completes, make the embodiment of the present invention do less change on the basis that original processes processing procedure controls, be more convenient for understanding and using.Meanwhile, the judgement in material transferring path and the demand of adjustment also realistic processes is finally carried out in processes process.
The above embodiment only have expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (10)
1. a method for semiconductor equipment processes abnormality processing, is characterized in that, comprises the following steps:
Whether the characterization processes course of processing there is exception;
When described processes process occurs abnormal, stop current process step, and obstructive type of dishing out is reported to the police;
Corresponding operation is performed according to selected default abnormality processing pattern;
Described default abnormality processing pattern is multiple, and different described default abnormality processing patterns comprises different operating procedure combinations.
2. the method for semiconductor equipment processes abnormality processing according to claim 1, it is characterized in that, described default abnormality processing pattern comprises first and presets abnormality processing pattern, second presets abnormality processing pattern, 3rd presets abnormality processing pattern, 4th presets abnormality processing pattern, 5th presets abnormality processing pattern, 6th presets abnormality processing pattern, 7th presets abnormality processing pattern, 8th presets abnormality processing pattern, and the 9th presets abnormality processing pattern, and more than one the combination in the tenth default abnormality processing pattern;
Default abnormality processing pattern selected by described basis performs corresponding operation, comprises the following steps:
When selected default abnormality processing pattern is the first default abnormality processing pattern, control to continue to perform next processing step in technique list;
When selected default abnormality processing pattern is the second default abnormality processing pattern, control to re-execute current process step;
When selected default abnormality processing pattern is the 3rd default abnormality processing pattern, control to continue to perform current process step;
When selected default abnormality processing pattern is the 4th default abnormality processing pattern, controls the stop process course of processing, wait pending;
When selected default abnormality processing pattern is the 5th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and spread out of material by technical process normal termination;
When selected default abnormality processing pattern is the 6th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and spread out of material by specified path;
When selected default abnormality processing pattern is the 7th default abnormality processing pattern, controls to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control;
When selected default abnormality processing pattern is the 8th default abnormality processing pattern, control to spread out of material by technical process normal termination;
When selected default abnormality processing pattern is the 9th default abnormality processing pattern, control to spread out of material by specified path;
When selected default abnormality processing pattern is the tenth default abnormality processing pattern, control material directly to transmit Aligning control.
3. the method for semiconductor equipment processes abnormality processing according to claim 1, is characterized in that, further comprising the steps of:
When described processes process does not occur abnormal, control to continue to perform next processing step, until complete all processing steps in described technique list according to technique list.
4. the method for semiconductor equipment processes abnormality processing according to claim 2, is characterized in that, described default abnormality processing pattern also comprises the 11 and presets abnormality processing pattern;
Default abnormality processing pattern selected by described basis performs corresponding operation, further comprising the steps of:
When selected default abnormality processing pattern is the 11 default abnormality processing pattern, control to terminate the current process course of processing.
5. the method for semiconductor equipment processes abnormality processing according to claim 2, it is characterized in that, it is described when selected default abnormality processing pattern is the 6th default abnormality processing pattern, control to perform the processing step removing chuck absorption, and spread out of material by specified path, comprise the following steps:
Arranging current process step number is processing step sequence number corresponding to described releasing chuck absorbing process step, and it is effective to arrange specified path output identification;
Described releasing chuck absorbing process step and subsequent process steps is performed according to the processing step execution sequence in technique list;
After completing all processing steps in described technique list, judge that whether described specified path output identification is effective, if so, then spread out of material by specified path;
Described when selected default abnormality processing pattern is the 7th default abnormality processing pattern, control to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control, comprise the following steps:
Arranging current process step number is processing step sequence number corresponding to described releasing chuck absorbing process step, and arranges that to pass initial point mark back effective;
Described releasing chuck absorbing process step and subsequent process steps is performed according to the processing step execution sequence in technique list;
After completing all processing steps in described technique list, whether effectively pass initial point mark described in judgement back, if so, then material is directly transmitted Aligning control.
6. a system for semiconductor equipment processes abnormality processing, is characterized in that, comprises detection module, alarm module, and mode control module, wherein:
Whether described detection module, there is exception for the characterization processes course of processing;
Described alarm module, for when described processes process occurs abnormal, stops current process step, and obstructive type of dishing out is reported to the police;
Described mode control module, for performing corresponding operation according to selected default abnormality processing pattern;
Described default abnormality processing pattern is multiple, and different described default abnormality processing patterns comprises different operating procedure combinations.
7. the system of semiconductor equipment processes abnormality processing according to claim 6, it is characterized in that, described default abnormality processing pattern comprises first and presets abnormality processing pattern, second presets abnormality processing pattern, 3rd presets abnormality processing pattern, 4th presets abnormality processing pattern, 5th presets abnormality processing pattern, 6th presets abnormality processing pattern, 7th presets abnormality processing pattern, 8th presets abnormality processing pattern, and the 9th presets abnormality processing pattern, and more than one the combination in the tenth default abnormality processing pattern;
Described mode control module comprises first mode implementation sub-module, second pattern implementation sub-module, three-mode implementation sub-module, four-mode implementation sub-module, the 5th pattern implementation sub-module, 6th pattern implementation sub-module, 7th pattern implementation sub-module, the 8th pattern implementation sub-module, the 9th pattern implementation sub-module, and the tenth pattern implementation sub-module, wherein:
Described first mode implementation sub-module, during for being the first default abnormality processing pattern when selected default abnormality processing pattern, controls to continue to perform next processing step in technique list;
Described second pattern implementation sub-module, during for being the second default abnormality processing pattern when selected default abnormality processing pattern, controls to re-execute current process step;
Described three-mode implementation sub-module, during for being the 3rd default abnormality processing pattern when selected default abnormality processing pattern, controls to continue to perform current process step;
Described four-mode implementation sub-module, during for being the 4th default abnormality processing pattern when selected default abnormality processing pattern, controlling the stop process course of processing, waiting pending;
Described 5th pattern implementation sub-module, during for being the 5th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and spreading out of material by technical process normal termination;
Described 6th pattern implementation sub-module, during for being the 6th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and spreading out of material by specified path;
Described 7th pattern implementation sub-module, during for being the 7th default abnormality processing pattern when selected default abnormality processing pattern, controlling to perform the processing step removing chuck absorption, and material is directly transmitted Aligning control;
Described 8th pattern implementation sub-module, during for being the 8th default abnormality processing pattern when selected default abnormality processing pattern, controls to spread out of material by technical process normal termination;
Described 9th pattern implementation sub-module, during for being the 9th default abnormality processing pattern when selected default abnormality processing pattern, controls to spread out of material by specified path;
Described tenth pattern implementation sub-module, during for being the tenth default abnormality processing pattern when selected default abnormality processing pattern, controls material directly to transmit Aligning control.
8. the system of semiconductor equipment processes abnormality processing according to claim 6, it is characterized in that, also comprise technique Executive Module, for when described processes process does not occur abnormal, control to continue to perform next processing step, until complete all processing steps in described technique list according to technique list.
9. the system of semiconductor equipment processes abnormality processing according to claim 7, is characterized in that, described default abnormality processing pattern also comprises the 11 and presets abnormality processing pattern;
Described mode control module also comprises the 11 pattern implementation sub-module, during for being the 11 default abnormality processing pattern when selected default abnormality processing pattern, controls to terminate the current process course of processing.
10. the system of semiconductor equipment processes abnormality processing according to claim 7, is characterized in that:
Described 6th pattern implementation sub-module comprises the first setting unit, the first performance element, and the first detecting unit, wherein:
Described first setting unit be processing step sequence number corresponding to described releasing chuck absorbing process step for arranging current process step number, and it is effective to arrange specified path output identification;
Described first performance element, for performing described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list;
Described first detecting unit, after completing all processing steps in described technique list, judges that whether described specified path output identification is effective, if so, then spreads out of material by specified path;
Described 7th pattern implementation sub-module comprises the second setting unit, the second performance element, and the second detecting unit, wherein:
Described second setting unit is processing step sequence number corresponding to described releasing chuck absorbing process step for arranging current process step number, and arranges that to pass initial point mark back effective;
Described second performance element, for performing described releasing chuck absorbing process step and subsequent process steps according to the processing step execution sequence in technique list;
Whether effective described second detecting unit, after completing all processing steps in described technique list, pass initial point mark back, if so, then material directly transmitted Aligning control described in judgement.
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