CN104752283A - Chip flip bonding device - Google Patents
Chip flip bonding device Download PDFInfo
- Publication number
- CN104752283A CN104752283A CN201510159819.7A CN201510159819A CN104752283A CN 104752283 A CN104752283 A CN 104752283A CN 201510159819 A CN201510159819 A CN 201510159819A CN 104752283 A CN104752283 A CN 104752283A
- Authority
- CN
- China
- Prior art keywords
- chip
- suction nozzle
- carrier
- wafer carrying
- carrying body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000007246 mechanism Effects 0.000 claims abstract description 39
- 230000033001 locomotion Effects 0.000 claims abstract description 15
- 238000004458 analytical method Methods 0.000 claims description 6
- 238000003384 imaging method Methods 0.000 claims description 6
- 230000007547 defect Effects 0.000 claims description 5
- 238000009434 installation Methods 0.000 claims description 3
- 229920000297 Rayon Polymers 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 abstract 3
- 235000012431 wafers Nutrition 0.000 description 34
- 238000000034 method Methods 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000007306 turnover Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims (7)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510159819.7A CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
PCT/CN2015/081754 WO2016161703A1 (en) | 2015-04-07 | 2015-06-18 | Device for flip-chip mounting chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510159819.7A CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104752283A true CN104752283A (en) | 2015-07-01 |
CN104752283B CN104752283B (en) | 2018-02-13 |
Family
ID=53591772
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510159819.7A Active CN104752283B (en) | 2015-04-07 | 2015-04-07 | Flip-chip device |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN104752283B (en) |
WO (1) | WO2016161703A1 (en) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106783717A (en) * | 2016-12-23 | 2017-05-31 | 合肥矽迈微电子科技有限公司 | Flip-chip patch device and method |
CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
WO2018188731A1 (en) * | 2017-04-11 | 2018-10-18 | Muehlbauer GmbH & Co. KG | Component receiving device with optical sensor |
CN109588036A (en) * | 2018-11-30 | 2019-04-05 | 江门市三兴照明科技有限公司 | A kind of lamp bead mounting device |
WO2019210626A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | Long-distance, accurate and rapid chip loading and unloading device |
CN111739834A (en) * | 2020-04-30 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | Chip flip-chip apparatus, system and method |
TWI709727B (en) * | 2019-08-12 | 2020-11-11 | 京元電子股份有限公司 | Ic chip appearance inspection module |
CN112394030A (en) * | 2019-08-15 | 2021-02-23 | 京元电子股份有限公司 | IC chip appearance inspection module |
CN114062382A (en) * | 2020-08-04 | 2022-02-18 | 深圳中科飞测科技股份有限公司 | Detection system and detection method |
CN114678321A (en) * | 2022-05-27 | 2022-06-28 | 山东睿芯半导体科技有限公司 | Chip mounting device |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进***自动化有限公司 | Flip chip bonder and method therefor |
US20070020801A1 (en) * | 2005-07-20 | 2007-01-25 | Fujitsu Limited | IC chip mounting method |
CN100481318C (en) * | 2004-02-16 | 2009-04-22 | 米尔鲍尔股份公司 | Electronic component testing and rotating device and method |
CN204632732U (en) * | 2015-04-07 | 2015-09-09 | 嘉兴景焱智能装备技术有限公司 | Flip-chip device |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10203601A1 (en) * | 2002-01-30 | 2003-08-14 | Siemens Ag | Chip removal device, chip removal system, placement system and method for removing chips from a wafer |
US6861608B2 (en) * | 2002-05-31 | 2005-03-01 | Texas Instruments Incorporated | Process and system to package residual quantities of wafer level packages |
CH698718B1 (en) * | 2007-01-31 | 2009-10-15 | Oerlikon Assembly Equipment Ag | A device for mounting a flip chip on a substrate. |
CN102201357B (en) * | 2011-04-19 | 2013-04-17 | 上海微松工业自动化有限公司 | Equipment for extracting, turning and setting wafer-level packaged microchip |
-
2015
- 2015-04-07 CN CN201510159819.7A patent/CN104752283B/en active Active
- 2015-06-18 WO PCT/CN2015/081754 patent/WO2016161703A1/en active Application Filing
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1613146A (en) * | 2002-01-07 | 2005-05-04 | 先进***自动化有限公司 | Flip chip bonder and method therefor |
CN100481318C (en) * | 2004-02-16 | 2009-04-22 | 米尔鲍尔股份公司 | Electronic component testing and rotating device and method |
US20070020801A1 (en) * | 2005-07-20 | 2007-01-25 | Fujitsu Limited | IC chip mounting method |
CN204632732U (en) * | 2015-04-07 | 2015-09-09 | 嘉兴景焱智能装备技术有限公司 | Flip-chip device |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106783717A (en) * | 2016-12-23 | 2017-05-31 | 合肥矽迈微电子科技有限公司 | Flip-chip patch device and method |
US11217465B2 (en) | 2017-04-11 | 2022-01-04 | Muehlbauer GmbH & Co. KG | Component receiving device with optical sensor |
WO2018188731A1 (en) * | 2017-04-11 | 2018-10-18 | Muehlbauer GmbH & Co. KG | Component receiving device with optical sensor |
CN108155124A (en) * | 2017-12-25 | 2018-06-12 | 北京中电科电子装备有限公司 | A kind of chip attachment device and method |
WO2019210626A1 (en) * | 2018-05-03 | 2019-11-07 | 苏州艾科瑞思智能装备股份有限公司 | Long-distance, accurate and rapid chip loading and unloading device |
CN110444498A (en) * | 2018-05-03 | 2019-11-12 | 苏州艾科瑞思智能装备股份有限公司 | A kind of long range precisely quickly takes cored sheet devices |
CN109588036A (en) * | 2018-11-30 | 2019-04-05 | 江门市三兴照明科技有限公司 | A kind of lamp bead mounting device |
TWI709727B (en) * | 2019-08-12 | 2020-11-11 | 京元電子股份有限公司 | Ic chip appearance inspection module |
CN112394030A (en) * | 2019-08-15 | 2021-02-23 | 京元电子股份有限公司 | IC chip appearance inspection module |
CN111739834A (en) * | 2020-04-30 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | Chip flip-chip apparatus, system and method |
CN114062382A (en) * | 2020-08-04 | 2022-02-18 | 深圳中科飞测科技股份有限公司 | Detection system and detection method |
CN114678321A (en) * | 2022-05-27 | 2022-06-28 | 山东睿芯半导体科技有限公司 | Chip mounting device |
CN114678321B (en) * | 2022-05-27 | 2022-08-23 | 山东睿芯半导体科技有限公司 | Chip mounting device |
Also Published As
Publication number | Publication date |
---|---|
CN104752283B (en) | 2018-02-13 |
WO2016161703A1 (en) | 2016-10-13 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chip flip chip device Effective date of registration: 20230526 Granted publication date: 20180213 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
|
PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20180213 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2023980041808 |
|
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Chip flip device Granted publication date: 20180213 Pledgee: Shanghai Rural Commercial Bank Co.,Ltd. Zhejiang Yangtze River Delta Integrated Demonstration Zone Sub branch Pledgor: JIAXING JINGYAN INTELLIGENT EQUIPMENT TECHNOLOGY Co.,Ltd. Registration number: Y2024980018023 |