CN104829978A - Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof - Google Patents

Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof Download PDF

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Publication number
CN104829978A
CN104829978A CN201510160243.6A CN201510160243A CN104829978A CN 104829978 A CN104829978 A CN 104829978A CN 201510160243 A CN201510160243 A CN 201510160243A CN 104829978 A CN104829978 A CN 104829978A
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weight
parts
preparation
heat radiation
light source
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张英才
刘德时
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Mingguang Taiyuan Security Technology Co. Ltd.
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Anhui Bo Chang Electronics Technology Limited-Liability Co
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K13/00Use of mixtures of ingredients not covered by one single of the preceding main groups, each of these compounds being essential
    • C08K13/06Pretreated ingredients and ingredients covered by the main groups C08K3/00 - C08K7/00
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/34Silicon-containing compounds
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08K3/38Boron-containing compounds
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/36Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/45Heterocyclic compounds having sulfur in the ring
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/28Nitrogen-containing compounds
    • C08K2003/282Binary compounds of nitrogen with aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
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  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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Abstract

The invention relates to a LED heat radiation material and especially relates to a Teflon-based high-heat radiation heat dissipation material for a LED light source and a preparation method thereof. The Teflon-based high-heat radiation heat dissipation material is prepared from 8-10 parts by weight of active alumina micro-powder of 200-300 meshes, 0.1-0.2 parts by weight of nanometer lanthanum hexaboride, 0.01-0.02 parts by weight of 3,4-ethylenedioxythiophene, 3-5 parts by weight of sodium silicate, 3-5 parts by weight of zirconia sol with solid content of 15-20%, 30-40 parts by weight of an ethanol aqueous solution with content of 3-5.5%, 20-25 parts by weight of aluminum nitride micro-powder of 400-600 meshes, 40-50 parts by weight of Teflon micro-powder of 200-300 meshes and 2-3 parts by weight of an assistant. The LED heat radiation material has the advantages of uniform and stable heat dispersion, environment corrosion resistance, light aging resistance, cleanliness, stain resistance, safety, insulation and cutting easiness and is an ideal LED lamp heat radiation material.

Description

A kind of LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material and preparation method thereof
Technical field
The present invention relates to LED heat sink material, be specifically related to a kind of LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material and preparation method thereof and production method thereof.
Background technology
LED is the abbreviation of photodiode, be a kind of be the semiconductor electronic component of luminous energy by electric energy conversion, there is volume little, life-span is long, current consumption is low, speed of response is fast, luminous efficiency is high, the advantages such as energy-conserving and environment-protective, it is the product of the most competitive power of the conventional light source as an alternative of generally acknowledging in the industry, also be widely used in real life, still there is many problems in current LED product, wherein heat dissipation problem is the most important thing always, common heat sink material mostly is high-thermal conductive metal, high heat conduction inorganic materials and the composite sintering of these materials form, it is large to there is excision forming difficulty in these materials, cost is higher, be subject to the shortcomings such as environmental corrosion, and with plastics and the composite heat sink material made of heat conductive filler, good radiating effect can be played, the environmental compatibility of material can be improved again, reach the use properties of efficient stable.
Tetrafluoroethylene has high temperature resistant, resistance to chemical attack, the plurality of advantages such as easy to clean, is described as the king of plastics; Aluminium nitride good heat conductivity, thermal expansivity is little, and the heat sink material being base-material mixed sintering with both can make up the defect that traditional LED dispels the heat, and has outstanding use properties.
Summary of the invention
The object of the invention is to, provide a kind of LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material and preparation method thereof, to achieve these goals, the technical solution used in the present invention is as follows:
A kind of LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material and preparation method thereof, it is characterized in that, material of the present invention is made up of the raw material of following weight part: 200-300 order Reactive alumina 8-10, nanometer lanthanum hexaborane 0.1-0.2,3,4-rthylene dioxythiophene 0.01-0.02, water glass 3-5, solid content are zirconia sol 3-5,5% aqueous ethanolic solution 30-40,400-600 order aluminium nitride micro mist 20-25,200-300 order ptfe micropowder 40-50, the auxiliary agent 2-3 of 15-20%.
Described auxiliary agent is made up of the raw material of following weight part: silane coupling agent kh550 6-8, potassium methyl silicate 1-2, titanium acetylacetone (25% isopropanol water solution) 1-3, nano silicon 3-4, sodium hydroxide 0.1-0.2, water 20-25, preparation method is: be first dissolved in by sodium hydroxide in appropriate water, be mixed with the solution that pH value is 10-11, add nano silicon subsequently, ultrasonic immersion 40-50min, powder after alkaline purification is washed to neutral rear dry, and add water and be mixed with colloidal sol, again other leftover materials are mixed with the silicon dioxide gel of preparation subsequently, high-speed stirring dispersion 60-80min, obtain.
Described a kind of LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material and preparation method thereof, its preparation method is:
(1) first drop in zirconia sol by nanometer lanthanum hexaborane, ultrasonic disperse 40-50min after stirring, gained material is for subsequent use;
(2) by water glass, 3,4-ethene dioxythiophene drops in aqueous ethanolic solution, after stirring makes material dissolve dispersion completely, drop into ptfe micropowder, continue dispersed with stirring 40-50min, then step (1) gained material and other leftover materials are added, mixed grinding dispersion 2-3h, compression moulding after material mixes completely, shaping rear base substrate blowing 15-20h under 50-60 DEG C of condition, remove moisture completely, gained base substrate fires 30-40min under 350-380 DEG C of condition, be cooled to room temperature subsequently, obtain final product.
The invention has the advantages that: with water glass, 3,4-ethene dioxythiophene-aqueous ethanolic solution is as binding agent, surface treatment is carried out to polytetrafluoroethylpowder powder, improve the surface property of material, improve the cohesive force between raw material, in advance through nanometer lanthanum hexaborane dispersed raising in base-material of the coated process of zirconia sol, improve the heat-radiating properties of material, heat-sinking capability obtains and promotes, and the auxiliary agent of interpolation helps effect that raw material is compatible, help sintering; Plastic base heat sink material prepared by the present invention has uniform and stable thermal conductivity, environmental corrosion resisting, light aging resisting, and cleaning bears dirty, safe insulation, and being easy to processing and cutting, is a kind of desirable LED lamp heat sink material.
Embodiment
Embodiment
The present embodiment heat sink material is made up of following raw material: 200 order Reactive aluminas 10, nanometer lanthanum hexaborane 0.1,3,4-rthylene dioxythiophene 0.01, water glass 5, solid content are zirconia sol 3,5% aqueous ethanolic solution 35,600 order aluminium nitride micro mist 23,200 order ptfe micropowder 50, the auxiliary agent 3 of 20%.
Described auxiliary agent is made up of the raw material of following weight part: silane coupling agent kh550 8, potassium methyl silicate 1, titanium acetylacetone (25% isopropanol water solution) 2, nano silicon 4, sodium hydroxide 0.2, water 25, preparation method is: be first dissolved in by sodium hydroxide in appropriate water, be mixed with the solution that pH value is 10.5, add nano silicon subsequently, ultrasonic immersion 50min, powder after alkaline purification is washed to neutral rear dry, and add water and be mixed with colloidal sol, again other leftover materials are mixed with the silicon dioxide gel of preparation subsequently, high-speed stirring dispersion 65min, obtain.
Described a kind of LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material and preparation method thereof, its preparation method is:
(1) first drop in zirconia sol by nanometer lanthanum hexaborane, ultrasonic disperse 50min after stirring, gained material is for subsequent use;
(2) water glass, 3,4-rthylene dioxythiophene are dropped in aqueous ethanolic solution, stir after making material dissolve dispersion completely, drop into ptfe micropowder, continue dispersed with stirring 50min, then add step (1) gained material and other leftover materials, mixed grinding dispersion 3h, compression moulding after material mixes completely, shaping rear base substrate blowing 16h under 50-60 DEG C of condition, remove moisture completely, gained base substrate fires 30min under 350-380 DEG C of condition, be cooled to room temperature subsequently, obtain final product.
It is as follows that material obtained by the present embodiment tests according to relevant criterion the performance index obtained:
Tensile strength is: 52.3MPa; Elongation at break: 0.45%; Dielectric strength: 20.5KV/mm; Thermal conductivity is 6.2W/m.k; Thermal diffusivity is 30.4mm 2/ s; The more single tetrafluoroethylene of thermal linear expansion coefficient reduces 80%; Illumination aging resisting performance grade: 4.5 grades.

Claims (2)

1. LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material and preparation method thereof, it is characterized in that, this material is made up of the raw material of following weight part: 200-300 order Reactive alumina 8-10, nanometer lanthanum hexaborane 0.1-0.2,3,4-rthylene dioxythiophene 0.01-0.02, water glass 3-5, solid content are zirconia sol 3-5,5% aqueous ethanolic solution 30-40,400-600 order aluminium nitride micro mist 20-25,200-300 order ptfe micropowder 40-50, the auxiliary agent 2-3 of 15-20%;
Described auxiliary agent is made up of the raw material of following weight part: silane coupling agent kh550 6-8, potassium methyl silicate 1-2, titanium acetylacetone (25% isopropanol water solution) 1-3, nano silicon 3-4, sodium hydroxide 0.1-0.2, water 20-25, preparation method is: be first dissolved in by sodium hydroxide in appropriate water, be mixed with the solution that pH value is 10-11, add nano silicon subsequently, ultrasonic immersion 40-50min, powder after alkaline purification is washed to neutral rear dry, and add water and be mixed with colloidal sol, again other leftover materials are mixed with the silicon dioxide gel of preparation subsequently, high-speed stirring dispersion 60-80min, obtain.
2. a kind of LED light source polytetrafluoroethylene (PTFE) base high-heating radiation heat sink material as claimed in claim 1 and preparation method thereof, its preparation method is:
(1) first drop in zirconia sol by nanometer lanthanum hexaborane, ultrasonic disperse 40-50min after stirring, gained material is for subsequent use;
(2) by water glass, 3,4-ethene dioxythiophene drops in aqueous ethanolic solution, after stirring makes material dissolve dispersion completely, drop into ptfe micropowder, continue dispersed with stirring 40-50min, then step (1) gained material and other leftover materials are added, mixed grinding dispersion 2-3h, compression moulding after material mixes completely, shaping rear base substrate blowing 15-20h under 50-60 DEG C of condition, remove moisture completely, gained base substrate fires 30-40min under 350-380 DEG C of condition, be cooled to room temperature subsequently, obtain final product.
CN201510160243.6A 2015-04-07 2015-04-07 Teflon-based high-heat radiation heat dissipation material for LED light source and preparation method thereof Pending CN104829978A (en)

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102822279A (en) * 2010-04-07 2012-12-12 电气化学工业株式会社 Heat dissipating resin composition for led lighting housing and heat dissipating housing for led lighting
CN103214910A (en) * 2013-04-03 2013-07-24 上海三思电子工程有限公司 Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof
CN103547644A (en) * 2011-06-17 2014-01-29 日本瑞翁株式会社 Thermally conductive pressure-sensitive adhesive sheet-like molded body, method for producing same, and electronic device
CN103555087A (en) * 2013-09-25 2014-02-05 天长市天泰光电科技有限公司 Fluororesin heat radiation paint for LED lamp and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102822279A (en) * 2010-04-07 2012-12-12 电气化学工业株式会社 Heat dissipating resin composition for led lighting housing and heat dissipating housing for led lighting
CN103547644A (en) * 2011-06-17 2014-01-29 日本瑞翁株式会社 Thermally conductive pressure-sensitive adhesive sheet-like molded body, method for producing same, and electronic device
CN103214910A (en) * 2013-04-03 2013-07-24 上海三思电子工程有限公司 Radiation heat dissipation coating for reducing light-emitting diode (LED) chip junction temperature and preparation method thereof
CN103555087A (en) * 2013-09-25 2014-02-05 天长市天泰光电科技有限公司 Fluororesin heat radiation paint for LED lamp and preparation method thereof

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Inventor after: Zhang Yingcai

Inventor before: Zhang Yingcai

Inventor before: Liu Deshi

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Effective date of registration: 20170313

Address after: 239400 Anhui Province Jian Xi Zhen Zhu Gang Cun, Mingguang City

Applicant after: Mingguang Taiyuan Security Technology Co. Ltd.

Address before: 239000, Chuzhou Province, East Garden Road, No. 555, Konka industrial transfer park, building No. 8, No.

Applicant before: Anhui Bo Chang electronics technology limited-liability company

RJ01 Rejection of invention patent application after publication
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Application publication date: 20150812