CN104916606A - 半导体装置及其制造方法 - Google Patents
半导体装置及其制造方法 Download PDFInfo
- Publication number
- CN104916606A CN104916606A CN201510103995.9A CN201510103995A CN104916606A CN 104916606 A CN104916606 A CN 104916606A CN 201510103995 A CN201510103995 A CN 201510103995A CN 104916606 A CN104916606 A CN 104916606A
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- Prior art keywords
- lead
- island portion
- semiconductor device
- inner lead
- messenger wire
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 63
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000011347 resin Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 34
- 238000007789 sealing Methods 0.000 claims description 29
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 230000002459 sustained effect Effects 0.000 claims description 4
- 238000005868 electrolysis reaction Methods 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 239000000758 substrate Substances 0.000 abstract description 17
- 229910000679 solder Inorganic materials 0.000 abstract description 7
- 239000000725 suspension Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000009977 dual effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000003447 ipsilateral effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/49—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions wire-like arrangements or pins or rods
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
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- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
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- H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Geometry (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Ceramic Engineering (AREA)
Abstract
Description
Claims (7)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-046883 | 2014-03-10 | ||
JP2014046883A JP6284397B2 (ja) | 2014-03-10 | 2014-03-10 | 半導体装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104916606A true CN104916606A (zh) | 2015-09-16 |
CN104916606B CN104916606B (zh) | 2018-11-13 |
Family
ID=54018104
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510103995.9A Expired - Fee Related CN104916606B (zh) | 2014-03-10 | 2015-03-10 | 半导体装置及其制造方法 |
Country Status (5)
Country | Link |
---|---|
US (1) | US10109561B2 (zh) |
JP (1) | JP6284397B2 (zh) |
KR (1) | KR102330402B1 (zh) |
CN (1) | CN104916606B (zh) |
TW (1) | TWI634634B (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106048679A (zh) * | 2016-05-30 | 2016-10-26 | 北京首钢微电子有限公司 | 一种集成电路的电镀方法 |
CN109314091A (zh) * | 2016-06-27 | 2019-02-05 | Koa株式会社 | 表面安装型薄膜电阻网络 |
CN113053847A (zh) * | 2019-12-26 | 2021-06-29 | 珠海格力电器股份有限公司 | 芯片封装结构及其制备方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6500299B2 (ja) * | 2015-03-10 | 2019-04-17 | 新日本無線株式会社 | リードフレームおよびそれを用いた半導体装置の製造方法 |
US9741617B2 (en) * | 2015-11-16 | 2017-08-22 | Amkor Technology, Inc. | Encapsulated semiconductor package and method of manufacturing thereof |
JP6332251B2 (ja) | 2015-12-09 | 2018-05-30 | 日亜化学工業株式会社 | パッケージの製造方法及び発光装置の製造方法、並びにパッケージ及び発光装置 |
US10879211B2 (en) | 2016-06-30 | 2020-12-29 | R.S.M. Electron Power, Inc. | Method of joining a surface-mount component to a substrate with solder that has been temporarily secured |
JP2023179984A (ja) | 2022-06-08 | 2023-12-20 | Tdk株式会社 | リードフレームおよび電子部品 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1306676A (zh) * | 1999-04-08 | 2001-08-01 | 新光电气工业株式会社 | 半导体装置用引线框架 |
US20030116842A1 (en) * | 2001-12-25 | 2003-06-26 | Koji Motonami | Semiconductor device and manufacturing method thereof |
CN101290920A (zh) * | 2007-04-16 | 2008-10-22 | 三洋电机株式会社 | 半导体装置 |
US20090102029A1 (en) * | 2007-10-19 | 2009-04-23 | Rohm Co., Ltd. | Semiconductor Device |
CN102244016A (zh) * | 2008-08-29 | 2011-11-16 | 三洋电机株式会社 | 树脂密封型半导体装置及其制造方法、引线框 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59147448A (ja) * | 1983-02-12 | 1984-08-23 | Fujitsu Ltd | 半導体素子搭載用リ−ドフレ−ムおよびこれを用いて製造される半導体装置とその製造方法 |
KR0145768B1 (ko) * | 1994-08-16 | 1998-08-01 | 김광호 | 리드 프레임과 그를 이용한 반도체 패키지 제조방법 |
KR100266726B1 (ko) * | 1995-09-29 | 2000-09-15 | 기타지마 요시토시 | 리드프레임과 이 리드프레임을 갖춘 반도체장치 |
JPH1074882A (ja) * | 1996-08-29 | 1998-03-17 | Nec Kansai Ltd | リードフレーム及びタイバ切断装置 |
JP2000294718A (ja) * | 1999-04-05 | 2000-10-20 | Sony Corp | 半導体装置及びその製造方法 |
JP4011076B2 (ja) * | 2004-06-28 | 2007-11-21 | 株式会社東芝 | 半導体装置及びその製造方法 |
JP2006019465A (ja) | 2004-07-01 | 2006-01-19 | Mitsui Chemicals Inc | 半導体パッケージおよびその製造方法 |
JP2006332275A (ja) * | 2005-05-25 | 2006-12-07 | Mitsumi Electric Co Ltd | 半導体装置の製造方法及び半導体装置 |
CN104465414B (zh) * | 2009-07-06 | 2017-08-15 | 瑞萨电子株式会社 | 半导体器件的制造方法 |
JP5010693B2 (ja) * | 2010-01-29 | 2012-08-29 | 株式会社東芝 | Ledパッケージ |
JP5798021B2 (ja) * | 2011-12-01 | 2015-10-21 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6161251B2 (ja) * | 2012-10-17 | 2017-07-12 | ルネサスエレクトロニクス株式会社 | 半導体装置およびその製造方法 |
-
2014
- 2014-03-10 JP JP2014046883A patent/JP6284397B2/ja not_active Expired - Fee Related
-
2015
- 2015-02-16 TW TW104105327A patent/TWI634634B/zh not_active IP Right Cessation
- 2015-03-06 KR KR1020150031723A patent/KR102330402B1/ko active IP Right Grant
- 2015-03-09 US US14/641,491 patent/US10109561B2/en not_active Expired - Fee Related
- 2015-03-10 CN CN201510103995.9A patent/CN104916606B/zh not_active Expired - Fee Related
Patent Citations (5)
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CN106048679A (zh) * | 2016-05-30 | 2016-10-26 | 北京首钢微电子有限公司 | 一种集成电路的电镀方法 |
CN109314091A (zh) * | 2016-06-27 | 2019-02-05 | Koa株式会社 | 表面安装型薄膜电阻网络 |
CN109314091B (zh) * | 2016-06-27 | 2022-07-05 | Koa株式会社 | 表面安装型薄膜电阻网络 |
CN113053847A (zh) * | 2019-12-26 | 2021-06-29 | 珠海格力电器股份有限公司 | 芯片封装结构及其制备方法 |
Also Published As
Publication number | Publication date |
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US10109561B2 (en) | 2018-10-23 |
TWI634634B (zh) | 2018-09-01 |
KR102330402B1 (ko) | 2021-11-23 |
TW201539695A (zh) | 2015-10-16 |
US20150255378A1 (en) | 2015-09-10 |
KR20150105923A (ko) | 2015-09-18 |
JP6284397B2 (ja) | 2018-02-28 |
JP2015170822A (ja) | 2015-09-28 |
CN104916606B (zh) | 2018-11-13 |
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