CN104858771A - Zirconium oxide ultrathin wafer polishing device and polishing method - Google Patents
Zirconium oxide ultrathin wafer polishing device and polishing method Download PDFInfo
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- CN104858771A CN104858771A CN201510293653.8A CN201510293653A CN104858771A CN 104858771 A CN104858771 A CN 104858771A CN 201510293653 A CN201510293653 A CN 201510293653A CN 104858771 A CN104858771 A CN 104858771A
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- abrasive disk
- workpiece
- epicyclic train
- platen
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/08—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for double side lapping
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
The invention relates to the technical field of polishing equipment, in particular to a polishing device. The polishing device comprises a rotation shaft, a planetary gear train, a first grinding disc, a second grinding disc, a first pressing disc, a second pressing disc, a first driving motor, a second driving motor and a driving mechanism; the planetary gear train is driven by the rotation shaft to rotate, the first grinding disc is arranged on the face close to the planetary gear train and is parallel to the planetary gear train, and the first pressing disc is connected with the face, far away from the planetary gear train, of the first grinding disc; the second grinding disc makes contact with the other face of the planetary gear train, the second pressing disc and the second grinding disc are compressed, the first pressing disc is connected with the driving mechanism, the first pressing disc is driven by the driving mechanism to move to the direction close to or far away from the planetary gear train, and the first grinding disc and the second grinding disc are driven by the first driving motor and the second driving motor respectively to rotate towards the opposite direction. The polishing device can machine an ultrathin wafer with the thickness 0.08 mm-0.2 mm, the planeness is good, and the constant thickness is low.
Description
Technical field
The present invention relates to polissoir technical field, be specifically related to a kind of zirconia superthin section burnishing device and finishing method.
Background technology
Because the thickness of ceramic fingerprint recognition sheet requirement is generally within 0.1mm, thickness is thinner, effect is better, and polishing machine present on market all adopts one side grinding technics, and due to its structure and pressure, the isoparametric setting of rotating speed, all can only process the product that thickness is more than 0.2mm, if and merely to workpiece apply pressure, the fracture of workpiece can be caused again, therefore concerning requiring that ultra-thin potsherd, existing polishing machine cannot reach the thickness of needs; And present polishing machine is due to the problem of its structural design, the planeness of workpiece of polishing does not often reach requirement, and equal thickness can not control in lower scope; The potsherd effect of such polishing is poor, again revises, and can waste a lot of time.
Summary of the invention
The object of the invention is the defect existed to overcome prior art, provide a kind of zirconia superthin section burnishing device, it can process the superthin section of thickness at 0.08 ~ 0.2mm, and flatness is better, and equal thickness is lower.
The present invention also provides a kind of zirconia superthin section finishing method.
In order to realize object of the present invention, the present invention by the following technical solutions:
A kind of zirconia superthin section burnishing device, it comprises rotating shaft, epicyclic train, first abrasive disk, second abrasive disk, first platen, second platen, first drive motors, second drive motors and driving mechanism, described epicyclic train is driven by described rotating shaft and rotates, described first abrasive disk is located near the one side of described epicyclic train and parallel with described epicyclic train, described first platen is connected with the one side of described first abrasive disk away from described epicyclic train, described second abrasive disk contacts with the another side of described epicyclic train, described second platen and described second abrasive disk compress, described first platen is connected with described driving mechanism, close by described driving mechanism band trend or away from described epicyclic train the direction of described first platen is moved, described first abrasive disk, described second abrasive disk is respectively by described first drive motors, second drive motors drives and rotates round about.
Wherein in an embodiment, described epicyclic train comprises sun gear and planetary gear, the central ring of described sun gear is connected with described rotating shaft, described planetary gear is connected with a joggle with the external toothing of described sun gear and central ring respectively, the one side of described second abrasive disk and described planetary gear compresses, and described first abrasive disk is arranged near the another side of described planetary gear.
Wherein in an embodiment, the ultimate range between described planetary gear and described first abrasive disk is 0.2mm.
Wherein in an embodiment, described driving mechanism is cylinder, and the piston rod of described cylinder is connected with described first platen is vertical.
Wherein in an embodiment, the piston rod of described cylinder is provided with pressure sensor.
The present invention also adopts following technical scheme: zirconia superthin section finishing method, it comprises the steps:
The planetary gear that the workpiece of thickness 0.2mm ~ 0.3mm is placed in thickness 0.15mm is fastened;
Driving mechanism drives the first platen to workpiece movable, the first abrasive disk workpiece pressing, described first abrasive disk to the Stress control of described workpiece at 23 ~ 27kg;
Described workpiece is driven by described epicyclic train and rotates, and the rotating shaft rotating speed of described epicyclic train controls at 12 ~ 16r/min;
Described first abrasive disk, the second abrasive disk are with contrary direction relative motion, and the rotating speed of described first abrasive disk, the second abrasive disk controls at 18 ~ 22r/min;
The rotation under the pressure of described first abrasive disk, the second abrasive disk of described workpiece, described workpiece rotational frequency controls at 28 ~ 32r/min;
After Preset Time, after described workpiece polishing, thickness is 0.13 ~ 0.18mm;
Be that the planetary gear that the workpiece of 0.13 ~ 0.18mm is placed in thickness 0.08mm is fastened by described thickness;
Described driving mechanism drives the first platen to described workpiece movable, described first abrasive disk workpiece pressing, described first abrasive disk to the Stress control of described workpiece at 23 ~ 27kg;
Described workpiece is driven by described epicyclic train and rotates, and the rotating shaft rotating speed of described epicyclic train controls at 12 ~ 16r/min;
Described first abrasive disk, the second abrasive disk are with contrary direction relative motion, and the rotating speed of described first abrasive disk, the second abrasive disk controls at 18 ~ 22r/min;
The rotation under the pressure of described first abrasive disk, the second abrasive disk of described workpiece, described workpiece rotational frequency controls at 28 ~ 32r/min;
After Preset Time, after described workpiece polishing, thickness is 0.08 ~ 0.12mm.
Wherein in an embodiment, after described Preset Time, after described workpiece polishing, thickness is 0.13 ~ 0.18mm, and wherein said Preset Time is 20 ~ 30min.
Wherein in an embodiment, after described Preset Time, after described workpiece polishing, thickness is 0.08 ~ 0.12mm, and wherein said Preset Time is 20 ~ 30min.
Described first abrasive disk, the second abrasive disk rotate with same rotational speed.
Zirconia superthin section burnishing device of the present invention, its beneficial effect is compared to existing technology:
1) this burnishing device adopts planet circular system and first, second abrasive disk to be combined together, and adopts double side grinding process, and planet circular system drives workpiece to rotate, and first, second abrasive disk gives workpiece and applies pressure, and workpiece produces rotation; In Ginding process, the parameters such as the pressure of grinding, rotating speed are rationally set, and adopt the method for regrind, finally grind out the superthin section of 0.08 ~ 0.2mm, overcome the thin slice that traditional handicraft can only grind out more than 0.2mm, meet the thinness requirement of ceramic fingerprint recognition sheet; To the applying Stress control of workpiece at zone of reasonableness, and the rotation of workpiece own additionally reduces the generation of workpiece fracture,
2) adopt first, second abrasive disk relative to and rightabout rotate, because workpiece two sides all applies equal pressure, the planeness of workpiece of processing is better, solves the problem of the flatness difference that existing work pieces process goes out; Adopt twin grinding to also solve the problem of equal thickness, the equal thickness of workpiece is controlled within 0.01mm.
Accompanying drawing explanation
Fig. 1 is the profile of zirconia superthin section burnishing device described in the embodiment of the present invention.
Detailed description of the invention
For feature of the present invention, technological means and the specific purposes reached, function can be understood further, below in conjunction with detailed description of the invention and accompanying drawing, the present invention is described in further detail.
Embodiment:
With reference to Fig. 1, zirconia superthin section burnishing device of the present invention, it comprises rotating shaft 10, epicyclic train 30, first abrasive disk 40, second abrasive disk 50, first platen 60, second platen 80 and driving mechanism 70, epicyclic train 30 drives rotation by rotating shaft 10, rotating shaft 10 is by motor-driven rotation, specifically the center of this epicyclic train 30 is connected with rotating shaft 10, and when rotating under the driving of rotating shaft 10 at motor, epicyclic train 30 also drives rotation by rotating shaft 10.
The one side of epicyclic train 30 is located at by second abrasive disk 50, and contact with this face of epicyclic train 30, second platen 80 and the second abrasive disk 50 compress, second abrasive disk 50 is driven by the second drive motors (not shown) and rotates, and the effect of the second platen 80 is to the second abrasive disk 50 pressure.The another side place near epicyclic train 30 is located at by first abrasive disk 40, and be arranged in parallel with epicyclic train 30, and the first abrasive disk 40 has the distance of below 0.2mm (ultimate range is 0.2mm) with this mask of epicyclic train 30 during work, first platen 60 is connected with the one side of the first abrasive disk 40 away from epicyclic train 30, first platen 60 is connected with driving mechanism 70, close with trend by driving mechanism 70 or away from described epicyclic train 30 direction is moved, and the effect of the first platen 60 is compression first abrasive disks 40.The workpiece 100 processed is located on this epicyclic train 30, and the first platen 60 drives the first abrasive disk 40 to move towards epicyclic train 30, workpiece pressing 100, and the first abrasive disk 40 rotates under the drive of the first drive motors.
This driving mechanism 70 is preferably cylinder, the piston rod of cylinder 70 is connected with the first platen 60 is vertical, make the activity of cylinder 70 that the first platen 60 can be driven exactly to move towards the direction of epicyclic train 30 abreast, make the first platen 60 that the first abrasive disk 40 can be driven to move to workpiece 100, and be pressed on the one side of workpiece 100, thus the first abrasive disk 40 can carry out sanding and polishing to workpiece 100.
This epicyclic train 30 comprises sun gear 302 and planetary gear 304, the central ring 306 of sun gear 302 is connected with rotating shaft 10, planetary gear 304 is connected with a joggle with the external toothing 308 of sun gear 302 and central ring 306 respectively, second abrasive disk 50 contacts with the one side of planetary gear 304, first abrasive disk 40 is arranged near the another side of planetary gear 304, and parallel with planetary gear 304.
Give the pressure of the first platen 60 and workpiece 100 for monitoring cylinder in real time, the piston rod of cylinder 70 is provided with pressure sensor 702, monitoring cylinder 70 puts on the pressure of the first platen 60 in real time, prevents pressure excessive and causes damage to workpiece 100.
The machinable thickness of workpiece of this device is at 0.08 ~ 0.2mm, and the distance therefore between the first abrasive disk 40 and epicyclic train 30 is between 0.08 ~ 0.2mm.
During the work of this device, the planetary gear that the workpiece 100 of thickness 0.2mm ~ 0.3mm is placed in thickness 0.15mm is fastened, driving mechanism 70 drives the first platen 60 to move to workpiece 100, and the first platen 60 drives the Stress control of the first abrasive disk 40 workpiece pressing 100, first abrasive disk 40 pairs of workpiece 100 at 23 ~ 27kg, workpiece 100 drives rotation by epicyclic train 30, and rotating shaft 10 rotating speed of epicyclic train 30 controls at 12 ~ 16r/min, first abrasive disk 40, second abrasive disk 50 is with contrary direction relative motion, and the rotating speed of the first abrasive disk 40, second abrasive disk 50 controls at 18 ~ 22r/min, workpiece 100 rotation under the pressure of the first abrasive disk 40, second abrasive disk 50, the rotating speed of workpiece 100 controls at 28 ~ 32r/min, after Preset Time (Preset Time is 20 ~ 30min herein), workpiece 100 is polished to the thin slice that thickness is 0.13 ~ 0.18mm, be that the workpiece 100 of 0.13 ~ 0.18mm is placed on the epicyclic train 30 of thickness 0.08mm again by above-mentioned thickness, driving mechanism 70 drives the first platen 60 to move to workpiece 100, first abrasive disk 40 compresses this workpiece 100, first abrasive disk 40 to the Stress control of this workpiece 100 at 23 ~ 27kg, workpiece 100 drives rotation by epicyclic train 30, the rotating shaft rotating speed of epicyclic train 30 controls at 12 ~ 16r/min, first abrasive disk 40, second abrasive disk 50 is with contrary direction relative motion, first abrasive disk 40, the rotating speed of the second abrasive disk 50 controls at 18 ~ 22r/min, workpiece 100 is at the first abrasive disk 40, rotation under the pressure of the second abrasive disk 50, workpiece 100 rotating speed controls at 28 ~ 32r/min, after Preset Time (Preset Time is 20 ~ 30min herein), described workpiece 100 is polished to the superthin section that thickness is 0.08 ~ 0.12mm, thus, this device can process the superthin section of below 0.08-0.2.
After said apparatus polishing, workpiece 100 burnishing parameters obtained is as following table.
The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.
Claims (9)
1. a zirconia superthin section burnishing device, it is characterized in that: comprise rotating shaft (10), epicyclic train (30), first abrasive disk (40), second abrasive disk (50), first platen (60), second platen (80), first drive motors, second drive motors and driving mechanism (70), described epicyclic train (30) is driven by described rotating shaft (10) and rotates, described first abrasive disk (40) is located near the one side of described epicyclic train (30) and parallel with described epicyclic train (30), described first platen (60) is connected with the one side of described first abrasive disk (40) away from described epicyclic train (30), described second abrasive disk (50) contacts with the another side of described epicyclic train (30), described second platen (80) and described second abrasive disk (50) compress, described first platen (60) is connected with described driving mechanism (70), described first platen (60) is with close or away from described epicyclic train (30) the direction of trend to move by described driving mechanism (70), described first abrasive disk (40), described second abrasive disk (50) is respectively by described first drive motors, second drive motors drives and rotates round about.
2. zirconia superthin section burnishing device according to claim 1, it is characterized in that: described epicyclic train (30) comprises sun gear (302) and planetary gear (304), the central ring (306) of described sun gear (302) is connected with described rotating shaft (10), described planetary gear (304) is connected with a joggle with the external toothing (308) of described sun gear (302) and central ring (306) respectively, described second abrasive disk (50) compresses with the one side of described planetary gear (304), described first abrasive disk (40) is arranged near the another side of described planetary gear (304).
3. zirconia superthin section burnishing device according to claim 2, is characterized in that: the ultimate range between described planetary gear (304) and described first abrasive disk (40) is 0.2mm.
4. zirconia superthin section burnishing device according to claim 1, is characterized in that: described driving mechanism (70) is cylinder, and the piston rod of described cylinder is connected with described first platen (60) is vertical.
5. zirconia superthin section burnishing device according to claim 4, is characterized in that: the piston rod of described cylinder is provided with pressure sensor (702).
6. zirconia superthin section finishing method, is characterized in that, comprises the steps:
The workpiece (100) of thickness 0.2mm ~ 0.3mm is placed on the epicyclic train (30) of thickness 0.15mm;
Driving mechanism (70) drives the first platen (60) mobile to workpiece (100), first abrasive disk (40) workpiece pressing (100), described first abrasive disk (40) to the Stress control of described workpiece (100) at 23 ~ 27kg;
Described workpiece (100) is driven by described epicyclic train (30) and rotates, and rotating shaft (10) rotating speed of described epicyclic train (30) controls at 12 ~ 16r/min;
Described first abrasive disk (40), the second abrasive disk (50) are with contrary direction relative motion, and the rotating speed of described first abrasive disk (40), the second abrasive disk (50) controls at 18 ~ 22r/min;
Described workpiece (100) rotation under the pressure of described first abrasive disk (40), the second abrasive disk (50), described workpiece (100) rotating speed controls at 28 ~ 32r/min;
After Preset Time, after described workpiece (100) polishing, thickness is 0.13 ~ 0.18mm;
Be that the workpiece (100) of 0.13 ~ 0.18mm is placed on the epicyclic train (30) of thickness 0.08mm by described thickness;
Described driving mechanism (70) drives the first platen (60) mobile to described workpiece (100), described first abrasive disk (40) workpiece pressing (100), described first abrasive disk (40) to the Stress control of described workpiece (100) at 23 ~ 27kg;
Described workpiece (100) is driven by described epicyclic train (30) and rotates, and rotating shaft (10) rotating speed of described epicyclic train (30) controls at 12 ~ 16r/min;
Described first abrasive disk (40), the second abrasive disk (50) are with contrary direction relative motion, and the rotating speed of described first abrasive disk (40), the second abrasive disk (50) controls at 18 ~ 22r/min;
Described workpiece (100) rotation under the pressure of described first abrasive disk (40), the second abrasive disk (50), described workpiece (100) rotating speed controls at 28 ~ 32r/min;
After Preset Time, after described workpiece (100) polishing, thickness is 0.08 ~ 0.12mm.
7. zirconia superthin section finishing method according to claim 6, is characterized in that: after described Preset Time, and after described workpiece (100) polishing, thickness is 0.13 ~ 0.18mm, and wherein said Preset Time is 20 ~ 30min.
8. zirconia superthin section finishing method according to claim 6, is characterized in that: after described Preset Time, and after described workpiece (100) polishing, thickness is 0.08 ~ 0.12mm, and wherein said Preset Time is 20 ~ 30min.
9. zirconia superthin section finishing method according to claim 6, is characterized in that: described first abrasive disk (40), the second abrasive disk (50) are rotated with same rotational speed.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510293653.8A CN104858771B (en) | 2015-06-01 | 2015-06-01 | Zirconium oxide superthin section burnishing device and polishing method |
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| CN201510293653.8A CN104858771B (en) | 2015-06-01 | 2015-06-01 | Zirconium oxide superthin section burnishing device and polishing method |
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| CN104858771B CN104858771B (en) | 2017-09-29 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108237442A (en) * | 2016-12-23 | 2018-07-03 | 蓝思科技（长沙）有限公司 | A kind of processing technology of ultra-thin ceramic fingerprint recognition piece |
| CN110000654A (en) * | 2019-05-24 | 2019-07-12 | 苏州默声熙达设备科技有限公司 | A kind of Circular glass outer wall edging device |
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| CN108237442B (en) * | 2016-12-23 | 2020-08-04 | 蓝思科技（长沙）有限公司 | Processing technology of ultrathin ceramic fingerprint identification sheet |
| CN110000654A (en) * | 2019-05-24 | 2019-07-12 | 苏州默声熙达设备科技有限公司 | A kind of Circular glass outer wall edging device |
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| CN104858771B (en) | 2017-09-29 |
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