CN104904004B - Workpiece adheres to chuck assembly and workpiece make-up machine - Google Patents
Workpiece adheres to chuck assembly and workpiece make-up machine Download PDFInfo
- Publication number
- CN104904004B CN104904004B CN201380069904.3A CN201380069904A CN104904004B CN 104904004 B CN104904004 B CN 104904004B CN 201380069904 A CN201380069904 A CN 201380069904A CN 104904004 B CN104904004 B CN 104904004B
- Authority
- CN
- China
- Prior art keywords
- workpiece
- adhesion
- plate workpiece
- stripping portion
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Liquid Crystal (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Jigs For Machine Tools (AREA)
Abstract
The present invention provides a kind of workpiece adhesion chuck assembly and workpiece make-up machine, and it easily and reliably from stripping portion peels off the plate workpiece that stripping is attached in vacuum under air atmosphere.In the present invention, relative to the plate workpiece (W) that holding is attached in adhesion part (1), by the prominent deformation of stripping portion (2) elasticity under vacuum atmosphere, and press surface (2a) is contacted with the surface (W1) of plate workpiece (W), so that plate workpiece (W) is stripped from adhesion part (1).Afterwards, in the state of keeping making the press surface (2a) of stripping portion (2) be contacted with the surface (W1) of plate workpiece (W), open the ambient atmosphere of plate workpiece (W), so as to air is flowed into by stream (2p) from the outer space (S2) of stripping portion (2) to inner space (S1), by vacuum breaking between the inner space (S1) and plate workpiece (W) of stripping portion (2).
Description
Technical field
The present invention be about a kind of workpiece adhere to chuck assembly and possess the workpiece adhere to chuck assembly workpiece make-up machine,
Workpiece adhesion chuck assembly for example liquid crystal display (LCD), organic el display (OLED), plasma display panel (PDP),
In the manufacturing process of the flat-panel monitors such as flexible display, it is used in and keep the glass such as CF glass or TFT glass including adhesion
The plate workpiece such as glass substrate or the synthetic resin substrate comprising the plastic foils such as PES (Poly-Ether-Sulphone) etc.
And the substrate assembling apparatus of the baseplate-laminating machine fitted, convey insulator, electric conductor or the semiconductor crystal wafers such as this substrate
Base board delivery device Deng workpiece (handled object) etc..
Background technology
In the past, chuck assembly and workpiece make-up machine were adhered to as this workpiece, and there is the base plate bonding including following part to fill
Put：1st chamber, possesses the 1st flat board that the 1st substrate is disposed；2nd chamber, from above-mentioned 1st chamber isolation and possesses and above-mentioned
The 2nd flat board that 2nd substrate of 1 base plate bonding is disposed；Substrate chuck, with making to be placed in above-mentioned 1st flat board using adhesion
On the 1st substrate fix adhesion rubber；And adhering disintegration removes device, the power in the direction opposite with above-mentioned adhesion is guided, so that
Above-mentioned 1st substrate departs from above-mentioned adhesion rubber.Above-mentioned adhering disintegration is except device is from being arranged at above-mentioned 1st flat board and to the above-mentioned 1st
The attachment surface direction heating expansion of substrate is constituted come the heating bulge for departing from above-mentioned 1st substrate.Above-mentioned heating bulge bag
Include the bulge of the material of the ductility of the attachment surface side expansion for being included in above-mentioned 1st substrate for being attached to above-mentioned adhesion rubber
Part, and above-mentioned adhesion rubber is formed at central part, above-mentioned heating bulge is located at around it with ring-type.Under vacuum conditions,
Above-mentioned 1st substrate is set to depart from from above-mentioned adhesion rubber by expanding above-mentioned heating bulge, and it is above-mentioned with underlying
2nd base plate bonding, afterwards, isolates above-mentioned 1st chamber and above-mentioned 2nd chamber and atmosphere opening, and convey the above-mentioned 1st for being bonded
Substrate and above-mentioned 2nd substrate (referring for example to patent document 1).
Conventional art document
Patent document
Patent document 1：Japanese Patent Publication 2010-126342 publications (6- pages 9, Fig. 1-8)
The summary of invention
The invention technical task to be solved
However, in the manufacturing process such as LCD, under vacuum atmosphere, if making two pieces of baseplate-laminatings enclose material quilt for liquid crystal etc.
Sandwich between it, the adhesion that the wherein substrate of a side is released afterwards keeps and opens its ambient atmosphere, then two pieces of substrate clampings
Enclose material and not completely bonding because release adhesion keep a wherein side substrate be possible to away from enclose material and from
Gap is mixed into the gases such as air to material is enclosed.
Therefore, in order to solve this problem points, it is contemplated that the adhesion for not releasing the substrate for being bonded under vacuum atmosphere is protected
Atmosphere opening while holding, and crimp two pieces of substrates, prevents air to be mixed into inclosure material.
But, in the substrate chuck of the patent document 1, if making cyclic expansion part be close contact in the 1st under vacuum conditions
The surface of substrate and to the 2nd substrate crimp, and make its ambient atmosphere open, then the adhesion surrounded by cyclic expansion part
The surrounding space of rubber turns into vacuum state.Accordingly, there exist following fatal problem, i.e., relative to the surface of the 1st substrate, ring-type
Swelling part turns into absorption layer, even if the expansion of cyclic expansion part cannot also peel off the 1st substrate under atmospheric atmosphere afterwards.
If as a result, deforming cyclic expansion part reverse shunk in rear operation, causing to fit on the 2nd substrate
1st substrate is sling by cyclic expansion part (absorption layer).Now, when the 1st substrate is thickness 0.3mm such as the following ultra thin substrates, deposit
Because making the 1st substrate deform with deadweight that slinging and producing, and with asking that the accuracy of fit of the 2nd substrate declines
Topic.
Also, because swelling part is made up of the material of ductility, therefore through prolonged and repeated because of the elastic deformation of swelling part
When the pressing of the 1st substrate for producing is peeled off, the press surface of swelling part is blended in the surface of the 1st substrate, so as to by swelling part
Press surface when being crimped on the surface of the 1st substrate, there is the table of Van der Waals force (gravitation) and the 1st substrate arrived by microscopic observation
The problem that face adheres to and cannot peel off.
Also, in the substrate bonding apparatus of the patent document 1, relative to the 1st flat board, multiple substrate chucks and adhering disintegration
Except device is respectively configured to matrix shape, is adhered to simultaneously by the adhesion rubber of multiple substrate chucks and keep the 1st substrate, passed through
Multiple adhering disintegrations peel off the 1st substrate simultaneously except the expansion of the cyclic expansion part in device.
But, if making multiple cyclic expansion parts respectively be close contact in the surface of the 1st substrate in the case where vacuum state is kept
In the case of, open its ambient atmosphere, then multiple adhering disintegrations by some cyclic expansion parts except at least being surrounded in device
The surrounding space for adhering to rubber turns into vacuum state, it is impossible to respectively peel off the 1st substrate.Therefore, it is same by cyclic expansion part
When contraction distortion, cause to fit in the 1st substrate on the 2nd substrate and locally sling by some cyclic expansion parts (absorption layer), and
In the presence of being locally deformed with the 1st substrate, and with the problem of the accuracy decline of fitting of the 2nd substrate.
To solve this problem, its purpose is under air atmosphere, easily and reliably from stripping portion to problem of the invention
Plate workpiece of stripping etc. is attached in stripping vacuum.
Means for solving technical task
To realize this purpose, workpiece of the invention adheres to chuck assembly, is peeled off under vacuum atmosphere and is attached holding
After plate workpiece, open the ambient atmosphere of the plate workpiece, wherein, possess：Adhesion part, the adhesion part with the tabular
The opposed mode of workpiece is set and detachably adhesion keeps the plate workpiece；And stripping portion, the stripping portion elastically deformable,
And set in the way of surrounding the periphery of the adhesion part, it is crimped on described with the prominent deformation towards the plate workpiece
The surface of plate workpiece simultaneously forces to peel off from the adhesion part, and the stripping portion has press surface, and the press surface is being configured with
The inner space of the adhesion part and surround the inner space between the outer space of configuration more more outward than the stripping portion
The mode of periphery formed, from vacuum atmosphere up to atmosphere opening when contacted with the surface of the plate workpiece；And vacuum
Destruction stream, the atmosphere opening that the vacuum breaking stream is contacted in the press surface with the surface of the plate workpiece
When, connect the inner space and the outer space and air is flowed into the inner space from the outer space.
Invention effect
In workpiece of the invention adhesion chuck assembly with the feature, relative to the plate that holding is attached in adhesion part
Shape workpiece, makes press surface be contacted with plate workpiece surface the prominent deformation of stripping portion elasticity, so that tabular under vacuum atmosphere
Workpiece is stripped from adhesion part, and afterwards, holding makes the press surface of stripping portion make plate in the state of being contacted with the surface of plate workpiece
The ambient atmosphere of shape workpiece is opened, so that air is entered from the outer space of stripping portion by stream to inner side spatial flow, stripping portion
Inner space and plate workpiece between by vacuum breaking.
Thereby, it is possible to easily and reliably peel off the tabular work that stripping is attached in vacuum from stripping portion under air atmosphere
Part.
If as a result, make cyclic expansion part be close contact in the case of the 1st substrate by atmosphere opening under keeping vacuum state,
The conventional art phase that then turn into vacuum state and cannot peel off with the surrounding space of the adhesion rubber surrounded by cyclic expansion part
Than even if deforming the press surface reverse shunk of stripping portion in rear operation, plate workpiece will not also be lifted, even if tabular
Workpiece is ultra thin substrate, will not also be deformed, and the strain deformation of plate workpiece does not occur and can normally be adhered to
Keep and peel off.
Brief description of the drawings
Fig. 1 is to represent that the workpiece involved by embodiments of the present invention adheres to the explanatory diagram of chuck assembly, and (a) is longitudinal section
Front view, (b) is look up figure.
Fig. 2 is the diminution longitudinal section front view for representing the workpiece make-up machine involved by embodiments of the present invention.
Specific embodiment
Hereinafter, embodiments of the present invention are described in detail according to diagram.
It is big reaching shown in workpiece adhesion chuck assembly A such as Fig. 1 (a), Fig. 1 (b) involved by embodiments of the present invention
Under the atmosphere of the vacuum of gas atmosphere or vacuum atmosphere and regulation, for example detachably adhesion keeps the base comprising such as LCD
The plate workpiece W of plate etc., and after forcing to peel off the plate workpiece W that this is attached holding under the vacuum atmosphere, make plate workpiece W
Ambient atmosphere open (return to air atmosphere in).
If being described in detail, the workpiece adhesion chuck assembly A of embodiments of the present invention possesses following main composition
Important document：Adhesion part 1, is set in the mode opposed with plate workpiece W and detachably adhesion keeps plate workpiece W；Peel off
Portion 2, elastically deformable and is set in the way of surrounding the periphery of adhesion part 1；And support 3, in order to directly or indirectly install
Adhesion part 1 and stripping portion 2 and set.
Adhesion part 1 is its entirety or a part for example with fluorubber or elastomer, butyl rubber, photoresist, propylene
The adhesion material such as class or silicon class is formed as the adhesion tablet of sheet, and is formed as the adhesive face 1a for having resilient planar.
The adhesive face 1a of adhesion part 1 is configured to, and the mode opposed with plate workpiece W is installed on aftermentioned support 3, and makes court
The surface W1 of the plate workpiece W moved to adhesion part 1 and support 3 is contacted, so that plate workpiece W is detachably attached guarantor
Hold.
In addition, in the shown example of figure, adhesive face 1a is preferably configured as, be formed as concavo-convex for example, by be embossed processing etc.
Shape and overall easily elastic deformation and easily adhere to plate workpiece W.
Stripping portion 2 is its entirety or a part with the elastically deformable such as such as rubber or elastomer, soft synthetic resin
Elastomeric material is formed as the flexure strips such as the barrier film or elastic membrane of the sheets such as circular or rectangle, and with being formed as surrounding adhesion part 1
Adhesive face 1a periphery ring-type elastically deformable press surface 2a.
The press surface 2a of stripping portion 2 is configured to, with it is opposed with plate workpiece W and along closer or far from plate workpiece W table
The Z-direction of face W1 can the mode of the prominent deformation of elasticity be installed on aftermentioned support 3, and by the primary side in press surface 2a with it is secondary
Pressure differential of level side etc. deforms towards plate workpiece W elasticity is prominent.
Support 3 is for example to be difficult to be adhered to the press surface 2a of stripping portion 2 with hard resin, metal, ceramics etc.
Material is formed as the base plate of the tabular of circle or rectangle etc., and is set in the mode parallel with plate workpiece W.
Opposed with plate workpiece W opposed faces 3a in support 3, adhesion part 1 is along Z-direction and the XY directions intersected with this
Immovably it is installed on its center, and adhesive face 1a is configured to press surface 2a than stripping portion 2 more to plate workpiece W somewhat
It is prominent.
Stripping portion 2 surrounds adhesion part 1 to be arranged in the opposed faces 3a of support 3 along the immovable mode in XY directions
The ring-type position of periphery, and make press surface 2a that the plate workpiece W of the adhesive face 1a of adhesion part 1 is held in towards adhesion along Z-direction
The prominent deformation of elasticity, further promotes so as to be crimped on surface W1 to equidirectional.
As making the press surface 2a of stripping portion 2 along the concrete example of the mechanism of the prominent deformation of Z-direction elasticity, preferably it is also equipped with
For the primary side supply driving drive division 4 of fluid F to press surface 2a, supplied from drive division 4 to the primary side of press surface 2a
Driving fluid F is given, so that so that press surface 2a is maintained at the plate workpiece W elasticity of the adhesive face 1a of adhesion part 1 towards adhesion
Prominent mode dilatancy.
Drive division 4 has only unidirectional supply or two-way picks and places the fluid F of the driving comprising the gases such as compressed air or liquid
The driving source (not shown) such as pump and support 3 opposed faces be formed at ring-type position the back side stream 3b, and driving source
Connected with the primary side of press surface 2a via stream 3b.
In the work of drive division 4, driving is supplied by stream 3b with fluid F towards the primary side of press surface 2a, so that
Make press surface 2a that the plate workpiece W dilatancies of the adhesive face 1a of adhesion part 1 are held in towards adhesion, and be crimped on plate workpiece
The surface W1 of W, stripping plate workpiece W is forcibly pressed from the adhesive face 1a of adhesion part 1.
Also, it is not shown as other, but as making the press surface 2a of stripping portion 2 along the prominent deformation of Z-direction elasticity
Mechanism, is pressed etc. instead of supply driving by cylinder body etc. with the drive division 4 of fluid F, can be made with other driving sources
Press surface 2a is along the prominent deformation of Z-direction elasticity.
The peeling action of the plate workpiece W of stripping portion 2 is illustrated according to Fig. 1 (a).
Under original state, as shown in the single dotted broken line of Fig. 1 (a), the press surface 2a of stripping portion 2 is with opposed with support 3
The mode contraction distortion that face 3a connects is plane or concavity, and the plate workpiece W not kept to being attached face 1a adhesions acts on stripping
It is standby from power.
During stripping, as shown in the double dot dash line of Fig. 1 (a), by the pressure official post of the primary side and primary side of press surface 2a
Press surface 2a expands and prominent deformation by along Z-direction away from the surface 3a of support 3 and in the way of being close to plate workpiece W, so that
Press surface 2a is contacted with the surface W1 of plate workpiece W and is pressed and forcibly peel off plate workpiece W (pressings from adhesive face 1a
Peel off).
Also, after peeling off plate workpiece W from adhesive face 1a, make the press surface 2a of stripping portion 2 with along Z-direction away from tabular
The mode reverse shunk of the surface W1 of workpiece W and deformation of submerging, so as to return to the initial shape shown in the single dotted broken line of Fig. 1 (a)
State.
Also, the surface W1 that stripping portion 2 has press surface 2a and plate workpiece W when the stripping portion is contacted and is crimped
When, connect the outer space S2 for being configured with the inner space S1 of the stripping portion 2 of adhesion part 1 and the side opposite with the inner space
Logical vacuum breaking stream 2p.
Vacuum breaking stream 2p is made up of multiple gap 2b and multiple groove 2c etc., and the multiple gap 2b will be will peel off
The mode that the press surface 2a Surface Machinings in portion 2 are connected into concavo-convex throughout inner space S1 and outer space S2 is formed, described
Multiple groove 2c are so that the press surface 2a of multiple stripping portions 2 respectively discontinuously to be set along the circumferential direction centered on adhesion part 1
The mode that inner space S1 and outer space S2 is connected between press surface 2a adjacent in the circumferential direction is formed.
In example shown in Fig. 1 (a), Fig. 1 (b), as stream 2p, the press surface 2a of stripping portion 2 is for example added with embossing
Work and air blast treatment (sand-blast) or other surfaces processing etc. are formed as concavo-convex, so as to form multiple gap 2b, and along with
Circumferential direction centered on adhesion part 1 discontinuously sets multiple press surface 2a, so as to be formed along the radiation direction centered on adhesion part 1
Multiple groove 2c of extension.
In addition, concaveconvex shape, the shape of multiple gap 2b of the press surface 2a by being embossed the generations such as processing and Surface Machining
Shape and their size and depth are not limited to illustrated example, and can carry out various modifications.
Also, it is not shown as other, but as stream 2p, also can only set by concavo-convex in press surface 2a
Appointing in multiple gap 2b of the Surface Machining formation or multiple groove 2c being formed between press surface 2a adjacent in the circumferential direction
One.
Workpiece adhesion chuck assembly A according to this embodiments of the present invention, in air atmosphere or vacuum atmosphere, leads to
The adhesive face 1a adhesions for crossing adhesion part 1 keep plate workpiece W, afterwards, relative to the plate workpiece W kept in the adhesion of adhesion part 1,
The elastic expansion of stripping portion 2 and prominent deformation made under vacuum atmosphere press surface 2a contacted with the surface W1 of plate workpiece W and
Crimping.
Thus, plate workpiece W is peeled off from adhesion part 1.
Afterwards in the state of holding contacts the surface W1 of the press surface 2a and plate workpiece W of stripping portion 2, make tabular work
The ambient atmosphere of part W is opened.
Thus, air is flowed into from the outer space S2 of stripping portion 2 by stream 2p to inner side space S 1, stripping portion 2 it is interior
By vacuum breaking between side space S 1 and plate workpiece W.
Therefore, under air atmosphere, can easily and reliably be peeled off from stripping portion 2 and the adhesion stripping of portion 1 is attached in vacuum
From plate workpiece W.
As a result, in rear operation, though make the press surface 2a of stripping portion 2 with along Z-direction away from plate workpiece W surface
The mode reverse shunk of W1 and submerge deformation plate workpiece W will not also be lifted, even if plate workpiece W be such as thickness
The such as the following ultra thin substrates of 0.3mm will not also deform, and not make plate workpiece W that strain deformation occurs, and can carry out normal
Adhesion keeps and peels off.
Especially, stream 2p be by by the press surface 2a Surface Machinings of stripping portion 2 into concavo-convex throughout inner space S1
And the mode of outer space S2 connections formed multiple gap 2b when, make with the prominent deformation of stripping portion 2 it is concavo-convex by
Pressure surface 2a is crimped with the surface W1 of plate workpiece W, thus air by the multiple gap 2b as stream 2p respectively from outside
Space S 2 is flowed into inner side space S 1, by vacuum breaking between the inner space S1 and plate workpiece W of stripping portion 2.
Accordingly, as simple structure, plate workpiece W can be normally peeled off from stripping portion 2 under air atmosphere.
As a result, manufacture and maintenance relatively simple and cost decline.
Also, stream 2p be by by the press surface 2a of multiple stripping portions 2 respectively along circumferential direction centered on adhesion part 1
The mode for discontinuously setting and inner space S1 and outer space S2 being connected between press surface 2a adjacent in the circumferential direction is formed
During multiple groove 2c, the press surface 2a than stripping portion 2 can be formed deeply and as the groove 2c of stream 2p, with stripping portion 2
Prominent deformation makes multiple press surface 2a while being crimped with the surface W1 of plate workpiece W, so that air is by as the recessed of stream 2p
Groove 2c is respectively flowed into from outer space S2 to inner side space S 1, true between the inner space S1 and plate workpiece W of stripping portion 2
Sky destruction.
Accordingly, as simple structure, and can be through being reliably peeled tabular work from stripping portion 2 in air atmosphere for a long time
Part W.
As a result, manufacture and safeguard that relatively simple and cost declines, and can be through being stablized for a long time stripping.
That is, if by the elastic deformation of the swelling part of the material comprising ductility and through the pressing of prolonged and repeated 1st substrate
Peel off, then with pass through the Van der Waals force that microscopic observation arrives because of the surface that the press surface of swelling part is blended in the 1st substrate and adhere to
Compared without strippable conventional art in the surface of the 1st substrate, constituted through prolonged and repeated reason elastomer (ductility material)
The elastic deformation of stripping portion 2 and the pressing of plate workpiece W that produces is peeled off, even if the press surface 2a abrasions of stripping portion 2, it is also possible to
Groove 2c deeper than the press surface 2a of stripping portion 2 and as stream 2p is formed, therefore, it is possible to reduce because of the shadow that Van der Waals force is produced
Ring, can maintain to peel off and excellent in stability through long-term.
On the other hand, workpiece make-up machine involved by embodiments of the present invention is as shown in Fig. 2 multiple workpiece adhesions
Chuck assembly A respectively either one of scattering device in opposite a pair of holding plates 11,11 ' or both at regular intervals,
Holding plate workpiece (the 1st plate workpiece) W is detachably adhered to multiple adhesion chuck assembly A, and peels off it, so that
It is overlapped in another plate workpiece (the 2nd plate workpiece) W ' and fits.
Used as its concrete example, holding plate 11,11 ' is for example smoothly formed by flat board etc., and a side (top) wherein
Holding plate 11 be provided with workpiece adhesion holding meanss A, its adhesive attachment means 1 adhesion keep the 1st plate workpiece W, the opposing party (under
Holding plate 11 ' just) maintains the 2nd plate workpiece W ' in the way of via seal C and the 1st plate workpiece W parallel opposeds.
In addition, as needed, in a pair of holding plates 11,11 ' either one or both keep dress to surround workpiece adhesion
The mode for putting A is provided with multiple attraction adsorbing mechanisms 12, and by these adsorbing mechanism 12 can be attracted detachably to attract
Adsorb in the 1st plate workpiece W or the 2nd plate workpiece W ' either one or both.
Embodiment 1
Then, according to illustrating various embodiments of the present invention.
Such as shown in Fig. 1 (a), Fig. 1 (b), workpiece adhesion chuck assembly A is formed into the stripping portion 2 of ring-type to the embodiment 1
The mode that the driving fluid F in self-driven portion 4 is sealed since inner circumferential position 2d and periphery position 2e is respectively clamped and fastened on
Support 3.
If further describing, stripping portion 2 is for example (to be injected into compression molding (compression forming) and injection moulding
Type) etc. be integrally formed as the barrier film and elastic membrane of ring-type, and pressing with the elastically deformable formed along the surface 3a of support 3
Flange shape inner circumferential position 2d that the inner side and outside of pressure surface 2a and press surface 2a are formed continuously along the mode for radially extending and
Periphery position 2e.
In example shown in Fig. 1 (a), Fig. 1 (b), mounting hole 3c is offered in the center of support 3, from surface 3a sides along Z
The base material 5 of adhesion part 1 is inserted mounting hole 3c by direction, so that the inner circumferential position 2d of stripping portion 2 is clamped without removable along Z-direction
Fixation is clamped dynamicly.
The base material 5 of adhesion part 1 is formed as cylindric or corner post shape, adhesive part 1 is fixed in one end 5a, in the other end
5b screws togather fastening part 5c such as nut etc. and fixes from the behind of support 3, so as to be fixed on the mounting hole 3c of support 3.
The lateral surface of base material 5 and the inner peripheral surface of the mounting hole 3c opposed with its be formed be mutually clamped stage portion 5d,
3c1, sandwiches the inner circumferential position 2d of stripping portion 2 between stage portion 5d, 3c1 along Z-direction.
Annular recessed portion 3d is arranged with the periphery of the surface 3a sides of support 3, using the fasteners such as screw and bolt 7 by ring
6 are installed on annular recessed portion 3d, so as to sandwich the periphery position 2e of stripping portion 2 along Z-direction between annular recessed portion 3d and ring 6.
Preferably, when inner circumferential position 2d and periphery position 2e is integrally formed and is clamped and fastened on support 3 for anti-stop bit
Put annular thickening part 2d1,2e1 of skew.
The surface 3a of support 3 is formed as convex by stage the portion 3c1 and annular recessed portion 3d of mounting hole 3c, along its surface
Between the press surface 2a and inner circumferential position 2d and periphery position 2e of stripping portion 2, a pair of foot position 2f are integrally formed.
Also, the base material 5 of adhesion part 1, stripping portion 2, support 3 and ring 6 are installed them and are integrated according to secondary, turn into
Workpiece adhesion chuck assembly A.
Also, it is not shown as other, but do not use base material 5 and ring 6 and can by the inner circumferential position 2d of stripping portion 2 and
Periphery position 2e is clamped and fastened on support 3 or the shape of support 3 and stripping portion 2 is changed into the shape beyond illustrated example.
Workpiece adhesion chuck assembly A according to involved by this embodiments of the invention 1, by by ring-type stripping portion 2
Inner circumferential position 2d and periphery position 2e are respectively clamped and fastened on support 3 and the primary of press surface 2a are supplied to from drive division 4
The driving fluid F of side is pressed face 2a closings, therefore the leakage of driving fluid F does not occur, and press surface 2a is towards tabular
The surface W1 of workpiece W is to primary side dilatancy.
Accordingly, as simple structure, and the leakage of driving fluid F is prevented from, and pressing is driven through steady in a long-term
Face 2a.
As a result, in the presence of following advantage：Manufacture and maintenance relatively simple and cost decline, and can be through carrying out tabular for a long time
The stripping of the stabilization of workpiece W.
Also, as shown in Fig. 1 (a), Fig. 1 (b), set by the concavo-convex Surface Machining in press surface 2a as stream 2p
During both multiple gap 2b of the formation and multiple groove 2c being formed between press surface 2a adjacent in the circumferential direction, only
During multiple gap 2b, even if the outer space S2 from stripping portion 2 is not enough to the throughput of the air of inner side space S 1, can also make sky
Gas is supplemented from outer space S2 by multiple groove 2c to inner side space S 1, thus stripping portion 2 inner space S1 and plate
By vacuum breaking between shape workpiece W.
Thus, have the following advantages that：Under air atmosphere, quickly and reliably peeled off from stripping portion 2 and be attached in vacuum
The plate workpiece W that the adhesion of portion 1 is peeled off.
And, as stream 2p, though press surface 2a upper surfaces processing multiple gap 2b because through for a long time with tabular work
Part W contact peel off and wear and tear, throw away remain be arranged at than gap 2b depth position groove 2c, therefore be further able to through
The long-term stripping stablized.
Embodiment 2
The embodiment 2 is as shown in Fig. 2 workpiece make-up machine is reaching the vacuum of air atmosphere or vacuum atmosphere or regulation
Under atmosphere, the adhesion part 1 for adhering to work piece apparatus A in the multiple workpiece for being disposed therein the holding plate 11 of a side is adhered to and kept simultaneously
Plate workpiece (the 1st plate workpiece) W, and fit in another plate workpiece (the 2nd plate for the holding plate 11 ' for being maintained at the opposing party
Shape workpiece) W ', afterwards, under vacuum atmosphere, chuck assembly A is adhered in the multiple workpiece for being disposed therein the holding plate 11 of a side
Stripping portion 2 in, while after peeling off the 1st plate workpiece W that is fitted and the 2nd plate workpiece W ', make the 1st plate workpiece W and
The ambient atmosphere of the 2nd plate workpiece W ' opens (returning to air atmosphere).
In the example shown in Fig. 2, the support 3 of workpiece adhesion chuck assembly A is embedded into the table for being formed at holding plate 11
Multiple concavity 11a in face, and fixed workpiece adhesion chuck assembly A is installed in holding plate 11 with the fasteners such as screw and bolt 7,
Driving fluid F is individually supplied to the stream 3b of support 3 from the passage 11b dug on holding plate 11, so as to peel off
The press surface 2a dilatancies in portion 2 and forcibly press peel off adhesive face 1a adhesion keep the 1st plate workpiece W.
Also, it is not shown as other, but the installing mechanism as support 3 relative to holding plate 11, can replace
The firm part 7 such as screw and bolt and use other retention mechanisms.
Workpiece make-up machine according to involved by this embodiments of the invention 2, in the viscous of multiple workpiece adhesion chuck assembly A
Attached portion 1 adheres to and maintains plate workpiece (the 1st plate workpiece) W simultaneously, and fits in another plate workpiece (the 2nd plate workpiece) W '
Afterwards, under vacuum atmosphere, make the prominent deformation simultaneously of stripping portion 2 of multiple workpiece adhesion chuck assembly A and make press surface 2a points
The surface W1 of the 1st plate workpiece W is not crimped on, so as to peel off plate workpiece W from adhesion part 1.Afterwards, keeping making stripping portion
In the state of the surface W1 of 2 press surface 2a and plate workpiece W is contacted, around the 1st plate workpiece W and the 2nd plate workpiece W '
By atmosphere opening so that air is respectively flowed into inner space S1 by each stream 2p from outer space S2, stripping portion 2 it is interior
By vacuum breaking between the plate workpiece W of side space S 1 and the 1st.
Therefore, plate workpiece (the 1st plate workpiece) W for being fitted and another plate workpiece (the 2nd tabular work are made in basis
Part) W ' to keep poised state in the case of, can easily and reliably be peeled off from stripping portion 2 under air atmosphere.
As a result, keeping making multiple cyclic expansion parts respectively be close contact in the surface of the 1st substrate under vacuum conditions
In the case of, if opening its ambient atmosphere, the week with the adhesion rubber at least being surrounded by several cyclic expansion parts
Confining space turns into vacuum state and the conventional art that cannot peel off the 1st substrate is compared, though make in rear operation stripping portion 2 by
Pressure surface 2a shrinks and deformation of submerging simultaneously, and the 1st plate workpiece W also will not locally sling, and prevent the part of the 1st plate workpiece W
Deformation.
Thus, have the following advantages that：It is able to maintain that the laminating of the 1st plate workpiece W and the 2nd plate workpiece W ' higher is accurate
Degree, and improve yield rate and productivity ratio.
In addition, in the example shown in Fig. 2, only the holding plate 11 of a side (top) sets workpiece adhesion chuck dress wherein
Put A and attract adsorbing mechanism 12, but be not limited to this, it is also possible to workpiece is set in the holding plate 11 ' of the opposing party (lower section) and is glued
Attached chuck assembly A attracts adsorbing mechanism 12.
Symbol description
A- workpiece adhere to chuck assembly, 1- adhesion parts, 1a- adhesive faces, 2- stripping portions, 2a- press surfaces, 2b- gaps, 2c-
Groove, 2d- inner circumferentials position, 2e- peripheries position, 2p- streams, 3- supports, 4- drive divisions, the holding plate of a 11- wherein sides,
The holding plate of 11 '-the opposing party, F- driving fluids, S1- inner spaces, S2- outer spaces, W- plate workpieces (the 1st tabular work
Part), W1- surfaces, W '-another plate workpiece (the 2nd plate workpiece).
Claims (6)
1. a kind of workpiece adhesion chuck assembly, after the plate workpiece that stripping is attached holding under the vacuum atmosphere, makes the tabular
The ambient atmosphere of workpiece is opened, it is characterised in that possessed：
Adhesion part, the adhesion part is set in the mode opposed with the plate workpiece and detachably adhesion keeps the tabular work
Part；And
Stripping portion, the stripping portion elastically deformable, and set in the way of surrounding the periphery of the adhesion part, with described in
Protruding for plate workpiece deforms and is crimped on the surface of the plate workpiece and forces to peel off from the adhesion part,
The stripping portion has press surface and vacuum breaking stream,
The press surface is between the outer space of the inner space of the adhesion part and configuration on the outside of the stripping portion is configured with
Formed with surrounding the periphery of the inner space, from vacuum atmosphere up to atmosphere opening when connect with the surface of the plate workpiece
Touch；
The vacuum breaking stream makes institute in the atmosphere opening that the press surface is contacted with the surface of the plate workpiece
State inner space to be connected with the outer space, and air is flowed into the inner space from the outer space.
2. workpiece according to claim 1 adheres to chuck assembly, it is characterised in that：
The stream be with by the press surface Surface Machining of the stripping portion into concavo-convex throughout the inner space and
Multiple gaps that the mode of the outer space connection is formed.
3. workpiece according to claim 1 adheres to chuck assembly, it is characterised in that：
The stream be by by the press surface of multiple stripping portions respectively along Zhou Fang centered on the adhesion part
The side of the inner space and the outer space is connected between the press surface adjacent in the circumferential direction to discontinuously setting
Multiple grooves that formula is formed.
4. workpiece according to claim 1 adheres to chuck assembly, it is characterised in that：
The workpiece adhesion chuck assembly is also equipped with：Support, the support is provided with the adhesion part and the stripping portion；And
Drive division, the drive division supplies driving fluid to the primary side of the press surface,
Be formed as the inner circumferential position and periphery position of the stripping portion of ring-type to be enclosed from the driving with by the press surface
The mode of the driving fluid in portion is respectively clamped and fastened on the support.
5. the workpiece according to Claims 2 or 3 adheres to chuck assembly, it is characterised in that：
The workpiece adhesion chuck assembly is also equipped with：Support, the support is provided with the adhesion part and the stripping portion；And
Drive division, the drive division supplies driving fluid to the primary side of the press surface,
Be formed as the inner circumferential position and periphery position of the stripping portion of ring-type to be enclosed from the driving with by the press surface
The mode of the driving fluid in portion is respectively clamped and fastened on the support.
6. a kind of workpiece make-up machine, it is characterised in that：Workpiece adhesion chuck dress according to any one of Claims 1 to 4
Put any one party in a pair of opposite holding plates or both and set multiple,
The adhesion part for adhering to chuck assembly in the workpiece for being arranged at the holding plate of a side is adhered to and keeps the plate simultaneously
Shape workpiece, and make another plate workpiece that it fits in the holding plate for being maintained at the opposing party, under vacuum atmosphere, being arranged at
The tabular work fitted is peeled off simultaneously in the stripping portion of the workpiece adhesion chuck assembly for stating the holding plate of a side
After part and another plate workpiece, open the ambient atmosphere of the plate workpiece and another plate workpiece.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2013/050215 WO2014109018A1 (en) | 2013-01-09 | 2013-01-09 | Workpiece adhesive chuck device and workpiece attachment machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104904004A CN104904004A (en) | 2015-09-09 |
| CN104904004B true CN104904004B (en) | 2017-05-31 |
Family
ID=50396784
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201380069904.3A Active CN104904004B (en) | 2013-01-09 | 2013-01-09 | Workpiece adheres to chuck assembly and workpiece make-up machine |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP5442171B1 (en) |
| KR (1) | KR101944155B1 (en) |
| CN (1) | CN104904004B (en) |
| TW (1) | TWI576954B (en) |
| WO (1) | WO2014109018A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101983674B1 (en) * | 2016-11-10 | 2019-05-30 | 어플라이드 머티어리얼스, 인코포레이티드 | A holding arrangement for holding a substrate, a carrier including a holding arrangement, a processing system using a carrier, and a method for releasing a substrate from the holding arrangement |
| WO2020175401A1 (en) * | 2019-02-28 | 2020-09-03 | 日東電工株式会社 | Adhering device, transfer device using same, and transfer method |
| JP6942908B1 (en) * | 2020-11-13 | 2021-09-29 | 信越エンジニアリング株式会社 | Work adhesive chuck device and work bonding machine |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101379606A (en) * | 2007-01-31 | 2009-03-04 | 信越工程株式会社 | Apparatus for bonding chuck |
| JP4903906B1 (en) * | 2011-04-07 | 2012-03-28 | 信越エンジニアリング株式会社 | Workpiece adhesive chuck device and workpiece bonding machine |
| CN102649336A (en) * | 2011-02-28 | 2012-08-29 | 信越工程株式会社 | Working attaching chuck device and work piece laminating machine |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4796382B2 (en) * | 2005-12-08 | 2011-10-19 | 株式会社ディスコ | Chuck table of processing equipment |
| KR100953101B1 (en) * | 2008-09-29 | 2010-04-19 | (주)아폴로테크 | Chuck |
| JP2010126342A (en) * | 2008-12-01 | 2010-06-10 | Advanced Display Process Engineering Co Ltd | Substrate chuck and substrate fusion device having the same |
| KR20110038995A (en) * | 2009-10-09 | 2011-04-15 | 엘아이지에이디피 주식회사 | Substrate chuck, substrate attaching apparatus comprising the same and substrate detaching method using the substrate attaching apparatus |
-
2013
- 2013-01-09 CN CN201380069904.3A patent/CN104904004B/en active Active
- 2013-01-09 KR KR1020157021342A patent/KR101944155B1/en active IP Right Grant
- 2013-01-09 WO PCT/JP2013/050215 patent/WO2014109018A1/en active Application Filing
- 2013-01-09 JP JP2013539835A patent/JP5442171B1/en active Active
-
2014
- 2014-01-02 TW TW103100071A patent/TWI576954B/en active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101379606A (en) * | 2007-01-31 | 2009-03-04 | 信越工程株式会社 | Apparatus for bonding chuck |
| CN102649336A (en) * | 2011-02-28 | 2012-08-29 | 信越工程株式会社 | Working attaching chuck device and work piece laminating machine |
| JP4903906B1 (en) * | 2011-04-07 | 2012-03-28 | 信越エンジニアリング株式会社 | Workpiece adhesive chuck device and workpiece bonding machine |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2014109018A1 (en) | 2014-07-17 |
| TW201442140A (en) | 2014-11-01 |
| TWI576954B (en) | 2017-04-01 |
| KR101944155B1 (en) | 2019-01-30 |
| CN104904004A (en) | 2015-09-09 |
| JP5442171B1 (en) | 2014-03-12 |
| JPWO2014109018A1 (en) | 2017-01-19 |
| KR20150104191A (en) | 2015-09-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4785995B1 (en) | Workpiece adhesive chuck device and workpiece bonding machine | |
| KR102121630B1 (en) | Separating apparatus and separating method | |
| TWI364576B (en) | ||
| JP4125776B1 (en) | Adhesive chuck device | |
| CN104904004B (en) | Workpiece adheres to chuck assembly and workpiece make-up machine | |
| KR101145756B1 (en) | Adhesive rubber type chucking device and substrates adhesion apparatus using the same | |
| JP3943590B2 (en) | Substrate holding structure | |
| JP4903906B1 (en) | Workpiece adhesive chuck device and workpiece bonding machine | |
| KR20180088720A (en) | A holding arrangement for holding a substrate, a carrier for holding the substrate, a vacuum processing system, a method for holding the substrate, and a method for releasing the substrate | |
| TW201318095A (en) | Thin substrate supporting apparatus and the fabricating method thereof | |
| KR20150140222A (en) | Peeling apparatus and peeling method for laminate, and manufacturing method of electronic device | |
| JP5577817B2 (en) | Substrate mounting pad mechanism | |
| TWI766810B (en) | Workpiece Adhesion Chuck Device and Workpiece Laminating Machine | |
| KR20200093291A (en) | Apparatus for processing substrate | |
| KR20140109703A (en) | A Carrier used in the manufacturing process of OLED and a method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |