CN114481041A - Method for manufacturing vacuum evaporation non-metal electroforming mold - Google Patents
Method for manufacturing vacuum evaporation non-metal electroforming mold Download PDFInfo
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- CN114481041A CN114481041A CN202111597523.5A CN202111597523A CN114481041A CN 114481041 A CN114481041 A CN 114481041A CN 202111597523 A CN202111597523 A CN 202111597523A CN 114481041 A CN114481041 A CN 114481041A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/28—Vacuum evaporation by wave energy or particle radiation
- C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Electrochemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The invention provides a method for manufacturing a vacuum evaporation non-metal electroforming mold, belonging to the field of electroforming template manufacturing; the invention comprises the following steps: step one, after dust removal is carried out on a substrate, soaking the substrate in a solvent for deoiling, and drying the substrate after deoiling; secondly, placing the substrate in vacuum evaporation equipment, and installing an evaporation source; the evaporation source is metallic nickel; step three, vacuumizing the vacuum evaporation equipment; step four, preheating the substrate; step five, heating the evaporation source by electric heating or laser pulse to evaporate and plate a conductive layer on the substrate, and stopping evaporation when the conductive layer reaches a preset thickness; and step six, taking the substrate out of the vacuum evaporation equipment to obtain the finished product electroforming mold. The invention uses vacuum evaporation to replace the traditional silver spraying means to add a conducting layer for the non-metal electroforming part, thereby not only being environment-friendly and harmless to human body, but also having stable and controllable process and wider adaptability.
Description
Technical Field
The invention relates to a technology for manufacturing a precision die, in particular to a method for manufacturing a nonmetal electroforming die by vacuum evaporation, belonging to the technical field of vacuum evaporation manufacturing.
Background
In the production method of the precision mold by replication, electroforming is most commonly used. Electroforming allows large batches of nearly 1:1 copies to be made of the metal mold. If the mother board die material is metal, the mother board die material can be directly put into an electroplating pool for electroplating. If the metal is non-metal, the electroforming is performed after the conductive treatment. The treatment method is usually silver spraying, i.e. silver ions are reduced into silver attached to the surface of the substrate by using a silver mirror reaction.
As one of the methods commonly used in the art, silver spraying has an advantage in that the operation is applicable to surfaces of various shapes, and the conductivity of silver is extremely excellent. The coating thickness is typically tens of microns, but is difficult to control accurately.
Moreover, in the silver spraying process, several steps of cleaning, wetting, sensitizing, silver mirror reaction, cleaning and air drying are generally required. This requires the use of a variety of chemical reagents, particularly aldehydes (formaldehyde, acetaldehyde) and hydrazine (hydrazine hydrate) reducing agents, which are commonly used in reduction reactions, which are highly hazardous. When silver spraying is carried out, the dangerous chemical agents can be fully atomized and sprayed out, and are easier to be inhaled or adsorbed on the surface of the skin, so that the health of operators and the environment is damaged.
In addition, the silver spraying effect may be affected by various factors, such as the storage time of the reagent, the impurity content of the deionized water, the operation method of the operator, etc., which all may adversely affect the silver spraying effect and quality (the appearance may have a different color area, the conductivity is not uniform, etc.), thereby causing the product quality defect.
Disclosure of Invention
The invention provides a novel method for manufacturing a vacuum evaporation non-metal electroforming mold, which can replace silver spraying operation in the prior art by forming a conductive layer on a substrate in a vacuum evaporation mode so as to solve the technical problems of unstable quality and unfriendly environment of the silver spraying operation in the prior art.
The method for manufacturing the vacuum evaporation non-metal electroforming mold comprises the following steps:
step one, after dust removal is carried out on a substrate, soaking the substrate in a solvent for deoiling, and drying the substrate after deoiling;
secondly, placing the substrate in vacuum evaporation equipment, and installing an evaporation source; the evaporation source is metallic nickel;
step three, vacuumizing the vacuum evaporation equipment;
step four, preheating the substrate;
step five, heating the evaporation source by electric heating or laser pulse to evaporate a conductive layer on the substrate, and stopping evaporation after the conductive layer reaches a preset thickness;
and step six, taking the substrate out of the vacuum evaporation equipment to obtain the finished product electroforming mold.
In the first step, when the degreasing operation is performed, the metal electroforming mold is firstly soaked in soap water, washed, then soaked in alcohol, washed and dried.
The method for manufacturing the nonmetal electroforming mold by vacuum evaporation, wherein in the fourth step, the substrate is made of a PC plate; preheating the PC plate to 30-80 ℃.
The method for manufacturing a vacuum evaporation non-metal electroforming mold, wherein the vacuum evaporation equipment comprises: the device comprises a double electron beam evaporation device, a laser evaporation device and a plasma ion source evaporation device.
In the fifth step, after the thickness of the conductive layer reaches 100-700nm, the evaporation is stopped.
In the method of manufacturing a vacuum evaporation non-metal electroforming mold as described above, in the fourth step, the substrate is a plastic plate, a resin plate, or a polycarbonate plate.
The method for manufacturing a vacuum evaporation non-metal electroforming mold, wherein in the fourth step, the plastic plate is a PC plate, an ABS plate, a PP plate or an acrylic plate.
In the embodiment of the invention, the vacuum evaporation is used for replacing the traditional silver spraying means to add the conducting layer to the non-metal electroforming part, so that the method is environment-friendly, harmless to human bodies, stable and controllable in process and wider in adaptability.
Drawings
Fig. 1 is a schematic flow chart of a method for manufacturing a vacuum evaporation non-metal electroforming mold according to an embodiment of the present invention.
Detailed Description
The method for manufacturing the vacuum evaporation non-metal electroforming mold of the invention can be made of the following materials and components, and is not limited to the following materials and components, for example: vacuum evaporation equipment, a substrate, an evaporation source and the like.
Fig. 1 is a schematic flow chart illustrating a method for manufacturing a vacuum evaporation non-metal electroforming mold according to an embodiment of the present invention.
The method for manufacturing the vacuum evaporation non-metal electroforming mold comprises the following steps:
step one, after dust removal is carried out on a substrate, soaking the substrate in a solvent for deoiling, and drying the substrate after deoiling; the residues on the substrate can pollute the environment of a vacuum chamber of the evaporation equipment and influence the bonding property of the coating; generally, in the first step, when oil removal operation is performed, firstly, soap water is used for soaking, and after cleaning, alcohol is used for soaking, cleaning and drying.
Secondly, placing the substrate in vacuum evaporation equipment, and installing an evaporation source; the evaporation source is metallic nickel; in consideration of subsequent electroforming requirements, the evaporation source needs to be a good conductor material, and good conductivity improves electroforming quality. While considering the binding property, cost, and workability of electroformed nickel, it is preferable to evaporate metal nickel. But the evaporation source material can be filled with proper amount according to the size of the machine and the substrate, such as metallic silver, gold or other metals.
Step three, vacuumizing the vacuum evaporation equipment; thereby meeting the requirement of vacuum evaporation.
Step four, preheating the substrate; preheating the substrate helps to improve the quality of the coating, as well as the density of the evaporated layer, thereby improving conductivity. The temperature for preheating is generally selected to be a temperature below the glass transition temperature of the substrate.
Preferably, in the fourth step, the substrate is made of a PC board; preheating the PC plate to 30-80 ℃.
Step five, heating the evaporation source by electric heating or laser pulse to evaporate and plate a conductive layer on the substrate, and stopping evaporation when the conductive layer reaches a preset thickness; in general, the deposition is stopped after the thickness of the conductive layer reaches 100-700 nm.
And step six, taking the substrate out of the vacuum evaporation equipment to obtain the finished product electroforming mold.
In this embodiment, the vacuum evaporation apparatus includes: a dual electron beam evaporation device, a laser evaporation device and a plasma ion source evaporation device, and is not limited to these devices; the specific parameters of the evaporation process are determined by the machine, the base material, the shape and the required thickness of the non-metal electroforming part.
In the fourth step of the method for manufacturing a vacuum evaporation non-metal electroforming mold of the present embodiment, the substrate is a plastic plate, a resin plate, or a polycarbonate plate.
The method for manufacturing the nonmetal electroforming mold by vacuum evaporation in the embodiment of the invention has the advantages that:
1. the vacuum evaporation has less limitation on the base material and strong adsorption force, and does not need to use various dangerous reagents like silver spraying.
2. The vacuum evaporation result is more stable and controllable, and the coating material, thickness, coating surface effect and the like of the evaporation can be effectively controlled.
3. The process has mature application in the fields of laboratories, semiconductors and precision processing coating, has mature equipment and process, and can be well applied to the production and manufacturing links of the electroforming template.
4. The conventional vacuum evaporation method can carry out ion bombardment on the substrate to improve the adhesive force, but the method does not need to carry out the step.
The method uses vacuum evaporation to replace the traditional silver spraying method to add a conducting layer for the non-metal electroforming part, and the method is more environment-friendly, stable and controllable in process and various in selection of the base material.
The conventional vacuum evaporation process needs sufficient pretreatment to ensure the close combination of the plating layer and the substrate. The conductive layer on vacuum evaporation for electroforming needs to be easily peeled off from the electroforming material or the stencil. The line of evaporating nickel, electroforming nickel, the latter can be easier to handle.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments. Through the above description of the embodiments, those skilled in the art can clearly understand that the method of the above embodiment can be implemented by some variations and the necessary general technical superposition; of course, the method can also be realized by simplifying some important technical features in the upper level. Based on such understanding, the technical solution of the present invention essentially or contributing to the prior art is: the overall application method is matched with the method described in each embodiment of the invention.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (7)
1. A method for manufacturing a vacuum evaporation non-metal electroforming mold is characterized by comprising the following steps:
step one, after removing dust on a substrate, soaking the substrate in a solvent to remove oil, and drying the substrate after removing the oil;
secondly, placing the substrate in vacuum evaporation equipment, and installing an evaporation source; the evaporation source is metallic nickel;
step three, vacuumizing the vacuum evaporation equipment;
step four, preheating the substrate;
step five, heating the evaporation source by electric heating or laser pulse to evaporate and plate a conductive layer on the substrate, and stopping evaporation when the conductive layer reaches a preset thickness;
and step six, taking the substrate out of the vacuum evaporation equipment to obtain a finished product electroforming mold.
2. The method according to claim 1, wherein in the first step, the degreasing operation is performed by soaking the mold in soap water, cleaning the mold, soaking the mold in alcohol, cleaning the mold, and drying the mold.
3. The method according to claim 1, wherein in the fourth step, the substrate is a plastic plate; preheating the plastic plate to 30-80 ℃.
4. The method of claim 1, wherein the vacuum evaporation apparatus comprises: double electron beam evaporation equipment, laser evaporation equipment and plasma ion source evaporation equipment.
5. The method as claimed in claim 1, wherein in the step five, the evaporation is stopped after the thickness of the conductive layer reaches 100-700 nm.
6. The method for manufacturing a vacuum evaporation non-metal electroforming mold according to any of claims 1 to 2, wherein in the fourth step, the substrate is a plastic plate, a resin plate or a polycarbonate plate.
7. The method according to claim 1, wherein in the fourth step, the plastic sheet is a PC sheet, an ABS sheet, a PP sheet, or an acrylic sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111597523.5A CN114481041A (en) | 2021-12-24 | 2021-12-24 | Method for manufacturing vacuum evaporation non-metal electroforming mold |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111597523.5A CN114481041A (en) | 2021-12-24 | 2021-12-24 | Method for manufacturing vacuum evaporation non-metal electroforming mold |
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| Publication Number | Publication Date |
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| CN114481041A true CN114481041A (en) | 2022-05-13 |
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| CN202111597523.5A Pending CN114481041A (en) | 2021-12-24 | 2021-12-24 | Method for manufacturing vacuum evaporation non-metal electroforming mold |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001073181A (en) * | 1999-09-01 | 2001-03-21 | Ricoh Co Ltd | Electroforming original plate blank, electroforming original plate, production of electroforming parts and production of diaphragm |
| JP2006175742A (en) * | 2004-12-22 | 2006-07-06 | Cbc Ings Kk | Metallically finished plastic ornament |
| CN101092720A (en) * | 2006-06-20 | 2007-12-26 | 比亚迪股份有限公司 | An electroform method |
| CN101435091A (en) * | 2008-11-25 | 2009-05-20 | 广东东南薄膜科技股份有限公司 | Improved method for converting plastic mother film into metal mother matrix |
| CN103147045A (en) * | 2013-03-27 | 2013-06-12 | 东莞劲胜精密组件股份有限公司 | Metallized surface decorative finishing method of plastic shell |
| CN105111487A (en) * | 2015-09-22 | 2015-12-02 | 太仓市金鹿电镀有限公司 | ABS film electroplating process for automobile electroformed label |
| CN106256925A (en) * | 2015-06-18 | 2016-12-28 | 佳能特机株式会社 | Vacuum deposition apparatus, the manufacture method of evaporation film and the manufacture method of organic electronic device |
-
2021
- 2021-12-24 CN CN202111597523.5A patent/CN114481041A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001073181A (en) * | 1999-09-01 | 2001-03-21 | Ricoh Co Ltd | Electroforming original plate blank, electroforming original plate, production of electroforming parts and production of diaphragm |
| JP2006175742A (en) * | 2004-12-22 | 2006-07-06 | Cbc Ings Kk | Metallically finished plastic ornament |
| CN101092720A (en) * | 2006-06-20 | 2007-12-26 | 比亚迪股份有限公司 | An electroform method |
| CN101435091A (en) * | 2008-11-25 | 2009-05-20 | 广东东南薄膜科技股份有限公司 | Improved method for converting plastic mother film into metal mother matrix |
| CN103147045A (en) * | 2013-03-27 | 2013-06-12 | 东莞劲胜精密组件股份有限公司 | Metallized surface decorative finishing method of plastic shell |
| CN106256925A (en) * | 2015-06-18 | 2016-12-28 | 佳能特机株式会社 | Vacuum deposition apparatus, the manufacture method of evaporation film and the manufacture method of organic electronic device |
| CN105111487A (en) * | 2015-09-22 | 2015-12-02 | 太仓市金鹿电镀有限公司 | ABS film electroplating process for automobile electroformed label |
Non-Patent Citations (1)
| Title |
|---|
| 张允诚等编: "《电镀工艺手册 第2版》", 国防工业出版社, pages: 512 * |
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