TWI566308B - High accuracy die bonding apparatus with high yield - Google Patents
High accuracy die bonding apparatus with high yield Download PDFInfo
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Description
本發明係一種高產出之高精度晶片接合裝置，其提供一種能夠多段傳送晶粒，並完成高精度與高產出黏合晶粒的裝置。 The present invention is a high-output, high-precision wafer bonding apparatus that provides a device capable of transferring crystal grains in multiple stages and accomplishing high-precision and high-output bonding of crystal grains.
近年半導體製程的發展已日趨成熟，現有IC為了縮小體積與降低成本並提高性能，不斷地在2D IC的概念下縮小IC電路的線距，但當IC線距已經發展到20奈米以下的製程，既有的發展方向已逐漸出現了瓶頸，為了突破即有IC性能的限制，3D IC的發展成為新的趨勢，然3D IC的製程中，最關鍵與重要的製程之一為高精度的晶粒黏合，而最常應用的即為高精度的覆晶接合技術。 In recent years, the development of semiconductor processes has become increasingly mature. In order to reduce the size, reduce the cost and improve the performance, existing ICs continue to reduce the line pitch of IC circuits under the concept of 2D IC, but when the IC line distance has been developed to below 20 nm process The existing development direction has gradually emerged as a bottleneck. In order to break through the limitations of IC performance, the development of 3D IC has become a new trend. However, one of the most critical and important processes in the process of 3D IC is high-precision crystal. Particle bonding, and the most commonly used is the high-precision flip chip bonding technology.
現今的覆晶製程，其係切割一晶圓(Wafer)，以形成複數個晶粒(Die)，再將該些晶粒予以翻轉，並經一黏晶(Die Bond)的步驟，以使晶粒黏附於一基板。 In today's flip chip process, a wafer is cut to form a plurality of wafers, and the grains are flipped and subjected to a Die Bond step to crystallize The particles adhere to a substrate.
然於黏晶的步驟中，一黏晶機的吸取模組係吸取位於一晶圓(Wafer)或晶粒盤(Die Tray)之晶粒，並將晶粒移動至一沾膠模組，以使晶粒沾附有黏劑，再將已具有黏劑之晶粒移動至一基板處，再由視覺定位模組進行定位並放下晶粒，以使晶粒黏附於基板，而後吸取模組再由另一路徑或循原路徑回至晶粒盤的上方，以再次吸取晶粒。這種製程安排無法兼顧高精度與高產能的需求，且只限於對晶片必需翻面而進行高精度對位與接合的覆晶應用． In the step of bonding the crystal, the suction module of the die bonding machine sucks the die on a wafer or a die (Die Tray), and moves the die to a glue module to The die is adhered with an adhesive, and the die having the adhesive is moved to a substrate, and then the positioning module is positioned and the die is lowered to adhere the die to the substrate, and then the module is sucked again. Returning to the upper side of the die disc by another path or the original path to pick up the die again. This process arrangement cannot meet the requirements of high precision and high throughput, and is limited to flip chip applications where the wafer must be turned over for high-precision alignment and bonding.
但現今仍未有廠商思考提出一種分段式黏晶模式，其係藉由多段式的流程，以對應以將多個晶粒同時或順序沾膠，而沾膠的晶粒係能及時進行黏附，而且可以兼顧對於非覆晶應用，將晶片 以正面做高精度的壓合的對策，也因此造成3D IC黏晶發展的瓶頸所在。 However, there is still no manufacturer thinking about a segmented die-bonding mode. The multi-stage process is used to simultaneously or sequentially glue multiple grains, and the bonded die can be adhered in time. And can be balanced for non-reclaping applications, wafers The high-precision press-fitting measures on the front side also cause bottlenecks in the development of 3D IC slime.
承上所述，現有黏晶的步驟中無法突破的主要瓶頸之一係為沾膠，因沾膠會造成吸取模組於該步驟中產生停滯的情況，而無形中造成製程的困擾，而且吸取模組於黏晶與吸晶的行進路徑過於冗長，影響生產效率．主要瓶頸之二是在於對於覆晶與非覆晶的應用轉換不具有彈性，所以現有的黏晶機仍有尚待進步的空間。 As mentioned above, one of the main bottlenecks that cannot be broken in the existing steps of the die-bonding process is glued, because the glue will cause the suction module to stagnate in this step, and the process is inconveniently caused, and the suction is taken. The travel path of the module in the die-bonding and absorbing crystals is too long and affects the production efficiency. The second bottleneck is that there is no flexibility for the application of flip chip and non-clad, so the existing die bonder still has room for improvement.
鑑於上述之缺點，本發明之目的在於提供一種高產出之高精度晶片接合裝置，其能夠克服製程的困擾，並能保持黏晶作業之流暢度，以將黏晶製程分段化，而使沾膠與黏附的動作得以同時進行，藉以提升黏晶速度以及提升機台的彈性與生產效率；特別是本發明係利用於一轉承台作為晶粒(晶片)的中繼站，配合一翻轉機構，使機台能夠彈性並對應覆晶與非覆晶的高精度晶粒接合應用。 In view of the above disadvantages, the object of the present invention is to provide a high-output, high-precision wafer bonding apparatus capable of overcoming the troubles of the process and maintaining the smoothness of the die bonding operation to segment the die bonding process. The action of sticking and sticking can be carried out at the same time, thereby increasing the speed of the bonding and increasing the elasticity and production efficiency of the machine; in particular, the invention utilizes a rotating platform as a relay station of the die (wafer), together with a turning mechanism, The machine is capable of elasticity and corresponds to high-precision die bonding applications of flip chip and non-clad.
為了達到上述之目的，本發明之技術手段在於提供一種高產出之高精度晶片接合裝置，其係用於黏附至少一晶粒，該晶片接合裝置包含有：一可供至少一晶粒設置的供應模組；一可承接該至少一晶粒的承接模組，其係設於該供應模組的一側；一旋轉模組，其係設於該供應模組與該承接模組之間；一轉承台，其係設於該供應模組與該旋轉模組之間；一第一取放模組，其設於該供應模組的上方，並於該供應模組與該轉承台之間移動；以及至少二第二取放模組，其係設於該旋轉模組。 In order to achieve the above object, the technical means of the present invention is to provide a high-output high-precision wafer bonding apparatus for adhering at least one die, the wafer bonding apparatus comprising: one for at least one die a supply module; a receiving module that can receive the at least one die, which is disposed on one side of the supply module; and a rotating module that is disposed between the supply module and the receiving module; a turntable, which is disposed between the supply module and the rotary module; a first pick and place module disposed above the supply module, and the supply module and the turntable Moving between; and at least two second pick-and-place modules are disposed in the rotating module.
綜合上述，本發明係運用旋轉模組，以使晶粒於沾膠時得以保持相當的流暢度，並且各晶粒於沾膠過程中不會相互阻礙。 In summary, the present invention utilizes a rotating module to maintain a relatively smooth flow of the die during gluing, and the individual dies do not interfere with one another during the gluing process.
另外，本發明係運用轉承台，以當作晶粒由供應模組至承接 模組之間的中繼站，並使用多個取放模組，故各取放模組僅具有較短的行進路徑，藉此使得黏晶機具有彈性。 In addition, the present invention utilizes a transfer table to serve as a die from a supply module to a receiving The relay station between the modules uses a plurality of pick-and-place modules, so each pick-and-place module has only a short travel path, thereby making the die bonder elastic.
10‧‧‧供應模組 10‧‧‧Supply module
11‧‧‧第一取放模組 11‧‧‧First pick and place module
12‧‧‧轉承台 12‧‧‧Transfer platform
13‧‧‧旋轉模組 13‧‧‧Rotary Module
14‧‧‧第二取放模組 14‧‧‧Second pick and place module
15‧‧‧沾膠模組 15‧‧‧ glued module
16‧‧‧承接模組 16‧‧‧Receiving modules
17‧‧‧第三視覺定位模組 17‧‧‧ Third Visual Positioning Module
18‧‧‧第二視覺定位模組 18‧‧‧Second Visual Positioning Module
19‧‧‧第一視覺定位模組 19‧‧‧First Vision Positioning Module
20‧‧‧晶粒 20‧‧‧ grain
21‧‧‧光源單元 21‧‧‧Light source unit
30‧‧‧供應模組 30‧‧‧Supply module
31‧‧‧第一取放模組 31‧‧‧First pick and place module
32‧‧‧翻轉模組 32‧‧‧Flip module
33‧‧‧轉承台 33‧‧‧Transfer platform
34‧‧‧旋轉模組 34‧‧‧Rotary Module
35‧‧‧第二取放模組 35‧‧‧Second pick and place module
36‧‧‧沾膠模組 36‧‧‧ glued module
37‧‧‧承接模組 37‧‧‧Accept module
38‧‧‧第三視覺定位模組 38‧‧‧ Third Vision Positioning Module
39‧‧‧第二視覺定位模組 39‧‧‧Second Visual Positioning Module
40‧‧‧第一視覺定位模組 40‧‧‧First Vision Positioning Module
41‧‧‧光源單元 41‧‧‧Light source unit
50‧‧‧晶粒 50‧‧‧ grain
60‧‧‧承接模組 60‧‧‧Accept module
70‧‧‧視覺定位模組 70‧‧‧Visual Positioning Module
71‧‧‧鏡射單元 71‧‧‧Mirror unit
72‧‧‧晶粒 72‧‧‧ grain
80‧‧‧上下視覺定位模組 80‧‧‧Up and down visual positioning module
81‧‧‧攝像單元 81‧‧‧ camera unit
82‧‧‧第一導鏡 82‧‧‧First Guide
83‧‧‧第二導鏡 83‧‧‧second mirror
10A‧‧‧供應模組 10A‧‧‧Supply Module
11A‧‧‧第一取放模組 11A‧‧‧First pick and place module
12A‧‧‧轉承台 12A‧‧‧Return platform
13A‧‧‧旋轉模組 13A‧‧‧Rotary Module
14A‧‧‧第二取放模組 14A‧‧‧Second pick and place module
15A‧‧‧沾膠模組 15A‧‧‧ glued module
16A‧‧‧承接模組 16A‧‧‧Receiving modules
17A‧‧‧第三視覺定位模組 17A‧‧‧ Third Vision Positioning Module
18A‧‧‧第二視覺定位模組 18A‧‧‧Second Visual Positioning Module
19A‧‧‧第一視覺定位模組 19A‧‧‧First Vision Positioning Module
20A‧‧‧晶粒 20A‧‧‧ grain
21A‧‧‧光源單元 21A‧‧‧Light source unit
30A‧‧‧供應模組 30A‧‧‧Supply Module
31A‧‧‧第一取放模組 31A‧‧‧First pick and place module
32A‧‧‧翻轉模組 32A‧‧‧Flip Module
33A‧‧‧轉承台 33A‧‧‧Return platform
34A‧‧‧旋轉模組 34A‧‧‧Rotary Module
35A‧‧‧第二取放模組 35A‧‧‧Second pick-and-place module
36A‧‧‧沾膠模組 36A‧‧‧ glued module
37A‧‧‧承接模組 37A‧‧‧Receiving modules
38A‧‧‧第三一視覺定位模組 38A‧‧‧The third visual positioning module
39A‧‧‧第二視覺定位模組 39A‧‧‧Second Visual Positioning Module
40A‧‧‧第一視覺定位模組 40A‧‧‧First Vision Positioning Module
41A‧‧‧光源單元 41A‧‧‧Light source unit
50A‧‧‧晶粒 50A‧‧‧ grain
圖1為本發明之一種高產出之高精度晶片接合裝置之第一實施例之局部俯視示意圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a partial top plan view of a first embodiment of a high throughput, high precision wafer bonding apparatus of the present invention.
圖2為本發明之高產出之高精度晶片接合裝置之第一實施例之動作示意圖。 2 is a schematic view showing the operation of the first embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖3為本發明之高產出之高精度晶片接合裝置之第二實施例之局部俯視示意圖。 3 is a partial top plan view of a second embodiment of a high throughput, high precision wafer bonding apparatus of the present invention.
圖4為本發明之高產出之高精度晶片接合裝置之第二實施例之動作示意圖。 4 is a schematic view showing the operation of the second embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖5為本發明之高產出之高精度晶片接合裝置之第三實施例之動作示意圖。 Figure 5 is a schematic view showing the operation of the third embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖6為本發明之高產出之高精度晶片接合裝置之第四實施例之動作示意圖。 Figure 6 is a schematic view showing the operation of the fourth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖7為本發明之高產出之高精度晶片接合裝置之第五實施例之動作示意圖。 Figure 7 is a schematic view showing the operation of the fifth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖8為本發明之高產出之高精度晶片接合裝置之第六實施例之動作示意圖。 Figure 8 is a schematic view showing the operation of the sixth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖9為本發明之高產出之高精度晶片接合裝置之第七實施例之局部動作示意圖。 Figure 9 is a partial schematic view showing the seventh embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖10為本發明之高產出之高精度晶片接合裝置之第八實施例之局部動作示意圖。 Figure 10 is a partial schematic view showing the eighth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖11為本發明之高產出之高精度晶片接合裝置之第九實施例之局部動作示意圖。 Figure 11 is a partial schematic view showing the ninth embodiment of the high-output high-precision wafer bonding apparatus of the present invention.
圖12為一視覺定位模組之示意圖。 12 is a schematic diagram of a visual positioning module.
圖13為一上下視覺定位模組之立體示意圖。 Figure 13 is a perspective view of a top and bottom visual positioning module.
以下係藉由特定的具體實施例說明本發明之實施方式，所屬技術領域中具有通常知識者可由本說明書所揭示之內容，輕易地 瞭解本發明之其他優點與功效。 The embodiments of the present invention are described below by way of specific embodiments, and those skilled in the art can easily disclose the contents disclosed in the present specification. Other advantages and effects of the present invention are understood.
請配合參考圖1及2所示，本發明係一種高產出之高精度晶片接合裝置之第一實施例，其具有一供應模組10、一第一取放模組11、一轉承台12、一旋轉模組13、至少二第二取放模組14、一沾膠模組15、一承接模組16、一第三視覺定位模組17、一第二視覺定位模組18、一第一視覺定位模組19與一光源單元21。 Referring to FIG. 1 and FIG. 2, the present invention is a high-output high-precision wafer bonding apparatus. The first embodiment has a supply module 10, a first pick-and-place module 11, and a turntable. 12, a rotating module 13, at least two second pick-and-place module 14, a glue module 15, a receiving module 16, a third visual positioning module 17, a second visual positioning module 18, a The first visual positioning module 19 and a light source unit 21 are provided.
如圖一及二所示，供應模組10係供複數個晶粒20設置。 As shown in FIGS. 1 and 2, the supply module 10 is provided for a plurality of crystal grains 20.
承接模組16係設於供應模組10的一側，以承接來自供應模組10的晶粒20。 The receiving module 16 is disposed on one side of the supply module 10 to receive the die 20 from the supply module 10.
旋轉模組13係設於供應模組10與承接模組16之間。 The rotary module 13 is disposed between the supply module 10 and the receiving module 16 .
轉承台12係設於供應模組10與旋轉模組13之間。 The turntable 12 is disposed between the supply module 10 and the rotating module 13.
第一取放模組11係設於供應模組10的上方，並於供應模組16與轉承台12之間移動，第一取放模組11能夠具有一真空吸力與一氣壓推力。 The first pick-and-place module 11 is disposed above the supply module 10 and moves between the supply module 16 and the rotating platform 12 . The first pick-and-place module 11 can have a vacuum suction force and a pneumatic pressure thrust.
至少二第二取放模組14係設於旋轉模組13。 At least two second pick-and-place modules 14 are disposed on the rotating module 13 .
沾膠模組15係設於旋轉模組13的下方。 The glue module 15 is disposed below the rotary module 13 .
第三視覺定位模組17係設於供應模組10的上方。 The third visual positioning module 17 is disposed above the supply module 10 .
第二視覺定位模組18係設於轉承台12的上方。 The second visual positioning module 18 is disposed above the rotation platform 12 .
第一視覺定位模組19係設於承接模組16的上方。 The first visual positioning module 19 is disposed above the receiving module 16 .
光源單元21係能夠移動地設於第一視覺定位模組19與承接模組16之間，即光源單元21係位於承接模組16的上方。 The light source unit 21 is movably disposed between the first visual positioning module 19 and the receiving module 16 , that is, the light source unit 21 is located above the receiving module 16 .
第三視覺定位模組17擷取位於供應模組10之晶粒20的影像，第一取放模組11依據該影像的資訊，以吸取欲被吸取的晶粒20，並將所吸取的晶粒移動至轉承台12。 The third visual positioning module 17 captures the image of the die 20 located in the supply module 10. The first pick-and-place module 11 absorbs the die 20 to be sucked according to the information of the image, and absorbs the crystal. The pellets are moved to the transfer table 12.
第二視覺定位模組18擷取位於轉承台12之晶粒20的影像，旋轉模組13依據該影像的資訊，而將第二取放模組14移動至欲被吸取的晶粒20的上方，以吸取晶粒20，待第二取放模組14吸取晶粒20後，旋轉模組13則轉動一角度，以將晶粒20移動至沾膠模組15，以使晶粒20沾附有黏劑，同時，另一第二取放模組14係被旋轉模組13移動至轉承台12的上方，以便於吸取另一待 吸取的晶粒20。 The second visual positioning module 18 captures the image of the die 20 located at the turntable 12, and the rotation module 13 moves the second pick and place module 14 to the die 20 to be sucked according to the information of the image. The die 20 is sucked up, and after the second pick-and-place module 14 picks up the die 20, the rotating module 13 is rotated by an angle to move the die 20 to the glue module 15 to make the die 20 The adhesive is attached, and the other second pick-and-place module 14 is moved by the rotating module 13 to the top of the rotating platform 12, so as to absorb another waiting The die 20 is sucked.
承上所述，旋轉模組13持續轉動，以將已沾附有黏劑之晶粒20移動至承接模組16的上方，以及將另一晶粒20移至沾膠模組15。 As described above, the rotary module 13 is continuously rotated to move the die 20 with the adhesive adhered to the upper portion of the receiving module 16 and to move the other die 20 to the adhesive module 15.
第一視覺定位模組19係能夠提高晶粒20與承接模組16之間定位的精準度，藉此使得黏晶作業的精度較佳，而且第一視覺定位模組19於對位晶粒20與承接模組16時，第一視覺定位模組19的視野係得以穿透晶粒20，以拍攝位於晶粒20另一面之記號，藉此提升定位的精準度，另外，第三視覺定位模組17與第二視覺定位模組18的視野亦可以依必要性穿透晶粒20，以拍攝位於晶粒20另一面之記號。 The first visual positioning module 19 can improve the positioning accuracy between the die 20 and the receiving module 16 , thereby making the precision of the die bonding operation better, and the first visual positioning module 19 is in the alignment die 20 . When the module 16 is received, the field of view of the first visual positioning module 19 can penetrate the die 20 to capture the mark on the other side of the die 20, thereby improving the positioning accuracy. In addition, the third visual positioning mode The fields of view of the group 17 and the second visual positioning module 18 can also penetrate the die 20 as necessary to capture the indicia on the other side of the die 20.
光源單元21係移動至第一視覺定位模組19與承接模組16之間，該移動係為上下且左右移動，當光源單元21係移動至第一視覺定位模組19下方時，光源單元21能夠照亮晶粒20與承接模組16，而使第一視覺定位模組19更能清楚地得到二者影像，並進行對位，待對位後，則進行黏合的動作。 The light source unit 21 is moved between the first visual positioning module 19 and the receiving module 16, and the movement is up and down and moving left and right. When the light source unit 21 is moved below the first visual positioning module 19, the light source unit 21 The die 20 and the receiving module 16 can be illuminated, so that the first visual positioning module 19 can more clearly obtain the images of the two, and perform the alignment. After the alignment, the bonding operation is performed.
如上所述，第三視覺定位模組17係能夠垂直取像與對位供應模組10的一面與晶粒20，第二視覺定位模組18係能夠垂直取像與對位轉承台12的一面與晶粒20，第一視覺定位模組19係能夠垂直取像與對位承接模組16的一面與晶粒20。 As described above, the third visual positioning module 17 is capable of vertically capturing the image and the one side of the alignment supply module 10 and the die 20, and the second visual positioning module 18 is capable of vertically capturing the image and the alignment bearing table 12. The first visual positioning module 19 can vertically take the image and the one side of the alignment receiving module 16 and the die 20 on one side and the die 20 .
請配合參考圖3與圖4所示，本發明係一種提升黏合率之高產出之高精度晶片接合裝置之第二實施例，其具有一供應模組30、一第一取放模組31、一選擇性的翻轉模組32、一轉承台33、一旋轉模組34、至少二第二取放模組35、一沾膠模組36、一承接模組37、一第三視覺定位模組38、一第二視覺定位模組39、一第一視覺定位模組40與一光源單元41。 Referring to FIG. 3 and FIG. 4 , the present invention is a high-output high-precision wafer bonding apparatus with improved adhesion ratio, which has a supply module 30 and a first pick-and-place module 31. a selective flipping module 32, a rotating platform 33, a rotating module 34, at least two second pick-and-place modules 35, a glue module 36, a receiving module 37, and a third visual positioning The module 38, a second visual positioning module 39, a first visual positioning module 40 and a light source unit 41.
如第一實施例所述，供應模組30、第一取放模組31、轉承台33、旋轉模組34、第二取放模組35、沾膠模組36、承接模組37、第三視覺定位模組38、第二視覺定位模組39、第一視覺定位模組40與光源單元41的設置方式、位置與動作皆同第一實施例，故不 多贅述。 As shown in the first embodiment, the supply module 30, the first pick-and-place module 31, the turntable 33, the rotating module 34, the second pick-and-place module 35, the glue module 36, the receiving module 37, The arrangement, position and action of the third visual positioning module 38, the second visual positioning module 39, the first visual positioning module 40 and the light source unit 41 are the same as the first embodiment, so More details.
於本實施例中，翻轉模組32係設於供應模組30與轉承台33之間，翻轉模組32具有一翻轉且能夠吸取晶粒的功能，當第一取放模組31吸取位於供應模組30之晶粒50後，並移動至翻轉模組32，第一取放模組31會將晶粒交接給翻轉模組32轉承台33，翻轉模組32會晶粒將第一取放模組31轉動一角度，舉例而言，該角度能夠為0~360度中之任一角度，但不限制，較佳為0~180度中之任一角度，經過轉動後的晶粒50則被放置於轉承台33，如第一實施例，晶粒50係會經沾膠模組36的沾膠與放置於承接模組37。 In this embodiment, the inverting module 32 is disposed between the supply module 30 and the rotating platform 33. The inverting module 32 has a function of flipping and sucking the die. When the first pick-and-place module 31 is sucked and located After the die 50 of the module 30 is supplied, and moved to the flip module 32, the first pick-and-place module 31 will transfer the die to the flip module 32, and the flip module 32 will be the first die. The pick-and-place module 31 is rotated by an angle. For example, the angle can be any one of 0 to 360 degrees, but is not limited, and is preferably any one of 0 to 180 degrees. 50 is placed on the transfer table 33. As in the first embodiment, the die 50 is adhered to the receiving module 37 via the glue module 36.
請配合參考圖5所示，本發明係一種高產出之高精度晶片接合裝置之第三實施例，其近似上述之第二實施例，故元件符號沿用第二實施例。 Referring to FIG. 5, the present invention is a third embodiment of a high-output high-precision wafer bonding apparatus which is similar to the second embodiment described above, so that the component symbols follow the second embodiment.
於本實施例中，翻轉模組32係設於旋轉模組34與轉承台33之間。 In the embodiment, the inversion module 32 is disposed between the rotating module 34 and the rotating platform 33.
當第一取放模組31吸取位於供應模組30之晶粒50後，並將晶粒50放置於轉承台33，翻轉模組32吸取位於轉承台33的晶粒50，並翻轉晶粒50，第二取放模組35則會吸取位於翻轉模組32之晶粒，並將晶粒進行沾膠與黏合之動作。 After the first pick-and-place module 31 picks up the die 50 located in the supply module 30 and places the die 50 on the turntable 33, the flip module 32 sucks the die 50 located on the turntable 33 and flips the crystal The granule 50 and the second pick-and-place module 35 pick up the dies of the flip module 32 and glue and bond the dies.
請配合參考圖6所示，本發明之第四實施例，其為本發明之第一實施例的進一步衍生，故元件符號沿用第一實施例。 Referring to FIG. 6, a fourth embodiment of the present invention is further derived from the first embodiment of the present invention, so that the component symbols follow the first embodiment.
另一供應模組10係設於承接模組16的另一側。 The other supply module 10 is disposed on the other side of the receiving module 16 .
另一旋轉模組13係設於另一供應模組10與承接模組16之間。 The other rotating module 13 is disposed between the other supply module 10 and the receiving module 16 .
另一第一取放模組11係設於另一供應模組10的上方。 The other first pick-and-place module 11 is disposed above the other supply module 10 .
另至少二第二取放模組14係設於另一旋轉模組13。 The other at least two second pick-and-place modules 14 are disposed on the other rotating module 13 .
另一沾膠模組15係設於另一旋轉模組13的下方。 The other glue module 15 is disposed below the other rotating module 13 .
另一第三視覺定位模組17係設於另一供應模組10的上方。 The other third visual positioning module 17 is disposed above the other supply module 10.
另一第二視覺定位模組18係設於另一轉承台12的上方。 Another second visual positioning module 18 is disposed above the other pivoting platform 12 .
另一第一視覺定位模組19係設於承接模組上方。 The other first visual positioning module 19 is disposed above the receiving module.
上述之供應模組10、第二視覺定位模組18、第三視覺定位模 組16、第一取放模組11、旋轉模組13與沾膠模組15的作動已於第一實施例中論述，故不在此贅述，本實施例係說明於承接模組16的另一側能夠再設置至少一供應模組10、至少一第二視覺定位模組18、至少二第二取放模組14、至少一第三視覺定位模組16、至少一第一取放模組11、至少一旋轉模組13與至少一沾膠模組15，藉由增加供應模組10、第一取放模組11、旋轉模組13與第二取放模組14的數量以及第一視覺定位模組19，以提升晶粒傳輸之產能。然兩個第一視覺定位模組19可依必要整合以一個第一視覺定位模組19替代。 The above supply module 10, the second visual positioning module 18, and the third visual positioning module The operation of the group 16 , the first pick-and-place module 11 , the rotating module 13 and the glue module 15 has been discussed in the first embodiment, and therefore will not be described here. This embodiment is described in another example of the receiving module 16 . At least one supply module 10, at least one second visual positioning module 18, at least two second pick-and-place modules 14, at least one third visual positioning module 16, and at least one first pick-and-place module 11 can be further disposed on the side. At least one rotating module 13 and at least one glue module 15 by increasing the number of the supply module 10, the first pick-and-place module 11, the rotating module 13 and the second pick-and-place module 14, and the first vision The module 19 is positioned to increase the throughput of the die transfer. However, the two first visual positioning modules 19 can be integrated with a first visual positioning module 19 as necessary.
請配合參考圖7所示，本發明之第五實施例，其為本發明之第二實施例的進一步衍生，該高產出之高精度晶片接合裝置具有一供應模組10A、二第一取放模組11A、二轉承台12A、二旋轉模組13A、至少二第二取放模組14A、二沾膠模組15A、二承接模組16A、一第三視覺定位模組17A、二第二視覺定位模組18A、二第一視覺定位模組19與二光源單元21A。 Referring to FIG. 7 , a fifth embodiment of the present invention is further derived from the second embodiment of the present invention. The high-output high-precision wafer bonding apparatus has a supply module 10A and a first take-up. The module 11A, the second rotating platform 12A, the two rotating modules 13A, the at least two second pick-and-place modules 14A, the two-dipped module 15A, the second receiving module 16A, a third visual positioning module 17A, two The second visual positioning module 18A, the two first visual positioning modules 19 and the two light source units 21A.
供應模組10A的頂端具有至少一晶粒20A。 The top end of the supply module 10A has at least one die 20A.
二第一取放模組11A係分別設於供應模組10A的上方，如圖7所示，一第一取方模組11A係位於供應模組10A上方的右邊，或一側，另一第一取方模組11A係位於供應模組10A上方的右邊，或另一側，該左、右邊或一側與另一側僅便於論述與理解本案，而非限制。 The first pick-and-place module 11A is respectively disposed above the supply module 10A. As shown in FIG. 7, a first take-off module 11A is located on the right side of the supply module 10A, or one side, and the other A snap module 11A is located on the right side above the supply module 10A, or the other side, and the left, right or side and the other side are only for ease of discussion and understanding of the present invention, and are not limiting.
二承接模組16A係分別位於供應模組10A的兩側，如上所述，一承接模組16A係位於供應模組10A的一側。另一承接模組16A係位於供應模組10A的另一側。 The two receiving modules 16A are respectively located on both sides of the supply module 10A. As described above, a receiving module 16A is located on one side of the supply module 10A. The other receiving module 16A is located on the other side of the supply module 10A.
一旋轉模組13A係位於供應模組10A與一承接模組16A之間。另一旋轉模組係位於供應模組10A與另一承接模組16A之間。 A rotating module 13A is located between the supply module 10A and a receiving module 16A. Another rotating module is located between the supply module 10A and another receiving module 16A.
至少二第二取放模組14A係設於旋轉模組13A。另一至少二第二取放模組係設於另一旋轉模組13A。 At least two second pick-and-place modules 14A are coupled to the rotating module 13A. The other at least two second pick-and-place modules are disposed on the other rotating module 13A.
沾膠模組15A係設於旋轉模組13A的下方。另一沾膠模組15A係設於另一旋轉模組13A的下方。 The glue module 15A is disposed below the rotary module 13A. The other glue module 15A is disposed below the other rotation module 13A.
第三視覺定位模組17A係設於供應模組10A的上方。 The third visual positioning module 17A is disposed above the supply module 10A.
第二視覺定位模組18A係設於轉承台12A的上方。另一第二視覺定位模組18A係設於另一轉承台12A的上方。 The second visual positioning module 18A is disposed above the turntable 12A. The other second visual positioning module 18A is disposed above the other revolving table 12A.
第一視覺定位模組19A係設於承接模組16A的上方。另一第一視覺定位模組19A係設於另一承接模組16A的上方。 The first visual positioning module 19A is disposed above the receiving module 16A. The other first visual positioning module 19A is disposed above the other receiving module 16A.
光源單元21A係能夠移動地設於第一視覺定位模組19A與承接模組16A之間。另一光源單元21A係能夠移動地設於另一第一視覺定位模組19A與另一承接模組16A之間。 The light source unit 21A is movably disposed between the first visual positioning module 19A and the receiving module 16A. The other light source unit 21A is movably disposed between the other first visual positioning module 19A and the other receiving module 16A.
供應模組10A、第一取放模組11A、轉承台12A、旋轉模組13A、第二取放模組14A、沾膠模組15A、承接模組16A、第三視覺定位模組17A、第二視覺定位模組18A、第一視覺定位模組19與光源單元21A之間的作動關係如上所述，故不多贅述。 The supply module 10A, the first pick-and-place module 11A, the turntable 12A, the rotating module 13A, the second pick-and-place module 14A, the glue module 15A, the receiving module 16A, the third visual positioning module 17A, The relationship between the second visual positioning module 18A, the first visual positioning module 19 and the light source unit 21A is as described above, and therefore will not be described again.
請配合參考圖8所示，本發明之第六實施例，其為本發明之第二實施例的進一步衍生，如同上述之第四實施例，於承接模組37的另一側依序設有另一旋轉模組34、另至少二第二取放模組35、另一沾膠模組36、另一第二視覺定位模組39、另一第一視覺定位模組40、另一翻轉模組32、另一轉承台33、另一供應模組30、另一第一取放模組31與另一第三視覺定位模組38。如上所述，二第一視覺定位模組40能夠整合為一單一第一視覺定位模組40。 Referring to FIG. 8 , a sixth embodiment of the present invention is further derived from the second embodiment of the present invention. As in the fourth embodiment, the other side of the receiving module 37 is sequentially disposed. Another rotating module 34, another at least two second pick-and-place modules 35, another glue module 36, another second vision positioning module 39, another first vision positioning module 40, and another flip mode The group 32, another transfer platform 33, another supply module 30, another first pick-and-place module 31 and another third visual positioning module 38. As described above, the two first visual positioning modules 40 can be integrated into a single first visual positioning module 40.
請配合參考圖9所示，本發明之第七實施例，其為本發明之第三實施例的進一步衍生，如上述之第五實施例，於本實施例中，另一轉承台33與另一翻轉模組32係不同於第五實施例，另一翻轉模組32係設於另一轉承台33與另一旋轉模組34之間。 Referring to FIG. 9 , a seventh embodiment of the present invention is further derived from the third embodiment of the present invention. As in the fifth embodiment described above, in the present embodiment, another rotating platform 33 is The other inverting module 32 is different from the fifth embodiment, and the other inverting module 32 is disposed between the other rotating platform 33 and the other rotating module 34.
如圖6、8及9所示，其係分別揭露有二第一視覺定位模組係位於承接模組的上方，如上所述，該二第一視覺定位模組係能夠整合為單一第一視覺定位模組。多個第一視覺定位模組的用意在於配合多個旋轉模組與設於旋轉模組之第二取放模組。 As shown in FIGS. 6, 8 and 9, respectively, two first visual positioning modules are disposed above the receiving module. As described above, the two first visual positioning modules can be integrated into a single first visual. Positioning module. The plurality of first visual positioning modules are intended to cooperate with a plurality of rotating modules and a second pick-and-place module disposed in the rotating module.
請配合參考圖10所示，本發明之第八實施例，其為本發明之第二實施例的進一步衍生，供應模組30A、晶粒50A、第一取放 模組31A、轉承台33A、旋轉模組34A、第二取放模組35A、沾膠模組36A、承接模組37A、第三視覺定位模組38A、第二視覺定位模組39A、第一視覺定位模組40A與光源單元41A的設置方式如上述之圖7所論述的內容。於本實施例中，一翻轉模組32係設於轉承台33A與供應模組30A之間。另一番轉模組32A係設於另一轉承台33A與供應模組30A之間。 Referring to FIG. 10, an eighth embodiment of the present invention is further derived from the second embodiment of the present invention. The supply module 30A, the die 50A, and the first pick and place are provided. The module 31A, the rotating platform 33A, the rotating module 34A, the second pick-and-place module 35A, the glue module 36A, the receiving module 37A, the third visual positioning module 38A, the second visual positioning module 39A, The arrangement of a visual positioning module 40A and the light source unit 41A is as discussed above in FIG. In this embodiment, a flip module 32 is disposed between the turntable 33A and the supply module 30A. The other transfer module 32A is disposed between the other transfer table 33A and the supply module 30A.
請配合參考圖11所示，本發明之第八實施例，其為本發明之第二實施例的進一步衍生，其與上述之第七實施例的差異在於，一翻轉模組32係設於轉承台33A與旋轉模組34A之間。另一番轉模組32A係設於另一轉承台33A與另一旋轉模組34A之間。於本實施例中所有元件係等同上述之第七實施例，除設置位置略有不同，故元件符號係沿用圖10。 Referring to FIG. 11 , an eighth embodiment of the present invention is further derived from the second embodiment of the present invention. The difference from the seventh embodiment is that a flip module 32 is set in the turn. Between the cap 33A and the rotating module 34A. The other transfer module 32A is disposed between the other transfer table 33A and the other rotary module 34A. In the present embodiment, all the components are equivalent to the seventh embodiment described above, and the component symbols are similar to those in FIG. 10 except that the setting positions are slightly different.
請配合圖12所示，一視覺定位模組70係能夠移動地設於承接模組60的上方，即視覺定位模組70係位於承接模組60與取放模組之間，一鏡射單元71係設於承接模組60的上方，並且相鄰於移動至承接模組60的上方之視覺定位模組70。 As shown in FIG. 12 , a visual positioning module 70 is movably disposed above the receiving module 60 , that is, the visual positioning module 70 is located between the receiving module 60 and the pick-and-place module, and a mirror unit The 71 is disposed above the receiving module 60 and adjacent to the visual positioning module 70 that moves to the upper of the receiving module 60.
視覺定位模組70係能夠選擇性擷取承接模組60的一面之影像，視覺定位模組70係能夠擷取位於取放模組之晶粒72的影像，或者同時擷取位於取放模組之晶粒72與承接模組60的一面之影像，或者視覺定位模組70僅擷取承接模組60的一面之影像。 The visual positioning module 70 is capable of selectively capturing images of one side of the receiving module 60. The visual positioning module 70 is capable of capturing an image of the die 72 located in the pick-and-place module, or simultaneously capturing the pick-and-place module. The image of the die 72 and one side of the module 60 is received, or the visual positioning module 70 captures only an image of one side of the receiving module 60.
若進一步說明上述之論述，當一晶粒72移動至承接模組60的上方時，視覺定位模組70係朝向承接模組60的上方移動，鏡射單元71將晶粒72朝向承接模組60的一面的影像反射給視覺定位模組70，以供視覺定位模組70擷取該影像，即擷取位於該面的晶粒72之記號，以提高黏晶的準確度，或者鏡射單元71將承接模組60的一面的影像反射給視覺定位模組70，以供視覺定位模組70擷取該影像，該擷像能夠同時進行或分別進行，以提高定位準確度，待定位確認後，視覺定位模組70即退出承接模組60的上方，以進行黏晶的動作。 If the above description is further described, when a die 72 is moved over the receiving module 60, the visual positioning module 70 moves toward the upper side of the receiving module 60, and the mirror unit 71 directs the die 72 toward the receiving module 60. The image of one side is reflected to the visual positioning module 70 for the visual positioning module 70 to capture the image, that is, the mark of the die 72 located on the surface is taken to improve the accuracy of the die, or the mirror unit 71 The image of one side of the receiving module 60 is reflected to the visual positioning module 70 for the visual positioning module 70 to capture the image, and the image can be simultaneously or separately performed to improve the positioning accuracy. The visual positioning module 70 exits the upper portion of the receiving module 60 to perform a die-bonding operation.
請配合參考圖13所示，如圖12所述之視覺定位模組70與鏡 射單元71能夠被一上下視覺定位模組80所取代。 Please refer to FIG. 13 for the visual positioning module 70 and the mirror as shown in FIG. The firing unit 71 can be replaced by a top and bottom visual positioning module 80.
上下視覺定位模組80係能夠移動地設於承接模組的上方，即上下視覺定位模組80係位於承接模組與取放模組之間，上下視覺定位模組80具有二攝像單元81、複數個第一導鏡82與復數個第二導鏡83，第二導鏡83係設於第一導鏡82的一側，第一導鏡82係設於各攝像單元81的一端，各攝像單元81係分別透過第一導鏡82與第二導鏡83，以擷取上下影像。該上影像為位於取放模組之晶粒的影像，該下影像為承接模組的一面的影像，或者位於承接模組之晶粒的影像。 The upper and lower visual positioning module 80 is movably disposed above the receiving module, that is, the upper and lower visual positioning module 80 is located between the receiving module and the pick-and-place module, and the upper and lower visual positioning module 80 has two camera units 81, A plurality of first guiding mirrors 82 and a plurality of second guiding mirrors 83 are disposed on one side of the first guiding mirror 82, and the first guiding mirrors 82 are disposed at one end of each of the imaging units 81, and each of the imaging units The unit 81 passes through the first guiding mirror 82 and the second guiding mirror 83 respectively to capture the upper and lower images. The upper image is an image of a die located in the pick-and-place module, and the lower image is an image of one side of the receiving module or an image of a die of the receiving module.
綜合上述，當晶粒由供應模組移至承接模組時，晶粒係將轉承台當為一中繼站，所以各取放模組能夠於一較短的行程中往復行進，以將晶粒由一站移至另一站，直至晶粒置放或黏附於承接模組37，而使黏晶製程較有彈性。 In summary, when the die is moved from the supply module to the receiving module, the die system acts as a relay station, so each pick-and-place module can reciprocate in a short stroke to Moving from one station to another until the die is placed or adhered to the receiving module 37, the die bonding process is more flexible.
本發明進一步應用旋轉模組配合多個吸取模組，已將多個晶粒依序沾膠，並且置放或黏設，藉以保持沾膠時的流暢度。 The invention further applies the rotating module to the plurality of suction modules, and the plurality of crystal grains are sequentially glued and placed or glued to maintain the smoothness of the glue.
另外，本發明所應用的視覺定位模組的視野可以穿透晶粒，以拍攝位於晶粒另一面之記號，即第一至第一視覺定位模組能夠拍攝位於晶粒另一面之記號，藉以使得晶粒的定位更加精準。 In addition, the visual field of the visual positioning module to which the present invention is applied can penetrate the die to capture the mark on the other side of the die, that is, the first to first visual positioning modules can capture the mark on the other side of the die, thereby Make the positioning of the crystals more precise.
第三視覺定位模組係能夠垂直取像與對位供應模組的一面與晶粒。 The third visual positioning module is capable of vertically taking an image and a side of the alignment supply module and the die.
第二視覺定位模組係能夠垂直取像與對位轉承台的一面與晶粒。 The second visual positioning module is capable of vertically taking an image and a side of the alignment bearing table and the die.
第一視覺定位模組係能夠垂直取像與對位承接模組的一面與晶粒。 The first visual positioning module is capable of vertically taking an image and a face and a die of the alignment receiving module.
再者，上述之第二實施例所述之翻轉模組為一選擇性的構件，即裝設有翻轉模組時，其能夠縮短第一取放模組移動至轉承台的距離，以增加第一取放模組移動速度，藉此能夠吸取較多的晶粒，而且翻轉晶粒的目的在於因不同的製程，晶粒所需沾膠的位置可能有所不同，故藉由翻轉模組，以將晶粒翻轉至所需要的位置與角度。 Furthermore, the inverting module described in the second embodiment is an optional component, that is, when the inverting module is installed, the distance between the first pick-and-place module and the rotating platform can be shortened to increase The first pick-and-place module moves at a speed, thereby being able to absorb a large number of dies, and the purpose of flipping the dies is that the positions of the sizing of the dies may be different due to different processes, so by flipping the module To flip the die to the desired position and angle.
再一，轉承台的目的係應製程的彈性，而產生的設計，如第一實施例所述，當晶粒不需要覆晶製程時，第一取放模組將晶粒直接放置於轉承台，第二取放模組再將晶粒由轉承台取出。 Furthermore, the purpose of the transfer table is to resilience of the process, and the resulting design, as described in the first embodiment, when the die does not require a flip chip process, the first pick-and-place module places the die directly on the turn The cap and the second pick-and-place module then take the die out of the turntable.
再二，若晶粒需要覆晶製程時，如第二實施例所述，第一取放模組將晶粒交給翻轉模組，翻轉模組翻轉晶粒，再將晶粒放置於轉承台，第二取放模組再將晶粒由轉承台取出，以進行黏晶程序。 Secondly, if the die needs a flip chip process, as described in the second embodiment, the first pick-and-place module feeds the die to the flip module, the flip module flips the die, and then places the die in the turn-around The second pick-and-place module removes the die from the turntable for the die bonding process.
再三，如第三實施例所述，第一取放模組將晶粒直接放置於轉承台，翻轉模組由轉承台吸取晶粒，並翻轉晶粒，第二取放模組吸取已翻轉的晶粒，以進行黏晶程序。 Further, as described in the third embodiment, the first pick-and-place module directly places the die on the turntable, the flipping module sucks the die from the turntable, and flips the die, and the second pick and place module sucks Flip the grain to perform the die bonding process.
再四，如第四、五與六實施例所述，供應模組、第二視覺定位模組、第二取放模組、第三視覺定位模組、第一取放模組、旋轉模組與沾膠模組的數量係能夠增加，以提升晶粒傳輸之產能。 Fourthly, as described in the fourth, fifth and sixth embodiments, the supply module, the second visual positioning module, the second pick-and-place module, the third visual positioning module, the first pick-and-place module, and the rotating module The number of adhesive modules can be increased to increase the throughput of die transfer.
以上所述之具體實施例，僅係用於例釋本發明之特點及功效，而非用於限定本發明之可實施範疇，於未脫離本發明上揭之精神與技術範疇下，任何運用本發明所揭示內容而完成之等效改變及修飾，均仍應為下述之申請專利範圍所涵蓋。 The specific embodiments described above are only used to exemplify the features and functions of the present invention, and are not intended to limit the scope of the present invention, and may be used without departing from the spirit and scope of the invention. Equivalent changes and modifications made to the disclosure of the invention are still covered by the scope of the following claims.
10‧‧‧供應模組 10‧‧‧Supply module
11‧‧‧第一取放模組 11‧‧‧First pick and place module
12‧‧‧轉承台 12‧‧‧Transfer platform
13‧‧‧旋轉模組 13‧‧‧Rotary Module
14‧‧‧第二取放模組 14‧‧‧Second pick and place module
15‧‧‧沾膠模組 15‧‧‧ glued module
16‧‧‧承接模組 16‧‧‧Receiving modules
17‧‧‧第三視覺定位模組 17‧‧‧ Third Visual Positioning Module
18‧‧‧第二視覺定位模組 18‧‧‧Second Visual Positioning Module
19‧‧‧第一視覺定位模組 19‧‧‧First Vision Positioning Module
20‧‧‧晶粒 20‧‧‧ grain
21‧‧‧光源單元 21‧‧‧Light source unit
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| TW102140775A TWI566308B (en) | 2013-11-08 | 2013-11-08 | High accuracy die bonding apparatus with high yield |
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| TW201519332A TW201519332A (en) | 2015-05-16 |
| TWI566308B true TWI566308B (en) | 2017-01-11 |
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| TWI700234B (en) * | 2019-08-30 | 2020-08-01 | 均華精密工業股份有限公司 | Die selecting apparatus |
| CN113299577A (en) * | 2020-02-21 | 2021-08-24 | 均华精密工业股份有限公司 | Die bonder |
| TWI722801B (en) * | 2020-02-21 | 2021-03-21 | 均華精密工業股份有限公司 | Die bonder |
| TWI738238B (en) * | 2020-03-04 | 2021-09-01 | 均華精密工業股份有限公司 | High productivity die bonding apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW514961B (en) * | 2000-03-10 | 2002-12-21 | Toray Eng Co Ltd | Chip mounting apparatus and alignment method of the apparatus |
| JP2007012802A (en) * | 2005-06-29 | 2007-01-18 | Toray Eng Co Ltd | Mounting method and mounting device |
| TW201120978A (en) * | 2009-12-04 | 2011-06-16 | Top Eng Co Ltd | LED chip bonding apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW514961B (en) * | 2000-03-10 | 2002-12-21 | Toray Eng Co Ltd | Chip mounting apparatus and alignment method of the apparatus |
| JP2007012802A (en) * | 2005-06-29 | 2007-01-18 | Toray Eng Co Ltd | Mounting method and mounting device |
| TW201120978A (en) * | 2009-12-04 | 2011-06-16 | Top Eng Co Ltd | LED chip bonding apparatus |
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