CN104790020A - Copper particle and processing method thereof - Google Patents

Copper particle and processing method thereof Download PDF

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Publication number
CN104790020A
CN104790020A CN201510224463.0A CN201510224463A CN104790020A CN 104790020 A CN104790020 A CN 104790020A CN 201510224463 A CN201510224463 A CN 201510224463A CN 104790020 A CN104790020 A CN 104790020A
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CN
China
Prior art keywords
copper
shot copper
shot
copper particle
hollow bulb
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201510224463.0A
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Chinese (zh)
Inventor
孔剑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangsu kindle copper co Ltd
Original Assignee
Jiangsu kindle copper co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangsu kindle copper co Ltd filed Critical Jiangsu kindle copper co Ltd
Priority to CN201510224463.0A priority Critical patent/CN104790020A/en
Publication of CN104790020A publication Critical patent/CN104790020A/en
Pending legal-status Critical Current

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  • Electroplating Methods And Accessories (AREA)

Abstract

The invention discloses a copper particle and a processing method thereof. The copper particle comprises a copper particle body, wherein the copper particle body is a cylinder; a plurality of grooves are formed in the side face of the copper particle body; the height difference between the lowest point at groove bottom of the groove and the side face of the copper particle body is 0.3-0.8 mm; the inside of the copper particle body is hollow; the hollow part is connected with the outside; the copper raw material is dissolved, the dissolved copper solution is injected to a mould and is cooled, and the copper billet is taken out and polished, washed and baked. By adopting the mode, the surface area of the copper particle is greatly increased, the copper ion can be simultaneously emitted from the surface of the groove and the surface of the copper particle body, so that the copper ions emitted under the same condition are increased, the borne current is increased and the electroplating time is shortened. The method is simple in operation and can be expertly operated by an operator without mastering many skills, the cost is saved and the rapid production effect can be reached.

Description

A kind of shot copper and working method
Technical field
The present invention relates to a kind of shot copper and working method.
Background technology
Steel cord develops product the most wide in rubber framework material, is also the product that production difficulty is maximum in metal products, and it is made up of more than two or two steel wires, or the structure that the combination by stock and stock or the combination by stock and silk are formed.Need to use shot copper in tire steel cord electroplating activity process.Shot copper also can be applied in the field such as cutting steel wire, Hardware fitting.But the shot copper existed the now object that to be all the smooth surface of solid shape smooth, the amount of the cupric ion discharged under identical conditions during use is certain, thus the electric current born can be certain, make electroplating time elongated.The Heavy Weight of solid shot copper, cost is high, uses inconvenience.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of shot copper and working method, and this working method is time saving and energy saving, and the copper ball result of use obtained is good.
For solving the problems of the technologies described above, the technical scheme that the present invention adopts is: provide a kind of shot copper, comprise shot copper body, the shape of described shot copper body is right cylinder, the side of described shot copper body is provided with several grooves, the difference of altitude of the bottom land lower-most point of described groove and the side of described shot copper body is 0.3-0.8mm, and the inside of described shot copper body is hollow, and described hollow bulb is connected with the external world.
In a preferred embodiment of the present invention, the height of described shot copper is 13-17mm, and the basal diameter of described shot copper is 6-10mm.
In a preferred embodiment of the present invention, the material of described shot copper is T2 fine copper.
In a preferred embodiment of the present invention, described groove is hemisphere, and several grooves described are for symmetry axis is symmetrically arranged with the medullary ray of described shot copper body.
In a preferred embodiment of the present invention, the shape of described hollow bulb is rectangular parallelepiped, the upper surface of described hollow bulb and the upper surface of described shot copper body coincide, and the lower surface of described hollow bulb and the lower surface of described shot copper body coincide, and described hollow bulb runs through the inside of described shot copper body.
In a preferred embodiment of the present invention, the length of described rectangular parallelepiped hollow bulb is 0.5-1mm, and wide is 0.5-1mm.
There is provided a kind of working method of shot copper, comprising step is: dissolve copper raw material, the copper solutions of dissolving to be injected in mould and to cool taking-up to obtain copper base, carries out polishing, cleaning drying and processing obtains shot copper to described copper base.
In a preferred embodiment of the present invention, the solvent temperature of described copper raw material is 1300-1500 DEG C.
The invention has the beneficial effects as follows: shot copper of the present invention and working method, the surface-area of described shot copper increases greatly, cupric ion can be released from groove surfaces and shot copper body surface simultaneously, thus the cupric ion of releasing under making identical conditions increases, increase the electric current born, reach the object shortening electroplating time, the method is simple to operate, not needing operator to grasp too many technical ability just can skilled operation, saves cost, and can reach the effect of producing fast.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of shot copper one of the present invention preferred embodiment;
In accompanying drawing, the mark of each parts is as follows: 1, shot copper body, and 2, groove, 3, hollow bulb.
Embodiment
Be clearly and completely described to the technical scheme in the embodiment of the present invention below, obviously, described embodiment is only a part of embodiment of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making other embodiments all obtained under creative work prerequisite, belong to the scope of protection of the invention.
Refer to Fig. 1, the embodiment of the present invention comprises:
A kind of shot copper, comprises shot copper body 1.The shape of described shot copper body 1 is right cylinder, and the height of described shot copper is 15mm, and the basal diameter of described shot copper is 8mm, and the material of described shot copper is T2 fine copper.The side of described shot copper body 1 is provided with several grooves 2, and the quantity of described groove 2 does not limit.The difference of altitude of the bottom land lower-most point of described groove 2 and the side of described shot copper body 1 is 0.3-0.8mm, all passable within the scope of this.The shape of described groove 2 can be different shape, and can be that rule is three-dimensional be arranged or irregular solid setting.In the present embodiment, described groove 2 is hemisphere, and several grooves 2 described are with the medullary ray of described shot copper body 1 for symmetry axis is symmetrically arranged, and the radius of described groove 2 hemisphere is 0.6mm.
The inside of described shot copper body 1 is hollow, and described hollow bulb 3 is connected with the external world, and described hollow bulb 3 can be different shape, and can be that rule is three-dimensional be arranged or irregular solid setting.In the present embodiment, the shape of described hollow bulb 3 is rectangular parallelepiped, the upper surface of described hollow bulb 3 and the upper surface of described shot copper body 1 coincide, and the lower surface of described hollow bulb 3 and the lower surface of described shot copper body 1 coincide, and described hollow bulb 3 runs through the inside of described shot copper body 1.The length of described rectangular parallelepiped hollow bulb 3 is 0.7mm, and wide is 0.6mm.
There is provided a kind of working method of shot copper, comprising step is: dissolve at 1400 DEG C copper raw material, the copper solutions of dissolving to be injected in mould and to cool taking-up to obtain copper base, carries out polishing, cleaning drying and processing obtains shot copper to described copper base.
The invention has the beneficial effects as follows:
One, the surface-area of described shot copper increases greatly, and cupric ion can be released from groove surfaces and shot copper body surface simultaneously;
Two, the cupric ion that described shot copper is released under making identical conditions increases, and increases the electric current born, and reaches the object shortening electroplating time;
Three, described method is simple to operate, and not needing operator to grasp too many technical ability just can skilled operation, saves cost, and can reach the effect of producing fast.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present invention.

Claims (8)

1. a shot copper, it is characterized in that, comprise shot copper body, the shape of described shot copper body is right cylinder, the side of described shot copper body is provided with several grooves, the difference of altitude of the bottom land lower-most point of described groove and the side of described shot copper body is 0.3-0.8mm, and the inside of described shot copper body is hollow, and described hollow bulb is connected with the external world.
2. shot copper according to claim 1, is characterized in that, the height of described shot copper is 13-17mm, and the basal diameter of described shot copper is 6-10mm.
3. shot copper according to claim 1, is characterized in that, the material of described shot copper is T2 fine copper.
4. shot copper according to claim 1, is characterized in that, described groove is hemisphere, and several grooves described are for symmetry axis is symmetrically arranged with the medullary ray of described shot copper body.
5. shot copper according to claim 1, it is characterized in that, the shape of described hollow bulb is rectangular parallelepiped, the upper surface of described hollow bulb and the upper surface of described shot copper body coincide, the lower surface of described hollow bulb and the lower surface of described shot copper body coincide, and described hollow bulb runs through the inside of described shot copper body.
6. shot copper according to claim 5, is characterized in that, the length of described rectangular parallelepiped hollow bulb is 0.5-1mm, and wide is 0.5-1mm.
7. the working method of shot copper according to claim 1, it is characterized in that, comprising step is: dissolve copper raw material, the copper solutions of dissolving to be injected in mould and to cool taking-up to obtain copper base, carries out polishing, cleaning drying and processing obtains shot copper to described copper base.
8. the working method of shot copper according to claim 7, is characterized in that, the solvent temperature of described copper raw material is 1300-1500 DEG C.
CN201510224463.0A 2015-05-06 2015-05-06 Copper particle and processing method thereof Pending CN104790020A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201510224463.0A CN104790020A (en) 2015-05-06 2015-05-06 Copper particle and processing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201510224463.0A CN104790020A (en) 2015-05-06 2015-05-06 Copper particle and processing method thereof

Publications (1)

Publication Number Publication Date
CN104790020A true CN104790020A (en) 2015-07-22

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106825549A (en) * 2017-04-13 2017-06-13 江苏金奕达铜业股份有限公司 A kind of copper particle with high surface area structure

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203065609U (en) * 2012-12-10 2013-07-17 重庆智锐德科技有限公司 Novel anode plate and mold thereof
CN103722350A (en) * 2014-01-14 2014-04-16 东又悦(苏州)电子科技新材料有限公司 Electroplating hollow phosphor copper ball and preparation method thereof
CN204608203U (en) * 2015-05-06 2015-09-02 江苏金奕达铜业股份有限公司 A kind of shot copper

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN203065609U (en) * 2012-12-10 2013-07-17 重庆智锐德科技有限公司 Novel anode plate and mold thereof
CN103722350A (en) * 2014-01-14 2014-04-16 东又悦(苏州)电子科技新材料有限公司 Electroplating hollow phosphor copper ball and preparation method thereof
CN204608203U (en) * 2015-05-06 2015-09-02 江苏金奕达铜业股份有限公司 A kind of shot copper

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106825549A (en) * 2017-04-13 2017-06-13 江苏金奕达铜业股份有限公司 A kind of copper particle with high surface area structure

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Application publication date: 20150722