CN104829978A - Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof - Google Patents
Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof Download PDFInfo
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- CN104829978A CN104829978A CN201510160243.6A CN201510160243A CN104829978A CN 104829978 A CN104829978 A CN 104829978A CN 201510160243 A CN201510160243 A CN 201510160243A CN 104829978 A CN104829978 A CN 104829978A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K13/00—Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
- C08K13/06—Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
- C08K5/45—Heterocyclic compounds having sulfur in the ring
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/10—Encapsulated ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510160243.6A CN104829978A (en) | 2015-04-07 | 2015-04-07 | Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201510160243.6A CN104829978A (en) | 2015-04-07 | 2015-04-07 | Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
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CN104829978A true CN104829978A (en) | 2015-08-12 |
Family
ID=53808197
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201510160243.6A Pending CN104829978A (en) | 2015-04-07 | 2015-04-07 | Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof |
Country Status (1)
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CN (1) | CN104829978A (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102822279A (en) * | 2010-04-07 | 2012-12-12 | 电气化学工业株式会社 | Heat dissipating resin composition for led lighting housing and heat dissipating housing for led lighting |
CN103214910A (en) * | 2013-04-03 | 2013-07-24 | 上海三思电子工程有限公司 | Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof |
CN103547644A (en) * | 2011-06-17 | 2014-01-29 | 日本瑞翁株式会社 | Thermally conductive pressure-sensitive adhesive sheet-like molded body, method for producing same, and electronic device |
CN103555087A (en) * | 2013-09-25 | 2014-02-05 | 天长市天泰光电科技有限公司 | Fluororesin heat radiation paint for LED lamp and preparation method thereof |
-
2015
- 2015-04-07 CN CN201510160243.6A patent/CN104829978A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102822279A (en) * | 2010-04-07 | 2012-12-12 | 电气化学工业株式会社 | Heat dissipating resin composition for led lighting housing and heat dissipating housing for led lighting |
CN103547644A (en) * | 2011-06-17 | 2014-01-29 | 日本瑞翁株式会社 | Thermally conductive pressure-sensitive adhesive sheet-like molded body, method for producing same, and electronic device |
CN103214910A (en) * | 2013-04-03 | 2013-07-24 | 上海三思电子工程有限公司 | Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof |
CN103555087A (en) * | 2013-09-25 | 2014-02-05 | 天长市天泰光电科技有限公司 | Fluororesin heat radiation paint for LED lamp and preparation method thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB03 | Change of inventor or designer information | ||
CB03 | Change of inventor or designer information |
Inventor after: Zhang Yingcai Inventor before: Zhang Yingcai Inventor before: Liu Deshi |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20170313 Address after: 239400 Anhui Province Jian Xi Zhen Zhu Gang Cun, Mingguang City Applicant after: Mingguang Taiyuan Security Technology Co. Ltd. Address before: 239000, Chuzhou Province, East Garden Road, No. 555, Konka industrial transfer park, building No. 8, No. Applicant before: Anhui Bo Chang electronics technology limited-liability company |
|
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150812 |