CN104718619A - Multiple die face-down stacking for two or more die - Google Patents

Multiple die face-down stacking for two or more die Download PDF

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Publication number
CN104718619A
CN104718619A CN201380051357.6A CN201380051357A CN104718619A CN 104718619 A CN104718619 A CN 104718619A CN 201380051357 A CN201380051357 A CN 201380051357A CN 104718619 A CN104718619 A CN 104718619A
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China
Prior art keywords
opening
microelectronic element
terminal
edge
substrate
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Pending
Application number
CN201380051357.6A
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Chinese (zh)
Inventor
贝尔加桑·哈巴
韦勒·佐尼
理查德·德威特·克里斯普
伊利亚斯·***
弗兰克·兰布雷希特
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Adeia Semiconductor Solutions LLC
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Tessera LLC
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Publication date
Priority claimed from US13/741,890 external-priority patent/US9013033B2/en
Application filed by Tessera LLC filed Critical Tessera LLC
Publication of CN104718619A publication Critical patent/CN104718619A/en
Pending legal-status Critical Current

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Abstract

A microelectronic assembly (100) can include a substrate (102) having first and second surfaces (104, 106) each extending in first and second transverse directions D1, D2, a peripheral edge (3) extending in the second direction, first and second openings (116, 126) extending between the first and second surfaces, and a peripheral region P1 of the second surface extending between the peripheral edge and one of the openings. The assembly (100) can also include a first microelectronic element (136) having an edge (146) extending between front and rear surfaces (140, 138) thereof and a second microelectronic element (153) having a front surface (157) facing the rear surface of the first microelectronic element and projecting beyond the edge. The assembly (100) can also include a plurality of terminals (110) exposed at the second surface (106), at least one of the terminals (110a) being disposed at least partially within the peripheral region P1.

Description

Many nude films upside-down mounting for two or more nude films is stacking
The cross reference of related application
The application is the application number submitted on January 15th, 2013 is 13/741, the continuation application of the U.S. Patent application of 890, application number is 13/741, the U.S. Patent application of 890 is the application numbers submitted on August 2nd, 2012 is 13/565, the continuation application of the U.S. Patent application of 613, application number is 13/565, the U.S. Patent application of 613 is the application numbers submitted on November 29th, 2011 is 13/306, the part continuation application of the U.S. Patent application of 300, application number is 13/306, the application number that the U.S. Patent application of 300 requires on April 21st, 2011 to submit to is 61/477, the rights and interests of the applying date of the U.S. Provisional Patent Application of 877, the disclosure of above-mentioned patent application is incorporated to herein hereby by reference.The application below owned together is incorporated to herein hereby by reference: the application number that on April 21st, 2011 submits to is 61/477,820,61/477,883 and 61/477, the U.S. Provisional Patent Application of 967.
Background of invention
The present invention relates to micromodule and its manufacture method of the stacked semiconductor chips comprising flip-chip oriented.
Semiconductor chip is arranged in a package usually, and this encapsulation is convenient to during manufacture and chip is installed to external substrate (such as circuit board or other circuit boards) period process chip.Such as, many semiconductor chips are arranged in the encapsulation being suitable for installing on surface.Propose the encapsulation of a large amount of this general type for various application.Modal, this encapsulation comprises substrate, is commonly referred to as " chip carrier ", and terminal is formed as the metal structure of plating on medium or etching.These terminals are typically via feature (such as along the thin trace that chip carrier self extends) and the contact being connected to chip self by the meticulous lead-in wire that extends between the contact of chip and terminal or trace or line.In surface mounting operation, encapsulation is placed on circuit boards, so that each terminal in encapsulation aligns to the corresponding contact weld pad on circuit board.Solder or other bonding materials are set between terminal and contact weld pad.By heating component with melting or " backflow " solder or otherwise activated bond material can bonding be in position by encapsulating for good and all.
Many encapsulation comprise the solder bump of solder ball (typically diameter is about 0.1mm and about 0.8mm (5 and 30 the mil)) form of the terminal being attached to encapsulation.The encapsulation with the solder ball array given prominence to from its basal surface is commonly referred to as ball grid array or " BGA " encapsulation.Be called that other encapsulation that Land grid array or " LGA " encapsulate are fastened to substrate by the thin layer that formed by solder or welding zone.Such encapsulation can be quite compact.Some being commonly referred to as " wafer-level package " encapsulates the area of circuit board taken and to equal or only slightly larger than the area of the device of inserting in encapsulation.This is favourable, because which reduce the overall dimensions of assembly and allow to use the short interconnection between the various devices on substrate, this in turn limits the signal propagation time between device, is convenient to the high speed operation of assembly thus.
Also need to produce and demonstrate and the total height of the plane orthogonal of circuit board or the little chip package of size.This thin microelectronics Packaging allows the circuit board with the encapsulation be arranged on wherein to be placed as very close to proximity structure, produces the overall size comprising the product of circuit board thus.The various suggestions for arranging multiple chip in single package or module are proposed.In " multi-chip module " of routine, chip is arranged on single package substrate side by side, and this substrate can be mounted to circuit board again.The method merely provides the limited reduction of the gross area taken by chip of circuit board.This gross area is still greater than the total surface area of each chip in module.
Also multiple chip package has been proposed to arrange in (that is, wherein multiple chip is placed as a layout on another) " stacking ".In stacked arrangement, multiple chip can be arranged in the region of the circuit board less than the gross area of chip.Such as, at above-mentioned U.S. Patent No. 5,679,977, No.5,148,265 and U.S. Patent No. 5,347,159 some embodiments in, disclose some stacked chip arrangements, the disclosure of above-mentioned United States Patent (USP) is incorporated to herein by reference.U.S. Patent No. 4,941,033 discloses a kind of layout, wherein chip-stacked be one by the conductor on so-called " the wiring film " that be associated with chip interconnected amongst one another on another, this United States Patent (USP) is also incorporated to herein by reference.
Although carried out these effort in the art, when the multi-chip package of the chip for having the contact be located substantially in chip center region, need further to improve.Some semiconductor chips (such as some storage chips) are generally fabricated as in a line or two row of locating at the central axis substantially along chip contact.
Summary of the invention
According to an aspect of the present invention, a kind of micromodule can comprise: substrate, and described substrate has: relative first surface and second surface, and each first direction at traversed by described first surface and described second surface and second direction extend; Periphery edge, described periphery edge extends in this second direction between described first surface and described second surface; First opening and the second opening, described first opening and described second opening extend between described first surface and described second surface; With the neighboring area of described second surface, extend between the opening in described periphery edge and described first opening and described second opening of the described neighboring area of described second surface.Each in described first opening and described second opening can have the elongated first size and second size in this second direction shorter than described first size that extend in said first direction.
Described micromodule can also comprise the first microelectronic element, and described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of described first register and the edge that extends between described front surface and described rear surface.Described micromodule can also comprise the second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of described second register.
Described micromodule can also comprise multiple terminal, and described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element.Described multiple terminal may be used at least one parts described micromodule being connected to described micromodule outside.At least one terminal in described multiple terminal can be at least partially disposed in described neighboring area, make to extend in said first direction and through at least one terminal described pass straight through at least one opening in described first opening and described second opening or at least one overthe openings in described first opening and described second opening.
In one example, described periphery edge can be the first periphery edge, and described neighboring area can be the first neighboring area, and at least one terminal described in described multiple terminal can be the first terminal.Described substrate can have the second periphery edge that is relative with described first periphery edge and that extend between described first surface and described second surface in this second direction.Described substrate can have the second week edge regions of the described second surface extended between the described opening in described second periphery edge and described first opening and described second opening.At least one terminal in described multiple terminal can be the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in said first direction and through described second terminal pass straight through at least one opening in described first opening and described second opening or at least one overthe openings in described first opening and described second opening.
In certain embodiments, described neighboring area can be the first neighboring area, and the described opening in described first opening and described second opening can be described first opening, and at least one terminal described in described multiple terminal can be the first terminal.Described substrate can have the second week edge regions of the described second surface extended between described periphery edge and described second opening.At least one terminal in described multiple terminal can be the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in said first direction and through described second terminal pass straight through described second opening or through described second overthe openings.
In the exemplary embodiment, described periphery edge can be the first periphery edge, described substrate can have the second periphery edge that is relative with described first periphery edge and that extend between described first surface and described second surface in this second direction, and described substrate can have in described second periphery edge and the 3rd neighboring area of described second surface extended between corresponding described first opening and described second opening and 4th week edge regions.At least one terminal in described multiple terminal can be the 3rd terminal, described 3rd terminal is at least partially disposed in described 3rd neighboring area, make to extend in said first direction and through described 3rd terminal pass straight through described first opening or through described first overthe openings.At least one terminal in described multiple terminal can be the 4th terminal, described 4th terminal is at least partially disposed in described 4th week edge regions, make to extend in said first direction and through described 4th terminal pass straight through described second opening or through described second overthe openings.
In one embodiment, the described bonding welding pad of described first microelectronic element and described second microelectronic element can be electrically connected to the conducting element of described substrate.In specific example, the described bonding welding pad of described first microelectronic element can be electrically connected to described conducting element by having to go between with first of the part of described first register, and the described bonding welding pad of described second microelectronic element can be electrically connected to described conducting element by having to go between with second of the part of described second register.In one example, at least one in following situation: described first lead-in wire can not extend through described first opening, or described second lead-in wire can not extend through described second opening.In certain embodiments, the described bonding welding pad of described first microelectronic element can be electrically connected to described conducting element by extend through the first bonding wire of described first opening, and the described bonding welding pad of described second microelectronic element can be electrically connected to described conducting element by extend through the second bonding wire of described second opening.In one embodiment, described first bonding wire can extend through only described first opening, and described second bonding wire can extend through only described second opening.
In specific example, the described edge of described first microelectronic element can be the first edge, and described first microelectronic element can have second edge relative with described first edge.Described second microelectronic element can have the first relative edge and the second edge.Each microelectronic element can have at least one row bonding welding pad, described at least one row bonding welding pad has five or more described bonding welding pads, and described at least one row bonding welding pad extends in said first direction in the central area of the described front surface of described each micromodule.Each central area can extend the centre 1/3rd of the distance between corresponding described first edge and described second edge.In one embodiment, each microelectronic element active device for providing memory array function that number ratio can be equipped with to provide the active device of any other function many.In the exemplary embodiment, described first microelectronic element can have at the described front surface of described first microelectronic element and the width between the described edge extended between described rear surface and relative edge, and described second microelectronic element can have at the described front surface of described second microelectronic element and the width between the relative edge extended between described rear surface.The described width of described first microelectronic element can be greater than described second size of described first opening, and the described width of described second microelectronic element can be greater than described second size of described second opening.
In one embodiment, one in described first opening and described second opening can extend to than another position closer to described periphery edge in described first opening and described second opening.In specific example, described substrate can have the 3rd opening and the 4th opening that extend between described first surface and described second surface, and each in described 3rd opening and described 4th opening has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction.Described micromodule can also comprise the 3rd microelectronic element and the 4th microelectronic element, each microelectronic element in described 3rd microelectronic element and described 4th microelectronic element has the front surface of the described first surface towards described substrate, each microelectronic element in described 3rd microelectronic element and described 4th microelectronic element have at the front surface place of described each microelectronic element and with the bonding welding pad of corresponding described 3rd opening or described 4th register.The described bonding welding pad of described 3rd microelectronic element and described 4th microelectronic element can be electrically connected to the conducting element of described substrate.In one example, described substrate can also be included in the hole extended between the inherent described first surface in described neighboring area and described second surface.Described hole may be used for allowing sealant or underfill to flow through described hole.
According to another aspect of the present invention, a kind of micromodule can comprise: substrate, described substrate has: relative first surface and second surface, and each first direction at traversed by described first surface and described second surface and second direction extend; Periphery edge, described periphery edge extends in this second direction between described first surface and described second surface; First opening and the second opening, described first opening and described second opening extend between described first surface and described second surface, and described first opening is between described second opening and described periphery edge; With the neighboring area of described second surface, the described neighboring area of described second surface extends between described periphery edge and described first opening.Described first opening can have the elongated first size and second size in this second direction shorter than described first size that extend in said first direction.Described second opening can have the elongated first size and second size in said first direction shorter than described first size that extend in this second direction.
Described micromodule can also comprise the first microelectronic element, and described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of described first register and the edge that extends between described front surface and described rear surface.Described micromodule can also comprise the second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of described second register.
Described micromodule can also comprise multiple terminal, and described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element.Described multiple terminal may be used at least one parts described micromodule being connected to described micromodule outside.At least one terminal in described multiple terminal can be at least partially disposed in described neighboring area, make to extend in said first direction and through at least one terminal described pass straight through described first opening or through described first overthe openings.
In one example, described periphery edge can be the first periphery edge, and described neighboring area can be the first neighboring area, and at least one terminal described in described multiple terminal can be the first terminal.Described substrate can have the second periphery edge extended between described first surface and described second surface in said first direction, and described substrate can have the second week edge regions of the described second surface extended between described second periphery edge and described second opening.At least one terminal in described multiple terminal can be the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in this second direction and through described second terminal pass straight through described second opening or through described second overthe openings.
In certain embodiments, described substrate can have and three periphery edge that in said first direction described first surface and described second surface between extend relative with described second periphery edge, and described substrate can have the 3rd neighboring area of the described second surface extended between described 3rd periphery edge and described second opening.At least one terminal in described multiple terminal can be the 3rd terminal, described 3rd terminal is at least partially disposed in described 3rd neighboring area, make to extend in this second direction and through described 3rd terminal pass straight through described second opening or through described second overthe openings.
According to another aspect more of the present invention, a kind of micromodule can comprise: substrate, described substrate has: relative first surface and second surface, and each first direction at traversed by described first surface and described second surface and second direction extend; Periphery edge, described periphery edge extends in said first direction between described first surface and described second surface; First opening, described first opening extends and has the elongated first size and second size in this second direction shorter than described first size that extend in said first direction between described first surface and described second surface; Second opening, described second opening extends and has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction between described first surface and described second surface; With the neighboring area of described second surface, the described neighboring area of described second surface extends between described periphery edge and described second opening.
Described micromodule can also comprise the first microelectronic element, and described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of described first register and the edge that extends between described front surface and described rear surface.Described micromodule can also comprise the second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of described second register.
Described micromodule can also comprise multiple terminal, and described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element.Described multiple terminal may be used at least one parts described micromodule being connected to described micromodule outside.At least one terminal in described multiple terminal can be at least partially disposed in described neighboring area, make to extend in this second direction and through at least one terminal described pass straight through described second opening or through described second overthe openings.
In one example, described periphery edge can be the first periphery edge, and described neighboring area can be the first neighboring area, and at least one terminal described in described multiple terminal can be the first terminal.Described substrate can have the second periphery edge that is relative with described first neighboring area and that extend between described first surface and described second surface in said first direction, and described substrate can have the second week edge regions of the described second surface extended between described second periphery edge and described second opening.At least one terminal in described multiple terminal can be the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in this second direction and through described second terminal pass straight through described second opening or through described second overthe openings.
In certain embodiments, described neighboring area can be the first neighboring area, at least one terminal described in described multiple terminal can be the first terminal, the described edge of described first microelectronic element can be the first edge, and described substrate can have the 3rd opening, described 3rd opening extends and has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction between described first surface and described second surface.Described substrate can have the second week edge regions of the described second surface extended between described periphery edge and described 3rd opening.At least one terminal in described multiple terminal can be the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in this second direction and through described second terminal pass straight through described 3rd opening or through described 3rd overthe openings.Described micromodule can also comprise the 3rd microelectronic element, described 3rd microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the second edge of described first microelectronic element relative with described first edge of described first microelectronic element front surface and at the described front surface place of described 3rd microelectronic element and with the bonding welding pad of described 3rd register.
In the exemplary embodiment, the front surface of described second microelectronic element and described 3rd microelectronic element can be positioned in single plane.In one embodiment, described periphery edge can be the first periphery edge, described substrate can have the second periphery edge that is relative with described first periphery edge and that extend between described first surface and described second surface in said first direction, and described substrate can have in described second periphery edge and the 3rd neighboring area of described second surface extended between corresponding described second opening and described 3rd opening and 4th week edge regions.At least one terminal in described multiple terminal can be the 3rd terminal, described 3rd terminal is at least partially disposed in described 3rd neighboring area, make to extend in this second direction and through described 3rd terminal pass straight through described first opening or through described first overthe openings.At least one terminal in described multiple terminal can be the 4th terminal, described 4th terminal is at least partially disposed in described 4th week edge regions, make to extend in this second direction and through described 4th terminal pass straight through described second opening or through described second overthe openings.
In specific example, described substrate can have the 4th opening, and described 4th opening extends and has the elongated first size and second size in this second direction shorter than described first size that extend in said first direction between described first surface and described second surface.Described micromodule can also comprise the 4th microelectronic element, described 4th microelectronic element have at the front surface place of described 4th microelectronic element and with the bonding welding pad of described 4th register.In one example, described second microelectronic element, described 3rd microelectronic element can have the first relative edge and the second edge with each microelectronic element in described 4th microelectronic element.Each microelectronic element can have at least one row bonding welding pad, described at least one row bonding welding pad has five or more described bonding welding pads, described at least one row bonding welding pad in the central area of the described front surface of described each micromodule with described first edge of described each microelectronic element and the direction of described second sides aligned parallel on extend.Each central area can extend the centre 1/3rd of the distance between corresponding described first edge and described second edge.
According to another aspect again of the present invention, a kind of micromodule can comprise: substrate, described substrate has the first dielectric element and the second dielectric element, and described first dielectric element has relative top surface and basal surface with each in described second dielectric element.Each in described top surface and described basal surface can extend on the first direction of traversed by and second direction.Described first dielectric element and described second dielectric element can at least one direction in the described first direction of traversed by or described second direction be spaced apart from each other.The first surface of described substrate can comprise the described top surface of described first dielectric element and described second dielectric element.The second surface of described substrate can comprise the described basal surface of described first dielectric element and described second dielectric element.Described substrate can also have the first opening, described first opening is limited by the open region between described first dielectric element and the adjacent opposite edges of described second dielectric element, each in described adjacent opposite edges has the first size extended in said first direction, and described first opening has second size in this second direction shorter than described first size; With the second opening, described second opening by described second dielectric element around.
Described micromodule can also comprise the first microelectronic element, and described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of a register in described first opening and described second opening and the edge that extends between described front surface and described rear surface.Described micromodule can also comprise the second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of another register in described first opening and described second opening.Described micromodule can also comprise multiple terminal, and described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element.Described multiple terminal may be used at least one parts described micromodule being connected to described micromodule outside.
In certain embodiments, described second opening can have the elongated first size and second size in this second direction shorter than described first size that extend in said first direction.In one example, described second opening can have the elongated first size and second size in said first direction shorter than described first size that extend in this second direction.In the exemplary embodiment, described substrate can also be included in the dielectric regions extended between described first dielectric element and the described adjacent opposite edges of described second dielectric element.The described first surface of described substrate can comprise the top surface of described dielectric regions.Described second surface can comprise the basal surface of described dielectric regions.In specific example, described dielectric regions can have than described first dielectric element and the high Young's modulus in the plane of described substrate of described second dielectric element.
In one embodiment, described bonding welding pad at the described front surface place of described first microelectronic element can with described first register, and described bonding welding pad at the described front surface place of described second microelectronic element can with described second register.In certain embodiments, described multiple terminal can comprise the first terminal and second terminal of the described bottom surface being exposed to described first dielectric element and described second dielectric element accordingly.At least some in the described bonding welding pad of described first microelectronic element can be electrically connected to described the first terminal and described second terminal.In one example, the described bonding welding pad at the described front surface place of described first microelectronic element can with described second register.Described bonding welding pad at the described front surface place of described second microelectronic element can with described first register.
According to another aspect of the present invention, a kind of micromodule can comprise: substrate, and described substrate has relative first surface and second surface, and each first direction at traversed by described first surface and described second surface and second direction extend.Described substrate can have the first dielectric element and the second dielectric element, and described first dielectric element and described second dielectric element are spaced apart from each other at least one direction in the described first direction or described second direction of traversed by.Described micromodule can also comprise the first microelectronic element, and described first microelectronic element has towards the front surface of described first surface, at the bonding welding pad at the described front surface place rear surface relative with described front surface and the edge that extends between described front surface and described rear surface.Described micromodule can also comprise the second microelectronic element, and described second microelectronic element has the described rear surface towards described first microelectronic element and protrudes past the bonding welding pad at the front surface at the described edge of described first microelectronic element and the described front surface place at described second microelectronic element.Described micromodule can also comprise multiple terminal, and described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element.Described multiple terminal may be used at least one parts described micromodule being connected to described micromodule outside.
In one example, at least one microelectronic element in described first microelectronic element and described second microelectronic element can cover the described top surface of each dielectric element in described first dielectric element and described second dielectric element at least in part.In the exemplary embodiment, the described edge of described first microelectronic element can be the first edge, and described first microelectronic element can have second edge relative with described first edge.Described second microelectronic element can have the first relative edge and the second edge.Each microelectronic element can have at least one row bonding welding pad, described at least one row bonding welding pad has five or more described bonding welding pads, and described at least one row bonding welding pad extends in said first direction in the central area of the described front surface of described each micromodule.Each central area can extend the centre 1/3rd of the distance between corresponding described first edge and described second edge.
According to another aspect more of the present invention, a kind of micromodule can comprise: substrate, described substrate has: the first dielectric element, the second dielectric element and the 3rd dielectric element, and described first dielectric element, described second dielectric element have relative top surface and basal surface with each in described 3rd dielectric element.Each in described top surface and described basal surface can extend on the first direction of traversed by and second direction.Described first dielectric element, described second dielectric element and described 3rd dielectric element can at least one direction in the described first direction of traversed by or described second direction be spaced apart from each other.The first surface of described substrate can comprise the described top surface of described first dielectric element, described second dielectric element and described 3rd dielectric element.The second surface of described substrate can comprise the described basal surface of described first dielectric element, described second dielectric element and described 3rd dielectric element.Described substrate can also have the first opening, and described first opening is limited by the open region between described first dielectric element and the adjacent opposite edges of described second dielectric element.Each in described adjacent opposite edges can have the first size extended in said first direction.Described first opening can have second size in this second direction shorter than described first size.Described substrate can also have the second opening, and described second opening is limited by the open region between described second dielectric element and the adjacent opposite edges of described 3rd dielectric element.Each in described adjacent opposite edges can have the first size extended in said first direction.Described first opening can have second size in this second direction shorter than described first size.
Described micromodule can also comprise the first microelectronic element, and described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of a register in described first opening and described second opening and the edge that extends between described front surface and described rear surface.Described micromodule can also comprise the second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of another register in described first opening and described second opening.Described micromodule can also comprise multiple terminal, and described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element.Described multiple terminal may be used at least one parts described micromodule being connected to described micromodule outside.
In one embodiment, described bonding welding pad at the described front surface place of described first microelectronic element can with described first register, and described bonding welding pad at the described front surface place of described second microelectronic element can with described second register.In specific example, described first microelectronic element can cover the described top surface of each dielectric element in described first dielectric element and described second dielectric element at least in part, and described second microelectronic element can cover the described top surface of each dielectric element in described second dielectric element and described 3rd dielectric element at least in part.In the exemplary embodiment, described bonding welding pad at the described front surface place of described first microelectronic element can with described second register, and described bonding welding pad at the described front surface place of described second microelectronic element can with described first register.
In certain embodiments, described multiple terminal can comprise the first terminal of the described bottom surface being exposed to described first dielectric element, described second dielectric element and described 3rd dielectric element accordingly, the second terminal and the 3rd terminal.At least some in the described bonding welding pad of at least one microelectronic element in described first microelectronic element and described second microelectronic element can be electrically connected to two or more terminals in described the first terminal, described second terminal and described 3rd terminal.In one example, at least some in the described bonding welding pad of described first microelectronic element can be electrically connected to described the first terminal and described second terminal.In specific example, at least some in the described bonding welding pad of described second microelectronic element can be electrically connected to described second terminal and described 3rd terminal.
In the exemplary embodiment, described substrate can have the neighboring area of the described second surface extended between periphery edge and an opening in described periphery edge and described first opening and described second opening extended between described first surface and described second surface in this second direction.At least one terminal in described multiple terminal can be at least partially disposed in described neighboring area, make to extend in said first direction and through at least one terminal described pass straight through at least one opening in described first opening and described second opening or at least one overthe openings in described first opening and described second opening.
In one example, described neighboring area can be the first neighboring area, and an opening in described first opening and described second opening can be described first opening, and at least one terminal described in described multiple terminal can be the first terminal.Described substrate can have described periphery edge and and described second opening between the second week edge regions of described second surface that extends.At least one terminal in described multiple terminal can be the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in said first direction and through described second terminal pass straight through described second opening or through described second overthe openings.In certain embodiments, described second dielectric element can comprise the part of described first neighboring area and described second week edge regions.In one embodiment, described first dielectric element can comprise a part for described first neighboring area, and described 3rd dielectric element can comprise a part for described second week edge regions.
In specific example, a kind of system can comprise micromodule described above and be electrically connected to other electronic units one or more of described micromodule.In one example, described system can also comprise housing, and described micromodule and other electronic unit described are mounted to described housing.
Accompanying drawing explanation
Fig. 1 is the plan view from above of the embodiment of the present invention.
Figure 1A is the face upwarding view of the parts in the embodiment of Fig. 1.
Figure 1B is the face upwarding view of the microelectronic element in the embodiment of Fig. 1.
Fig. 1 C is the face upwarding view of another microelectronic element in the embodiment of Fig. 1.
Fig. 2 A is the cross section intercepted along the 2A-2A in Fig. 1.
Fig. 2 B is the cross section intercepted along the line 2B-2B in Fig. 1.
Fig. 3 is the upward view of the embodiment shown in Fig. 1.
Fig. 3 A is the cross section of optional embodiment of the present invention.
Fig. 3 B is the possible upward view of of embodiment in Fig. 3 A.
Fig. 3 C is another the possible upward view of the embodiment had in Fig. 3 A of two dielectric elements.
Fig. 3 D is another the possible upward view again of the embodiment had in Fig. 3 A of three dielectric elements.
Fig. 3 E-3G is the modification of the embodiment in Fig. 3 D.
Fig. 3 H is for having the assembly in the processing of the micromodule shown in multiple Fig. 3 D.
Fig. 3 I is the cross section of the modification of embodiment in Fig. 3 A.
Fig. 3 J is the possible upward view of of embodiment in Fig. 3 I.
Fig. 3 K is another the possible upward view of the embodiment had in Fig. 3 I of multiple dielectric element.
Fig. 4 is the plan view from above of optional embodiment of the present invention.
Fig. 5 A is the cross section intercepted along the line 5A-5A in Fig. 4.
Fig. 5 B is the cross section intercepted along the line 5B-5B in Fig. 4.
Fig. 5 C is the cross section intercepted along the line 5C-5C in Fig. 4.
Fig. 6 is the upward view of Fig. 4.
Fig. 7 is the plane graph of optional embodiment of the present invention.
Fig. 8 A is the cross section intercepted along the line 8A-8A in Fig. 7.
Fig. 8 B is the cross section intercepted along the line 8B-8B in Fig. 7.
Fig. 8 C is the cross section intercepted along the line 8C-8C in Fig. 7.
Fig. 8 D is the cross section intercepted along the line 8D-8D in Fig. 7.
Fig. 9 is the upward view of Fig. 7.
Fig. 9 A is the plane graph of optional embodiment of the present invention.
Figure 10 is the plane graph of optional embodiment of the present invention.
Figure 11 A is the cross section intercepted along the line 10A-10A in Figure 10.
Figure 11 B is the cross section intercepted along the line 11B-11B in Figure 10.
Figure 11 C is the cross section intercepted along the line 11C-11C in Figure 10.
Figure 11 D is the cross section intercepted along the line 11D-11D in Figure 10.
Figure 12 is the upward view of Figure 11.
Figure 13 is the plane graph of optional embodiment of the present invention.
Figure 14 is the plan view from above of optional embodiment of the present invention.
Figure 15 is the cutaway view intercepted along the line 15-15 in Figure 14.
Figure 16 is the plan view from above of optional embodiment of the present invention.
Figure 17 A is the cutaway view intercepted along the line 17A-17A in Figure 16.
Figure 17 B is the cutaway view intercepted along the line 17B-17B in Figure 16.
Figure 18 is the schematic diagram of system according to an embodiment of the invention.
Embodiment
Fig. 1-3 shows the different views of microelectronics Packaging according to the embodiment of the present invention or micromodule 100.With reference to figure 1, micromodule 100 comprises two microelectronic elements covering substrate 102.Microelectronic element is stacked on flipped position, makes the rear surface 138 (Fig. 2 A) covering the first microelectronic element 136 at least partially of the second microelectronic element 153.
First microelectronic element 136 and the second microelectronic element 153 can be located on the substrate 102, so that the outward flange of the first microelectronic element 136 (namely, first edge 145, edge 144, second, the 3rd edge 146 and the 4th edge 147) and the second microelectronic element 153 outward flange (namely, first edge 162, edge 161, second, the 3rd edge 163 and the 4th edge 164) be positioned on the first surface 104 of substrate 102, and do not extend beyond the periphery edge of substrate 102.
In certain embodiments, substrate can for having the dielectric element of all kinds structure, such as be made up of polymeric material or inorganic material (such as pottery or glass), substrate has conducting element thereon, such as terminal and lead-in wire (such as trace), substrate contact or other conducting elements be electrically connected with terminal.In another example, substrate can be made up of semi-conducting material (such as silicon) substantially, or alternatively, substrate can comprise semiconductor material layer and one or more dielectric layer.In still another embodiment of the invention, substrate can for having the lead frame of lead-in wire, and wherein terminal can be the part of lead-in wire, the end section such as gone between.
As Fig. 2 A, 2B illustrate best, substrate 102 comprises first surface 104 and the second surface 106 relative with first surface, and each first direction D1 at traversed by first surface and second surface and second direction D2 extends.Although the thickness of substrate 102 can change with application, the most typically, the thickness of substrate 102 is about 10 to 100 microns.Substrate 102 can have the conductive trace 108 and multiple contact that are exposed to its surface, such as terminal contact 110, first group of contact 109 and second group of contact 111.As used in this article, conducting element " be exposed to " surface of structure description illustrate conducting element can be used for in a direction orthogonal to the surface from structural outer to the theoretical punctiform contact of body structure surface movement.Therefore, the terminal or other conducting elements that are exposed to the surface of structure can be given prominence to from such surface; Can be concordant with such surface; Or can be recessed into relative to such surface and be exposed by the hole in this structure or recess.
With reference to Figure 1A, between a pair relative edge, the first surface 104 of substrate 102 can comprise three parts, and these three parts are divided in the width of the substrate 102 between the first edge 103 of substrate 102 and the second edge 105.These three parts can have identical or different width, can comprise the second adjacent Outboard Sections 902 of the second edge 105 of first Outboard Sections 900 adjacent with the first edge 103 of substrate 102 and substrate 102 and take the core 906 in the region between the first Outboard Sections 900 and the second Outboard Sections 902.In one embodiment, the one or more part places during conductive trace 108 and multiple contact are exposed on the second surface 106 of substrate 102 these parts.In other embodiments, conductive trace 108 and contact can extend or extend in substrate 102 inside on the first surface 104 of substrate 102 and second surface 106.
Conductive trace 108 can be formed by any electric conducting material, but being combined to form the most typically by copper, copper alloy, gold or these materials.The thickness of trace also can change with application, but typically is about 5 to 25 microns.Substrate 102 and trace 108 can by such as simultaneously pending trial, the U.S. Patent No. 7,462 of commonly assigned people, the manufacture of method disclosed in 936, the disclosure of this patent is incorporated to herein by reference.
With reference to figure 1,1A, 2B and 3, substrate 102 may further include at least two holes or opening that extend between the first surface 104 and second surface 106 of substrate 102.The core 906 (Figure 1A) that first opening 116 can be positioned at substrate 102 is gone up and has pair of short edges 118 and long a pair limit 120, and the length on long limit 120 is greater than the length of minor face 118.First opening 116 can extend in the first direction dl.Second opening 126 can with the second direction D2 of first direction D1 traversed by extend.In this embodiment, the first direction D1 that the second direction D2 that the second opening 126 extends thereon can extend thereon perpendicular to the first opening 116, so that the first opening 116 and the second opening 126 can form T-shaped.It should be understood that alternatively, the first opening 116 and the second opening 126 can combine alternatively, to form a continuous print opening.In another optional embodiment, each in first opening 116 or the second opening 126 can comprise multiple opening, make the first opening 116 comprise the multiple openings extended in the first direction dl, and the second opening 126 is included in and multiple openings of extending on the second direction D2 of first direction D1 traversed by.Should further be appreciated that opening can also have any optional shape or design.
In one example, the first opening 116 can have the long size A1 being greater than short size A2, and long size A1 extends in the first direction dl, and short size A2 extends in a second direction d 2.Second opening 126 can have the long size B1 being greater than short size B2, and long size B1 extends in a second direction d 2, and short size B2 extends in the first direction dl.
With reference now to Fig. 2 A-2B, first microelectronic element 136 has front surface 140, front surface 140 towards substrate 102 first surface 104 and known bonding material or technology (such as using adhesive 101) can be used to be attached to the first surface 104 of substrate 102.First microelectronic element 136 comprises the rear surface 138 relative with its front surface 140 further.In this embodiment, front surface 140 is the first surface of microelectronic element 136, has bonding welding pad 142 thereon, and rear surface 138 is the rear surface of microelectronic element 136.In this embodiment, the first relative edge 144 of the first microelectronic element 136 and the second edge 145 and the 3rd relative edge 146 and the 4th edge 147 extend between the first surface 104 and second surface 106 of substrate 102.The edge of the first microelectronic element 136 can have identical or different length.
Turn to Figure 1B, the first microelectronic element 136 can be the semiconductor chip of any type.In this embodiment, the first microelectronic element 136 can for having DRAM (dynamic random access memory) chip of conducting element thereon.As shown, the surf zone of the front surface 140 of the first microelectronic element 136 can be divided into three regions on the direction between first edge and the second edge of the first microelectronic element with substantially identical width: the first perimeter 922, perimeter 920, second and the central area 924 be positioned between the first perimeter 920 and the second perimeter 922.Such as, if the length between long limit is 6 microns, the respective length of the first perimeter, the second perimeter and central area can be 2 microns.Therefore, central area 924 can orientate spaced apart 2 microns and with the second edge 145 spaced apart 2 microns with the first edge 144 as.In other words, central area can be positioned at the centre 1/3rd of the first microelectronic element 136.The active device for providing memory array function that any or all microelectronic element described herein can all be equipped with number ratio to provide the active device of any other function many.
As dram chip is distinctive, conducting element can comprise the first bonding welding pad 142, first bonding welding pad 142 and extend along the central area 924 of the front surface 140 of the first microelectronic element 136.Conducting element provides the first microelectronic element 136 and is positioned at the electrical connection between first group of contact 109 on the second surface 106 of substrate 102.Adhesive 101 may be used for the first microelectronic element 136 to be attached to substrate 102.
With reference to figure 2A and 2B, the bonding welding pad 142 of the first microelectronic element 136 can directly be positioned at above the first opening 117 of substrate 102.This allows bonding welding pad 142 to be exposed by the first opening 117.Any known method that bonding welding pad 142 can use foundation to be electrically connected is electrically connected to first group of contact 109 on the second surface 106 of substrate 102.In one embodiment, bonding wire 148 can to extend to first group of contact 109 on the second surface 106 of substrate 102 by the first opening 116 from the bonding welding pad 142 the first microelectronic element 136.Trace 108 (Fig. 3) may be used for first group of contact 109 to be connected to terminal contact 110.
Second microelectronic element 153 can be similar with the first microelectronic element 136.The front surface 157 with the second microelectronic element of bonding welding pad thereon, towards the first microelectronic element 136, makes the second microelectronic element 153 cover the rear surface 138 of the first microelectronic element 136.As shown in Figure 1 C, in this embodiment, the second microelectronic element 153 has the first relative edge 161 and the second edge 162 and extends and relative three edge 163 adjacent with the second edge 162 with the first edge 161 and the 4th edge 164 between the rear surface 155 and front surface 157 of the second microelectronic element 153.Conducting element (such as bonding welding pad 159) extends along the front surface 157 of the second microelectronic element 153.In this embodiment, second microelectronic element 153 can be semiconductor chip, such as dram chip, have the bonding welding pad 159 that the central area 932 along the second microelectronic element 153 is located, central area 932 is positioned between the first perimeter 928 and the second perimeter 930.In one embodiment, bonding welding pad 159 can extend on the direction of the direction traversed by extended thereon with the bonding welding pad 142 on the first microelectronic element 136.
As found out in Figure 1B, in specific example, first microelectronic element 136 can have at least one row bonding welding pad 142', often row bonding welding pad has five or more bonding welding pads 142, and at least one row bonding welding pad 142' extends in the central area 924 of the front surface 140 of the first microelectronic element on the D3 of direction.As found out in Fig. 1 C, in one example, second microelectronic element 153 can have at least one row bonding welding pad 159', often row bonding welding pad has five or more bonding welding pads 159, and at least one row bonding welding pad 159' extends in the central area 932 of the front surface 157 of the second microelectronic element on the D4 of direction.As shown in the example in Fig. 3, the direction D4 traversed by that the direction D3 that the row 142' of bonding welding pad 142 extends thereon can extend thereon with the row 159' of bonding welding pad 159.As shown in Figure 3, direction D3 can be parallel with the direction D1 that the long size of the first opening 116 extends thereon, and direction D4 can be parallel with the direction D2 that the long size of the second opening 126 extends thereon, but need not be this situation.Such as, in an embodiment (not shown), first block of data 50, direction D3 can be parallel with the direction D2 that the short size of first window extends thereon, and direction D4 can be parallel with the direction D1 that the short size of Second Window extends thereon.
Turn to Fig. 2 B, the second microelectronic element 153 can be positioned at above the first microelectronic element 136.As shown, distance piece 135 can be positioned between substrate 102 and the second microelectronic element 153, the second microelectronic element 153 to be supported on the At The Height above the first microelectronic element 136.As found out best in Fig. 1, the first edge 161 of the second microelectronic element 153 and the second edge 162 can with the first edge 144 of the first microelectronic element 136 and the direction of the second edge 145 traversed by extend.Therefore, the first edge 161 of the second microelectronic element 153 and the second edge 162 extend beyond in the 3rd edge 146 of the first microelectronic element 136 and the 4th edge 147.
With reference to figure 2B, the bonding welding pad 159 on the second microelectronic element 153 can be electrically connected with second group of contact 111 in the multiple contacts being exposed to substrate 102 place.
Conducting element may be used for the bonding welding pad 159 on the first microelectronic element 136 to be electrically connected with second group of contact 111 on the second surface 106 of substrate 102.In this embodiment, bonding wire 165 may be used for the bonding welding pad 159 on the second microelectronic element 153 to be connected with the second group of contact 111 (Fig. 2 B-3) on the second surface 106 of substrate 102.As shown, bonding wire 165 extends through the second opening 126 and is connected to second group of contact 111.
As shown in Figure 2 A, once stack assemblies is assembled, sealant 199 can cover some or all in the first surface 104 of substrate 102 and the first microelectronic element 136 and the second microelectronic element 153, and can cover the bonding wire 148,165 extending through corresponding first opening 116 and the second opening 126.
With reference to figure 3, solder ball 115 array can be attached to the terminal contact 110 (Fig. 2 B) at second surface 106 place being exposed to substrate 102.As shown, trace 108 can extend from first group of contact 109 along second surface 106, to provide the electrical connection between first group of contact 109 and the terminal contact 110 supporting solder ball 115.Terminal 110 may be used at least one parts micromodule 100 being connected to micromodule 100 outside.
In specific example, substrate 102 can also have the first periphery edge 3, first periphery edge 3 and extend between first surface 104 and second surface 106 in a second direction d 2.Substrate 102 can also have the second periphery edge 103, second periphery edge 103 and extend between first surface 104 and second surface 106 in the first direction dl.It is relative with the second periphery edge 103 and extend between first surface 104 and second surface 106 in the first direction dl that substrate 102 can also have the 3rd periphery edge the 105, three periphery edge 105.
First opening 116 can have the elongated first size L1 and the second size W1 in a second direction d 2 shorter than first size that extend in the first direction dl between the second opening 126 and the first periphery edge 3.Second opening 126 can have the elongated first size L2 and the second size W2 in the first direction dl shorter than first size that extend at second direction D2.
Substrate 102 can have the first neighboring area P1 of second surface 106, and the first neighboring area P1 of second surface 106 extends between the first periphery edge 3 and the first opening 116.Substrate 102 can also have the second week edge regions P2 of second surface 106, and the second week edge regions P2 of second surface 106 extends between the second periphery edge 103 and the second opening 126.Substrate 102 can also have the 3rd neighboring area P3 of second surface 106, and the 3rd neighboring area P3 of second surface 106 extends between the 3rd periphery edge 105 and the second opening 126.Second week edge regions P2 and the 3rd neighboring area P3 can be positioned at the opposite side of the second opening 126.
As shown in Figure 3, at least one (such as the first terminal 110a) in terminal 110 can be at least partially disposed in the first neighboring area P1, makes to extend in the first direction dl and through the straight line S1 of the first terminal 110a through the first opening 116 or above the first opening 116.At least one (such as second terminal 110b) in terminal 110 can be at least partially disposed in second week edge regions P2, makes to extend in a second direction d 2 and through the straight line S2 of the second terminal through the second opening 126 or above the second opening 126.At least one (such as the 3rd terminal 110c) in terminal 110 can be at least partially disposed in the 3rd neighboring area P3, make to extend in a second direction d 2 and through the 3rd terminal pass straight through the second opening 126 or above the second opening 126.In specific example, same straight line S2 can extend through the second terminal 110b and the 3rd terminal 110c, but needs not be this situation.
Embodiment in all the other embodiments discussed herein and Fig. 1-3 is substantially similar.Difference is only that microelectronic element is positioned at the respective openings in the mode of the flipped position on front surface or substrate and substrate.Therefore, all the other embodiments disclosed herein are equally applicable to about principle disclosed in the embodiment in Fig. 1-3.Therefore, similar label is for describing similar element.
With reference to figure 3A and 3B, micromodule 100' is similar with the micromodule illustrated about Fig. 1-3 and describe, except each in the first opening 16 and the second opening 26 has elongated accordingly first size L1, the L2 extended in the first direction dl and corresponding second size W1, the W2 extended in a second direction.That is, the first opening 16 and the second opening 26 extend parallel to each other, instead of traversed by ground extends each other.
As found out in Fig. 3 A, similar with Fig. 1-3, the rear surface 38 that the front surface 40 that the first microelectronic element 36 has the first surface 4 towards substrate 2, the bonding welding pad 42 alignd at front surface place and with the first opening 16 are relative with front surface and the edge 46 extended between front surface and rear surface.Second microelectronic element 53 has the rear surface 38 towards the first microelectronic element 36 and the front surface 57 protruding past the edge 46 of the first microelectronic element and the bonding welding pad 59 alignd at the front surface place of the second microelectronic element and with the second opening 26.
In specific example, first microelectronic element 36 can have the width between edge 46 and relative edge extended between its front surface with rear surface, and the second microelectronic element 53 can have the width between the relative edge that extends between its front surface with rear surface.The width of the first microelectronic element 36 can be greater than the second size W1 of the first opening 16, and the width of the second microelectronic element 53 can be greater than the second size W2 of the second opening 26.
Solder ball 15 array can be attached to the terminal contact 10 at second surface 6 place being exposed to substrate 2.Trace can extend from first group of substrate contact 9 and second group of substrate contact 11 along second surface 6, to provide the electrical connection between substrate contact 9,11 and the terminal contact 10 supporting solder ball 15.The bonding welding pad 42,59 of corresponding first microelectronic element 36 and the second microelectronic element 53 can be electrically connected with the conducting element of substrate 2 (such as substrate contact 9,11 and terminal 10).Terminal 10 may be used at least one parts micromodule 100' being connected to micromodule 100' outside.
In specific example, each that can also have in the first relative periphery edge 3 and the second periphery edge 5, first periphery edge 3 and the second periphery edge 5 of substrate 2 extends in a second direction d 2 between first surface 4 and second surface 6.Substrate 2 can have the first neighboring area P1 and the second week edge regions P2 of second surface 6, and the first neighboring area P1 of second surface 6 and second week edge regions P2 extends at the first periphery edge 3 and between the first corresponding opening 16 and the second opening 26.Substrate 2 can also have the 3rd neighboring area P3 and the 4th week edge regions P4 of second surface 6, and the 3rd neighboring area P3 of second surface 6 and 4th week edge regions P4 extends at the second periphery edge 5 and between the first corresponding opening 16 and the second opening 26.First neighboring area P1 and the 3rd neighboring area P3 can be positioned at the opposite side of the first opening 16, and second week edge regions P2 and 4th week edge regions P4 can be positioned at the opposite side of the second opening 26.
As shown in Figure 3 B, first opening 16 extends to distance apart from the first periphery edge 3 position identical with the distance of the second opening 26 apart from the first periphery edge 3, and the first opening extends to the identical position of distance of the distance apart from the second periphery edge 5 and second opening distance the second periphery edge 5, but need not be this situation.In one example, one in the first opening 16 and the second opening 26 can extend to than another in the first opening and the second opening closer to one or two the position in periphery edge 3,5.
As shown in Figure 3 B, at least one (such as the first terminal 10a) in terminal 10 can be at least partially disposed in the first neighboring area P1, makes to extend in the first direction dl and through the straight line S1 of the first terminal 10a through the first opening 16 or above the first opening 16.At least one (such as second terminal 10b) in terminal 10 can be at least partially disposed in second week edge regions P2, makes to extend in the first direction dl and through the straight line S2 of the second terminal through the second opening 26 or above the second opening 26.
At least one (such as the 3rd terminal 10c) in terminal 10 can be at least partially disposed in the 3rd neighboring area P3, make on second direction D3 extend and through the 3rd terminal pass straight through the first opening 16 or above the first opening 16.At least one (such as the 4th terminal 10d) in terminal 10 can be at least partially disposed in 4th week edge regions P4, make to extend in the first direction dl and through the 4th terminal pass straight through the second opening 26 or above the second opening 26.In specific example, same straight line S1 can extend through the first terminal 10a and the 3rd terminal 10c, but needs not be this situation.In one embodiment, same straight line S2 can extend through the second terminal 10b and the 4th terminal 10d, but needs not be this situation.
In one example, the bonding welding pad 42 of the first microelectronic element 36 can be electrically connected to conducting element 9 by the first lead-in wire 48, and the first lead-in wire 48 has the part of aliging with the first opening 16.Equally, the bonding welding pad 59 of the second microelectronic element 53 can be electrically connected to conducting element 11 by the second lead-in wire 65, and the second lead-in wire 65 has the part of aliging with the second opening 26.In one embodiment, the first lead-in wire 48 can not extend through the first opening 16, such as, if the first lead-in wire is bonding wire.Equally, the second lead-in wire 65 can not extend through the second opening 26, such as, if the second lead-in wire is bonding wire.
As shown in Figure 3A, the bonding welding pad 42 of the first microelectronic element 36 can be electrically connected to conducting element 9 by extend through the bonding wire 48 of the first opening 16.Equally, the bonding welding pad 59 of the second microelectronic element 53 can be electrically connected to conducting element 11 by extend through the bonding wire 65 of the second opening 26.In specific example, the first bonding wire 48 can extend through only the first opening 16, and the second bonding wire can extend through only the second opening 26.
In the exemplary embodiment, the first microelectronic element 36 and the second microelectronic element 53 can have corresponding bonding welding pad 42,59, and bonding welding pad 42,59 configures in the mode similar with the mode shown in Figure 1B and 1C.In this example, each in first microelectronic element 36 and the second microelectronic element 53 can have at least one row bonding welding pad, often row bonding welding pad has five or more corresponding bonding welding pads 42,59, at least one row bonding welding pad extends in a first direction in the central area of the corresponding front surface 40,57 of the first microelectronic element 36 and the second microelectronic element 53, and each central area extends the centre 1/3rd of the distance between the first relative edge of corresponding microelectronic element and the second edge.
Fig. 3 C shows another possible upward view of the micromodule 100 in Fig. 3 A.In the embodiment illustrated in fig. 3 c, substrate 2 can comprise setting adjacent to each other and isolated first dielectric element 2a and the second dielectric element 2b, and each dielectric element has relative top surface and basal surface.Two dielectric element 2a and 2b can be coplanar each other, make the first surface 4 of substrate 2 can comprise the top surface of two dielectric elements, and the second surface 6 of substrate can comprise the basal surface of two dielectric elements.
In another example, any one or each (dielectric element 2a and 2b such as shown in Fig. 3 C) in dielectric element described herein can be replaced by the substrate components be substantially made up of semi-conducting material (such as silicon).In certain embodiments, in dielectric element described herein any one or each can be included semiconductor material layer and one or more dielectric layer substrate components replace.In still another embodiment of the invention, in dielectric element described herein any one or each can be replaced by the lead frame with lead-in wire, wherein terminal can for lead-in wire part, the end section such as gone between.
First opening 16c can be limited by the adjacent open region between opposite edges 102a, 102b of the first dielectric element 2a and the second dielectric element 2b.Each in adjacent opposite edges 102a, 102b can have first size L1 and can extend in the first direction dl.First opening 16c can have the second size W1 in a second direction d 2 shorter than first size L1.Second opening 26 can be identical with the second opening in Fig. 3 B, make the second opening can by the second dielectric element 2b around.
Similar with the embodiment shown in Fig. 3 B, at least one (such as the first terminal 10a) in terminal 10 can be at least partially disposed in the first neighboring area P1, makes to extend in the first direction dl and through the straight line S1 of the first terminal 10a through the first opening 16c or above the first opening 16c.At least one (such as second terminal 10b) in terminal 10 can be at least partially disposed in second week edge regions P2, makes to extend in the first direction dl and through the straight line S2 of the second terminal through the second opening 26 or above the second opening 26.Equally, at least one the 3rd terminal 10c and the 4th terminal 10d can be at least partially disposed in the 3rd neighboring area and 4th week edge regions, describes about Fig. 3 B as above.
In specific example, the second opening 26 can be orientated vertical with the first opening 16c.Such as, the second opening 26 can have first size the L2 in a second direction d 2 and second size W2 in the first direction dl shorter than first size.In one embodiment, substrate 2 can also be included in the adjacent dielectric regions R extended between opposite edges 102a, 102b of the first dielectric element 2a and the second dielectric element 2b, the first surface of substrate comprises the top surface of dielectric regions, and second surface comprises the basal surface of dielectric regions.In specific example, dielectric regions R can have the Young's modulus on the plane of substrate higher than dielectric element 2a, 2b.
As shown in Fig. 3 A and 3C, the first microelectronic element 36 can cover the first opening 16c, and the second microelectronic element 53 can cover the second opening 26, makes the microelectronic element closer to substrate 2 be the microelectronic element of covering first opening.But, need not be this situation.In another embodiment, microelectronic element (such as the first microelectronic element 36) closer to substrate 2 can cover the second opening 26, and can cover the first opening 16c further from the microelectronic element (such as the second microelectronic element 53) of substrate.
Fig. 3 D shows another possible upward view of the micromodule 100 of Fig. 3 A.In the embodiment illustrated in fig. 3d, substrate 2 can comprise setting adjacent to each other and isolated first dielectric element 2a, the second dielectric element 2b and the 3rd dielectric element 2c, and each dielectric element has relative top surface and basal surface.Three dielectric elements 2a, 2b and 2c can be coplanar each other, make the first surface 4 of substrate 2 can comprise the top surface of all three dielectric elements, and the second surface 6 of substrate can comprise the basal surface of all three dielectric elements.
Similar with the first opening 16c in Fig. 3 C, the first opening 16d can be limited by the open region between the first dielectric element 2a and the adjacent opposite edges of the second dielectric element 2b.Second opening 26d can be limited by the open region between the second dielectric element 2b and the adjacent opposite edges of the 3rd dielectric element 2c.
Similar with the embodiment shown in Fig. 3 C, at least one (such as the first terminal 10a) in terminal 10 can be at least partially disposed in the first neighboring area P1, makes to extend in the first direction dl and through the straight line S1 of the first terminal 10a through the first opening 16d or above the first opening 16d.At least one (such as second terminal 10b) in terminal 10 can be at least partially disposed in second week edge regions P2, makes to extend in the first direction dl and through the straight line S2 of the second terminal through the second opening 26d or above the second opening 26d.Equally, at least one the 3rd terminal 10c and the 4th terminal 10d can be at least partially disposed in the 3rd neighboring area and 4th week edge regions, describes about Fig. 3 B as above.
In one example, terminal 10 can comprise the first terminal of the bottom surface being exposed to corresponding first dielectric element 2a, the second dielectric element 2b and the 3rd dielectric element 2c, the second terminal and the 3rd terminal, and at least some in the bonding welding pad 42,59 of at least one microelectronic element in microelectronic element 36,53 can be electrically connected with two or more in the first terminal of the first corresponding substrate portions, the second substrate portions and the 3rd substrate portions, the second terminal and the 3rd terminal.In certain embodiments, at least some in the bonding welding pad 42 of the first microelectronic element 36 can be electrically connected to the terminal 10 of the first substrate portions 2a and the second substrate portions 2b.In one embodiment, at least some in the bonding welding pad 59 of the second microelectronic element 53 can be electrically connected to the terminal 10 of the second substrate portions 2b and the 3rd substrate portions 2c.
Each in Fig. 3 E, 3F and 3G shows the optionally possible upward view of the micromodule 100 in Fig. 3 A.Embodiment shown in Fig. 3 E is identical with the embodiment shown in Fig. 3 D, except each neighboring area can comprise the multiple terminals 10 arranged adjacent to each other in the first direction dl.Such as, neighboring area P1 comprises terminal 10a and 10a', and the straight line S1 extended in a first direction between the first opening 16e and the periphery edge of substrate 2 extends through terminal 10a and 10a'.
Embodiment shown in Fig. 3 F is identical with the embodiment shown in Fig. 3 D, except neighboring area is positioned on the first substrate portions 2a and the 3rd substrate portions 2c, instead of is positioned at outside on the second substrate portions 2b.Embodiment shown in Fig. 3 G is identical with the embodiment shown in Fig. 3 F, except following: the second substrate portions 2b has the first width W of heart part wherein, first width W be greater than its peripheral part the second width W ', peripheral part is adjacent with core along first direction D1.
Fig. 3 H shows the assembly in the processing comprising the micromodule 100' shown in multiple Fig. 3 D.Fig. 3 H shows the first micromodule 100a' and the second micromodule 100b'.First micromodule and the second micromodule 100 are combined by the coupling part 2' of substrate 2, and the adjacent substrate portions in substrate portions 2a, 2b and 2c combines by the coupling part 2' of substrate 2.Such as, first substrate portions 2a of each in the first micromodule and the second micromodule combines by the coupling part 2' of substrate 2, second substrate portions 2b of each in the first micromodule and the second micromodule is combined, the 3rd substrate portions 2c of each in the first micromodule and the second micromodule is combined.After each micromodule 100' of manufacture, coupling part 2' can remove from micromodule (such as by cutting), thus is separated by each micromodule.
Although in Fig. 3 A-3H, the first opening and the second opening are shown as parallel to each other, and in other embodiments, the first opening and second opening of any one embodiment in the embodiment shown in Fig. 3 A-3H can be orientated traversed by each other, such as, shown in Fig. 1.In this embodiment, the first opening or the second opening can by the dielectric element of substrate around, and another opening can be limited by the open region between the first dielectric element and the adjacent opposite edges of the second dielectric element.In specific example, the first opening and the second opening can be limited by the corresponding open region between the adjacent opposite edges of adjacent dielectric element.
Although in Fig. 3 A-3H, microelectronic element is described to have two microelectronic elements, but in other embodiments, any one in the microelectronic element shown in Fig. 3 A-3H can also comprise the 3rd microelectronic element, or comprises the 3rd microelectronic element and the 4th microelectronic element.Such as, Fig. 6, the embodiment shown in 9 and 12 can comprise and arranging adjacent to each other and the dielectric element of isolated two, three, four, five or any other quantity.
In specific example, any configuration of the microelectronic element shown in Fig. 3 A-3H and opening can double adjacent to each other in single micromodule.Such as, as shown in fig. 31, microelectronic element configuration in Fig. 3 A can be doubled, make single substrate 2i can have four openings 16,26,32 and 82 and two to partly overlapping microelectronic element, make first can cover two the first openings 16 and 26 to the microelectronic element 36 and 53 of overlap, and the microelectronic element 68 and 88 overlapping to adjacent the second couple with first can cover two the second openings 32 and 82.
In one example, the 4th microelectronic element 88 in Fig. 3 I can be omitted, so that micromodule can have three partly overlapping microelectronic elements, two microelectronic elements in three microelectronic elements are arranged as its front surface in the single plane parallel with the surface of substrate, and another microelectronic element has the front surface be arranged in the Different Plane parallel with the surface of substrate.
Embodiment in Fig. 3 I can have the configuration of various upward view.In one example, as shown in figure 3j, configuration shown in Fig. 3 B can be doubled, make single substrate 2j can have four parallel opening 16j, 26j, 32j and 82j, each opening by substrate around, and can align with opening 16j, 26j, 32j and 82j in the contact of the microelectronic element of correspondence in microelectronic element.In another example, as shown in Fig. 3 K, configuration shown in Fig. 3 D can be doubled, single substrate 2k can be had and arrange with abutting against each other and isolated five dielectric elements 2a, 2b, 2c, 2d and 2e, and can align with opening 16k, 26k, 32k and 82k in the contact of the microelectronic element of correspondence in microelectronic element, each such opening by the adjacent dielectric element in dielectric element adjacent opposite edges between open region limit.In other embodiments, the feature of the substrate in Fig. 3 J and 3K can be combined into single embodiment, make in the one or more microelectronic elements in Fig. 3 I four microelectronic elements each can cover by the dielectric element of substrate around opening, and each in one or more microelectronic elements in four microelectronic elements in Fig. 3 I can to cover by the adjacent opposite edges of the adjacent dielectric element in dielectric element between the opening that limits of open region.
Fig. 4-6 shows optional stacking micromodule 200, and micromodule 200 comprises three stacking microelectronic elements of the position being in upside-down mounting.As illustrated best in Fig. 5 A and 5B, the second microelectronic element 253 and the 3rd microelectronic element 268 can cover the first microelectronic element 236.
As illustrated best in Figure 4 and 5 B, three openings that substrate 202 has first surface 204 and second surface 206 and extends between first surface 204 and second surface 206.The same with preceding embodiment, first opening 216 has first end 222 and the second end 224, and the core of substrate 202 can be positioned at, the core of substrate 202 is also the centre 1/3rd of the substrate 202 between the first edge 203 of substrate and the second relative edge 205.First opening 216 is included in the minor face 218 at its first end 222 and the second end 224 place.Second opening 226 can be orientated as adjacent with the first end 222 of the first opening 216.
3rd opening 232 can be orientated as adjacent with the second end 224 of the first opening 216, the direction of direction traversed by that extends thereon on the long limit 220 with the first opening 216, the long limit 234 of the 3rd opening 232 to extend.In the configuration, the second opening 226 and the 3rd opening 232 can be parallel to each other and vertical with the first opening 216, to form I shape.Alternatively, the first opening 216, second opening 226 and the 3rd opening 232 can combine, and make the first opening 216, second opening 226 and the 3rd opening 232 form a continuous print opening.The same with preceding embodiment, one or more in the first opening 216, second opening 226 or the 3rd opening 232 can comprise multiple opening.
In one example, the first opening 216 can have the long size A1 being greater than short size A2, and long size A1 extends in the first direction dl, and short size A2 with the second direction D2 of first direction traversed by extend.Second opening 226 can have the long size B1 being greater than short size B2, and long size B1 extends in a second direction d 2, and short size B2 extends in the first direction dl.3rd opening 232 can have the long size C1 being greater than short size C2, and long size C1 extends in a second direction d 2, and short size C2 extends in the first direction dl.
First microelectronic element 236 and the second microelectronic element 253 stacking with the layout similar with the embodiment in Fig. 1-3, and different in following degree: the 3rd microelectronic element 268 is included in assembly.With reference to figure 5A and 5B, the first microelectronic element 236 and the second microelectronic element 253 are positioned in Different Plane.As Fig. 5 B illustrates better, the 3rd microelectronic element 268 can be orientated as adjacent with the second microelectronic element 253 with the first microelectronic element 236.In this embodiment, the 3rd microelectronic element 268 is positioned in the plane identical with the second microelectronic element 253, but whether is positioned in the plane identical with the first microelectronic element 236.As shown, one or more distance piece 235 may be used for the 3rd microelectronic element 268 to be supported on above the first microelectronic element 236, the second edge 277 of the 3rd microelectronic element 268 is covered or the part at the 4th edge 247 of overlapping first microelectronic element 236 and corresponding first edge 244 of the first microelectronic element 236 and the second edge 245.Bonding welding pad 274 on 3rd microelectronic element 268 along the central area 942 of the 3rd microelectronic element 268 (Fig. 5 B, 6) a part extend and towards the 3rd opening 232.The same with disclosed embodiment above, central area 942 can be positioned at the centre 1/3rd of the length between the first edge 276 of the 3rd microelectronic element 268 and the second edge 277.Bonding welding pad 274 on 3rd microelectronic element 268 can be alignd with the 3rd opening 232 and be exposed by the 3rd opening 232.
As what describe about the embodiment with two microelectronic elements, 3rd microelectronic element 268 can have at least one row bonding welding pad, often row bonding welding pad has five or more bonding welding pads 274, and at least one row bonding welding pad extends in one direction in the central area of the front surface of the 3rd microelectronic element.In specific example, at least one row bonding welding pad of the 3rd microelectronic element 268 can be set to adjacent with the periphery edge of the 3rd microelectronic element, and often row bonding welding pad has five or more bonding welding pads 274.As shown in Figure 6, at least one row bonding welding pad 274' of the 3rd microelectronic element 268 can extend on the direction D2 identical with the direction that the long size of the 3rd opening 232 can extend thereon with the second opening 226, often row bonding welding pad 274' has five or more bonding welding pads 274, the direction D1 traversed by that direction D2 can extend thereon with the long size of the first opening 216, but need not be this situation.
Conducting connecting part may be used for each bonding welding pad on corresponding microelectronic element to connect to the corresponding contact sets on the basal surface of substrate.Such as, as shown, the 3rd group of contact 213 on the second surface 206 of the bonding welding pad 274 with substrate 202 that are exposed to the surface of the 3rd microelectronic element 268 is connected by bonding wire 280.With reference to figure 6, then, each bonding welding pad 274 on the 3rd microelectronic element 268 can be electrically connected with the terminal contact 210 supporting solder ball by conductive trace 208.Terminal 210 may be used at least one parts micromodule 200 being connected to micromodule 200 outside.
The same with preceding embodiment, the layout of the first microelectronic element 236, second microelectronic element 253 and the 3rd microelectronic element 268 allow in the respective bonding welding pad 242,259,274 (Fig. 5 B) of corresponding first microelectronic element 236, second microelectronic element 253 and the 3rd microelectronic element 268 each align with the first corresponding opening 216, second opening 226 and the 3rd opening 232.This allows again conducting connecting part through the first opening 216, second opening 226 and the 3rd opening 232 inside or passes the first opening 216, second opening 226 and the 3rd opening 232, and does not disturb adjacent conducting connecting part.In addition, this allows to have the stacking of two or more chips of the bonding welding pad be positioned on the central area of chip.
In specific example, substrate 202 can also have the first periphery edge 203, first periphery edge 203 and extend between first surface 204 and second surface 206 in the first direction dl.Substrate 202 can also have the second periphery edge 205, second periphery edge 205 and extend between first surface 204 and second surface 206 in the first direction dl.
First opening 216 can have the elongated first size L1 and the second size W1 in a second direction d 2 shorter than first size that extend in the first direction dl.Second opening 226 can have the elongated first size L2 and the second size W2 in the first direction dl shorter than first size that extend at second direction D2.3rd opening 232 can have the elongated first size L3 and the second size W3 in the first direction dl shorter than first size that extend at second direction D2.
Substrate 202 can have the first neighboring area P1 and the second week edge regions P2 of second surface 206, and the first neighboring area P1 of second surface 206 and second week edge regions P2 extends at the first periphery edge 203 and between the second corresponding opening 226 and the 3rd opening 232.Substrate 202 can also have the 3rd neighboring area P3 and the 4th week edge regions P4 of second surface 206, and the 3rd neighboring area P3 of second surface 206 and 4th week edge regions P4 extends at the second periphery edge 205 and between the second corresponding opening 226 and the 3rd opening 232.First neighboring area P1 and the 3rd neighboring area P3 can be positioned at the opposite side of the second opening 226, and second week edge regions P2 and 4th week edge regions P4 can be positioned at the opposite side of the 3rd opening 232.
As shown in Figure 6, at least one (such as the first terminal 210a) in terminal 210 can be at least partially disposed in the first neighboring area P1, makes to extend in a second direction d 2 and through the straight line S1 of the first terminal 210a through the second opening 226 or above the second opening 226.At least one (such as second terminal 210b) in terminal 210 can be at least partially disposed in second week edge regions P2, makes to extend in a second direction d 2 and through the straight line S2 of the second terminal through the 3rd opening 232 or above the 3rd opening 232.
At least one (such as the 3rd terminal 210c) in terminal 210 can be at least partially disposed in the 3rd neighboring area P3, make to extend in a second direction d 2 and through the 3rd terminal 210c pass straight through the second opening 226 or above the second opening 226.In specific example, same straight line S1 can extend through the first terminal 210a and the 3rd terminal 210c, but needs not be this situation.
At least one (such as the 4th terminal 210d) in terminal 210 can be at least partially disposed in 4th week edge regions P4, make to extend in a second direction d 2 and through the 4th terminal 210d pass straight through the 3rd opening 232 or above the 3rd opening 232.In specific example, same straight line S2 can extend through the second terminal 210b and the 4th terminal 210d, but needs not be this situation.
With reference now to Fig. 7-9, show another embodiment that micromodule 300 is described, micromodule 300 comprises covering substrate and is in four stacking microelectronic elements of flipped position.In this embodiment, four openings extend through first surface 304 and the second surface 306 of substrate 302.As illustrated best in Fig. 7, the first opening 316 and the second opening 326 are positioned on the direction vertical with the 4th opening 382 with the 3rd opening 332.First opening 316 has long limit 320 and minor face 318, and wherein minor face 318 is positioned at first end 322 and second end 324 place of the first opening 316.Second opening 326 also has pair of short edges 328 and long a pair limit 330, and wherein minor face 328 is positioned at first end 329 and second end 331 of the second opening 326.3rd opening 332 is set to and the respective first end 322 of the first opening 316 and the second opening 326,329 adjacent, and the 4th opening 382 is set to and respective second end 324 of the first opening 316 and the second opening 326,331 adjacent.In this embodiment, do not align with the long limit 320,330 of the first corresponding opening 316 and the second opening 326 in the corresponding long limit 334,384 of the 3rd opening 332 and the 4th opening 382.As shown, the interval of the outer peripheral edge 312 of the first opening 316 and the second opening 326 and substrate 302 is than the 3rd opening 332 and the 4th opening 382 spaced far with the outer peripheral edge 312 of substrate 302.
In one example, the first opening 316 can have the long size A1 being greater than short size A2, and long size A1 extends in the first direction dl, and short size A2 with the second direction D2 of first direction traversed by extend.Second opening 326 can have the long size B1 being greater than short size B2, and long size B1 extends in the first direction dl, and short size B2 extends in a second direction d 2.3rd opening 332 can have the long size C1 being greater than short size C2, and long size C1 extends in a second direction d 2, and short size C2 extends in the first direction dl.4th opening 382 can have the long size E1 being greater than short size E2, and long size E1 extends in a second direction d 2, and short size E2 extends in the first direction dl.
With reference to figure 7-8C, first microelectronic element 336 and the second microelectronic element 353 can use known material (such as adhesive 301 etc.) to be attached to substrate 302, so that the front surface 357 of the front surface of the first microelectronic element 336 340 and the second microelectronic element 353 can directly be positioned on the first surface 304 of substrate 302.Bonding welding pad 342 on first microelectronic element 336 can directly be positioned at above the first opening 316, and the bonding welding pad 359 on the second microelectronic element 353 can be positioned at above the second opening 326.As shown, the first edge 344 of the first microelectronic element 336 and the first edge 361 of the second edge 345 and the second microelectronic element 353 and the second edge 362 parallel to each other, and to extend in the same direction.
3rd microelectronic element 368 and the 4th microelectronic element 388 and the first microelectronic element 336 and the second microelectronic element 353 can be positioned on substrate 302.As Fig. 7 and 8A illustrates best, the front surface 372 of the 3rd microelectronic element 368 covers the rear surface 338,355 of the first microelectronic element 336 and the second microelectronic element 353.Similarly, the front surface 392 of the 4th microelectronic element 388 covers the rear surface 338,355 of corresponding first microelectronic element 336 and the second microelectronic element 353.Distance piece 235 (Fig. 8 A, 8B) may be used for the part of the first surface 304 towards substrate 302 of support the 3rd microelectronic element 368 and the 4th microelectronic element 388, but does not cover the first microelectronic element 336 and the second microelectronic element 353.
As shown in Fig. 7 and 8B-8D, the respective first end of the 3rd microelectronic element 368 and the first microelectronic element 336 and the second microelectronic element 353 348,365 adjacent.Second end 350 of the 4th microelectronic element 388 and the first corresponding microelectronic element 336 and the second microelectronic element 353,367 adjacent.In addition, the first respective edge 376 and second edge 377 of the 3rd microelectronic element 368 and the first edge 396 of the 4th microelectronic element 388 and the second edge 397 extend on the direction vertical with the second edge 362 with first edge 361 at the first respective edge 344 of the first microelectronic element 336 and the second edge 345 and the second microelectronic element 353.Therefore, with reference to figure 9, the bonding welding pad 374 extended along the central area 946 (Fig. 8 B) of the 3rd microelectronic element 368 and bonding welding pad 394 that the central area 948 (Fig. 8 B) along the 4th microelectronic element 388 extends can extend on the corresponding bonding welding pad 342 of locating near the first microelectronic element 336 and the respective central area 950,952 of the second microelectronic element 353,359 vertical directions.As what describe about the embodiment with two microelectronic elements, 4th microelectronic element 388 can at least one row bonding welding pad 394', often row bonding welding pad has five or more bonding welding pads 394, and at least one row bonding welding pad 394' extends in one direction in the central area of the front surface of the 4th microelectronic element.
The orientation of corresponding microelectronic element on substrate 302 allow the bonding welding pad 342 (Fig. 8 D) of the first microelectronic element 336, second microelectronic element 353, the 3rd microelectronic element 368 and the 4th microelectronic element 388,359 (Fig. 8 B), 374,394 to the contact 311,309, second group, first group of corresponding contact on the second surface 306 of substrate 302, the electrical connection between the 3rd group of contact 313 and the 4th group of contact 314.This electrical connection can in the first opening 316, second opening 326, the 3rd opening 332 and the 4th opening 382 inside or through the first opening 316, second opening 326, the 3rd opening 332 and the 4th opening 382.In this embodiment, bonding wire 380A, 380B (Fig. 8 A), 380C, 380D (Fig. 8 B) of extending from corresponding first microelectronic element 336, second microelectronic element 353, the 3rd microelectronic element 368 and the 4th microelectronic element 388 extend through the first opening 316, second opening 326, the 3rd opening 332 and the 4th opening 382, and are connected to the contact 311,309, second group, corresponding first group of contact on substrate, the 3rd group of contact 313 and the 4th group of contact 314 (Fig. 8 A, 8B).
As shown in Figure 9, contact 311,309, second group, first group of contact, the 3rd group of contact 313 and the 4th group of contact 314 can be connected to the terminal contact with dispersion electric conducting material thereon (such as solder ball) by the trace 308 extended along the second surface 306 of substrate 302.Terminal may be used at least one parts micromodule 300 being connected to micromodule 300 outside.
Similar with the embodiment illustrated about Fig. 3,3A-3H and 6 and describe, substrate 302 can have the neighboring area extended between the one or more and corresponding periphery edge of substrate in opening 316,326,332,382.Such as, substrate neighboring area P6 and P8 that can have neighboring area P1 and P3 extended between the opposite end and the relative periphery edge of substrate 302 of the 3rd opening 332, neighboring area P2 and P4 extended between the opposite end and the relative periphery edge of substrate 302 of the 4th opening 382, neighboring area P5 and P7 extended between the opposite end and the relative periphery edge of substrate 302 of the first opening 316 and extend between the opposite end and the relative periphery edge of substrate 302 of the second opening 326.As shown in Figure 9, at least one terminal being exposed to second surface 306 place of substrate 302 can be arranged in each of neighboring area P1-P8.In other embodiments, one or more in the P1-P8 of neighboring area can not have any terminal be positioned at wherein.
In embodiment shown in Figure 9, or in any one embodiment herein in other embodiments disclosed, substrate 302 can have the hole extending through substrate 302 between first surface 304 and second surface 306.In one embodiment, one or more such hole can be arranged in the one or more of the neighboring area P1-P8 adjacent with one or more terminal 310, such as, or be positioned at the position of one or more terminal, hole 395 is positioned at neighboring area P1 at least in part.Underfill agent or sealant (sealant 399 such as shown in Fig. 8 B) can be injected by this hole 395, to cover at least some in contact 309 that at least some in the bonding welding pad 342 of microelectronic element 336 and bonding welding pad be connected electrically.This hole 395 can be positioned at any position on the surface along substrate 302, but in a preferred embodiment, one or more hole can be arranged in the one or more of neighboring area P1-P8.In specific example, sealant 399 can passing hole 395 to become the angle of about miter angle to inject with the front surface of the one or more microelectronic elements in microelectronic element 336,353,368 and 388.
As illustrated further in Fig. 9 A, micromodule 300' may further include buffer element 390, buffer element 390 is arranged between the isolated edge 345,361 of microelectronic element, and the contact area supported 340,357 of microelectronic element is adjacent with substrate 302.In one embodiment, buffer element 390 can regenerate at least one signal and the first microelectronic element 336, second microelectronic element 353, the 3rd microelectronic element 368 and the 4th microelectronic element 388 that are sent to by regenerated signal assembly 300' of receiving from buffer element at the terminal place of assembly.In this case, buffer element 390 for from terminal reception signal, regenerated signal, and it is one or more to be transferred to by regenerated signal in the microelectronic element on assembly 300'.A benefit of this configuration is to provide the isolation between microelectronic element in assembly 300' and connected circuit board, makes the interconnection short-term on assembly and the respective signal line electric isolution on circuit board.By this way, the signal reflex caused by the short-term stopped inadequately in assembly can be avoided.
With reference now to Figure 10-12, show the embodiment of stack assemblies 400, stack assemblies 400 comprises the microelectronic element of the center bonding being in flipped position.First with reference to Figure 10 and 11A, this embodiment is different in following degree: although the first microelectronic element 436 and the second microelectronic element 453 adjacent one another are, the first microelectronic element 436 and the second microelectronic element 453 not in the same plane.The same with preceding embodiment, first microelectronic element 436 is positioned at flipped position, so that the bonding welding pad 442 extended along the central area 958 (Figure 11 A) of the first microelectronic element 436 or the centre 1/3rd between the first edge and the second edge is exposed by the first opening 416 (Figure 11 A and 12) of substrate 402.Second microelectronic element 453 orientates covering first microelectronic element 436 as at least partially.As found out best in Figure 11 A, the first edge 465 of the second microelectronic element 453 covers the part at the second edge 445 of the rear surface 438 of the first microelectronic element 436.Then, the 3rd microelectronic element 468 and the 4th microelectronic element 488 orientate covering first microelectronic element 436 and the second microelectronic element 453 as, discuss as in the previous examples.Figure 11 B-11D further illustrates the different views seemed with the similar assembly in Fig. 7-9.
The same with preceding embodiment, bonding wire may be used for the bonding welding pad on corresponding microelectronic element to be connected with the contact on substrate.Bonding wire 449 on first microelectronic element 436 extends from the bonding welding pad 442 the first microelectronic element 436, through the first opening 416 in substrate 402 and the first group of contact 409 extended on substrate 402.Bonding wire 460 on second microelectronic element 453 extends through the second opening 426 from bonding welding pad 459, and is connected to second group of contact 411 on substrate 402.Bonding wire 475 on 3rd microelectronic element 468 extends through the 3rd opening 432 from bonding welding pad 474, and is connected to the 3rd group of contact 413 on substrate 402.As shown in figure 12, trace 408 may be used for being connected to terminal contact 410 on substrate 402 by often organizing contact 409,411,413,414.Terminal 410 may be used at least one parts that micromodule 400 is connected to micromodule 400 outside.
Similar with the embodiment illustrated about Fig. 4,4A-3H, 6 and 9 and describe, substrate 402 can have the neighboring area extended between the one or more and respective perimeter edge of substrate in opening 416,426,432,482.Such as, substrate neighboring area P6 and P8 that can have neighboring area P1 and P3 extended between the opposite end and the relative periphery edge of substrate 402 of the 3rd opening 432, neighboring area P2 and P4 extended between the opposite end and the relative periphery edge of substrate 402 of the 4th opening 482, neighboring area P5 and P7 extended between the opposite end and the relative periphery edge of substrate 402 of the first opening 416 and extend between the opposite end and the relative periphery edge of substrate 402 of the second opening 426.As shown in Figure 9, at least one terminal being exposed to second surface 406 place of substrate 402 can be arranged in each of neighboring area P1-P8.In other embodiments, one or more in the P1-P8 of neighboring area can not have any terminal be positioned at wherein.
Turn to Figure 13, in embodiment in figs. 10-12, micromodule 500 comprises radiator 552 further, a part for the front surface 592 of radiator 552 and the 4th microelectronic element 588 and rear surface 590 thermal communication.Radiator 552 can also extend, to help heat to be evenly distributed in the layout of stacking microelectronic element between the first microelectronic element 536 and the second microelectronic element 553.Radiator 552 can also improve the heat radiation to surrounding environment.Radiator 552 can be partly or entirely made up of any suitable Heat Conduction Material.The example of suitable Heat Conduction Material includes, but not limited to the combination of metal, graphite, heat-conductive bonding agent (such as heat-conduction epoxy resin), solder etc. or such material.In one example, radiator 552 can be the sheet metal of basic continous.In certain embodiments, the preformed radiator 552 be made up of metal or other Heat Conduction Materials can such as use Heat Conduction Material (such as heat-conductive bonding agent or thermal conductive greases) be attached to the rear surface 590 of the 4th microelectronic element 588 or be arranged on the rear surface 590 of the 4th microelectronic element 588.Adhesive (if existence) can be the flexible material of the relative motion between permission radiator and heat spreader attachment microelectronic element assembly thereon, such as, to adapt to the different heat expansion between the flexible element be attached.Radiator 552 can also contact the 3rd microelectronic element 568 (not shown), the first surface of the first microelectronic element 536 and a part for the second microelectronic element 553.Radiator 552 can be single chip architecture.Alternatively, radiator 552 can comprise the multiple heat sink part be spaced apart from each other.In certain embodiments, radiator 552 for solder layer or can comprise solder layer, and solder layer is directly bonded to the rear surface of the one or more microelectronic elements in the first microelectronic element 536, second microelectronic element 553, the 3rd microelectronic element 568 and the 4th microelectronic element 588 at least partially.
Although it should be understood that preceding embodiment discloses the stacking microelectronic element of the chip comprising center bonding, it is also possible for being included in by least one chip of Bu Shi center bonding in any one in above-mentioned microelectronic element.Such as, with reference to Figure 14, substantially similar with the embodiment in Fig. 4-6 stacking micromodule is shown.This embodiment is different in following degree: in order to adapt to the position of bonding welding pad along the edge of the second microelectronic element, amendment is necessary.
As shown in figure 14, the same with preceding embodiment, the second microelectronic element can comprise three regions, the first perimeter 968, perimeter 966, second and the central area 970 be positioned between the first perimeter 966 and the second perimeter 968.Bonding welding pad 659 (Figure 15) on second microelectronic element 653 is positioned on the first perimeter 966 of the front surface 657 of the second microelectronic element 653.In order to adapt to the position of bonding welding pad 659 on the first perimeter 966 of the second microelectronic element 653, the second opening 626 of substrate 602 is also positioned in the first perimeter 966, with edge 612 (Figure 14) direct neighbor of substrate 602.With reference to Figure 15, then, conducting connecting part can extend to second group of contact 611 on the second surface 606 of substrate 602 from the bonding welding pad 659 the second microelectronic element 653.Second group of contact 611 is electrically connected with the terminal contact 610 supporting solder ball 615 by trace 608.
Be understood that, although in embodiment disclosed in above, electrical connection between the contact of the bonding wire extending through the opening in substrate on the second surface setting up microelectronic element and substrate, but any known structure for setting up this connection or method can be used.Such as, in one embodiment, with reference to figure 16-17B, the first microelectronic element 736 and the second microelectronic element 753 stacking in the mode similar with the embodiment shown in Fig. 1-3.In this embodiment, show two kinds of other Bonding Types.This bonding techniques is disclosed in such as U.S. Patent No. 5,861, and in 666, the disclosure of this United States Patent (USP) is incorporated to herein by reference.
First with reference to figure 17A, the bonding wire 748 extending to first group of contact 709 on the second surface 706 of substrate 702 from the bonding welding pad 742 the first microelectronic element 736 is shown.Bonding wire 748 is substantially hard than bonding wire disclosed in preceding embodiment.Turn to now Figure 17 B, similar bonding wire 765 can extend to second group of contact 711 on the first surface 704 (instead of second surface 706 of substrate 702) of substrate 702 from the bonding welding pad the second microelectronic element 753.Through hole 766 can extend between the first surface 704 of substrate 702 and second surface 706.Through hole 766 can be filled with electric conducting material, is connected to be conducted electricity with the terminal contact 710 on the second surface 706 of substrate 702 contact on the first surface of substrate.
Various microelectronic element discussed above may be used for constructing various electronic system.Such as, with reference to Figure 18, system 1000 according to a further embodiment of the invention comprises the structure 1006 and other electronic units 1008 and 1010 that describe in the preceding embodiment of above micromodule.In the illustrated example, parts 1008 are semiconductor chip, and parts 1010 are display screen, but can use any other parts.Certainly, although illustrate only two other parts to clearly illustrate in figure 18, this system can comprise any amount of such parts.Structure 1006 described above can be such as, compound chip or comprise the structure of multiple chip.In further modification, two structures 1006 can be set, and any amount of such structure can be used.Structure 1006 and parts 1008 and 1010 are arranged in the common housing 1001 that schematically shows with dotted line, and where necessary each other electrical interconnection to form required circuit.In the example system illustrated, this system comprises circuit board 1002, such as flexible printed circuit board, and circuit board comprises the conductor that will only illustrate in a lot of conductors 1004, Figure 18 interconnected amongst one another for parts in a lot of conductor 1004.But this is only exemplary; Any suitable structure for the formation of electrical connection can be used.Housing 1001 is shown as the portable housing that can be used for such as mobile phone or personal digital assistant type, and screen 1010 is exposed to the surface of housing.When structure 1006 comprises light-sensitive element (such as imager chip), lens 1011 or other optics also can be provided for light is guided to this structure.Equally, the simplification system shown in Figure 18 is only exemplary; Structure discussed above can be used to manufacture other system, comprise the system being usually regarded as fixed structure, such as desktop computer, router etc.
It should be understood that each dependent claims that the present invention proposes can combine in the mode different from the mode proposed in original claims with feature.It will also be appreciated that the feature that describes about each embodiment can be shared with other features of embodiment of describing in various combination.
Although describe the present invention with reference to specific embodiment, it should be understood that these embodiments only illustrate principle of the present invention and application.Therefore it is to be understood that when not departing from the spirit and scope of the present invention that claims limit, much can revise illustrative embodiment and can be designed other and arranging.
Industrial applicibility
The present invention enjoys industrial applicibility widely, includes, but not limited to the method for microelectronic element and manufacture microelectronic element.

Claims (49)

1. a micromodule, comprising:
Substrate, described substrate has:
Relative first surface and second surface, each first direction at traversed by described first surface and described second surface and second direction extend;
Periphery edge, described periphery edge extends in this second direction between described first surface and described second surface;
First opening and the second opening, described first opening and described second opening extend between described first surface and described second surface, and each in described first opening and described second opening has the elongated first size and second size in this second direction shorter than described first size that extend in said first direction; With the neighboring area of described second surface, extend between the opening in described periphery edge and described first opening and described second opening of the described neighboring area of described second surface;
First microelectronic element, described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of described first register and the edge that extends between described front surface and described rear surface;
Second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of described second register; With
Multiple terminal, described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element, described multiple terminal is used at least one parts described micromodule being connected to described micromodule outside, at least one terminal in described multiple terminal is at least partially disposed in described neighboring area, make to extend in said first direction and through at least one terminal described pass straight through at least one opening in described first opening and described second opening or at least one overthe openings in described first opening and described second opening.
2. micromodule according to claim 1, wherein said periphery edge is the first periphery edge, and described neighboring area is the first neighboring area, and at least one terminal described in described multiple terminal is the first terminal,
Wherein said substrate has the second periphery edge that is relative with described first periphery edge and that extend between described first surface and described second surface in this second direction, and the second week edge regions of the described second surface that described substrate has in described second periphery edge and described first opening and described second opening to be extended between a described opening, and
At least one terminal in wherein said multiple terminal is the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in said first direction and through described second terminal pass straight through at least one opening in described first opening and described second opening or at least one overthe openings in described first opening and described second opening.
3. micromodule according to claim 1, wherein said neighboring area is the first neighboring area, a described opening in described first opening and described second opening is described first opening, and at least one terminal described in described multiple terminal is the first terminal
Wherein said substrate has the second week edge regions of the described second surface extended between described periphery edge and described second opening, and
At least one terminal in wherein said multiple terminal is the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in said first direction and through described second terminal pass straight through described second opening or through described second overthe openings.
4. micromodule according to claim 3, wherein said periphery edge is the first periphery edge, described substrate has the second periphery edge that is relative with described first periphery edge and that extend between described first surface and described second surface in this second direction, and described substrate has in described second periphery edge and the 3rd neighboring area of described second surface extended between corresponding described first opening and described second opening and 4th week edge regions
At least one terminal in wherein said multiple terminal is the 3rd terminal, described 3rd terminal is at least partially disposed in described 3rd neighboring area, make to extend in said first direction and through described 3rd terminal pass straight through described first opening or through described first overthe openings, and
At least one terminal in wherein said multiple terminal is the 4th terminal, described 4th terminal is at least partially disposed in described 4th week edge regions, make to extend in said first direction and through described 4th terminal pass straight through described second opening or through described second overthe openings.
5. micromodule according to claim 1, the described bonding welding pad of wherein said first microelectronic element and described second microelectronic element is electrically connected to the conducting element of described substrate.
6. micromodule according to claim 5, the described bonding welding pad of wherein said first microelectronic element is electrically connected to described conducting element by having to go between with first of the part of described first register, and the described bonding welding pad of described second microelectronic element is electrically connected to described conducting element by having to go between with second of the part of described second register.
7., wherein at least there is the one in following situation in micromodule according to claim 6: described first lead-in wire does not extend through described first opening, or described second lead-in wire does not extend through described second opening.
8. micromodule according to claim 5, the described bonding welding pad of wherein said first microelectronic element is electrically connected to described conducting element by extend through the first bonding wire of described first opening, and the described bonding welding pad of described second microelectronic element is electrically connected to described conducting element by extend through the second bonding wire of described second opening.
9. micromodule according to claim 8, wherein said first bonding wire extends through only described first opening, and described second bonding wire extends through only described second opening.
10. micromodule according to claim 1, the described edge of wherein said first microelectronic element is the first edge, and described first microelectronic element has second edge relative with described first edge, wherein said second microelectronic element has the first relative edge and the second edge, and wherein each microelectronic element has at least one row bonding welding pad, described at least one row bonding welding pad has five or more described bonding welding pads, described at least one row bonding welding pad extends in said first direction in the central area of the described front surface of described each micromodule, each central area extends the centre 1/3rd of the distance between corresponding described first edge and described second edge.
11. micromodules according to claim 1, wherein each microelectronic element active device for providing memory array function of being equipped with number ratio to provide the active device of any other function many.
12. micromodules according to claim 1, wherein said first microelectronic element has at the described front surface of described first microelectronic element and the width between the described edge extended between described rear surface and relative edge, and described second microelectronic element has at the described front surface of described second microelectronic element and the width between the relative edge extended between described rear surface, the described width of described first microelectronic element is greater than described second size of described first opening, and the described width of described second microelectronic element is greater than described second size of described second opening.
13. micromodules according to claim 1, one in wherein said first opening and described second opening extends to than another position closer to described periphery edge in described first opening and described second opening.
14. micromodules according to claim 1, wherein said substrate has the 3rd opening and the 4th opening that extend between described first surface and described second surface, each in described 3rd opening and described 4th opening has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction
Described micromodule comprises the 3rd microelectronic element and the 4th microelectronic element further, each microelectronic element in described 3rd microelectronic element and described 4th microelectronic element has the front surface of the described first surface towards described substrate, each microelectronic element in described 3rd microelectronic element and described 4th microelectronic element have at the front surface place of described each microelectronic element and with the bonding welding pad of corresponding described 3rd opening or described 4th register, and
The described bonding welding pad of wherein said 3rd microelectronic element and described 4th microelectronic element is electrically connected to the conducting element of described substrate.
15. micromodules according to claim 14, wherein said substrate is included in the hole extended between the inherent described first surface in described neighboring area and described second surface further, and described hole flows through described hole for allowing sealant or underfill.
16. 1 kinds of micromodules, comprising:
Substrate, described substrate has:
Relative first surface and second surface, each first direction at traversed by described first surface and described second surface and second direction extend;
Periphery edge, described periphery edge extends in this second direction between described first surface and described second surface;
First opening and the second opening, described first opening and described second opening extend between described first surface and described second surface, described first opening is between described second opening and described periphery edge and have the elongated first size and second size in this second direction shorter than described first size that extend in said first direction, and described second opening has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction; With
The neighboring area of described second surface, the described neighboring area of described second surface extends between described periphery edge and described first opening;
First microelectronic element, described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of described first register and the edge that extends between described front surface and described rear surface;
Second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of described second register; With
Multiple terminal, described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element, described multiple terminal is used at least one parts described micromodule being connected to described micromodule outside, at least one terminal in described multiple terminal is at least partially disposed in described neighboring area, make to extend in said first direction and through at least one terminal described pass straight through described first opening or through described first overthe openings.
17. micromodules according to claim 16, wherein said periphery edge is the first periphery edge, and described neighboring area is the first neighboring area, and at least one terminal described in described multiple terminal is the first terminal,
Wherein said substrate has the second periphery edge extended between described first surface and described second surface in said first direction, and described substrate has the second week edge regions of the described second surface extended between described second periphery edge and described second opening, and
At least one terminal in wherein said multiple terminal is the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in this second direction and through described second terminal pass straight through described second opening or through described second overthe openings.
18. micromodules according to claim 17, wherein said substrate has and three periphery edge that in said first direction described first surface and described second surface between extend relative with described second periphery edge, and described substrate has the 3rd neighboring area of the described second surface extended between described 3rd periphery edge and described second opening, and
At least one terminal in wherein said multiple terminal is the 3rd terminal, described 3rd terminal is at least partially disposed in described 3rd neighboring area, make to extend in this second direction and through described 3rd terminal pass straight through described second opening or through described second overthe openings.
19. 1 kinds of micromodules, comprising:
Substrate, described substrate has:
Relative first surface and second surface, each first direction at traversed by described first surface and described second surface and second direction extend;
Periphery edge, described periphery edge extends in said first direction between described first surface and described second surface;
First opening, described first opening extends and has the elongated first size and second size in this second direction shorter than described first size that extend in said first direction between described first surface and described second surface;
Second opening, described second opening extends and has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction between described first surface and described second surface; With
The neighboring area of described second surface, the described neighboring area of described second surface extends between described periphery edge and described second opening;
First microelectronic element, described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of described first register and the edge that extends between described front surface and described rear surface;
Second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of described second register; With
Multiple terminal, described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element, described multiple terminal is used at least one parts described micromodule being connected to described micromodule outside, at least one terminal in described multiple terminal is at least partially disposed in described neighboring area, make to extend in this second direction and through at least one terminal described pass straight through described second opening or through described second overthe openings.
20. micromodules according to claim 19, wherein said periphery edge is the first periphery edge, and described neighboring area is the first neighboring area, and at least one terminal described in described multiple terminal is the first terminal,
Wherein said substrate has the second periphery edge that is relative with described first neighboring area and that extend between described first surface and described second surface in said first direction, and described substrate has the second week edge regions of the described second surface extended between described second periphery edge and described second opening, and
At least one terminal in wherein said multiple terminal is the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in this second direction and through described second terminal pass straight through described second opening or through described second overthe openings.
21. micromodules according to claim 19, wherein said neighboring area is the first neighboring area, at least one terminal described in described multiple terminal is the first terminal, the described edge of described first microelectronic element is the first edge, and described substrate has the 3rd opening, described 3rd opening extends and has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction between described first surface and described second surface
Wherein said substrate has the second week edge regions of the described second surface extended between described periphery edge and described 3rd opening, and
At least one terminal in wherein said multiple terminal is the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in this second direction and through described second terminal pass straight through described 3rd opening or through described 3rd overthe openings
Described micromodule comprises the 3rd microelectronic element further, described 3rd microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the second edge of described first microelectronic element relative with described first edge of described first microelectronic element front surface and at the described front surface place of described 3rd microelectronic element and with the bonding welding pad of described 3rd register.
22. micromodules according to claim 21, the front surface of wherein said second microelectronic element and described 3rd microelectronic element is positioned in single plane.
23. micromodules according to claim 21, wherein said periphery edge is the first periphery edge, described substrate has the second periphery edge that is relative with described first periphery edge and that extend between described first surface and described second surface in said first direction, and described substrate has in described second periphery edge and the 3rd neighboring area of described second surface extended between corresponding described second opening and described 3rd opening and 4th week edge regions
At least one terminal in wherein said multiple terminal is the 3rd terminal, described 3rd terminal is at least partially disposed in described 3rd neighboring area, make to extend in this second direction and through described 3rd terminal pass straight through described first opening or through described first overthe openings, and
At least one terminal in wherein said multiple terminal is the 4th terminal, described 4th terminal is at least partially disposed in described 4th week edge regions, make to extend in this second direction and through described 4th terminal pass straight through described second opening or through described second overthe openings.
24. micromodules according to claim 21, wherein said substrate has the 4th opening, described 4th opening extends and has the elongated first size and second size in this second direction shorter than described first size that extend in said first direction between described first surface and described second surface, described micromodule comprises the 4th microelectronic element further, described 4th microelectronic element have at the front surface place of described 4th microelectronic element and with the bonding welding pad of described 4th register.
25. micromodules according to claim 24, wherein said second microelectronic element, described 3rd microelectronic element has the first relative edge and the second edge with each microelectronic element in described 4th microelectronic element, and wherein each microelectronic element has at least one row bonding welding pad, described at least one row bonding welding pad has five or more described bonding welding pads, described at least one row bonding welding pad in the central area of the described front surface of described each micromodule with described first edge of described each microelectronic element and the direction of described second sides aligned parallel on extend, each central area extends the centre 1/3rd of the distance between corresponding described first edge and described second edge.
26. 1 kinds of micromodules, comprising:
Substrate, described substrate has:
First dielectric element and the second dielectric element, described first dielectric element has relative top surface and basal surface with each in described second dielectric element, each first direction at traversed by described top surface and described basal surface and second direction extend, described first dielectric element and described second dielectric element are spaced apart from each other at least one direction in the described first direction or described second direction of traversed by, the first surface of described substrate comprises the described top surface of described first dielectric element and described second dielectric element, the second surface of described substrate comprises the described basal surface of described first dielectric element and described second dielectric element,
First opening, described first opening is limited by the open region between described first dielectric element and the adjacent opposite edges of described second dielectric element, each in described adjacent opposite edges has the first size extended in said first direction, and described first opening has second size in this second direction shorter than described first size; With
Second opening, described second opening by described second dielectric element around;
First microelectronic element, described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of a register in described first opening and described second opening and the edge that extends between described front surface and described rear surface;
Second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of another register in described first opening and described second opening; With
Multiple terminal, described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element, and described multiple terminal is used at least one parts described micromodule being connected to described micromodule outside.
27. micromodules according to claim 26, wherein said second opening has the elongated first size and second size in this second direction shorter than described first size that extend in said first direction.
28. micromodules according to claim 26, wherein said second opening has the elongated first size and second size in said first direction shorter than described first size that extend in this second direction.
29. micromodules according to claim 26, wherein said substrate is included in the dielectric regions extended between described first dielectric element and the described adjacent opposite edges of described second dielectric element further, the described first surface of described substrate comprises the top surface of described dielectric regions, and described second surface comprises the basal surface of described dielectric regions.
30. micromodules according to claim 26, wherein said dielectric regions has than described first dielectric element and the high Young's modulus in the plane of described substrate of described second dielectric element.
31. micromodules according to claim 26, wherein in described bonding welding pad and described first register at the described front surface place of described first microelectronic element, and described bonding welding pad at the described front surface place of described second microelectronic element and described second register.
32. micromodules according to claim 31, wherein said multiple terminal comprises the first terminal and second terminal of the described bottom surface being exposed to described first dielectric element and described second dielectric element accordingly, and at least some in the described bonding welding pad of wherein said first microelectronic element is electrically connected to described the first terminal and described second terminal.
33. micromodules according to claim 26, wherein in described bonding welding pad and described second register at the described front surface place of described first microelectronic element, and described bonding welding pad at the described front surface place of described second microelectronic element and described first register.
34. 1 kinds of micromodules, comprising:
Substrate, described substrate has relative first surface and second surface, each first direction at traversed by described first surface and described second surface and second direction extend, described substrate has the first dielectric element and the second dielectric element, and described first dielectric element and described second dielectric element are spaced apart from each other at least one direction in the described first direction or described second direction of traversed by;
First microelectronic element, described first microelectronic element has towards the front surface of described first surface, at the bonding welding pad at the described front surface place rear surface relative with described front surface and the edge that extends between described front surface and described rear surface;
Second microelectronic element, described second microelectronic element has the described rear surface towards described first microelectronic element and protrudes past the bonding welding pad at the front surface at the described edge of described first microelectronic element and the described front surface place at described second microelectronic element; With
Multiple terminal, described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element, and described multiple terminal is used at least one parts described micromodule being connected to described micromodule outside.
35. micromodules according to claim 34, at least one microelectronic element in wherein said first microelectronic element and described second microelectronic element covers the described top surface of each dielectric element in described first dielectric element and described second dielectric element at least in part.
36. micromodules according to claim 34, the described edge of wherein said first microelectronic element is the first edge, and described first microelectronic element has second edge relative with described first edge, wherein said second microelectronic element has the first relative edge and the second edge, and wherein each microelectronic element has at least one row bonding welding pad, there are in described at least one row bonding welding pad five or more described bonding welding pads, described at least one row bonding welding pad extends in said first direction in the central area of the described front surface of described each micromodule, each central area extends the centre 1/3rd of the distance between corresponding described first edge and described second edge.
37. 1 kinds of micromodules, comprising:
Substrate, described substrate has:
First dielectric element, second dielectric element and the 3rd dielectric element, described first dielectric element, described second dielectric element has relative top surface and basal surface with each in described 3rd dielectric element, each first direction at traversed by described top surface and described basal surface and second direction extend, described first dielectric element, described second dielectric element and described 3rd dielectric element are spaced apart from each other at least one direction in the described first direction or described second direction of traversed by, the first surface of described substrate comprises described first dielectric element, the described top surface of described second dielectric element and described 3rd dielectric element, the second surface of described substrate comprises described first dielectric element, the described basal surface of described second dielectric element and described 3rd dielectric element,
First opening, described first opening is limited by the open region between described first dielectric element and the adjacent opposite edges of described second dielectric element, each in described adjacent opposite edges has the first size extended in said first direction, and described first opening has second size in this second direction shorter than described first size; With
Second opening, described second opening is limited by the open region between described second dielectric element and the adjacent opposite edges of described 3rd dielectric element, each in described adjacent opposite edges has the first size extended in said first direction, and described first opening has second size in this second direction shorter than described first size;
First microelectronic element, described first microelectronic element has towards the front surface of described first surface, at described front surface place and the rear surface relative with described front surface with the bonding welding pad of a register in described first opening and described second opening and the edge that extends between described front surface and described rear surface;
Second microelectronic element, described second microelectronic element there is the described rear surface towards described first microelectronic element and protrude past the described edge of described first microelectronic element front surface and at the described front surface place of described second microelectronic element and with the bonding welding pad of another register in described first opening and described second opening; With
Multiple terminal, described multiple terminal is exposed to described second surface place and is electrically connected with the described bonding welding pad of described first microelectronic element and described second microelectronic element, and described multiple terminal is used at least one parts described micromodule being connected to described micromodule outside.
38. according to micromodule according to claim 37, wherein in described bonding welding pad and described first register at the described front surface place of described first microelectronic element, and described bonding welding pad at the described front surface place of described second microelectronic element and described second register.
39. according to micromodule according to claim 38, wherein said first microelectronic element covers the described top surface of each dielectric element in described first dielectric element and described second dielectric element at least in part, and described second microelectronic element covers the described top surface of each dielectric element in described second dielectric element and described 3rd dielectric element at least in part.
40. according to micromodule according to claim 37, wherein in described bonding welding pad and described second register at the described front surface place of described first microelectronic element, and described bonding welding pad at the described front surface place of described second microelectronic element and described first register.
41. according to micromodule according to claim 37, wherein said multiple terminal comprises the first terminal of the described bottom surface being exposed to described first dielectric element, described second dielectric element and described 3rd dielectric element accordingly, the second terminal and the 3rd terminal, and at least some in the described bonding welding pad of at least one microelectronic element in wherein said first microelectronic element and described second microelectronic element is electrically connected to two or more terminals in described the first terminal, described second terminal and described 3rd terminal.
42. micromodules according to claim 41, at least some in the described bonding welding pad of wherein said first microelectronic element is electrically connected to described the first terminal and described second terminal.
43. micromodules according to claim 42, at least some in the described bonding welding pad of wherein said second microelectronic element is electrically connected to described second terminal and described 3rd terminal.
44. according to micromodule according to claim 37, wherein said substrate has the neighboring area of the described second surface extended between periphery edge and an opening in described periphery edge and described first opening and described second opening extended between described first surface and described second surface in this second direction, and
At least one terminal in wherein said multiple terminal is at least partially disposed in described neighboring area, make to extend in said first direction and through at least one terminal described pass straight through at least one opening in described first opening and described second opening or at least one overthe openings in described first opening and described second opening.
45. micromodules according to claim 44, wherein said neighboring area is the first neighboring area, an opening in described first opening and described second opening is described first opening, and at least one terminal described in described multiple terminal is the first terminal
Wherein said substrate have described periphery edge and and described second opening between the second week edge regions of described second surface that extends, and
At least one terminal in wherein said multiple terminal is the second terminal, described second terminal is at least partially disposed in described second week edge regions, make to extend in said first direction and through described second terminal pass straight through described second opening or through described second overthe openings.
46. micromodules according to claim 45, wherein said second dielectric element comprises the part of described first neighboring area and described second week edge regions.
47. micromodules according to claim 45, wherein said first dielectric element comprises a part for described first neighboring area, and described 3rd dielectric element comprises a part for described second week edge regions.
48. 1 kinds of systems, comprise the micromodule according to any one of claim 1,16,19,22,26 or 37 and are electrically connected to other electronic units one or more of described micromodule.
49. systems according to claim 48, comprise housing further, and described micromodule and other electronic unit described are mounted to described housing.
CN201380051357.6A 2012-08-02 2013-08-01 Multiple die face-down stacking for two or more die Pending CN104718619A (en)

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