CN104759627B - A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder - Google Patents
A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder Download PDFInfo
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- CN104759627B CN104759627B CN201410002957.XA CN201410002957A CN104759627B CN 104759627 B CN104759627 B CN 104759627B CN 201410002957 A CN201410002957 A CN 201410002957A CN 104759627 B CN104759627 B CN 104759627B
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Abstract
The invention discloses a kind of method that utilization millimeter, micron or nano oxidized copper powder manufacture miniature high porosity sintered copper heat pipe.This method is similar to normal sintering copper heat pipe, and difference is that, by adding the cupric oxide powder that cupric oxide powder or different grain size are mixed, by hydrogen reduction and sintering processes, high porosity sintered copper needed for preparing is the heat pipe method of liquid-sucking core.Micro heat pipe is generally made by copper powder direct sintering, and its sintered copper liquid-sucking core porosity is generally 40 50%.The sintered copper heat pipe being mixed to prepare using millimeter, micron or nano oxidized copper powder or its different grain size, the sintered copper porosity of acquisition is up to 60 80%, and porosity can be designed as needed.Be conducive to accelerating back-flow velocity of the liquid medium in high hole sintered copper liquid-sucking core, substantially reduce thermal resistance of the medium in liquid gas phase transition cyclic process in heat pipe, improve radiating efficiency.The manufacture method is simple, and production process is pollution-free and cost is low, is adapted to industrialized production.
Description
Technical field
The present invention relates to the manufacture method that a kind of electronic component carries out quick heat radiating micro heat pipe, more particularly to by also
Former sintered porous copper of the cupric oxide powder manufacture with high porosity is the manufacture method of the micro heat pipe of liquid-sucking core.
Background technology
Electron Heat management is a key areas in semiconductor and electronics industry, because heat management is exactly to semi-conductor electricity
The running temperature of sub- equipment carries out effective thermal control, to ensure the stability and reliability of its work.With IT, communication, LED
The development advanced by leaps and bounds with the microelectric technique such as solar energy, semiconductor electronic component size enters sub-micro from micron dimension
Rice and nanometer scale.With the degree more and more higher that electronic device is integrated, high frequency, high speed and the integrated circuit of electronic device
High density and volume tend to microminiaturization so that unit volume electronic component caloric value and one single chip energy consumption increase, equipment
The design of densification structure make it that radiating is more difficult again, hence it is imperative that solving high efficiency and heat radiation technical barrier.This problem
To in the portable electronic piece and communication apparatus of high speed development, electronic component, high-tension high-power electronic device and military equipment
Electronic component is most important.The invention and development of hot pipe technique, are that semiconductor and electronic radiation provide important solution party
Method and approach.
Hot pipe technique is George Ge Luofo of U.S. Los Alamos (Los Alamos) National Laboratory in 1963
One kind of (George Grover) invention is referred to as the heat transfer element of " heat pipe ", and it takes full advantage of heat-conduction principle and is situated between with refrigeration
The heat of thermal objects, is delivered to outside thermal source rapidly by the quick thermal transport property of matter through heat pipe, and its capacity of heat transmission, which exceedes, appoints
The capacity of heat transmission of what known metal.
Why heat pipe can possess the so good capacity of heat transmissionBecause the heat absorption of object, heat release are relative, every
When with the presence of the temperature difference, just necessarily there is heat phenomenon to transmission at low temperature at high temperature.Come from three kinds of modes of heat transfer
See（Radiation, convection current, conduction）, wherein heat transfer is most fast.Heat pipe is exactly to utilize sweat cooling so that heat pipe two ends temperature difference is very
Greatly, heat is made quickly to conduct.General heat pipe is made up of shell, liquid-sucking core and end cap.Inside heat pipe is to be pumped into negative pressure state, is filled
Enter appropriate liquid medium, this boiling point of liquid is low, readily volatilized.Tube wall has liquid-sucking core, and it is made up of capillary-porous material.Heat
Pipe one end is fire end or evaporation ends, and other end is condensation end, when heat pipe one end is heated, and the liquid in capillary steams rapidly
Hair, steam flows to other end under small pressure differential, and discharges heat, and regelation is into liquid, and liquid is again along more
Porous materials flow back to evaporation ends by the effect of capillary force, and so circulation is more than, and heat reaches other end by heat pipe one end.It is this to follow
Ring is quickly carried out, and heat, which can be conducted continuously, to be come.
Heat pipe is a kind of novel heat transfer element with very high thermal conductivity, and it passes through the liquid in Totally enclosed vacuum pipe
The evaporation of medium transmits heat with condensation, and it plays good refrigeration using fluid principles such as capillary actions.Tool
There is high thermal conductivity, good isothermal, the heat transfer area of cold and hot both sides arbitrarily to change, can remotely transferring, temperature can
The features such as control.The tube core of the substrate of heat-pipe radiator and the device for high-power power electronic such as IGCT, IGBT, IGCT is close
Contact, directly can quickly export the heat of tube core.
Liquid-sucking core is an important component of heat pipe.The structure type of liquid-sucking core will directly influence heat pipe and heat pipe
The performance of heat exchanger.Recently as the development of hot pipe technique, various countries researcher does in terms of liquid sucting core structure and theoretical research
Extensive work, the tube core of a function admirable should have：(1) sufficiently large capillary pumped pressure, or less tube core have
Imitate aperture；(2) less liquid flowing resistance, that is, have higher permeability；(3) good heat-transfer character, that is, have small
Radial direction thermal resistance；(4) good process repeatability and reliability, are simple to manufacture, cheap.
For the universal sintered copper liquid-sucking core heat pipe being directly made of Micron-Sized Copper Powders Coated, the hole of its sintered copper powder at present
Rate is substantially in 40-50%, and porosity is relatively low, and the thermal resistance that flowed back in cyclic process is relatively large.Exist to solve the two liquid-sucking cores
Key issue, propose present invention.
The content of the invention
There is the low influence liquid medium phase of porosity for being directly sintered at present with copper powder as liquid-sucking core in the present invention
Become circulation rate and relative increase condensation end liquid backflow resistance, proposition uses cupric oxide powder or the oxidation with varying particle size
Reduction sintering is carried out after copper powder mixing, the sintered porous copper that can be made into high porosity is the heat pipe of liquid-sucking core.Copper powder is used with existing
The sintered copper heat pipe being made is compared, and oxidized copper powder is replaced after copper powder, and the porosity of sintered copper may be up to 60- after reduction sintering
80%, pore size is that significant change also occurs for particulate interspaces so that liquid medium produces stronger capillary attraction, promotes phase transformation
Process and liquid-vapour cycle speed are accelerated, and particularly greatly accelerate back-flow velocity of the gas after condensation end is changed into liquid phase, drop
The thermal resistance of low condensed liquid medium back flow, improves radiating efficiency, effectively solves quickly to dissipate needed for golf calorific value electronic component
Heat problem.
Brief description of the drawings
Fig. 1 is the schematic diagram that copper pipe is placed in the porous ceramics template of through hole（Support shuttering with through-hole structure）
Fig. 2 is stainless steel or ceramic intermediolateral column be put into after structure, cupric oxide powder will inject simultaneously jolt ramming in its gap（By oxygen
Change the high porosity sintering copper pipe structure sketch that copper powder is made）
Embodiment
The diameter 4 of normal miniature heat pipe, 5,6,8,10,16mm, according to the thickness requirement of liquid-sucking core, respectively from different straight
Footpath stainless steel or aluminium oxide ceramics intermediolateral column, after copper pipe cuts and is cleaned and dried, are placed on the support shuttering shown in Fig. 1, template
Using the porous ceramic plate of perforate, such as porous cordierite, mullite are used as template.
The thickness of high porosity sintered copper according to needed for last, it is determined that the required quantity for adding cupric oxide powder, accurate weighing
Cupric oxide powder is injected in the amount of required cupric oxide powder, the hole between copper pipe and stainless steel or aluminium oxide ceramics intermediolateral column simultaneously
Carry out vibration ramming.Wherein cupric oxide powder can be constituted by following two kinds：
（i）Cupric oxide powder can be the micron order cupric oxide powder composition of similar particle size
（ii）Cupric oxide powder can also be made up of the mixed-powder of millimeter, micron and nanoscale different grain size size
Add after above-mentioned powder, vibration ramming, push it into reduction furnace, stove is fully washed with nitrogen according to Fig. 2 structures
Stove, it is ensured that be subsequently passed through safety during hydrogen-nitrogen mixture gas.The content of hydrogen can be with reducing atmosphere hydrogen nitrogen mixed gas, gaseous mixture
Between 10%-75%.Generally when temperature is more than 500 DEG C, hydrogen nitrogen mixed gas is passed through.Reduction temperature is arrived at 850 DEG C
Between 1050 DEG C, the recovery time, at 20 minutes to 2 hours, cools to room temperature with the furnace after reduction（Practical operation is less than or equal to 80
DEG C i.e. can be taken off）.The sintered copper of high porosity needed for preparing is adjusted for the thickness of liquid-sucking core from 0.15 millimeter to 1.5 millimeters
Section and control.
Subsequently into conventional heat pipe encapsulation and heat dispersion test process.It is to take out intermediolateral column first, detects oxidized copper
Whether the high hole sintered copper after reduction meets requirement in position in heat pipe, because due to gravity in the reduction process of cupric oxide powder
Effect, the height of the sintered copper of actual high porosity has a small amount of decline.Detection is met after requirement, carries out the protective atmosphere of lower end
Under friction soldering.Upper end is subsequently carried out after drawing necking down, is carried out vacuum pumping liquid injection, is then encapsulated soldering.The number of reservoir quantity
It is the amount of liquid medium needed for being calculated according to the amount of the porosity of high porosity sintered copper.This completes by cupric oxide powder
The manufacturing process of the high hole sintered copper heat pipe of round shape sintered through high temperature reduction.
The processes such as the Bending Deformation needed for follow-up manufacture method are similar with the Bending Deformation of normal sintering copper heat pipe.
High hole is made by reduction sintering process by millimeter, micron, nano oxidized copper powder the invention provides one kind
Rate sintered porous copper is the manufacturing method of thermotube of liquid-sucking core, after measured its Qmax（Heat radiation power）Raising and the heat of liquid backflow
Resistance is decreased obviously, and phase transformation circulation rate is accelerated, and meets the quick heat radiating requirement needed for electronic equipment.Preparation method letter of the present invention
Single, easy to operate, equipment is simple, and production process is pollution-free, good product quality（Product purity is high, structure-controllable）, production efficiency
Height, production cost is low, is adapted to industrialized production.
Instantiation
Instantiation of the invention described further below, is sintered using the reduction of cupric oxide powder, prepares the high hole of 0.5 millimeters thick
Gap rate sintered copper is the heat pipe of liquid-sucking core.
(1) according to selected a diameter of 6 or 8 millimeters, the copper pipe that wall thickness is 0.3 millimeter,
(2) after being cleaned and dried, insert porous cordierite template, it is ensured that perpendicular positioning, be then put into not according to positioning method
Become rusty steel or aluminium oxide ceramics intermediolateral column；
(3) from the cupric oxide powder of a diameter of 50-60 microns, require to count according to heat pipe length and sintering copper thickness etc.
Calculate, the quantity of the cupric oxide powder needed for weighing, by the above method, the desired amount of cupric oxide powder is injected in copper pipe and stainless steel
Studding gap and vibration ramming.
I) after injection cupric oxide powder, generally in pine dress, through vibration ramming
Ii) it is compacted after injection cupric oxide powder after vibration ramming using 3-5 air pressure
(4) it is transferred in the reduction sintering furnace of hydrogen nitrogen mixed gas atmosphere and carries out thermomechanical aging, hydrogen nitrogen mixing ratio is 75 ~ 10%（Hydrogen
Gas）：（25-90%（Nitrogen）, firing rate is 15-20 DEG C/minute, and 1 hour is incubated to 950 DEG C；
(5) and then according to conventional heat pipe welded, vacuumize with water filling method for packing be prepared for high porosity sintering it is many
Hole copper is liquid-sucking core heat pipe：
I) through pine dress jolt ramming, 950 DEG C is sintered in by the reduction under hydrogen nitrogen reducing atmosphere and is kept for 1 hour, room is furnace-cooled to
Temperature, its analysis of porosity reaches 70-72%；
ii）Copper oxide particle through pine dress jolt ramming suitably pressurizes, and pressure is 3-5 atmospheric pressure, and it uses same heat
Mechanical treatment technique, its porosity reaches 65-67%.
Follow-up encapsulation fluid injection forming process is also similar as the heat pipe of liquid-sucking core with normal sintering copper with as above.
Reservoir quantity needs to be calculated according to the amount of the sintered copper of high hole.
Obtained above two high porosity sintered copper is the round shape heat pipe of liquid-sucking core, with being directly sintered with copper powder
Sintered copper is compared for the heat pipe of liquid-sucking core, and Qmax is obviously improved after tested.Show high porosity sintering prepared by reductive copper oxide
Copper has high efficiency and heat radiation effect for the heat pipe of liquid-sucking core.
Claims (3)
1. a kind of method that the micro heat pipe that high porosity sintered copper is liquid-sucking core is prepared by the reduction sintering of cupric oxide powder,
The Mixed adjustment particulate interspaces of the cupric oxide powder using cupric oxide powder particulate interspaces and using different grain size size are characterized in,
To aoxidize the porosity and pore size of the sintered porous copper formed after copper reduction needed for controlling, high porosity and aperture is utilized to become
Change the capillarity produced and realize the Rapid Circulation of medium phase transition process in heat pipe, substantially reduce medium condensation end of heat pipe by
Vapour turns the thermal resistance during the liquid quick backflow after liquid, improves radiating efficiency；
Its preparation process includes：(1) copper pipe is cleaned and dried；(2) it is placed in die clamper and positions and be put into intermediolateral column, is then injected into oxygen
Change copper powders and jolt ramming；(3) reduction sintering；(4) one end welding, one end necking down processing；(5) vacuumize water filling and encapsulate；(6) circle
Shape properties of hot pipe is detected；(7) bending and deformation shaping；(8) radiating effect analysis detection；
The reduction sintering process uses hydrogen in hydrogen-nitrogen mixture gas, the hydrogen-nitrogen mixture gas：Nitrogen ratio is 75%-10%：
25%-90%；The temperature of sintering is reduced at 850 DEG C to 1050 DEG C, firing rate is 15~20 DEG C/min, reduces sintering time
At 20 minutes to 2 hours, it is adjusted, is pressed from 0.15 millimeter to 1.5 millimeters according to prepared high porosity sintering copper thickness
According to above-mentioned time range, during thickness of thin, reduction sintering time suitably shortens, when thickness is thick, reduces sintering time proper extension.
2. the reduction of cupric oxide powder as claimed in claim 1 sinters to prepare the miniature heat that high porosity sintered copper is liquid-sucking core
The method of pipe, it is characterised in that the porosity for the high porosity sintered copper that cupric oxide powder is formed after reduction sintering can be up to
60-80%.
3. the reduction of cupric oxide powder as claimed in claim 1 sinters to prepare the miniature heat that high porosity sintered copper is liquid-sucking core
The method of pipe, it is characterised in that the cupric oxide powder mixing of variable grain size, forms the pore size of high porosity sintered copper
Alterable and regulation so that medium capillarity in hole clearly, accelerates the circulation rate after the phase transformation of medium, significantly
Thermal resistance of the medium in the quick backflow process after the condensation end of heat pipe is converted into liquid is reduced, radiating efficiency is improved.
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| CN201410002957.XA CN104759627B (en) | 2014-01-03 | 2014-01-03 | A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder |
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| CN201410002957.XA CN104759627B (en) | 2014-01-03 | 2014-01-03 | A kind of method that micro heat pipe is manufactured by reduction-oxidation copper powder |
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| CN104759627B true CN104759627B (en) | 2017-08-29 |
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| CN112719263A (en) * | 2020-12-30 | 2021-04-30 | 北京有研粉末新材料研究院有限公司 | Method for preparing heat pipe liquid absorption core material |
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| CN113245543B (en) * | 2021-07-15 | 2021-10-01 | 江苏集萃先进金属材料研究所有限公司 | Copper powder, preparation method thereof and capillary core prepared from copper powder |
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Effective date of registration: 20220622 Address after: 311231 No. 389, Hongxing Road, Xiaoshan robot Town, economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Liangge Material Co.,Ltd. Address before: 212300 Chuangye Park, Shuangyi Road, Danyang Development Zone, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU GREEN NEW MATERIAL SCIENCE & TECHNOLOGY CO.,LTD. |