CN104785450B - Semiconductor element test separator - Google Patents
Semiconductor element test separator Download PDFInfo
- Publication number
- CN104785450B CN104785450B CN201410691161.XA CN201410691161A CN104785450B CN 104785450 B CN104785450 B CN 104785450B CN 201410691161 A CN201410691161 A CN 201410691161A CN 104785450 B CN104785450 B CN 104785450B
- Authority
- CN
- China
- Prior art keywords
- mentioned
- semiconductor element
- cleaner
- user tray
- test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67333—Trays for chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/30—Structural arrangements specially adapted for testing or measuring during manufacture or treatment, or specially adapted for reliability measurements
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to semiconductor element test separator.According to the present invention, the cleaner for removing foreign matter from the mounting key element of user tray etc. is combined in the pick and place device of separator.By composition as described above, the present invention can not only clean the empty mounting key element in halted state, and it sets simple, and have the advantages that to minimize cleaner installation space.
Description
Technical field
The present invention relates to a kind of semiconductor element test separator (HANDLER FOR SEMICONDUCTOR DEVICE
TEST), more particularly in order to test semiconductor element and to tester semiconductor supply element after, classify according to grade
Terminate the separator of the semiconductor element of test.
Background technology
Separator is to support the setting of being tested by tester of semiconductor element manufactured by the manufacturing process through specifying
Standby, it makes each semiconductor element for being placed in user tray be loaded into test pallet and is placed in test pallet to tester supply
State each semiconductor element, and make to have terminated each semiconductor element of test and be offloaded to user tray from test pallet.
This separator possesses between user tray and test pallet and in such as aligner, buffer, sorting
Picking up for semiconductor element is conveyed between mutually different each mounting key element or arrangement key element put (Pick and as platform
Place) device, and pick and place device at least has a pick-and-place module.And, pick-and-place module possesses using vacuum power to be inhaled
Multiple pick-ups that are attached and gripping the action that semiconductor element or releasing are gripped.
That pick and place device is named according to use with various titles.In general, user tray will be located at
Semiconductor element is referred to as loader in the case of being loaded into the pick and place device of test pallet, and will be located at partly leading for test pallet
Volume elements part is referred to as emptier in the case of being offloaded to the pick and place device of user tray.
On the other hand, due to mounting key element on load semiconductor element, if thus mounting part there are various foreign matters,
Then its mounting is bad or influences the quality of semiconductor element.Thus, it is desirable that mounting key element is removing the shape of various foreign matters
Mounting semiconductor element is waited under state.
On removal mounting key element foreign matter technology, proposition have South Korea granted patent publication 10-0815131 (with
Be referred to as the first ＇ of technology 1 of ＇ down), publication publication 10-2012-0027580 (hereinafter referred to as ' first technology 2 '), authorize special
The technologies such as sharp publication 10-0862638 (the first ＇ of technology 3 of hereinafter referred to as ＇).
First technology 1 be make user tray rotate and from the technology of user tray separating semiconductor element.However, it is this
First technology 1 is due to occupying larger space and mechanism's composition complexity, thus it is for removing the foreign matter in mounting key element to be difficult to convert
Technology.
First technology 2 is to introduce test cabinet or setting from the path that test cabinet is drawn the technology of cleaning unit.Therefore,
First technology 2 cannot be applied to from being fixed or the mounting key element in halted state removes the technology of foreign matter.
First technology 3 is the technology of the Superficial Foreign Body with air cleaner or fur brush cleaner removal semiconductor element.Greatly
All multiple mounting portions for possessing the depression that can load each semiconductor element in mounting key element.Thus, even if with air or hairbrush
Clean each mounting portion, the removal efficiency of foreign matter is not also high, but also occur foreign matter be only mutually different mounting portion it
Between situation about moving.Therefore, in the technical elements being adapted to from mounting key element removal foreign matter there is problem in first technology 3.
The content of the invention
Solve desired problem
It is an object of the invention to provide a kind of technology for removing foreign matter from the mounting key element in halted state.
Solution to problem
It is intended to reach the semiconductor element test separator of the invention of above-mentioned purpose, including：Loader, it will
Semiconductor element is loaded to test pallet from user tray；Attachment means, it makes the survey for being finished to load by above-mentioned loader
Each semiconductor element for trying pallet is electrically connected with tester；Emptier, if it is electrically connected by above-mentioned attachment means with tester
The test of each semiconductor element terminate, then semiconductor element is offloaded to user tray from test pallet；And, cleaner,
Its for being vacateed by above-mentioned loader in each semiconductor element after carry out foreign matter removal in the user tray of halted state,
Or carry out foreign matter removal for the user tray in halted state before semiconductor element is loaded by above-mentioned emptier.
Above-mentioned cleaner is combined and together with above-mentioned loader or above-mentioned emptier with above-mentioned loader or above-mentioned emptier
It is mobile.
Above-mentioned cleaner includes：From the vacuum suction part of user tray vacuum aspirated foreign body；And, inhaled by above-mentioned vacuum
Enter the foreign matter free-falling that part is sucked and the dust part collected.
Further include for making above-mentioned cleaner relative to the lifting that above-mentioned loader or above-mentioned emptier are lifted
Device.
Above-mentioned separator further include to confirm on the user tray of halted state whether remaining semiconductor element
Element validator, above-mentioned cleaner confirming work in the case that user tray has been vacated by said elements validator
Make.
Invention effect
Had the effect that according to the present invention.
Firstth, can not only be cleaned for the mounting key element such as user tray in halted state, and it is set
Simply.
Secondth, due to being constituted in the way of being combined with pick and place device, it is thus possible to minimize the installation space of cleaner.
Brief description of the drawings
Fig. 1 is for the conceptual top view of separator of the invention.
Fig. 2 is the general profile chart of the main portions for Fig. 1.
Fig. 3 is the upward view for being formed in the vacuum suction part of the cleaner of the main portions of Fig. 1.
Fig. 4 is the general profile chart of the semiconductor element mobile device for another way of the invention.
Symbol description
120 ＇-loader, 170-emptier, 180,180 ＇-cleaner, 181-vacuum suction part, 182-dust
Part, 190,190 ＇-element validator.
Specific embodiment
Illustrate referring to the drawings according to the preferred embodiments of the present invention as described above, be easy to explanation for purpose of brevity,
The explanation mentioned in background technology is omitted or sketched as far as possible.
Fig. 1 is for conceptual the bowing of general semiconductor element test separator 100 (hereinafter referred to as ' separator ')
View.
As shown in figure 1, separator 100 is configured to include test pallet 110 (TEST TRAY), loader 120
(LOADER), equal hot cell 130 (SOAK CHAMBER), test cabinet 140 (TEST CHAMBER), (PUSHING of propulsion plant 150
APPARATUS equal hot cell 160 (DESOAK CHAMBER), emptier 170 (UNLOADING APPARATUS), cleaner), are moved back
180 (CLEANER), element validator 190 and lifter 210 etc..
Test pallet 110 is provided with the multiple inserts for being capable of installation settings semiconductor element, and by multiple conveying devices
(not shown) is circulated along identified closed path C.
Loader 120 is that each semiconductor element to be tested for making the user tray CT being placed on loading plate lp is loaded
To the pick and place device of the test pallet 110 (LOADING) positioned at " loaded " position LP (LOADING POSITION).
In order to each semiconductor element will come from " loaded " position LP conveyings, to be loaded into test pallet 110 is according to test
Environmental condition preheat or precooling and be provided with equal hot cell 130.
Preheated through in equal hot cell 130, be transported to test position TP (TESTPOSITION), dress after precooling to test
It is loaded in each semiconductor element of test pallet 110 and is provided with test cabinet 140.
Push to and test cabinet as each semiconductor element in test cabinet 140, to be loaded into test pallet 110 will be located at
Tester (TESTER) side that 140 sides combine causes the attachment means that each semiconductor element electrically connects with tester and is provided with propulsion
Device 150.
In order to half and half be led being conveyed from test cabinet 140, being loaded into test pallet 110, heated or cooling
Volume elements part revert to normal temperature and is provided with and moves back equal hot cell 160.
Emptier 170 be by from move back equal hot cell 160 be delivered to unloading position UP (UNLOADINGPOSITION), load
Classified according to test grade in each semiconductor element of test pallet 110, and unloaded (UNLOADING) to unloading on support plate up
Empty user tray CT pick and place device.
Used as reference, its construction of the user tray CT and user tray CT unloaded on support plate up or form on loading plate lp are equal
It is identical, why make symbol different, it is only for clear and definite " loaded " position and unloading position.
Cleaner 180 is true from user tray CT before semiconductor element is filled to user tray CT by emptier 170
Empty aspirated foreign body and remove the foreign matter of user tray CT.For this cleaner 180, because lifter 210 intervenes emptier
170 sides and combine, it is thus possible to moved with the movement of emptier 170.Therefore, because cleaner 180 can be to conduct
Clean the user tray CT movements of object, it is thus possible to carry out the cleaning of the user tray CT in halted state.Fig. 2 be for
Fig. 1 includes the general profile chart of the main portions of emptier 170 and cleaner 180.Reference picture 2, is combined with emptier 170
Cleaner 180 includes vacuum suction part 181 and dust part 182.It is, of course, also possible to be that cleaner is directly combined with emptier
Mode example.
As shown in figure 3, due to being formed with multiple inlet hole h in the bottom surface of vacuum suction part 181, thus sucked by vacuum
Vacuum pressure inside part 181 and suck the foreign matter on the user tray CT of downside.
Dust part 182 is arranged at the side of vacuum suction part 181, and upside position is provided and sucked by inlet hole h
Air movable passageway W, downside position provide chamber, after inlet hole h lateral thrusts rise air movement lead to
The foreign matter of road W free-fallings because of deadweight comes together in the chamber.Here, the movable passageway of air finally can be with factory
The vacuum pipeline connection of (TEST HOUSE) is connected with the vavuum pump for separately setting.
Whether element validator 190 confirms stopping at the remaining semiconductor elements of the user tray CT unloaded on support plate up.This
Kind of element validator 190 can with image mechanism into.Thus, the work of cleaner 180 be by element validator 190 come really
Recognizing in the case that user tray CT is in the state vacated is carried out.
In order that cleaner 180 is lifted relative to emptier 170 and is provided with lifter 210.Therefore, in palpus emptier
Cleaner 180 rises and without prejudice to unloading operation in the case of 170 work, the cleaner in the case where palpus cleaner 180 works
180 decline so as to its cleaning work will not be influenceed by emptier 170.Linear slide that can be with above-below direction as length direction
Guide rail and cylinder possess this lifter 210, or applicable motor and possess this lifter 210, the energy of this lifter 210
Enough it is substantially located between emptier 170 and cleaner 180.
On the other hand, it is possible to understand that into Fig. 2 be for being combined with cleaner 180 in the emptier 170 as pick and place device
With the construction of the new semiconductor element mobile device of element validator 190.I.e., according to the present invention, put due to not only possessing to pick up
Device is also equipped with cleaner and element validator, therefore, prompting is a kind of can to move the cleaning of user tray and semiconductor element
The semiconductor element mobile device of the new paragon that action industry is carried out in the lump.
Therefore, as shown in Figure 4, additionally it is possible to the ＇ of loader 120 be combined with the ＇ of cleaner 180, the ＇ of element validator 190, with
And the semiconductor element mobile device of the mode of the ＇ of lifter 210 implements the present invention.In this case, dress is being stopped at
After user tray CT on support plate is vacateed by the operation of the ＇ of loader 120, foreign matter removal can be carried out by the ＇ of cleaner 180
Operation.
And then according to the present invention, because cleaner 180,180 ＇ can be moved to the upper side position of various mounting key elements, because
As long as and the position that pick and place device to be moved, then can be cleaned not only for user tray CT, and for such as
Such various mounting key elements such as test pallet, aligner, buffer and pigeonholes can also be cleaned.
As described above, according to the present invention, for cleaner 180,180 ＇ assign mobility and with the mobility of pick and place device
With reference to, thus can not only implement cleaning function and to greatest extent simplify design, and can for all mountings will
Element is cleaned.
As described above, although by referring to the embodiment of accompanying drawing illustrated for of the invention, it is but above-mentioned
Embodiment be to enumerate preferred example to illustrate the present invention, therefore, be not construed as the present invention is limited to above-mentioned
Embodiment, and should be understood to interest field of the invention and determined by appending claims and its equivalent concepts.
Claims (4)
1. a kind of semiconductor element test separator, it is characterised in that including：
Loader, it loads to test pallet semiconductor element from user tray；
Attachment means, it makes each semiconductor element of the test pallet for finishing loading by above-mentioned loader be electrically connected with tester
Connect；
Emptier, if the test of its each semiconductor element electrically connected with tester by above-mentioned attachment means terminates, will be partly
Conductor element is offloaded to user tray from test pallet；And,
Cleaner, its for being vacateed by above-mentioned loader in each semiconductor element after enter in the user tray of halted state
Row foreign matter is removed, or is carried out for the user tray in halted state before semiconductor element is loaded by above-mentioned emptier
Foreign matter is removed；
Above-mentioned cleaner is included from the vacuum suction part of user tray vacuum aspirated foreign body and by above-mentioned vacuum suction part
The foreign matter free-falling for being sucked and the dust part collected, above-mentioned vacuum suction part at least include an inlet hole, above-mentioned
Dust collecting part sets up the side for being placed in above-mentioned vacuum suction part separately；
The air sucked by above-mentioned inlet hole is risen from after the lateral thrust of above-mentioned dust part, and above-mentioned foreign matter comes together in above-mentioned
The downside position of dust part.
2. semiconductor element test separator according to claim 1, it is characterised in that
Above-mentioned cleaner is combined with above-mentioned loader or above-mentioned emptier and moved together with above-mentioned loader or above-mentioned emptier.
3. semiconductor element test separator according to claim 2, it is characterised in that
Further include for making above-mentioned cleaner relative to the lifter that above-mentioned loader or above-mentioned emptier are lifted.
4. semiconductor element test separator according to claim 1, it is characterised in that
Further include to confirm on the user tray of halted state whether the element validator of remaining semiconductor element,
Above-mentioned cleaner is confirmed user tray and is worked in the case of having vacated by said elements validator.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2014-0007186 | 2014-01-21 | ||
| KR1020140007186A KR102043633B1 (en) | 2014-01-21 | 2014-01-21 | Handler for semiconductor device test |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104785450A CN104785450A (en) | 2015-07-22 |
| CN104785450B true CN104785450B (en) | 2017-05-31 |
Family
ID=53550903
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410691161.XA Active CN104785450B (en) | 2014-01-21 | 2014-11-26 | Semiconductor element test separator |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR102043633B1 (en) |
| CN (1) | CN104785450B (en) |
| TW (1) | TWI533003B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102656451B1 (en) * | 2016-03-18 | 2024-04-12 | (주)테크윙 | Handler for testing electronic components |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2908820B2 (en) * | 1989-10-24 | 1999-06-21 | 株式会社日本マイクロニクス | IC carrier |
| JP3417528B2 (en) * | 1996-04-05 | 2003-06-16 | 株式会社アドバンテスト | IC test equipment |
| JP2002168909A (en) * | 2000-11-29 | 2002-06-14 | Ando Electric Co Ltd | Ic handler, and method of cleaning contactor |
| KR100714106B1 (en) * | 2005-12-15 | 2007-05-02 | (주)테크윙 | Test handler and operation method of test handler |
| KR100862638B1 (en) * | 2007-03-13 | 2008-10-09 | (주) 인텍플러스 | Apparatus for inspection of semiconductor device having the cleaning means and method for inspection by the same |
| CN101322971B (en) * | 2007-06-14 | 2014-05-28 | 鸿劲科技股份有限公司 | Memory body IC testing and sorting machine |
| CN201454870U (en) * | 2009-07-22 | 2010-05-12 | 咸阳文林机电设备制造有限公司 | Fully-automatic LED chip selector |
| KR20120027580A (en) * | 2010-09-13 | 2012-03-22 | 삼성전자주식회사 | Test handler for semiconductor package and the test method using the same |
| CN202212360U (en) * | 2011-08-13 | 2012-05-09 | 张家港市金桥轻工机械有限公司 | Pole plate separator |
| KR101489373B1 (en) * | 2013-09-17 | 2015-02-12 | 주식회사 넥스트솔루션 | Cleaning apparatus for test handler |
-
2014
- 2014-01-21 KR KR1020140007186A patent/KR102043633B1/en active IP Right Grant
- 2014-11-26 CN CN201410691161.XA patent/CN104785450B/en active Active
- 2014-11-28 TW TW103141451A patent/TWI533003B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| TWI533003B (en) | 2016-05-11 |
| CN104785450A (en) | 2015-07-22 |
| KR20150086941A (en) | 2015-07-29 |
| TW201530165A (en) | 2015-08-01 |
| KR102043633B1 (en) | 2019-11-13 |
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