CN104943320B - A kind of applying method of substrate - Google Patents
A kind of applying method of substrate Download PDFInfo
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- CN104943320B CN104943320B CN201510253335.9A CN201510253335A CN104943320B CN 104943320 B CN104943320 B CN 104943320B CN 201510253335 A CN201510253335 A CN 201510253335A CN 104943320 B CN104943320 B CN 104943320B
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- substrate
- pattern
- laminating
- region
- protection
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/30—Partial laminating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/0076—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised in that the layers are not bonded on the totality of their surfaces
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Abstract
The invention provides a kind of applying method of substrate, is related to product manufacturing technical field, can solve the problem that after in prior art fitting to thin substrate on thick substrate, as the thin substrate that the active force of fitting between thin substrate and thick substrate causes by force is difficult to the problem that peels off.Concrete scheme is：Pasting on region in first substrate, forms laminating pattern with gap, and what second substrate was covered in first substrate pastes region so that second substrate and pattern contacts of fitting, the thickness of second substrate are less than the thickness of first substrate.The embodiment of the present invention is used for carrying out baseplate-laminating.
Description
Technical field
The present invention relates to product manufacturing technical field, more particularly to a kind of applying method of substrate.
Background technology
Ultrathin products are the main flow directions of future electronic product, due to the thickness of ultrathin products less (such as 0.2 millimeter),
So that ultrathin products are easily lost, it is difficult to make.Existing manufacture craft generally directly cannot be processed super on ultra thin substrate
Thin product, and need support and the protection by thick substrate.
In prior art, generally first on thick substrate 001, one layer of attaching film 002 is formed, then ultra thin substrate 003 is led to
Cross and fit with attaching film 002, and then ultra thin substrate 003 is fitted on thick substrate 001；Afterwards ultra thin substrate 003 is entered
Row processing and fabricating, so as to obtain ultrathin products.Wherein, ultra thin substrate 003 is fitted to the sectional view after thick substrate 001 to join
See Fig. 1.However, stronger between ultra thin substrate and attaching film in prior art often fit active force so that after machining
Ultra thin substrate be difficult to peel off.
Content of the invention
Embodiments of the invention provide a kind of applying method of substrate, can solve the problem that in prior art and fit to thin substrate
After on thick substrate, as the thin substrate that the active force of fitting between thin substrate and thick substrate causes by force is difficult to the problem that peels off.
For reaching above-mentioned purpose, embodiments of the invention are adopted the following technical scheme that：
On the one hand, there is provided a kind of applying method of substrate, the method include：
Pasting on region in first substrate, forms the laminating pattern with gap；
What second substrate was covered in the first substrate pastes region so that the second substrate and the pattern of fitting
Contact, the thickness of the second substrate are less than the thickness of first substrate.
In conjunction with this aspect, in the first mode in the cards of this aspect, second substrate is covered in institute described
State first substrate paste region before, methods described also includes：
On the region that the first substrate corresponds to the gap, form first and protect pattern, the first protection pattern
Thickness with described laminating pattern thickness identical.
In conjunction with the first mode in the cards of this aspect, in second mode in the cards of this aspect,
While forming the described first protection pattern, methods described also includes：
In the outer peripheral areas of pattern of fitting described in the first substrate, the second protection pattern that formation is closed, described second
The thickness of protection pattern is identical with the thickness of the laminating pattern.
In conjunction with this aspect, in the third mode in the cards of this aspect, the laminating pattern is uniform arrangement
Bar paten.
In conjunction with this aspect, in the 4th kind of mode in the cards of this aspect, described region is pasted in first substrate
On, forming the laminating pattern with gap includes：
Attaching film is made on the first substrate；
The attaching film composition is formed the laminating with gap for pasting region for being located at the first substrate
Pattern.
In conjunction with second possible implementation of this aspect, in the 5th kind of mode in the cards of this aspect,
While forming the protection pattern, in the outer peripheral areas of pattern of fitting described in the first substrate, described the of closing is formed
Two protection patterns include：
Protective film is made on the first substrate；
The protective film composition is formed the region for pasting the correspondence gap on region for being located at the first substrate
Described first protection pattern, and formed positioned at described in the first substrate fit pattern outer peripheral areas described second protection
Pattern.
In conjunction with the 5th kind of possible implementation of this aspect to this aspect, in the 6th kind of side in the cards of this aspect
In formula, the first substrate and the second substrate are glass substrate, plastic base or metal substrate.
In conjunction with the 6th kind of possible implementation of this aspect, in the 7th kind of mode in the cards of this aspect, if
The first substrate and the second substrate are glass substrate, then the material of the laminating pattern is tin indium oxide.
In conjunction with the 6th kind of possible implementation of this aspect, in the 8th kind of mode in the cards of this aspect, if
The first substrate and the second substrate are glass substrate, then the material of the first protection pattern is silicon nitride, carbonization
Silicon or polyimides.
The embodiment of the present invention provides a kind of applying method of substrate, has by the formation on region that pastes in first substrate
Thickness is then covered in pasting on region for first substrate less than the second substrate of first substrate and causes by the laminating pattern in gap
Second substrate and the pattern contacts of fitting with gap, so that second substrate can only be by pasting on region with first substrate
Laminating active force at laminating pattern is fitted on first substrate, and second substrate pastes on region, with first substrate, pattern of fitting
Gap location do not fit active force, so as to reduce the active force of fitting of second substrate and first substrate.In prior art
By not setting compared with one layer of attaching film in gap fit together between first substrate, the embodiment of the present invention is carried second substrate
For method can solve the problem that and in prior art fit to thin substrate on thick substrate after, due between thin substrate and thick substrate
The thin substrate that laminating active force causes by force is difficult to the problem that peels off.
Description of the drawings
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
Accompanying drawing to be used needed for technology description is had to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, acceptable
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is, in prior art, ultra thin substrate is fitted to the sectional view after thick substrate；
Fig. 2 is a kind of method flow schematic diagram provided in an embodiment of the present invention；
Fig. 3 is a kind of sectional view of first substrate for forming laminating pattern provided in an embodiment of the present invention；
Fig. 4 is provided in an embodiment of the present invention a kind of second substrate to be fitted to the of the formation laminating pattern shown in Fig. 3
Sectional view after one substrate；
Fig. 5-7 is the top view of laminating pattern in structure shown in Fig. 3 provided in an embodiment of the present invention；
Fig. 8 is another method flow schematic diagram provided in an embodiment of the present invention；
Fig. 9 is a kind of section view of first substrate for forming laminating pattern and the first protection pattern provided in an embodiment of the present invention
Figure；
Figure 10-12 is the vertical view of laminating pattern and the first protection pattern in structure shown in Fig. 9 provided in an embodiment of the present invention
Figure；
Figure 13 is that pattern protected by a kind of laminating pattern, the first protection pattern and second of being formed provided in an embodiment of the present invention
The sectional view of first substrate；
Figure 14 is fit in structure shown in Figure 13 provided in an embodiment of the present invention pattern, the first protection pattern and the second protection
The top view of pattern；
Figure 15 is a kind of formation laminating pattern and the fitted to second substrate shown in Fig. 9 provided in an embodiment of the present invention
Sectional view after the first substrate of one protection pattern；
Figure 16 be provided in an embodiment of the present invention a kind of by second substrate fit to formation laminating pattern shown in Figure 13, the
Sectional view after the first substrate of one protection pattern and the second protection pattern；
Figure 17 is another method flow schematic diagram provided in an embodiment of the present invention.
Specific embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
In describing the invention, it is to be understood that term " on ", the orientation of instruction such as D score or position relationship be base
In orientation shown in the drawings or position relationship, it is for only for ease of the description present invention and simplifies description, rather than indicate or imply
The device of indication or element must be with specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to this
The restriction of invention.
Embodiment 1
A kind of applying method of substrate is embodiments provided, referring to Fig. 2, the key step of the method can be wrapped
Include：
101 as shown in figure 3, pasting on region in first substrate 011, forms the laminating pattern 012 with gap.
102 as shown in figure 4, what second substrate 013 was covered in first substrate 011 pastes region so that second substrate
013 is contacted with laminating pattern 012, and the thickness of second substrate 013 is less than the thickness of first substrate 011.
Wherein, first substrate 011 and second substrate 013 can be the arbitrarily material such as glass substrate, plastic base, metal substrate
The substrate of material, and first substrate 011 can be the same or different with the material of second substrate 013, is not limited here.
The region that pastes of first substrate 011 refers to, during laminating, in view of the vertical line direction of first substrate 011,
The meeting region Chong Die with second substrate 013.Example, the size of general first substrate 011 is more than the size of second substrate 013,
Now, the region that pastes of first substrate 011 can be view field of the second substrate 013 on first substrate 011；Certainly,
The size of one substrate 011 can also be equal to the size of second substrate 013, and now, the region that pastes of first substrate 011 can be the
The whole surface region of one substrate 011；Example again, the size of first substrate 011 is also less than the chi of second substrate 013
Very little, now, the region that pastes of first substrate 011 can still be the whole surface region of first substrate 011.
Laminating pattern 012 refers to the pattern with laminating effect, in the present embodiment in order to by second substrate 013 and first
Substrate 011 fits together, it is however generally that, if the material depending on the pattern is acted on laminating.In the present embodiment, the figure
The material of case can be material or the cohesive material that can form intermolecular force with second substrate 013.In addition, so-called
The laminating pattern 012 pasted on region with gap of one substrate 011 refers to, pasting on region in first substrate 011, only
A part of region pattern 012 of being fitted is covered, and the region not covered by laminating pattern 012 by another part is referred to as gap.Should
Can not be filled by any other material in gap.
For the shape of pattern 012 of fitting in structure shown in Fig. 3, multiple discontinuous pattern (i.e. multiple figures can be included
Do not connect between case), the interval between these discontinuous patterns is gap.Example, laminating figure in structure shown in Fig. 3
The top view of case 012 is referred to Fig. 5, and bar paten of the pattern 012 for uniform arrangement of fitting, second substrate 013 can pass through
The bar shaped laminating pattern 012 of uniform arrangement is fit together with first substrate 011 so that second substrate 013 and first substrate 011
Between laminating active force more uniform so that relatively thin second substrate 013 peel off when be difficult to be damaged.Specifically such as
Shown in Fig. 5 (a), bar paten is arranged in array, and the distance s in the horizontal direction between every adjacent bar pattern are equal,
Spacing d on vertical direction per adjacent bar pattern is also equal, and wherein s and d equal can not also can be waited, and needs explanation
Be the bar paten be usually rectangle；Or as shown in Fig. 5 (b), bar paten equidistantly arranges (spacing use along horizontal direction
V is identified), each bar paten vertically extends.Or, example, the vertical view of pattern 012 of fitting in structure shown in Fig. 3
Figure can also be with reference to Fig. 6, and laminating pattern 012 is net-like pattern.Or, and example, pattern 012 of fitting in structure shown in Fig. 3
Top view can also be with reference to Fig. 7, laminating pattern 012 is irregular pattern.It is true that laminating pattern 012 can be arbitrary shape
The pattern of shape, the embodiment of the present invention are not limited to its concrete shape.
Above-mentioned laminating pattern 012 can be formed on first substrate 011 by patterning processes, and so-called patterning processes are permissible
Including：The techniques such as film forming, exposure, development, it is of course possible to the technique such as further include to etch, peel off.Certainly, in the present embodiment
Patterning processes are also not necessarily limited to this, as long as the technique that can form the pattern of certain shape on substrate all should be in the protection of the present invention
In the range of.Exemplary, attaching film can be made on first substrate 011, then attaching film composition is formed and be located at the
The laminating pattern 012 with gap for pasting region of one substrate 011.
Above-mentioned steps 101 and 102 are used for for relatively thin second substrate 013 fitting to thicker first substrate 011, this
Bright embodiment is not limited for the concrete thickness of first substrate 011 and second substrate 013.For example, first substrate 011
Thickness can be 0.5mm, and the thickness of second substrate 013 can be 0.1mm, 0.01mm, or 102～105 Ethylmercurichlorendimides etc..
A kind of applying method of substrate provided in an embodiment of the present invention, by pasting shape on region in first substrate 011
Become the laminating pattern 012 with gap, then the second substrate 013 by thickness less than first substrate 011 is covered in first substrate
011 paste on region so that second substrate 013 is contacted with the laminating pattern 012 with gap, so that second substrate 013
Can only be fitted on first substrate 011 by pasting the laminating active force at pattern 012 of fitting on region with first substrate 011,
And the gap location that second substrate 013 pastes pattern 012 of fitting on region with first substrate 011 is not fitted active force, so as to drop
Low fit active force of the second substrate 013 with first substrate 011.Pass through not between thin substrate and thick substrate with prior art
If one layer of attaching film in gap fits together comparing, method provided in an embodiment of the present invention can solve the problem that will in prior art
After thin substrate is fitted on thick substrate, as the thin substrate that the active force of fitting between thin substrate and thick substrate causes by force is difficult to
The problem of stripping.
Embodiment 2
Referring to Fig. 8, the embodiment of the present invention provides the applying method of another kind of substrate, and key step can include step：
201st, pasting on region in first substrate 011, forms the laminating pattern 012 with gap.
Wherein, first substrate 011 paste formed on region with gap laminating pattern 012 process, specifically may be used
With referring to the description in embodiment 1.
Pasting the laminating pattern 012 that formed on region with gap and can cause second substrate 013 in first substrate 011
Can only fit to first substrate by stronger laminating active force at the pattern 012 of fitting on region is pasted with first substrate 011
On 011, and the gap location in laminating pattern 012 is not fitted active force, thus, with thin substrate in prior art and thick substrate it
Between compared by pasting one layer of attaching film for not setting gap on region and fit together, method energy provided in an embodiment of the present invention
Enough reduce the active force of fitting of second substrate 013 and first substrate 011, so as to solve due to second substrate 013 and first substrate
The second substrate 013 that laminating active force between 011 causes by force is difficult to the problem that peels off.
202 as shown in figure 9, on the region that first substrate 011 corresponds to laminating 012 gap of pattern, form the first protection figure
Case 014, the thickness of the first protection pattern 014 are identical with the thickness of laminating pattern 012.
First substrate 011 paste the laminating pattern 012 formed on region with gap after, can also be in the first base
Plate 011 corresponds to be formed on the region in laminating 012 gap of pattern protects pattern 014 with the thickness identical first of pattern 012 of fitting,
Such that it is able to form one layer of flat and continuous film layer between second substrate 013 and first substrate 011, it is thus possible to avoid not
In the case of forming the first protection pattern 014, pass through laminating pattern during product component is made on second substrate 013
The sepage problem that 012 gap occurs, so as to protect laminating pattern not corroded by sepage so that second substrate 013 is in stripping
It can be fitted on first substrate 011 securely by pattern 012 of fitting from before.For example, when need to laminating after
When the first surface that second substrate 013 is not pasted with first substrate 011 is etched processing, if not in corresponding laminating pattern 012
The region in gap form first and protect pattern 014, then solution in order to be etched may penetrate into laminating pattern 012
Gap is so as to corrode laminating pattern 012.
It should be noted that the effect of laminating pattern 012 is primarily to fit to first substrate by second substrate 013
On 011, and first protection pattern 014 primary effect be in order to avoid sepage, so as to protect laminating pattern not by sepage corruption
Erosion, is not intended to fit second substrate 013 and first substrate 011, therefore the material of the first protection pattern 014 and pattern of fitting
012 material is different, active force of almost not fitting between second substrate 013 and the first protection pattern 014, or laminating effect
Power is weaker.
Further, since the first protection pattern 014 is the gap of corresponding laminating pattern 012, thus the first protection pattern 014
Shape with laminating 012 gap of pattern shape corresponding.For example, in structure shown in Fig. 9, when laminating pattern 012 be as Fig. 5
During the bar paten of shown uniform arrangement, referring to Figure 10, the first protection pattern 014 in corresponding laminating 012 gap of pattern is also
The bar paten of uniform arrangement；Or, when pattern 012 of fitting is net-like pattern as shown in Figure 6, the first protection pattern 014
Be shaped as chequer as shown in figure 11；Or, when laminating pattern 012 is erose pattern as shown in Figure 7
When, corresponding the irregularly shaped of 012 gap of pattern of fitting being shaped as shown in Figure 12 of the first protection pattern 014.Due to laminating
Pattern 012 can be the pattern of arbitrary shape, thus the first protection pattern 014 can also be the pattern of arbitrary shape, the present invention
Embodiment is not limited.
Further, while the first protection pattern 014 is formed, the method can also include：Paste in first substrate 011
The outer peripheral areas of pattern 012 are closed, forms the second protection pattern 015 of closing, the thickness of the second protection pattern 015 and pattern of fitting
012 thickness is identical.As the outer peripheral areas in laminating pattern 012 form the second protection pattern 015 of closing, will can fit
Pattern 012 is fully enclosed in the inside of the second protection pattern 015, thus can make product component on second substrate 013
During avoid etchant solution to fit pattern 012 corrosion, so as to preferably protect laminating pattern 012 so that second substrate
013 can be fitted on first substrate 011 by pattern 012 of fitting before stripping securely.
Specifically, while the first protection pattern 014 is formed, the external zones of pattern 012 of fitting in first substrate 011
Domain, the second protection pattern 015 for forming closing can include：Protective film is made on first substrate 011, by protective film structure
Figure becomes the first protection pattern 014 in the region for pasting on region corresponding gap positioned at first substrate 011, and is formed positioned at the
Second protection pattern 015 of the outer peripheral areas of the laminating pattern 012 of one substrate 011.Wherein, second protection pattern 015 material with
The material of the first protection pattern 014 is identical.
Exemplary, form the first substrate that laminating pattern 012, first protects pattern 014 and the second protection pattern 015
011 sectional view can also be with reference to Figure 13；In structure shown in Figure 13, laminating pattern 012, first protects pattern 014 and the second protection
The top view of pattern 015 is referred to Figure 14.
203rd, second substrate 013 is covered in first substrate 011 pastes region so that second substrate 013 and figure of fitting
Case 012 is contacted, and the thickness of second substrate 013 is less than the thickness of first substrate 011.
Exemplary, second substrate 013 is fitted to formation laminating pattern 012 and the first protection pattern 014 shown in Fig. 9
First substrate 011 after sectional view may refer to Figure 15；Second substrate 013 is fitted to the formation laminating pattern shown in Figure 13
012nd, the sectional view after the first substrate 011 of the first protection pattern 014 and the second protection pattern 015 may refer to Figure 16.
In embodiments of the present invention, due to first substrate 011 and second substrate 013 can for glass substrate, plastic base,
Metal substrate or the substrate of other any materials.And first substrate 011 is different with the material of second substrate 013, then in order to carry out
The material of the laminating pattern 012 of laminating is likely to difference, and the material of the first protection pattern 014 is likely to difference.
Exemplary, if first substrate 011 and second substrate 013 are glass substrate, the material of pattern 012 of fitting can
Think tin indium oxide.If first substrate 011 and second substrate 013 are glass substrate, the material of the first protection pattern 014 can
Think silicon nitride, carborundum or polyimides etc..Identical with the material of the first protection pattern 014, the material of the second protection pattern 015
Material can also be silicon nitride, carborundum or polyimides etc..
Or, exemplary, if first substrate 011 and second substrate 013 are plastic base, can also be by then
The laminating pattern 012 that dosage form becomes is fitted, and the material of the first protection pattern 014 can also be silicon nitride, carborundum or polyamides
Imines etc..Certainly, for first substrate 011 using material and second substrate 013 using material various combination, Ke Yigen
The material of laminating pattern 012 and the first protection pattern 014 is selected according to concrete condition, is not limited here.
A kind of applying method of substrate provided in an embodiment of the present invention, is passing through pasting on region in first substrate 011
The laminating pattern 012 with gap is formed, then the second substrate 013 by thickness less than first substrate 011 is covered in the first base
The pasting on region so that second substrate 013 is contacted with the laminating pattern 012 with gap of plate 011, so that second substrate
013 can only fit to first substrate 011 by pasting the laminating active force at pattern 012 of fitting on region with first substrate 011
On, reduce the active force of fitting of second substrate 013 and first substrate 011.With in prior art between thin substrate and thick substrate
Compared by not setting one layer of attaching film in gap and fitting together, method provided in an embodiment of the present invention can solve the problem that existing skill
After in art fitting to thin substrate on thick substrate, due to the thin base that the active force of fitting between thin substrate and thick substrate causes by force
Plate is difficult to the problem that peels off.
Embodiment 3
The embodiment of the present invention will be glass substrate with first substrate 011 and second substrate 013, the material of pattern 012 of fitting
Expect for tin indium oxide (Indium Tin Oxide, ITO), as a example by the material of the first protection pattern 014 is silicon nitride, to substrate
Applying method is illustrated.Referring to Figure 17, the key step of the method can include：
301st, ITO attaching film is made on first substrate 011.
Wherein, attaching film effect primarily to formed laminating pattern 012, so as to second substrate 013 is fitted to
On first substrate 011.When first substrate 011 and second substrate 013 are glass substrate, two glass substrates are fitted in one
The material that the material of the laminating pattern 012 for rising can have multiple, i.e. attaching film can have multiple, such as ITO, solid etc..
As intermolecular active force can be formed with glass substrate when ITO is contacted on the contact surface so as to closely inhale with glass substrate
Close, and compared with other materials such as solid, when second substrate 013 is peeled off, solid laminating pattern 012 can leave more
Residual, needs to process further；And residual will not be left using the laminating pattern 012 of ITO material, it is more suitable as pattern of fitting
012 material.Thus, in this step, can be by modes such as sputtering, ion plating, vacuum evaporation on 011 surface of first substrate
One layer of continuous ITO attaching film of deposition, in order to form ITO laminating pattern 012 on the basis of ITO attaching film, so as to
Second substrate 013 and first substrate 011 are fit together.
302nd, ITO attaching film composition is formed the ITO laminating with gap for pasting region positioned at first substrate 011
Pattern 012.
After 011 surface of first substrate forms continuous ito thin film, can be formed positioned at first substrate by patterning processes
The 011 ITO laminating pattern 012 for pasting region.Exemplary, the composition such as gluing, exposure, development, etching, stripping can be passed through
Technological process forms the bar shaped ITO laminating pattern 012 of uniform arrangement.
It should be noted that after forming the ITO laminating pattern 012 with gap, thin glass substrate can be caused to be only capable of leading to
Cross and paste, with thick substrate, the laminating active force that ITO on region fitted at pattern 012 and fit on heavy sheet glass substrate, and in laminating figure
The gap location of case 012 does not have a laminating active force, thus with prior art in by not setting gap between thin substrate and thick substrate
One layer of ITO attaching film fit together and compare, method provided in an embodiment of the present invention reduces thin glass substrate with thick glass
The laminating active force of glass substrate, can solve the problem that after in prior art fitting to thin substrate on thick substrate, due to thin substrate with
The thin substrate that laminating active force between thick substrate causes by force is difficult to the problem that peels off.
303rd, silicon nitride protective film is made on first substrate 011.
Wherein, the effect of protective film is primarily to form first protection in the region in corresponding laminating 012 gap of pattern
Pattern 014, so as to form one layer of flat film layer to avoid the occurrence of sepage in pasting on region for first substrate 011, be not
In order to second substrate 013 is fitted on first substrate 011, thus permissible between the first protection pattern 014 and second substrate 013
There is no laminating active force or laminating active force is weaker, thus the material for making the first protection pattern 014 and protective film can
Think multiple protection materials such as silicon nitride, carborundum, polyimides.Exemplary, here protection is made using silicon nitride material
Film.
Specifically, can be by modes such as sputtering, ion plating, vacuum evaporation in the first substrate for forming laminating pattern 012
011 surface deposition one layer of continuous silicon nitride film, i.e. silicon nitride protective film.
The 304th, silicon nitride protective film composition is formed the area for corresponding to ITO laminating 012 gap of pattern positioned at first substrate 011
Pattern 014 protected by silicon nitride first on domain, and forms the outer peripheral areas of the ITO laminating pattern 012 positioned at first substrate 011
Pattern 015 protected by silicon nitride second.
Exemplary, silicon nitride protective film can pass through the patterning processes flow process such as gluing, exposure, development, etching, stripping
Pattern protected by the silicon nitride first for pasting the region in corresponding ITO laminating 012 gap of pattern on region for forming first substrate 011
014, and formed positioned at first substrate 011 ITO laminating pattern 012 outer peripheral areas silicon nitride second protect pattern 015, make
Silicon nitride first protects the thickness of pattern 014, silicon nitride second to protect the thickness of pattern 015 to fit with ITO the thickness of pattern 012
Degree is identical.
305th, second substrate 013 is covered in first substrate 011 pastes region so that second substrate 013 and figure of fitting
Case 012 is contacted, and the thickness of second substrate 013 is less than the thickness of first substrate 011.
In this step, less for thickness second substrate (i.e. thin glass substrate) is covered in the larger first substrate of thickness
The pasting on region of 011 (i.e. heavy sheet glass substrate) so that second substrate 013 and fit pattern 012 and the first protection 014 shape of pattern
The continuous film layer contact for becoming, and fitted on first substrate 011 by pattern 012 of fitting.
A kind of applying method of substrate provided in an embodiment of the present invention, by forming in pasting on region for heavy sheet glass substrate
Thin glass substrate is then covered in the pasting on region of heavy sheet glass substrate so that thin by the ITO laminating pattern 012 with gap
Glass substrate with gap ITO laminating pattern 012 contact so that thin glass substrate can only by with heavy sheet glass substrate
Paste the laminating active force on region at ITO laminating pattern 012 to fit on heavy sheet glass substrate, thin glass substrate is reduced with thickness
The laminating active force of glass substrate.Fitted by not setting one layer of ITO in gap between thin substrate and thick substrate with prior art
Film adhered compare together, method provided in an embodiment of the present invention can solve the problem that in prior art and for thin substrate fit to thick base
After on plate, as the thin substrate that the active force of fitting between thin substrate and thick substrate causes by force is difficult to the problem that peels off.
The above, the only specific embodiment of the present invention, but protection scope of the present invention is not limited thereto, and any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be defined by the scope of the claims.
Claims (8)
1. a kind of applying method of substrate, it is characterised in that include：
The laminating pattern that formed on region with gap of pasting in first substrate；
On the region that the first substrate corresponds to the gap, form first and protect pattern, the thickness of the first protection pattern
Spend identical with the thickness of the laminating pattern；
What second substrate was covered in the first substrate pastes region so that the second substrate is connect with the pattern of fitting
Touch, the thickness of the second substrate is less than the thickness of first substrate.
2. method according to claim 1, it is characterised in that while the first protection pattern is formed, the side
Method also includes：
The outer peripheral areas of the laminating pattern on the first substrate, form the second protection pattern of closing, and described second protects
The thickness of shield pattern is identical with the thickness of the laminating pattern.
3. method according to claim 1, it is characterised in that the laminating pattern is the bar paten of uniform arrangement.
4. method according to claim 1, it is characterised in that between the pasting on region and formed and have of the first substrate
The laminating pattern of gap includes：
Attaching film is made on the first substrate；
The attaching film composition is formed the laminating pattern with gap for pasting region for being located at the first substrate.
5. method according to claim 2, it is characterised in that while the first protection pattern is formed, described
The outer peripheral areas of the laminating pattern on first substrate, the described second protection pattern for forming closing include：
Protective film is made on the first substrate；
The protective film composition is formed the institute for pasting the region in the correspondence gap on region for being located at the first substrate
The first protection pattern is stated, and forms the second protection figure positioned at the outer peripheral areas of laminating pattern described in the first substrate
Case.
6. the method according to any one of claim 1-5, it is characterised in that the first substrate and the second substrate are
Glass substrate, plastic base or metal substrate.
7. method according to claim 6, it is characterised in that if the first substrate and the second substrate are glass
Substrate, then the material of the laminating pattern is tin indium oxide.
8. method according to claim 6, it is characterised in that if the first substrate and the second substrate are glass
Substrate, then the material of the first protection pattern is silicon nitride, carborundum or polyimides.
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| US8168511B2 (en) * | 2007-09-20 | 2012-05-01 | Sharp Kabushiki Kaisha | Display device manufacturing method and laminated structure |
| CA2772110C (en) * | 2011-02-01 | 2013-07-23 | Micro Technology Co., Ltd. | Thin-sheet glass substrate laminate and method of manufacturing the same |
| CN104409408B (en) * | 2014-12-02 | 2017-10-10 | 昆山国显光电有限公司 | A kind of preparation method of rigid substrates and flexible display |
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