CN104854671B - 壳体模制型电容器及其制造方法 - Google Patents
壳体模制型电容器及其制造方法 Download PDFInfo
- Publication number
- CN104854671B CN104854671B CN201380064234.6A CN201380064234A CN104854671B CN 104854671 B CN104854671 B CN 104854671B CN 201380064234 A CN201380064234 A CN 201380064234A CN 104854671 B CN104854671 B CN 104854671B
- Authority
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- China
- Prior art keywords
- bus
- connecting portion
- sealing plate
- housing
- capacitor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 211
- 238000000034 method Methods 0.000 title claims description 11
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 238000007789 sealing Methods 0.000 claims abstract description 135
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 238000005452 bending Methods 0.000 claims description 13
- 238000002360 preparation method Methods 0.000 claims 4
- 239000000463 material Substances 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 18
- 238000001465 metallisation Methods 0.000 description 16
- 238000005516 engineering process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 239000011104 metalized film Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 229920000069 polyphenylene sulfide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000007767 bonding agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000001883 metal evaporation Methods 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 210000000170 cell membrane Anatomy 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000002687 intercalation Effects 0.000 description 1
- 238000009830 intercalation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/236—Terminals leading through the housing, i.e. lead-through
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/04—Mountings specially adapted for mounting on a chassis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/10—Housing; Encapsulation
- H01G2/103—Sealings, e.g. for lead-in wires; Covers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T10/00—Road transport of goods or passengers
- Y02T10/60—Other road transportation technologies with climate change mitigation effect
- Y02T10/70—Energy storage systems for electromobility, e.g. batteries
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/51—Plural diverse manufacturing apparatus including means for metal shaping or assembling
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
Claims (22)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012269055A JP6145631B2 (ja) | 2012-12-10 | 2012-12-10 | ケースモールド型コンデンサ |
JP2012269056A JP6145690B2 (ja) | 2012-12-10 | 2012-12-10 | ケースモールド型コンデンサ |
JP2012-269055 | 2012-12-10 | ||
JP2012-269056 | 2012-12-10 | ||
PCT/JP2013/006969 WO2014091696A1 (ja) | 2012-12-10 | 2013-11-27 | ケースモールド型コンデンサとその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104854671A CN104854671A (zh) | 2015-08-19 |
CN104854671B true CN104854671B (zh) | 2018-02-09 |
Family
ID=50934004
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380064234.6A Active CN104854671B (zh) | 2012-12-10 | 2013-11-27 | 壳体模制型电容器及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US9824823B2 (zh) |
CN (1) | CN104854671B (zh) |
WO (1) | WO2014091696A1 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112016005973T5 (de) * | 2015-12-25 | 2018-09-20 | Panasonic Intellectual Property Management Co., Ltd. | Elektronische vorrichtung |
DE102016000931A1 (de) * | 2016-01-28 | 2017-08-03 | Electronicon Kondensatoren Gmbh | Niederinduktiver elektrischer Außenanschluss für in einem Gehäuse angeordnete Wickel elektrischer Leistungskondensatoren |
JP6890233B2 (ja) * | 2016-02-25 | 2021-06-18 | パナソニックIpマネジメント株式会社 | フィルムコンデンサ |
JP6655456B2 (ja) * | 2016-04-20 | 2020-02-26 | 株式会社指月電機製作所 | 外部端子構造及び樹脂モールド型コンデンサ |
CN110337702B (zh) * | 2017-02-28 | 2021-07-20 | 松下知识产权经营株式会社 | 电容器的制造方法 |
JP6640772B2 (ja) * | 2017-03-01 | 2020-02-05 | 株式会社指月電機製作所 | コンデンサ |
WO2019107128A1 (ja) * | 2017-11-29 | 2019-06-06 | パナソニックIpマネジメント株式会社 | コンデンサ |
JP7145463B2 (ja) * | 2018-07-12 | 2022-10-03 | パナソニックIpマネジメント株式会社 | コンデンサ |
JP6709832B2 (ja) * | 2018-10-16 | 2020-06-17 | 三菱電機株式会社 | 樹脂モールド型コンデンサ、及び電力変換装置 |
WO2020241145A1 (ja) * | 2019-05-24 | 2020-12-03 | パナソニックIpマネジメント株式会社 | コンデンサ |
CN110265234B (zh) * | 2019-06-28 | 2024-07-12 | 常州常捷科技有限公司 | 新能源汽车电容器用灌封工装 |
JP7097341B2 (ja) * | 2019-10-02 | 2022-07-07 | 株式会社デンソー | コンデンサ |
JP7492923B2 (ja) | 2021-01-08 | 2024-05-30 | ニチコン株式会社 | フィルムコンデンサ |
JP2023032910A (ja) * | 2021-08-27 | 2023-03-09 | Tdk株式会社 | 電子部品 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642255A (en) * | 1995-04-28 | 1997-06-24 | Matsushita Electric Industrial Co., Ltd. | Capacitor case having flat coupling sections |
US6498712B1 (en) * | 2002-03-06 | 2002-12-24 | Voltronics Corporation | Variable capacitor |
Family Cites Families (29)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60124907A (ja) * | 1983-12-12 | 1985-07-04 | 株式会社指月電機製作所 | 樹脂封入コンデンサの製造方法 |
JPS60129412A (ja) | 1983-12-14 | 1985-07-10 | 斉藤 光司 | 圧入ピン |
JP2559494B2 (ja) | 1989-08-04 | 1996-12-04 | 富士通株式会社 | マイクロプログラム制御方法 |
JPH0758660B2 (ja) * | 1990-02-09 | 1995-06-21 | 松下電器産業株式会社 | コンデンサ |
JP2981000B2 (ja) | 1991-03-27 | 1999-11-22 | キヤノン株式会社 | 画像形成装置 |
JPH1022779A (ja) | 1996-07-02 | 1998-01-23 | Ngk Spark Plug Co Ltd | 梯子型電気濾波器 |
JP4020479B2 (ja) | 1998-01-16 | 2007-12-12 | ニチコン株式会社 | 樹脂封口型コンデンサ |
JP2002324727A (ja) * | 2001-04-25 | 2002-11-08 | Matsushita Electric Ind Co Ltd | コンデンサ |
JP4296886B2 (ja) * | 2003-09-18 | 2009-07-15 | パナソニック株式会社 | キャパシタモジュール |
US7547233B2 (en) | 2003-09-18 | 2009-06-16 | Panasonic Corporation | Capacitor unit |
WO2006116967A2 (de) * | 2005-05-02 | 2006-11-09 | Epcos Ag | Leistungskondensator |
JP2007281882A (ja) | 2006-04-06 | 2007-10-25 | Matsushita Electric Ind Co Ltd | 光送受信器 |
US20080121386A1 (en) | 2006-11-29 | 2008-05-29 | Denso Corporation | Method of manufacturing header tank for heat exchanger and heat exchanger having the header tank |
JP2008261550A (ja) | 2007-04-12 | 2008-10-30 | Denso Corp | 熱交換器およびその製造方法 |
JP2009099884A (ja) * | 2007-10-19 | 2009-05-07 | Toyota Motor Corp | コンデンサ |
JP4983540B2 (ja) | 2007-10-22 | 2012-07-25 | パナソニック株式会社 | ケースモールド型コンデンサ |
JP5029293B2 (ja) | 2007-10-30 | 2012-09-19 | 株式会社指月電機製作所 | ケース入りコンデンサ |
JP5233294B2 (ja) * | 2008-01-28 | 2013-07-10 | パナソニック株式会社 | 電子部品 |
JP4642872B2 (ja) | 2008-04-03 | 2011-03-02 | 東京瓦斯株式会社 | オーブン装置 |
KR100983882B1 (ko) * | 2008-07-07 | 2010-09-27 | 주식회사 뉴인텍 | 커패시터용 부스바 조립방법 및 그 제품 |
JP5212811B2 (ja) | 2008-10-08 | 2013-06-19 | 株式会社指月電機製作所 | 樹脂封止電気部品及びその製造方法 |
KR101034063B1 (ko) * | 2008-11-24 | 2011-05-12 | 현대자동차주식회사 | 필름커패시터 |
JPWO2010067514A1 (ja) * | 2008-12-10 | 2012-05-17 | パナソニック株式会社 | ケースモールド型コンデンサ |
JP5424092B2 (ja) | 2008-12-16 | 2014-02-26 | 住友電気工業株式会社 | リアクトルの製造方法 |
JP2010182914A (ja) | 2009-02-06 | 2010-08-19 | Panasonic Corp | ケースモールド型コンデンサ |
JP5391797B2 (ja) | 2009-04-13 | 2014-01-15 | パナソニック株式会社 | ケースモールド型コンデンサ |
JP5548424B2 (ja) | 2009-10-28 | 2014-07-16 | 株式会社指月電機製作所 | コンデンサ |
JP2011155138A (ja) * | 2010-01-27 | 2011-08-11 | Shizuki Electric Co Inc | コンデンサ |
WO2012098622A1 (ja) * | 2011-01-21 | 2012-07-26 | パナソニック株式会社 | ケースモールド型コンデンサ |
-
2013
- 2013-11-27 WO PCT/JP2013/006969 patent/WO2014091696A1/ja active Application Filing
- 2013-11-27 US US14/648,662 patent/US9824823B2/en active Active
- 2013-11-27 CN CN201380064234.6A patent/CN104854671B/zh active Active
-
2017
- 2017-10-20 US US15/789,899 patent/US10079098B2/en active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5642255A (en) * | 1995-04-28 | 1997-06-24 | Matsushita Electric Industrial Co., Ltd. | Capacitor case having flat coupling sections |
US6498712B1 (en) * | 2002-03-06 | 2002-12-24 | Voltronics Corporation | Variable capacitor |
Also Published As
Publication number | Publication date |
---|---|
US9824823B2 (en) | 2017-11-21 |
US20180040425A1 (en) | 2018-02-08 |
WO2014091696A1 (ja) | 2014-06-19 |
CN104854671A (zh) | 2015-08-19 |
US10079098B2 (en) | 2018-09-18 |
US20150348710A1 (en) | 2015-12-03 |
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Legal Events
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EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20150819 Assignee: PANASONIC ELECTRONIC DEVICES (JIANGMEN) CO.,LTD. Assignor: Matsushita Electric Industrial Co.,Ltd. Contract record no.: 2018990000203 Denomination of invention: Case mold type capacitor and method for manufacturing the same Granted publication date: 20180209 License type: Common License Record date: 20180808 |
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EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: PANASONIC ELECTRONIC DEVICES (JIANGMEN) CO.,LTD. Assignor: Matsushita Electric Industrial Co.,Ltd. Contract record no.: 2018990000203 Date of cancellation: 20220831 |
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EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20150819 Assignee: PANASONIC ELECTRONIC DEVICES (JIANGMEN) CO.,LTD. Assignor: Panasonic electromechanical Co.,Ltd. Contract record no.: X2022990000977 Denomination of invention: Shell molded capacitor and its manufacturing method Granted publication date: 20180209 License type: Common License Record date: 20230103 |