CN104754922A - Radiating device of electronic element - Google Patents
Radiating device of electronic element Download PDFInfo
- Publication number
- CN104754922A CN104754922A CN201510121450.0A CN201510121450A CN104754922A CN 104754922 A CN104754922 A CN 104754922A CN 201510121450 A CN201510121450 A CN 201510121450A CN 104754922 A CN104754922 A CN 104754922A
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- heat sink
- microflute group
- heat
- runner
- dual
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Abstract
The invention provides a radiating device of an electronic element. The radiating device of the electronic element adopts a sealed type active circular heating; a sealing structure is formed through an upper substrate and a microgroove group heat sink; the inner structure of the microgroove group heat sink is that a middle flow way is encircled by two side flow ways, and two side flow ways are interconnected to the bottom part of the middle flow way, and microgroove groups are respectively arranged on the two side flow ways and the middle flow way; upper and lower faces of a lower substrate are respectively bonded with the bottom face of the microgroove group and an electronic element; a cross groove path of the microgroove group heat sink makes the pressure and flowing distributions of cooling mediums more uniform; the downwards impact jet flow makes the heat exchanging efficiency higher.
Description
Technical field
The invention belongs to heat abstractor field, especially a kind of heat abstractor of electronic component.
Background technology
Light-Emitting Diode (Light Emitting Diode, LED) is 21st century competitive novel solid light source.Compared with conventional light source, it has, and long service life, volume are little, consume energy low, the advantage such as reliability is high, response is fast, flexible design, control are flexible.Under the overall background of " energy-conserving and environment-protective, low-carbon economy ", LED, as " forth generation " lighting source, keeps up with the trend of the times, just in the extensive use of multiple fields.But the key factor that restriction LED light source continues to promote is the junction temperature of LED chip.At present, the drive current of power-type LED is up to 1A, this will cause chip internal heat accumulation, cause the series of problems such as the decline of luminous dominant wavelength shift, light extraction efficiency, fluorescent material accelerated ageing and shortening in useful life, Natural Heat Convection of the prior art effectively cannot solve the high junction temperature problem of heater element.
Summary of the invention
For Shortcomings in prior art, the invention provides a kind of heat abstractor of electronic component, adopt microflute group heat sink, the microstructure design of conduit makes it have larger area of dissipation, radiating efficiency is high, stable performance, is suitable as the heat radiation carrier of the such as electronic component that the caloric value such as great power LED headlamp or street lamp is larger.
The present invention realizes above-mentioned technical purpose by following technological means.
A heat abstractor for electronic component, is characterized in that, described device comprises upper substrate and microflute group is heat sink;
Described upper substrate is positioned at the described heat sink top of microflute group, described upper substrate and the heat sink formation hermetically-sealed construction of described microflute group;
Described microflute group is heat sink comprises entrance point, middle part runner, microflute group, dual-side runner, the port of export and coolant;
Described dual-side runner is U-shaped, described dual-side runner surrounds described middle part runner, described entrance point and the described port of export are positioned at the described heat sink two ends of microflute group, described entrance point and described middle part flow passage, described coolant enters described middle part runner by described arrival end, the described port of export and described dual-side flow passage, described coolant to be converged at the described port of export by dual-side runner and flows out;
Described middle part runner is communicated with the bottom of described dual-side runner in described microflute group is heat sink, and described middle part runner and dual-side runner are respectively equipped with microflute group, and described microflute group is made up of parallel conduit.
Further, described device also comprises infrabasal plate, and the material of described infrabasal plate is silicon or heat-conducting metal.
Further, described infrabasal plate and described microflute group heat sink between scribble heat conductive silica gel.
In such scheme, the material that described microflute group is heat sink is Heat Conduction Material.
In such scheme, described coolant is water or ethylene glycol.
In such scheme, the wide and separation of the conduit of described microflute group is and is less than 1mm.
Beneficial effect of the present invention:
(1) microflute group is heat sink takes up room little, and the microstructure design of conduit makes it have larger area of dissipation volume ratio, the high and stable performance of radiating efficiency.
(2) lateral channel that microflute group is heat sink makes the pressure of liquid, flow distribution more even, and downward impact jet flow makes heat exchange efficiency higher.
(3) compared with common microchannel heat sink, inlet channel, two outlet flow can reduce the energy loss of heat eliminating medium when import and export flows.
Accompanying drawing explanation
Fig. 1 is the structure chart of the heat abstractor of electronic component of the present invention.
Fig. 2 is the heat sink structural representation of microflute group of the present invention.
Fig. 3 is Fig. 2 middle section A-A cutaway view.
Fig. 4 is Fig. 3 middle section B-B cutaway view.
Description of reference numerals is as follows: 10. upper substrate, and 20. microflute groups are heat sink, 21. arrival ends, runner in the middle part of in the of 22., 23. microflute groups, 24. side runners, 25. ports of export, 30. infrabasal plates, 40. heat-generating electronic elements.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment, the present invention is further illustrated, but protection scope of the present invention is not limited to this.
The heat abstractor of electronic component as shown in Figure 1, by upper substrate 10, microflute group is heat sink 20, infrabasal plate 30 forms, the shape that microflute group is heat sink is the casing of upper opening, upper substrate 10 is positioned at the heat sink top of microflute group, be fixedly connected with microflute group heat sink 20, form hermetically-sealed construction, microflute group heat sink 20 is played to the effect of sealing and protection; Bondd by heat conductive silica gel between infrabasal plate 30 and heat sink 20 lower surfaces of microflute group, the material of infrabasal plate 30 is silicon or heat-conducting metal, it is the excessive body of delivered heat, heat conductive silica gel can reduce the upper surface of infrabasal plate 30 and the contact heat resistance of heat sink 20 lower surfaces of microflute group, the lower surface laminating heating electronic original part 40 of infrabasal plate 30, the even heat that electronic component 40 sends is distributed in infrabasal plate 30 surface, and by heat conductive silica gel by bottom heat conduction to microflute group heat sink 20, electronic component 40 can be high-power chip or core cpu.
Fig. 2 is the heat sink structural representation of microflute group of the present invention, microflute group is heat sink 20 to be made up of Heat Conduction Material, structure is that U-shaped dual-side runner 24 surrounds middle part runner, entrance point 21 and the port of export 25 are positioned at the two ends of microflute group heat sink 20, entrance point 21 is communicated with middle part runner 22, the port of export 25 is communicated with dual-side runner 24, middle part runner 22 is communicated with the bottom of dual-side runner 24 in microflute group heat sink 20, middle part runner 22 and dual-side runner 24 are respectively equipped with microflute group 23, microflute group 23 is made up of parallel channel, and the wide and separation of conduit is and is less than 1mm.
Fig. 3 is Fig. 2 middle section A-A cutaway view, Fig. 4 is Fig. 3 middle section B-B cutaway view, according to Fig. 3, Fig. 4, the operation principle of the heat abstractor of electronic component of the present invention: the heat that the electronic original part 40 of heating sends conducts to bottom microflute group heat sink 20 via infrabasal plate 30, coolant (water or ethylene glycol) is entered microflute group 23 top of middle part runner 22 under the effect of micropump by entrance point 21, coolant moves downward under the actuating force of micropump and the double action of gravity, because conduit spacing is less, the sectional area of coolant flowing reduces, flow velocity can increase rapidly, form the impact jet flow through microflute group 23, and be divided into the two strands of medium streams in left and right at each microflute bottom even, then flow along conduit direction in foot passage, take away conducting the heat being distributed in heat sink bottom of coming by substrate, microflute group 23 on dual-side runner 24 is overflowed, collect at the port of export 25, finally flow out through the port of export 25, and heat is derived.
Numerical simulation result shows, the heat abstractor of electronic component of the present invention can be used for the heat radiation of the larger heater element of power, ambient temperature 40 DEG C, and liquid-inlet temperature 25 DEG C, when heating power is 100W, the junction temperature of heater element can be controlled within 120 DEG C.
Described embodiment is preferred embodiment of the present invention; but the present invention is not limited to above-mentioned execution mode; when not deviating from flesh and blood of the present invention, any apparent improvement that those skilled in the art can make, replacement or modification all belong to protection scope of the present invention.
Claims (6)
1. a heat abstractor for electronic component, is characterized in that, described device comprises upper substrate (10) and microflute group heat sink (20);
Described upper substrate (10) is positioned at described microflute group heat sink (20) top, and described upper substrate (10) and described microflute group heat sink (20) form hermetically-sealed construction;
Described microflute group is heat sink (20) comprises entrance point (21), middle part runner (22), microflute group (23), dual-side runner (24), the port of export (25) and coolant;
Described dual-side runner (24) is for U-shaped, described dual-side runner (24) surrounds described middle part runner, described entrance point (21) and the described port of export (25) are positioned at described microflute group heat sink (20) two ends, described entrance point (21) is communicated with described middle part runner (22), described coolant enters described middle part runner (22) by described arrival end (21), the described port of export (25) is communicated with described dual-side runner (24), described coolant is converged by dual-side runner (24) at the described port of export (25) and flows out,
Described middle part runner (22) is communicated with the bottom of described dual-side runner (24) in described microflute group heat sink (20), described middle part runner (22) and dual-side runner (24) are respectively equipped with microflute group (23), and described microflute group (23) is made up of parallel conduit.
2. the heat abstractor of electronic component as claimed in claim 1, it is characterized in that, described device also comprises infrabasal plate (30), and the material of described infrabasal plate (30) is silicon or heat-conducting metal.
3. the heat abstractor of electronic component as claimed in claim 2, is characterized in that, scribble heat conductive silica gel between described infrabasal plate (30) and described microflute group heat sink (20).
4. the heat abstractor of electronic component as claimed in claim 1, it is characterized in that, the material that described microflute group is heat sink (20) is Heat Conduction Material.
5. the heat abstractor of electronic component as claimed in claim 1, it is characterized in that, described coolant is water or ethylene glycol.
6. the heat abstractor of electronic component as claimed in claim 1, is characterized in that, the wide and separation of the conduit of described microflute group (23) is and is less than 1mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510121450.0A CN104754922A (en) | 2015-03-19 | 2015-03-19 | Radiating device of electronic element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510121450.0A CN104754922A (en) | 2015-03-19 | 2015-03-19 | Radiating device of electronic element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104754922A true CN104754922A (en) | 2015-07-01 |
Family
ID=53593823
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510121450.0A Pending CN104754922A (en) | 2015-03-19 | 2015-03-19 | Radiating device of electronic element |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104754922A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323092A (en) * | 2017-01-18 | 2018-07-24 | 宇瞻科技股份有限公司 | Liquid cooling header structure with uniform flow path path |
| CN113438872A (en) * | 2021-07-01 | 2021-09-24 | 合肥工业大学 | Jet flow cold plate with gradually-reduced outlet type micro channel |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005745A (en) * | 2006-01-20 | 2007-07-25 | 刘胜 | Micro jet flow cooling system for electronic device |
| CN201365388Y (en) * | 2008-12-30 | 2009-12-16 | 上海大郡自动化***工程有限公司 | Electronic module cooler with base plate heat source |
| CN203242614U (en) * | 2013-05-15 | 2013-10-16 | 中国电子科技集团公司第三十八研究所 | Microfluidic-channel heat dissipation device used for an electronic component and electronic device |
| CN103594430A (en) * | 2013-10-25 | 2014-02-19 | 上海交通大学 | Micro-channel radiator for dissipating heat of power electronic device |
-
2015
- 2015-03-19 CN CN201510121450.0A patent/CN104754922A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101005745A (en) * | 2006-01-20 | 2007-07-25 | 刘胜 | Micro jet flow cooling system for electronic device |
| CN201365388Y (en) * | 2008-12-30 | 2009-12-16 | 上海大郡自动化***工程有限公司 | Electronic module cooler with base plate heat source |
| CN203242614U (en) * | 2013-05-15 | 2013-10-16 | 中国电子科技集团公司第三十八研究所 | Microfluidic-channel heat dissipation device used for an electronic component and electronic device |
| CN103594430A (en) * | 2013-10-25 | 2014-02-19 | 上海交通大学 | Micro-channel radiator for dissipating heat of power electronic device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323092A (en) * | 2017-01-18 | 2018-07-24 | 宇瞻科技股份有限公司 | Liquid cooling header structure with uniform flow path path |
| CN108323092B (en) * | 2017-01-18 | 2019-07-19 | 宇瞻科技股份有限公司 | Liquid cooling header structure with uniform flow path path |
| CN113438872A (en) * | 2021-07-01 | 2021-09-24 | 合肥工业大学 | Jet flow cold plate with gradually-reduced outlet type micro channel |
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Application publication date: 20150701 |