CN104755860A - 功率电子器件冷却 - Google Patents
功率电子器件冷却 Download PDFInfo
- Publication number
- CN104755860A CN104755860A CN201380057452.7A CN201380057452A CN104755860A CN 104755860 A CN104755860 A CN 104755860A CN 201380057452 A CN201380057452 A CN 201380057452A CN 104755860 A CN104755860 A CN 104755860A
- Authority
- CN
- China
- Prior art keywords
- evaporation
- fluid
- heat
- cooling
- access road
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title claims abstract description 122
- 238000001704 evaporation Methods 0.000 claims abstract description 397
- 230000008020 evaporation Effects 0.000 claims abstract description 392
- 239000012809 cooling fluid Substances 0.000 claims abstract description 155
- 239000012530 fluid Substances 0.000 claims description 133
- 239000007788 liquid Substances 0.000 claims description 56
- 238000000034 method Methods 0.000 claims description 27
- 239000000463 material Substances 0.000 claims description 10
- 230000007704 transition Effects 0.000 claims description 9
- 238000009835 boiling Methods 0.000 claims description 8
- 238000009833 condensation Methods 0.000 claims description 8
- 230000005494 condensation Effects 0.000 claims description 8
- 239000012071 phase Substances 0.000 description 21
- 238000009834 vaporization Methods 0.000 description 14
- 230000008016 vaporization Effects 0.000 description 14
- 239000002826 coolant Substances 0.000 description 12
- 238000013461 design Methods 0.000 description 7
- 230000005484 gravity Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 7
- 238000009413 insulation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000005219 brazing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 229920006395 saturated elastomer Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 230000002146 bilateral effect Effects 0.000 description 3
- 230000006835 compression Effects 0.000 description 3
- 238000007906 compression Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 239000011810 insulating material Substances 0.000 description 3
- 230000002028 premature Effects 0.000 description 3
- 230000009466 transformation Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 239000004411 aluminium Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000007710 freezing Methods 0.000 description 2
- 230000008014 freezing Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000002269 spontaneous effect Effects 0.000 description 2
- 238000009827 uniform distribution Methods 0.000 description 2
- 238000010792 warming Methods 0.000 description 2
- LVGUZGTVOIAKKC-UHFFFAOYSA-N 1,1,1,2-tetrafluoroethane Chemical compound FCC(F)(F)F LVGUZGTVOIAKKC-UHFFFAOYSA-N 0.000 description 1
- CVOFKRWYWCSDMA-UHFFFAOYSA-N 2-chloro-n-(2,6-diethylphenyl)-n-(methoxymethyl)acetamide;2,6-dinitro-n,n-dipropyl-4-(trifluoromethyl)aniline Chemical compound CCC1=CC=CC(CC)=C1N(COC)C(=O)CCl.CCCN(CCC)C1=C([N+]([O-])=O)C=C(C(F)(F)F)C=C1[N+]([O-])=O CVOFKRWYWCSDMA-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- -1 and afterwards Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000010622 cold drawing Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 210000002445 nipple Anatomy 0.000 description 1
- MSSNHSVIGIHOJA-UHFFFAOYSA-N pentafluoropropane Chemical compound FC(F)CC(F)(F)F MSSNHSVIGIHOJA-UHFFFAOYSA-N 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000003507 refrigerant Substances 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B39/00—Evaporators; Condensers
- F25B39/02—Evaporators
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F7/00—Elements not covered by group F28F1/00, F28F3/00 or F28F5/00
- F28F7/02—Blocks traversed by passages for heat-exchange media
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/001—Casings in the form of plate-like arrangements; Frames enclosing a heat exchange core
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
- F28F9/22—Arrangements for directing heat-exchange media into successive compartments, e.g. arrangements of guide plates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
- H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Removal Of Water From Condensation And Defrosting (AREA)
Abstract
Description
Claims (10)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12182709.1 | 2012-09-03 | ||
EP12182709.1A EP2703763A1 (en) | 2012-09-03 | 2012-09-03 | Evaporator with integrated pre-heater for power electronics cooling |
PCT/EP2013/067826 WO2014033173A2 (en) | 2012-09-03 | 2013-08-28 | Power electronics cooling |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104755860A true CN104755860A (zh) | 2015-07-01 |
CN104755860B CN104755860B (zh) | 2017-02-22 |
Family
ID=46762940
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380057452.7A Active CN104755860B (zh) | 2012-09-03 | 2013-08-28 | 功率电子器件冷却 |
Country Status (4)
Country | Link |
---|---|
US (1) | US9618244B2 (zh) |
EP (2) | EP2703763A1 (zh) |
CN (1) | CN104755860B (zh) |
WO (1) | WO2014033173A2 (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105890235A (zh) * | 2016-04-11 | 2016-08-24 | 海信(山东)空调有限公司 | 一种两相流冷却***用干度控制装置及控制方法 |
CN108278916A (zh) * | 2018-01-12 | 2018-07-13 | 中国科学院长春光学精密机械与物理研究所 | 板式环路热管蒸发器 |
CN110888096A (zh) * | 2018-09-10 | 2020-03-17 | 通用电气公司 | 用于低温冷却器热管理的***和方法 |
Families Citing this family (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5883897A (en) * | 1997-04-25 | 1999-03-16 | Motorola, Inc. | Method and apparatus for providing synchronization during transcoder switching in a communication system |
KR101917013B1 (ko) * | 2013-12-13 | 2018-11-08 | 닛본 덴끼 가부시끼가이샤 | 냉매 분배 장치 및 냉각 장치 |
US20170280590A1 (en) * | 2014-08-27 | 2017-09-28 | Nec Corporation | Phase-change cooling device and phase-change cooling method |
JP6605819B2 (ja) * | 2015-03-06 | 2019-11-13 | 株式会社東芝 | 冷却装置 |
US9560790B2 (en) | 2015-05-13 | 2017-01-31 | Toyota Motor Engineering & Manufacturing North America, Inc. | Power electronics cooling system with two-phase cooler |
EP3196586B1 (en) | 2016-01-07 | 2018-09-12 | ABB Schweiz AG | Power-electronic module arrangement |
US10638648B2 (en) | 2016-04-28 | 2020-04-28 | Ge Energy Power Conversion Technology Ltd. | Cooling system with pressure regulation |
US9894815B1 (en) | 2016-08-08 | 2018-02-13 | General Electric Company | Heat removal assembly for use with a power converter |
US10859318B2 (en) * | 2017-02-16 | 2020-12-08 | J R Thermal, LLC | Serial thermosyphon |
US20190115284A1 (en) * | 2017-10-16 | 2019-04-18 | David Herbert Livingston | Cooling device and method for heat-generating components |
WO2019093230A1 (ja) * | 2017-11-07 | 2019-05-16 | 株式会社デンソー | 機器温調装置 |
JP7185420B2 (ja) * | 2018-05-24 | 2022-12-07 | 現代自動車株式会社 | 沸騰冷却装置 |
WO2020011327A1 (en) * | 2018-07-11 | 2020-01-16 | Hb Products A/S | Refrigerant vapour quality measurement for optimized evaporator control and liquid distribution |
JP2020067226A (ja) * | 2018-10-24 | 2020-04-30 | 株式会社デンソー | 温度調整装置 |
JP2020098041A (ja) * | 2018-12-17 | 2020-06-25 | 株式会社デンソー | 機器温調装置 |
EP3931511B1 (en) * | 2019-02-27 | 2023-06-28 | J R Thermal, LLC | Two-orientation condenser for enhanced gravity driven film condensation |
US11990598B1 (en) | 2020-09-10 | 2024-05-21 | Hamfop Technologies LLC | Heat activated multiphase fluid-operated pump for battery temperature control |
US20210219459A1 (en) * | 2021-03-08 | 2021-07-15 | Intel Corporation | Two-phase manifold cold plate for liquid cooling |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1143778A1 (en) * | 2000-04-04 | 2001-10-10 | Thermal Form & Function LLC | Pumped liquid cooling system using a phase change refrigerant |
CN1409589A (zh) * | 2001-09-26 | 2003-04-09 | 穆丹制造公司 | 用于大功率电子设备机柜的模块化冷却***和热总线 |
US20060011326A1 (en) * | 2004-07-15 | 2006-01-19 | Yassour Yuval | Heat-exchanger device and cooling system |
CN101363696A (zh) * | 2008-09-03 | 2009-02-11 | 赵耀华 | 一种用于电子器件冷却的平板热管及其加工工艺 |
EP2431701A1 (en) * | 2009-06-17 | 2012-03-21 | Huawei Technologies Co., Ltd. | Heat dissipation device and radio frequency module with same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3507981A1 (de) * | 1984-03-07 | 1985-10-10 | The Furukawa Electric Co., Ltd., Tokio/Tokyo | Waermetauscher mit getrennt angeordneten verdampfungs-und kondensationszonen |
SE503322C2 (sv) | 1995-03-17 | 1996-05-28 | Ericsson Telefon Ab L M | Kylsystem för elektronik |
US7352580B2 (en) * | 2006-02-14 | 2008-04-01 | Hua-Hsin Tsai | CPU cooler |
ATE554643T1 (de) | 2009-08-05 | 2012-05-15 | Abb Research Ltd | Verdampfer und kühlkreis |
CN102374807A (zh) * | 2010-08-20 | 2012-03-14 | 富准精密工业(深圳)有限公司 | 回路热管 |
-
2012
- 2012-09-03 EP EP12182709.1A patent/EP2703763A1/en not_active Withdrawn
-
2013
- 2013-08-28 CN CN201380057452.7A patent/CN104755860B/zh active Active
- 2013-08-28 WO PCT/EP2013/067826 patent/WO2014033173A2/en active Application Filing
- 2013-08-28 EP EP13753322.0A patent/EP2893273B1/en active Active
-
2015
- 2015-03-03 US US14/636,391 patent/US9618244B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1143778A1 (en) * | 2000-04-04 | 2001-10-10 | Thermal Form & Function LLC | Pumped liquid cooling system using a phase change refrigerant |
CN1409589A (zh) * | 2001-09-26 | 2003-04-09 | 穆丹制造公司 | 用于大功率电子设备机柜的模块化冷却***和热总线 |
US20060011326A1 (en) * | 2004-07-15 | 2006-01-19 | Yassour Yuval | Heat-exchanger device and cooling system |
CN101363696A (zh) * | 2008-09-03 | 2009-02-11 | 赵耀华 | 一种用于电子器件冷却的平板热管及其加工工艺 |
EP2431701A1 (en) * | 2009-06-17 | 2012-03-21 | Huawei Technologies Co., Ltd. | Heat dissipation device and radio frequency module with same |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105890235A (zh) * | 2016-04-11 | 2016-08-24 | 海信(山东)空调有限公司 | 一种两相流冷却***用干度控制装置及控制方法 |
CN108278916A (zh) * | 2018-01-12 | 2018-07-13 | 中国科学院长春光学精密机械与物理研究所 | 板式环路热管蒸发器 |
CN110888096A (zh) * | 2018-09-10 | 2020-03-17 | 通用电气公司 | 用于低温冷却器热管理的***和方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2014033173A2 (en) | 2014-03-06 |
EP2703763A1 (en) | 2014-03-05 |
EP2893273B1 (en) | 2016-05-18 |
EP2893273A2 (en) | 2015-07-15 |
WO2014033173A3 (en) | 2014-07-03 |
US9618244B2 (en) | 2017-04-11 |
US20150241094A1 (en) | 2015-08-27 |
CN104755860B (zh) | 2017-02-22 |
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Effective date of registration: 20180511 Address after: Baden, Switzerland Patentee after: ABB Switzerland Co.,Ltd. Address before: Zurich Patentee before: ABB TECHNOLOGY Ltd. |
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Address after: Swiss Baden Patentee after: Hitachi energy Switzerland AG Address before: Swiss Baden Patentee before: ABB grid Switzerland AG |
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TR01 | Transfer of patent right |
Effective date of registration: 20240124 Address after: Zurich, SUI Patentee after: Hitachi Energy Co.,Ltd. Country or region after: Switzerland Address before: Swiss Baden Patentee before: Hitachi energy Switzerland AG Country or region before: Switzerland |
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