CN104930889A - Heat exchanger and semi-conductor wine cabinet - Google Patents
Heat exchanger and semi-conductor wine cabinet Download PDFInfo
- Publication number
- CN104930889A CN104930889A CN201410102908.3A CN201410102908A CN104930889A CN 104930889 A CN104930889 A CN 104930889A CN 201410102908 A CN201410102908 A CN 201410102908A CN 104930889 A CN104930889 A CN 104930889A
- Authority
- CN
- China
- Prior art keywords
- plane
- heat
- heat pipe
- transfer block
- heat transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The invention provides a heat exchanger and a semi-conductor wine cabinet. The heat exchanger comprises a heat exchanging block exchanging heat with cold source or heat source, a plurality of independent heat pipes, two ends of each which are sealed, wherein cold media is sealed in each heat pipe; a first end of each heat pipe is embedded into the heat exchanging block in a pres fit embedding way; and the at least part embedded into the heat exchanging block is a flat pipe. With the heat exchanging block embedded into the heat exchanger in a press fit way, so stable connection can be achieved; the embedded part is the flat pipe, so heat exchanging efficiency can be further improved; and besides, the invention further discloses a semi-conductor wine cabinet utilizing the heat exchanger.
Description
Technical field
The present invention relates to refrigeration plant, particularly relate to a kind of heat exchanger and use the semiconductor wine cabinet of this heat exchanger.
Background technology
Generally only adopt the mode of screw or welding to be connected for the heat pipe of the heat exchanger of refrigeration plant and heat transfer block in prior art, easily loosen between the heat pipe of this heat exchanger and heat transfer block, and the less heat exchange efficiency that thus causes of the contact point of the two is lower.Further, in the prior art, the heat exchanger of semiconductor wine cabinet is not suitable for.
In addition, the noise that the compressor of compressor wine cabinet of the prior art and other mechanical moving elements (as blower fan) can produce mechanical oscillation and send more than 40 decibels when running, the comparatively quiet place such as in parlor, this mechanical oscillation and noise are more obvious, easily cause discomfort to consumer, affect Consumer's Experience.In addition, because the temperature fluctuation of the evaporimeter of compressor wine cabinet is large, therefore easily frosting in wine cabinet, makes wine cabinet temperature unstable.
In order to solve the problem, in recent years, those skilled in the art propose a kind of semiconductor wine cabinet using semiconductor chilling plate to realize refrigeration.Semiconductor chilling plate, is also thermoelectric module, is a kind of heat pump.Its advantage does not have moving component, can be applied in some limited space, reliability requirement is high and needs the occasion that minimizing cold-producing medium pollutes.Peltier(amber ear note according to semi-conducting material) effect, when the galvanic couple that direct current is connected into by two kinds of different semi-conducting materials, heat can be absorbed at the two ends of galvanic couple respectively and release heat, thus the object of refrigeration can be realized.Semiconductor wine cabinet uses the cold junction of semiconductor chilling plate to freeze, and makes temperature stabilization in wine cabinet, and overcome the defect that temperature fluctuation that compressor cooling mode causes is large, and do not use compressor cooling, considerably reduce noise, mechanical oscillation are also relatively little.Generally, for hot junction and the freezing temperature difference that can produce 30 to 50 DEG C of the semiconductor chilling plate of individual layer, therefore use single layer of semiconductor cooling piece can be easy to the wine cabinet temperature obtaining 5-20 DEG C.It also has the following advantages: structure is simple, and parts are few, easy to maintenance; Mechanical drive disk assembly, thus can not wearing and tearing be produced, the life-span is long; Noise is low, and vibration is few; Without the need to chiller refrigeration, environmental protection; Efficiency is high, power consumption low (at below 100W, power consumption only has the half of compression refrigeration equipment and absorption refrigerating equipment).
Although semiconductor wine cabinet vibrates and noise is less, but because it adopts blower fan to the hot-side heat dissipation of semiconductor chilling plate usually, owing to can produce larger noise and mechanical oscillation in blower fan work, therefore semiconductor wine cabinet of the prior art still cannot reach low noise, low vibration and even zero noise, zero effect vibrated.
Summary of the invention
One object of the present invention is intended at least one defect of the refrigeration plant overcoming prior art, provides that a kind of heat pipe is firmly connected with heat transfer block, the heat exchanger of high efficient heat exchanging and semiconductor wine cabinet.
The present invention's further object be to reduce semiconductor wine cabinet run time noise and vibration.
In order to realize above-mentioned one or more object, the invention provides a kind of heat exchanger, comprising: heat transfer block, be configured to and low-temperature receiver or thermal source heat exchange; Many separate heat pipes, heat pipe closed at both ends described in every root and described inside heat pipe is closed with refrigerant; Wherein, the first end of heat pipe described in every root is embedded in described heat transfer block by the method that pressing embeds; The part at least embedding described heat transfer block of described heat pipe is flat tube.
Alternatively, described many separate heat pipes at least comprise: the first heat pipe, after described heat transfer block stretches out, extend to the first plane, linearly extend in described first plane, and be bent to the second plane with described first plane orthogonal, in described second plane, linearly extend to the second end of described first heat pipe; Second heat pipe, after described heat transfer block stretches out, extend to the first plane, linearly extend in described first plane, and be bent to three plane all vertical with described first plane, described second plane, in described 3rd plane, linearly extend to the second end of described 3rd heat pipe; 3rd heat pipe, after described heat transfer block stretches out, extends to the first plane, linearly extends in described first plane, and is bent to and described second parallel plane 4th plane, linearly extends to the second end of described 4th heat pipe in described 4th plane.
Alternatively, described many separate heat pipes also comprise at least one other heat pipe, described in every root, other heat pipes are after described heat transfer block stretches out, extend to described first plane, linearly extend in described first plane, and be bent to described second plane or the 3rd plane or the 4th plane, in the plane be bent to, linearly extend to its second end.
Alternatively, the described first heat pipe path linearly extended in described first plane and the path that described first heat pipe linearly extends in described second plane vertical projection is in the horizontal plane mutually vertical and be in the same side of the outer face of described heat transfer block; The path that described second heat pipe linearly extends in described first plane and the path that described second heat pipe linearly extends in described 3rd plane vertical projection is in the horizontal plane mutually vertical and be in the same side of the outer face of described heat transfer block; The path that described 3rd heat pipe linearly extends in described first plane and the path that described 3rd heat pipe linearly extends in described 4th plane vertical projection is in the horizontal plane mutually vertical and be in the same side of the outer face of described heat transfer block.
Alternatively, described first heat pipe is parallel to described 3rd heat pipe linearly extended part in the 4th plane in the part that the second rectilinear in planes extends.
Alternatively, when described heat transfer block is configured to low-temperature receiver heat exchange, described refrigerant is R134a or R600a.
Alternatively, when described heat transfer block is configured to thermal source heat exchange, described refrigerant is water.
In order to realize above-mentioned one or more object, present invention also offers a kind of semiconductor wine cabinet, described semiconductor wine cabinet comprises above-mentioned heat exchanger.
Alternatively, described low-temperature receiver is the cold junction of described semiconductor chilling plate, and described heat transfer block is fitted described cold junction; Described 3rd plane is the plane at the upper surface place of the inner bag of described semiconductor wine cabinet, and described first plane, described second plane, described 4th plane are respectively the plane at any three the side place adjacent with described upper surface of the inner bag of described semiconductor wine cabinet.
Alternatively, described thermal source is the hot junction of described semiconductor chilling plate, and described heat transfer block is fitted described hot junction; Described 3rd plane is the plane at the upper surface place of the shell of described semiconductor wine cabinet, and described first plane, described second plane, described 4th plane are respectively the plane at any three the side place adjacent with described upper surface of the shell of described semiconductor wine cabinet.
Alternatively, described heat transfer block is copper billet; Described inner bag is aluminum liner.
Alternatively, described heat transfer block is copper billet; Described shell is aluminium shell.
Heat exchanger of the present invention embeds heat transfer block due to the method that embedded by pressing, and therefore the two can firmly connect, and due to the part embedded be flat tube, also make heat exchange efficiency improve further.
Further, the heat pipe of heat exchanger of the present invention, owing to having special shape, makes the heat exchange area of heat pipe comparatively large and is evenly distributed, therefore, it is possible to improve heat exchange efficiency largely.
Further, due at least four faces and the heat pipe uniform contact of the inner bag of semiconductor wine cabinet, the cold that semiconductor chilling plate cold junction is produced can efficiently, be uniformly scattered onto inner bag, and to scatter without the need to arranging blower fan within it by the cold that the cold junction of semiconductor chilling plate provides; In like manner, the heat that the hot junction due to semiconductor chilling plate produces can efficiently, be uniformly scattered onto shell, and the hot junction of blower fan to semiconductor chilling plate need not be used to dispel the heat; In semiconductor wine cabinet, need not blower fan be set like this, reduces noise and vibration, improve Consumer's Experience.
According to hereafter by reference to the accompanying drawings to the detailed description of the specific embodiment of the invention, those skilled in the art will understand above-mentioned and other objects, advantage and feature of the present invention more.
Accompanying drawing explanation
Hereinafter describe specific embodiments more of the present invention with reference to the accompanying drawings by way of example, and not by way of limitation in detail.Reference numeral identical in accompanying drawing denotes same or similar parts or part.It should be appreciated by those skilled in the art that these accompanying drawings may not be drawn in proportion.In accompanying drawing:
Fig. 1 is the heat transfer block of heat exchanger according to an embodiment of the invention and the sectional view of the radial direction along described heat pipe inlaying heat pipe within it;
Fig. 2 is the structural representation that the cold junction using heat exchanger shown in Fig. 1 to be semiconductor chilling plate according to an embodiment of the invention carries out the semiconductor wine cabinet of heat exchange;
Fig. 3 is the structural representation that the semiconductor wine cabinet of heat exchange is carried out in the hot junction using heat exchanger shown in Fig. 1 to be semiconductor chilling plate according to an embodiment of the invention;
Fig. 4 be according to an embodiment of the invention with the syndeton schematic diagram in the heat transfer block of the heat exchanger of the hot junction heat exchange of semiconductor chilling plate, heat pipe, semiconductor chilling plate hot junction.
The Reference numeral used in accompanying drawing is as follows:
101 heat transfer blocks,
102 first heat pipes,
103 second heat pipes,
104 the 3rd heat pipes,
105 the 4th heat pipes,
201 first planes,
202 second planes,
203 the 3rd planes,
204 the 4th planes,
205 inner bags,
206 shells,
The hot junction of 401 semiconductor chilling plates,
402 heat exchange fins.
Detailed description of the invention
Fig. 1 is the heat transfer block of heat exchanger according to an embodiment of the invention and the sectional view of the radial direction along heat pipe inlaying heat pipe within it.As seen from Figure 1, this heat exchanger can comprise heat transfer block 101 and the separate heat pipe of Duo Gen.Every root heat pipe closed at both ends and inside heat pipe is closed with refrigerant.In the embodiment shown in fig. 1, the first end of every root heat pipe is embedded in heat transfer block 101 by the method that pressing embeds, to improve the firmness that the two connects; And the part at least embedding heat transfer block 101 of heat pipe is flat tube.Because the heat exchange efficiency of flat tube is higher than pipe, therefore, the heat exchange efficiency of heat pipe and heat transfer block 101 is also improved.
In one embodiment of the invention, the part that heat pipe is embedded into heat transfer block 101 can run through the two ends of heat transfer block 101, like this while the firmness connected both improving further, also increases the contact area of the two, improves heat exchange efficiency.
Fig. 2 is the structural representation that the cold junction using heat exchanger shown in Fig. 1 to be semiconductor chilling plate according to an embodiment of the invention carries out the semiconductor wine cabinet of heat exchange.Composition graphs 1, Fig. 2 can find out, in an embodiment of the present invention, many separate heat pipes at least can comprise the first heat pipe 102 to the 3rd heat pipe 104.Wherein, first heat pipe 102, after heat transfer block 101 stretches out, extends to the first plane 201, linearly extends in the first plane 201, and be bent to second plane 202 vertical with the first plane 201, in the second plane 202, linearly extend to the second end of the first heat pipe 102; Second heat pipe 103 is after heat transfer block 101 stretches out, extend to the first plane 201, linearly extend in the first plane 201, and be bent to three plane 203 all vertical with the first plane 201, second plane 202, in the 3rd plane 203, linearly extend to the second end of the 3rd heat pipe 104; 3rd heat pipe 104 is after heat transfer block 101 stretches out, extend to the first plane 201, linearly extend in the first plane 201, and be bent to four plane 204 parallel with the second plane 202, in the 4th plane 204, linearly extend to the second end of the 4th heat pipe 105.
In one embodiment of the invention, many separate heat pipes also can comprise at least one other heat pipe, such as, the 4th heat pipe 105 shown in Fig. 1, Fig. 2.Other heat pipes of every root are after heat transfer block 101 stretches out, may extend to the first plane 201, linearly extend in the first plane 201, and be bent to the second plane 202 or the 3rd plane 203 or the 4th plane 204, in the plane be bent to, linearly extend to its second end.In one embodiment of the invention, the first heat pipe 102 linearly extended part in the second plane 202 can be parallel to the 3rd heat pipe 104 linearly extended part in the 4th plane 204.Second heat pipe 103 linearly extended part in the 3rd plane 203 also can be parallel to the 4th heat pipe 105 linearly extended part in the 3rd plane 203.
In another embodiment of the present invention, every root heat pipe can along the first linearly extended path of plane 201 with its along the path that another plane and straight line extends vertical projection in the horizontal plane mutually vertical and be in the same side of the outer face of heat transfer block 101.Particularly, the path that linearly extends in the first plane 201 of the first heat pipe 102 can be mutually vertical with the path that the first heat pipe 102 linearly extends in the second plane 202 vertical projection in the horizontal plane and be in the same side of the outer face of heat transfer block 101; The path that second heat pipe 103 linearly extends in the first plane 201 can be mutually vertical with the path that the second heat pipe 103 linearly extends in the 3rd plane 203 vertical projection in the horizontal plane and be in the same side of the outer face of heat transfer block 101; The path that 3rd heat pipe 104 linearly extends in the first plane 201 can be mutually vertical with the path that the 3rd heat pipe 104 linearly extends in the 4th plane 204 vertical projection in the horizontal plane and be in the same side of the outer face of heat transfer block 101; The path that 4th heat pipe 105 linearly extends in the first plane 201 can be mutually vertical with the path that the 4th heat pipe 105 linearly extends in the 3rd plane 203 vertical projection in the horizontal plane and be in the same side of the outer face of heat transfer block 101.
In the embodiment shown in Figure 2, can by this heat exchanger application in semiconductor wine cabinet, this semiconductor wine cabinet can be the shape of cuboid or approximate cuboid.In some embodiments of the invention, the first heat pipe 102, second heat pipe 103 is after a sided linear of the inner bag 205 of semiconductor wine cabinet extends, and the upper surface being folded into the inner bag 205 of semiconductor wine cabinet continues straight line and extends; 3rd heat pipe 104, the 4th heat pipe 105, after this sided linear extends, are folded into and extend with this side of inner bag 205 and perpendicular and be parallel to each other two sided linear of the upper surface of inner bag 205.In other words, 3rd plane 203 is the plane at the upper surface place of the inner bag 205 of semiconductor wine cabinet, and the first plane 201, second plane 202, the 4th plane 204 are respectively the plane at any three the side place adjacent with upper surface of the inner bag 205 of semiconductor wine cabinet.In the process, heat pipe is fitted in the surface of inner bag 205, the two close contact, to reach better radiating effect.Because the temperature difference at heat pipe two ends is generally within 1 DEG C, and its one end laminating inner bag 205, the other end is freezed by the cold junction of semiconductor chilling plate, and therefore it can absorb the heat of inner bag 205 well, reaches the object reducing inner bag 205 temperature.Now, the inner bag 205 of wine cabinet can be aluminum liner 205, to conduct heat better; Heat transfer block 101 can be copper billet or aluminium block, is preferably copper billet, to increase heat exchange efficiency and to reduce the corrosion be subject to
In other embodiments of the present invention, heat transfer block 101 can be fitted with the cold junction of the semiconductor chilling plate of semiconductor wine cabinet, namely its for low-temperature receiver heat exchange.Refrigerant now in heat pipe can be R134a or R600a, and it is more reliable relative to existing perfusion carbon dioxide gas body technique, is more prone to realize for production.In other embodiments of the invention, the heat transfer block 101 of heat exchanger can conduct heat with other low-temperature receivers.
Fig. 3 is the structural representation that the semiconductor wine cabinet of heat exchange is carried out in the hot junction using heat exchanger shown in Fig. 1 to be semiconductor chilling plate according to an embodiment of the invention.In the embodiment shown in fig. 3, the structure of heat exchanger is similar to the structure of the heat exchanger of above-described embodiment.
In the embodiment shown in fig. 3, can by heat exchanger application in semiconductor wine cabinet, this semiconductor wine cabinet is the shape of cuboid or approximate cuboid.First heat pipe 102, second heat pipe 103 is after a sided linear of the shell 206 of semiconductor wine cabinet extends, and the upper surface being folded into the shell 206 of semiconductor wine cabinet continues straight line and extends; 3rd heat pipe 104, the 4th heat pipe 105, after this sided linear extends, are folded into and extend with this side of inner bag 205 and perpendicular and be parallel to each other two sided linear of the upper surface of shell 206.In other words, 3rd plane 203 is the plane at the upper surface place of the inner bag 205 of semiconductor wine cabinet, and the first plane 201, second plane 202, the 4th plane 204 are respectively the plane at any three the side place adjacent with upper surface of the shell 206 of semiconductor wine cabinet.In the process, heat pipe is fitted in the surface of shell 206, the two close contact, to reach better radiating effect.Now, the shell 206 of wine cabinet can be aluminium shell 206, and its radiating efficiency is higher, therefore, it is possible to be comparatively fast dispersed in environment by the heat that heat pipe transmission comes.Heat transfer block 101 can be copper billet or aluminium block, is preferably copper billet, to increase heat exchange efficiency and to reduce the corrosion be subject to.
In one embodiment of the invention, can be fitted in the hot junction of the semiconductor chilling plate of heat exchanger and semiconductor wine cabinet, namely its for thermal source heat exchange.Refrigerant now in heat pipe can be water, and this design makes when pouring into refrigerant simple to operate, with low cost.In other embodiments of the invention, the heat transfer block 101 of heat exchanger can conduct heat with other thermals source.
Fig. 4 be according to an embodiment of the invention with the syndeton schematic diagram in the heat transfer block of the heat exchanger of the hot junction heat exchange of semiconductor chilling plate, heat pipe, semiconductor chilling plate hot junction.In the embodiment shown in fig. 4, the heat transfer block 101 of fitting with the hot junction 401 of the semiconductor chilling plate of semiconductor wine cabinet can also be provided with heat exchange fin 402, while the shell 206 at heat pipe heat being delivered to semiconductor wine cabinet, the a part of heat being delivered to heat transfer block 101 from the hot junction of heat exchange fin 402 pairs of semiconductor chilling plates distributes, and plays the effect of auxiliary heat dissipation.
Composition graphs 1-Fig. 4, can find out, in the above-described embodiments, cold junction for semiconductor chilling plate carries out the heat transfer block 101 that dispels the heat and semiconductor chilling plate can be clamped in centre with the heat transfer block 101 carried out dispelling the heat in the hot junction for semiconductor chilling plate, the heat transfer block 101 wherein carrying out dispelling the heat for the cold junction of semiconductor chilling plate is in inner side, and the heat transfer block 101 carried out dispelling the heat in the hot junction for semiconductor chilling plate is in outside.Three's row becomes a complete thermal transfer devices, and the heat that the wine cabinet space that inner bag 205 row of semiconductor wine cabinet can be become produces is delivered to the shell 206 of semiconductor wine cabinet.Particularly, the heat that the wine cabinet space that the inner bag 205 of semiconductor wine cabinet is formed produces can be delivered to the cold junction of semiconductor chilling plate by heat exchanger as shown in Figure 2; And the hot junction 401 of semiconductor chilling plate is passed to by the cold junction of semiconductor chilling plate; The heat being delivered to the hot junction 401 of semiconductor chilling plate can be delivered to the shell 206 of semiconductor wine cabinet by heat exchanger as shown in Figure 3, heat is delivered in surrounding environment by the shell 206 of final semiconductor wine cabinet.
This scheme makes the cold junction of semiconductor chilling plate connect the inner bag 205 of semiconductor wine cabinet by a heat exchanger, also the hot junction 401 of semiconductor chilling plate is made to connect the shell 206 of semiconductor wine cabinet by another heat exchanger, not only have simple and compact for structure, parts are few, cost is low, advantage easy to maintenance, and the special shape of heat pipe due to this heat exchanger, make heat pipe can be efficient, equably with inner bag 205 and shell 206 heat-shift of semiconductor wine cabinet, thus blower fan need not be used to carry out air-cooled to wine cabinet space and dispel the heat to the hot junction 401 of semiconductor chilling plate, thus significantly can reduce noise and the mechanical oscillation of wine cabinet, improve Consumer's Experience.
So far, those skilled in the art will recognize that, although multiple exemplary embodiment of the present invention is illustrate and described herein detailed, but, without departing from the spirit and scope of the present invention, still can directly determine or derive other modification many or amendment of meeting the principle of the invention according to content disclosed by the invention.Therefore, scope of the present invention should be understood and regard as and cover all these other modification or amendments.
Claims (12)
1. a heat exchanger, is characterized in that, comprising:
Heat transfer block, is configured to and low-temperature receiver or thermal source heat exchange;
Many separate heat pipes, heat pipe closed at both ends described in every root and described inside heat pipe is closed with refrigerant;
Wherein, the first end of heat pipe described in every root is embedded in described heat transfer block by the method that pressing embeds; The part at least embedding described heat transfer block of described heat pipe is flat tube.
2. heat exchanger according to claim 1, is characterized in that,
Described many separate heat pipes at least comprise:
First heat pipe, after described heat transfer block stretches out, extends to the first plane, linearly extends in described first plane, and is bent to the second plane with described first plane orthogonal, linearly extends to the second end of described first heat pipe in described second plane;
Second heat pipe, after described heat transfer block stretches out, extend to the first plane, linearly extend in described first plane, and be bent to three plane all vertical with described first plane, described second plane, in described 3rd plane, linearly extend to the second end of described 3rd heat pipe;
3rd heat pipe, after described heat transfer block stretches out, extends to the first plane, linearly extends in described first plane, and is bent to and described second parallel plane 4th plane, linearly extends to the second end of described 4th heat pipe in described 4th plane.
3. heat exchanger according to claim 2, is characterized in that,
Described many separate heat pipes also comprise at least one other heat pipe, described in every root, other heat pipes are after described heat transfer block stretches out, extend to described first plane, linearly extend in described first plane, and be bent to described second plane or the 3rd plane or the 4th plane, in the plane be bent to, linearly extend to its second end.
4. heat exchanger according to claim 3, is characterized in that,
The path that described first heat pipe linearly extends in described first plane and the path that described first heat pipe linearly extends in described second plane vertical projection is in the horizontal plane mutually vertical and be in the same side of the outer face of described heat transfer block;
The path that described second heat pipe linearly extends in described first plane and the path that described second heat pipe linearly extends in described 3rd plane vertical projection is in the horizontal plane mutually vertical and be in the same side of the outer face of described heat transfer block;
The path that described 3rd heat pipe linearly extends in described first plane and the path that described 3rd heat pipe linearly extends in described 4th plane vertical projection is in the horizontal plane mutually vertical and be in the same side of the outer face of described heat transfer block.
5. heat exchanger according to claim 4, is characterized in that,
Described first heat pipe is parallel to described 3rd heat pipe linearly extended part in the 4th plane in the part that the second rectilinear in planes extends.
6. the heat exchanger according to any one of claim 5, is characterized in that,
When described heat transfer block is configured to low-temperature receiver heat exchange, described refrigerant is R134a or R600a.
7. the heat exchanger according to any one of claim 5, is characterized in that,
When described heat transfer block is configured to thermal source heat exchange, described refrigerant is water.
8. a semiconductor wine cabinet, is characterized in that, comprises the heat exchanger described in any one of claim 1-7.
9. semiconductor wine cabinet according to claim 8, is characterized in that,
Described low-temperature receiver is the cold junction of described semiconductor chilling plate, and described heat transfer block is fitted described cold junction;
Described 3rd plane is the plane at the upper surface place of the inner bag of described semiconductor wine cabinet, and described first plane, described second plane, described 4th plane are respectively the plane at any three the side place adjacent with described upper surface of the inner bag of described semiconductor wine cabinet.
10. semiconductor wine cabinet according to claim 7, is characterized in that,
Described thermal source is the hot junction of described semiconductor chilling plate, and described heat transfer block is fitted described hot junction;
Described 3rd plane is the plane at the upper surface place of the shell of described semiconductor wine cabinet, and described first plane, described second plane, described 4th plane are respectively the plane at any three the side place adjacent with described upper surface of the shell of described semiconductor wine cabinet.
11. semiconductor wine cabinets according to claim 9, is characterized in that,
Described heat transfer block is copper billet;
Described inner bag is aluminum liner.
12. semiconductor wine cabinets according to claim 10, is characterized in that,
Described heat transfer block is copper billet;
Described shell is aluminium shell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410102908.3A CN104930889B (en) | 2014-03-19 | 2014-03-19 | Heat exchanger and semi-conductor wine cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410102908.3A CN104930889B (en) | 2014-03-19 | 2014-03-19 | Heat exchanger and semi-conductor wine cabinet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104930889A true CN104930889A (en) | 2015-09-23 |
| CN104930889B CN104930889B (en) | 2017-01-25 |
Family
ID=54118168
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410102908.3A Active CN104930889B (en) | 2014-03-19 | 2014-03-19 | Heat exchanger and semi-conductor wine cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104930889B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106288895A (en) * | 2016-09-19 | 2017-01-04 | 上海珊泽精密金属制品有限公司 | Radiator inlaying heat pipe and preparation method thereof |
| CN110864483A (en) * | 2019-12-09 | 2020-03-06 | 珠海格力电器股份有限公司 | Heat exchange box body structure with high cooling speed and no frost and wind and refrigerator |
| CN110873476A (en) * | 2018-08-29 | 2020-03-10 | 青岛海尔特种电冰柜有限公司 | Cold end and semiconductor refrigeration equipment |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172937A (en) * | 1996-07-29 | 1998-02-11 | 三洋电机株式会社 | Cooling storage storehouse |
| JPH10267572A (en) * | 1997-03-19 | 1998-10-09 | Fujikura Ltd | Heat pipe retaining structure |
| JP2006012874A (en) * | 2004-06-22 | 2006-01-12 | Matsushita Electric Ind Co Ltd | Cooling device of semiconductor element |
| JP2006269634A (en) * | 2005-03-23 | 2006-10-05 | Fujikura Ltd | Heat sink with fan |
| JP2009270750A (en) * | 2008-05-05 | 2009-11-19 | Golden Sun News Technics Co Ltd | Flattening method of heat pipe evaporating section buried in radiator and radiator with heat pipe |
| CN102221153A (en) * | 2011-06-09 | 2011-10-19 | 中山伟强科技有限公司 | High-power LED lamp |
| CN102595711A (en) * | 2012-01-17 | 2012-07-18 | 中山伟强科技有限公司 | LED lighting system based on network control and high-power LED lamp |
| CN202918641U (en) * | 2012-11-16 | 2013-05-01 | 东莞汉旭五金塑胶科技有限公司 | Heat pipe radiator |
| CN103438741A (en) * | 2013-08-29 | 2013-12-11 | 中山市久能光电科技有限公司 | Radiator |
-
2014
- 2014-03-19 CN CN201410102908.3A patent/CN104930889B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1172937A (en) * | 1996-07-29 | 1998-02-11 | 三洋电机株式会社 | Cooling storage storehouse |
| JPH10267572A (en) * | 1997-03-19 | 1998-10-09 | Fujikura Ltd | Heat pipe retaining structure |
| JP2006012874A (en) * | 2004-06-22 | 2006-01-12 | Matsushita Electric Ind Co Ltd | Cooling device of semiconductor element |
| JP2006269634A (en) * | 2005-03-23 | 2006-10-05 | Fujikura Ltd | Heat sink with fan |
| JP2009270750A (en) * | 2008-05-05 | 2009-11-19 | Golden Sun News Technics Co Ltd | Flattening method of heat pipe evaporating section buried in radiator and radiator with heat pipe |
| CN102221153A (en) * | 2011-06-09 | 2011-10-19 | 中山伟强科技有限公司 | High-power LED lamp |
| CN102595711A (en) * | 2012-01-17 | 2012-07-18 | 中山伟强科技有限公司 | LED lighting system based on network control and high-power LED lamp |
| CN202918641U (en) * | 2012-11-16 | 2013-05-01 | 东莞汉旭五金塑胶科技有限公司 | Heat pipe radiator |
| CN103438741A (en) * | 2013-08-29 | 2013-12-11 | 中山市久能光电科技有限公司 | Radiator |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106288895A (en) * | 2016-09-19 | 2017-01-04 | 上海珊泽精密金属制品有限公司 | Radiator inlaying heat pipe and preparation method thereof |
| CN106288895B (en) * | 2016-09-19 | 2019-02-22 | 上海珊泽精密金属制品有限公司 | Inlay the radiator and preparation method thereof of heat pipe |
| CN110873476A (en) * | 2018-08-29 | 2020-03-10 | 青岛海尔特种电冰柜有限公司 | Cold end and semiconductor refrigeration equipment |
| CN110864483A (en) * | 2019-12-09 | 2020-03-06 | 珠海格力电器股份有限公司 | Heat exchange box body structure with high cooling speed and no frost and wind and refrigerator |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104930889B (en) | 2017-01-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20130291564A1 (en) | Thermoelectric cooling systems | |
| CN108800703B (en) | Semiconductor refrigeration equipment | |
| CN108800655B (en) | Semiconductor refrigerating device | |
| CN204286181U (en) | Heat abstractor and semiconductor refrigerating equipment | |
| CN104930889A (en) | Heat exchanger and semi-conductor wine cabinet | |
| CN104930890A (en) | Heat exchanger and semi-conductor wine cabinet | |
| CN104329870B (en) | Cold transferring and heat dissipating modular component, assembling method thereof and semiconductor refrigerator | |
| CN201876001U (en) | Split multi-stage thermoelectric refrigerator | |
| CN203893485U (en) | Heat pipe type efficient semiconductor refrigeration device | |
| CN102901265B (en) | Adsorption device for semiconductor refrigeration | |
| CN210569380U (en) | Lotus root core type refrigeration evaporator | |
| CN202393134U (en) | Refrigerating box and refrigerator comprising same | |
| CN105716365B (en) | Semiconductor wine cabinet | |
| CN210809082U (en) | Air cooler for cooling fruits and vegetables | |
| CN103267385A (en) | Refrigerating and heating device and application method thereof | |
| CN207340401U (en) | A kind of metab easy to heat dissipation | |
| CN202501656U (en) | Heat exchanger | |
| CN203385238U (en) | Refrigerating and heating device | |
| CN101835366A (en) | Direct cooling and heat radiating device for heat pipe of broadcast television transmitter | |
| JP2013033895A (en) | Electric cooling unit | |
| CN201674749U (en) | Heat pipe direct cooling heat dissipation apparatus used for broadcast and television transmitter | |
| CN104470329A (en) | High-power heating device set cooling device | |
| CN203068870U (en) | Refrigeration cooling system | |
| CN215295541U (en) | Single water tank refrigerating device and beverage machine comprising same | |
| CN104329827A (en) | Heat exchange device and semiconductor refrigerator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |