CN104877611A - 电路连接材料、使用其的连接结构体、临时压接方法以及应用 - Google Patents
电路连接材料、使用其的连接结构体、临时压接方法以及应用 Download PDFInfo
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- CN104877611A CN104877611A CN201510210020.6A CN201510210020A CN104877611A CN 104877611 A CN104877611 A CN 104877611A CN 201510210020 A CN201510210020 A CN 201510210020A CN 104877611 A CN104877611 A CN 104877611A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5046—Amines heterocyclic
- C08G59/5053—Amines heterocyclic containing only nitrogen as a heteroatom
- C08G59/5073—Amines heterocyclic containing only nitrogen as a heteroatom having two nitrogen atoms in the ring
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- C—CHEMISTRY; METALLURGY
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- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
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- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
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- H—ELECTRICITY
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- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
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- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
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- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- Chemical & Material Sciences (AREA)
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- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Dispersion Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Conductive Materials (AREA)
- Epoxy Resins (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Compositions Of Macromolecular Compounds (AREA)
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Abstract
Description
Claims (64)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
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JP2009262034 | 2009-11-17 | ||
JP2009-262034 | 2009-11-17 | ||
CN2010800517785A CN102686690A (zh) | 2009-11-17 | 2010-11-16 | 电路连接材料、使用其的连接结构体以及临时压接方法 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010800517785A Division CN102686690A (zh) | 2009-11-17 | 2010-11-16 | 电路连接材料、使用其的连接结构体以及临时压接方法 |
Publications (2)
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CN104877611A true CN104877611A (zh) | 2015-09-02 |
CN104877611B CN104877611B (zh) | 2020-04-10 |
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ID=44059627
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
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CN2010800517785A Pending CN102686690A (zh) | 2009-11-17 | 2010-11-16 | 电路连接材料、使用其的连接结构体以及临时压接方法 |
CN201510210020.6A Active CN104877611B (zh) | 2009-11-17 | 2010-11-16 | 电路连接材料、使用其的连接结构体、临时压接方法以及应用 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
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CN2010800517785A Pending CN102686690A (zh) | 2009-11-17 | 2010-11-16 | 电路连接材料、使用其的连接结构体以及临时压接方法 |
Country Status (6)
Country | Link |
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JP (2) | JP5944102B2 (zh) |
KR (1) | KR101374927B1 (zh) |
CN (2) | CN102686690A (zh) |
BR (1) | BR112012011798B1 (zh) |
TW (1) | TWI452110B (zh) |
WO (1) | WO2011062149A1 (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106883786A (zh) * | 2017-02-24 | 2017-06-23 | 深圳市金晖科技有限公司 | 一种全方位热固导电胶的制备方法 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2013001825A (ja) * | 2011-06-17 | 2013-01-07 | Tosoh Corp | エチレン−酢酸ビニル系共重合体組成物及びそれを用いた硬化物 |
JP5838674B2 (ja) * | 2011-09-12 | 2016-01-06 | 住友電気工業株式会社 | フィルム状異方導電性接着剤 |
JP6044261B2 (ja) * | 2012-10-22 | 2016-12-14 | 日立化成株式会社 | 異方導電性接着剤組成物 |
CN103173176B (zh) * | 2013-03-23 | 2014-12-03 | 广东新展化工新材料有限公司 | 一种双组分改性环氧胶粘剂及其制备方法 |
CN103173173B (zh) * | 2013-03-23 | 2014-12-24 | 广东新展化工新材料有限公司 | 一种双组分环氧胶粘剂及其制备方法 |
CN104592922B (zh) * | 2014-12-31 | 2016-04-20 | 湖北绿色家园精细化工股份有限公司 | 一种透明、高硬度、耐黄变环氧饰品胶及其制备工艺 |
JP6769586B1 (ja) * | 2018-12-26 | 2020-10-14 | 住友ベークライト株式会社 | 樹脂組成物および金属ベース銅張積層板 |
EP3950869A4 (en) * | 2019-03-28 | 2022-12-21 | Nitto Denko Corporation | CURABLE ADHESIVE FILM AND METHOD OF MAKING A CURABLE ADHESIVE FILM |
EP4036135A4 (en) * | 2019-09-27 | 2023-07-26 | Kaneka Corporation | ADHESIVE AND METHOD FOR MAKING THE ADHESIVE |
CN110972411B (zh) * | 2019-10-22 | 2022-12-06 | 深圳丹邦科技股份有限公司 | 基于量子碳基膜的柔性线路板基材及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1712483A (zh) * | 2004-06-23 | 2005-12-28 | Lg电线有限公司 | 各向异性的导电性粘接剂以及应用该粘接剂的薄膜 |
WO2009020005A1 (ja) * | 2007-08-08 | 2009-02-12 | Hitachi Chemical Company, Ltd. | 接着剤組成物、フィルム状接着剤及び回路部材の接続構造 |
WO2009054410A1 (ja) * | 2007-10-24 | 2009-04-30 | Hitachi Chemical Company, Ltd. | 導電粒子、回路接続材料及び接続構造体 |
CN101542845A (zh) * | 2007-04-25 | 2009-09-23 | 索尼化学&信息部件株式会社 | 各向异性导电性膜及连接结构体 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2833111B2 (ja) * | 1989-03-09 | 1998-12-09 | 日立化成工業株式会社 | 回路の接続方法及びそれに用いる接着剤フィルム |
JPH05279646A (ja) * | 1991-09-09 | 1993-10-26 | Hitachi Chem Co Ltd | マルチワイヤ配線板用接着剤およびこの接着剤を用いたマルチワイヤ配線板およびその製造方法 |
JP3907217B2 (ja) * | 1993-07-29 | 2007-04-18 | 日立化成工業株式会社 | 回路接続材料とその接続材料を用いた回路の接続方法 |
US20070116961A1 (en) * | 2005-11-23 | 2007-05-24 | 3M Innovative Properties Company | Anisotropic conductive adhesive compositions |
JP4605225B2 (ja) * | 2006-02-27 | 2011-01-05 | 日立化成工業株式会社 | 回路接続材料、これを用いた回路部材の接続構造及びその製造方法 |
JP2008111092A (ja) * | 2006-10-06 | 2008-05-15 | Hitachi Chem Co Ltd | 回路接続材料及びそれを用いた接続構造体 |
CN102051142A (zh) * | 2007-01-10 | 2011-05-11 | 日立化成工业株式会社 | 电路部件连接用粘接剂及使用该粘接剂的半导体装置 |
WO2009001605A1 (ja) * | 2007-06-26 | 2008-12-31 | Sony Chemical & Information Device Corporation | 異方性導電材料、接続構造体及びその製造方法 |
JP5141456B2 (ja) * | 2007-10-24 | 2013-02-13 | 日立化成工業株式会社 | 回路接続材料及び接続構造体 |
JP2009161684A (ja) * | 2008-01-09 | 2009-07-23 | Hitachi Chem Co Ltd | 回路接続用接着剤組成物、この接着剤組成物用いた回路部材の接続構造及び回路部材の接続方法 |
JP5226562B2 (ja) * | 2008-03-27 | 2013-07-03 | デクセリアルズ株式会社 | 異方性導電フィルム、並びに、接合体及びその製造方法 |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1712483A (zh) * | 2004-06-23 | 2005-12-28 | Lg电线有限公司 | 各向异性的导电性粘接剂以及应用该粘接剂的薄膜 |
CN101542845A (zh) * | 2007-04-25 | 2009-09-23 | 索尼化学&信息部件株式会社 | 各向异性导电性膜及连接结构体 |
WO2009020005A1 (ja) * | 2007-08-08 | 2009-02-12 | Hitachi Chemical Company, Ltd. | 接着剤組成物、フィルム状接着剤及び回路部材の接続構造 |
WO2009054410A1 (ja) * | 2007-10-24 | 2009-04-30 | Hitachi Chemical Company, Ltd. | 導電粒子、回路接続材料及び接続構造体 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106883786A (zh) * | 2017-02-24 | 2017-06-23 | 深圳市金晖科技有限公司 | 一种全方位热固导电胶的制备方法 |
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CN102686690A (zh) | 2012-09-19 |
CN104877611B (zh) | 2020-04-10 |
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