CN104713054B - composite radiating structure - Google Patents
composite radiating structure Download PDFInfo
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- CN104713054B CN104713054B CN201510142282.3A CN201510142282A CN104713054B CN 104713054 B CN104713054 B CN 104713054B CN 201510142282 A CN201510142282 A CN 201510142282A CN 104713054 B CN104713054 B CN 104713054B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2270/00—Resin or rubber layer containing a blend of at least two different polymers
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2311/00—Metals, their alloys or their compounds
- B32B2311/24—Aluminium
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2383/00—Polysiloxanes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
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Abstract
A kind of composite radiating structure, including：It is sequentially overlapped insulating layer, heat-conducting layer, heat transfer layer, heat dissipating layer and the protective layer of setting.The first filling of setting adhesive layer between insulating layer and heat-conducting layer, is arranged the second filling adhesive layer between heat-conducting layer and heat transfer layer, third filling adhesive layer is provided between heat transfer layer and heat dissipating layer, and the 4th filling adhesive layer is arranged between heat dissipating layer and protective layer.First filling adhesive layer includes each component of following mass parts：1 part~20 parts of 300 parts~1000 parts of nano alumina particles, 5 parts~30 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicones.Above-mentioned composite radiating structure can obtain that good insulating, the coefficient of expansion are low, thermal coefficient is big, good heat dissipation effect and light advantage by being sequentially overlapped setting insulating layer, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer.
Description
Technical field
The present invention relates to technical field of heat dissipation, more particularly to a kind of composite radiating structure.
Background technology
The fast development of LED industry, has pulled the development of upstream materials industry significantly, also further promotes high end materials neck
The breakthrough in domain.Wherein, a large amount of heat sink material can be used in LED lamp, including the potted element of LED wafer, LED light are thoroughly
Mirror, light-scattering component, high efficiency and heat radiation element, light reflection and light diffusing board etc..
All the time, heat dissipation is bad can lead to power supply damage, light decay quickening, reduced lifetime, be LED illumination always
The most important thing that system performance is promoted.Traditional three kinds are used for the material of LED radiator, including aluminium, plastics and ceramics, three
Respectively have quality, but can not still meet simultaneously the good insulating needed for LED radiator material, the coefficient of expansion is low, thermal coefficient is big,
The advantages of good heat dissipation effect, light and good mechanical property.
For example, Chinese patent 201310313412.6 discloses a kind of magnesium alloy LED bulb Radiator in Die Casting part and its system
Method is made, the specific open present invention provides a kind of magnesium alloy LED bulb Radiator in Die Casting part, die casting ingredient % by weight
For：Al1.7~2.5, Zn≤0.2, Mn >=0.2, Cu≤0.008, Fe≤0.004, Ni≤0.001, the other impurities of Si≤0.05
The sum of 0.01, Mg surpluses.There is provided a kind of manufacturing method of magnesium alloy LED bulb Radiator in Die Casting part simultaneously.The effect of the present invention
It is that LED bulb radiator is manufactured by using the magnesium alloy of this kind of ingredient so that LED illumination light bulb has good thermal diffusivity
Can, weight is substantially reduced, simple for process, dimensional accuracy is high, is shown under same test conditions by thermal diffusivity test result, should
Magnesium alloy junction temperature compared with AZ31 magnesium alloys has dropped 1~2 DEG C, is equivalent to LED life and extends 4~16%, luminous flux declines
Slow down 1%~2%.Reduce the manufacturing cost of LED light device and the use cost of user.However, above-mentioned patent disclosure
Material still remain poor insulativity, be not easy safety and the defect of heavier mass.
For another example, Chinese patent 201110043870.3 discloses a kind of heat-conducting thermosetting molding composite material and its use
On the way, specific open the invention discloses a kind of heat-conducting thermosetting molding composite material and application thereof, base stock and its again
Amount percentage composition is (1) thermoset substrate resin 15-65%；(2) thermal coefficient of conducting filler 20-80%, the filler are big
In 1W/m. DEG C；(3) other additives, such as toughener, reinforcing agent, stabilizer etc..The invention also discloses aforementioned heat-conducting type thermosettings
Property molded composites be used to prepare LED illumination radiating piece, forming temperature can control to less than usual and carry out scolding tin operation
220 DEG C so that the packaging technology of LED light and radiator can be combined into one with the moulding process of thermosets radiator, can
The real estate of LED light or heat-conducting metal holder to be directly connected with Heat Conduction Material, molding die and its auxiliary system have
Have the characteristics that can effective heat insulation and controlling temperature and easy to clean, can effectively reduce the processing of LED light and cost is made, improve LED radiator
Heat-sinking capability, to reduce the running temperature of LED component.However, the material of above-mentioned patent disclosure still remains thermal coefficient
The smaller and high defect of the coefficient of expansion.
For another example, Chinese patent 03126663.0 discloses a kind of 6063 aluminum alloy materials of modified, and specific disclosure is originally
A kind of 6063 aluminum alloy materials of modified of disclosure of the invention, the material are to be added with weight percentage in former 6063 aluminium alloys
For 0.11~0.2% mixed rare-earth elements La and Ce, the wherein additive amount of rare-earth elements La is 0.036~0.14%.Rare earth
Application of the element in aluminium alloy the result shows that, appropriate rare earth is added in aluminium alloy can improve machinery, physics and craftsmanship
Can, purification is shown as, strengthens and refines, is made using material of the present invention in semiconductor and air conditioner and condenser/evaporator device
Radiator has good extrudability and electrical and thermal conductivity performance.However, the material of above-mentioned patent disclosure still remains insulating properties
Difference was not easy safety, the not ideal enough defect with heavier mass of heat dissipation performance.
Invention content
Based on this, it is necessary to provide that a kind of good insulating, the coefficient of expansion is low, thermal coefficient is big, good heat dissipation effect and light
Composite radiating structure.
A kind of composite radiating structure, including：It is sequentially overlapped insulating layer, heat-conducting layer, heat transfer layer, heat dissipating layer and the protection of setting
Layer,
The first filling of setting adhesive layer between the insulating layer and the heat-conducting layer, the heat-conducting layer and the heat transfer layer it
Between setting second filling adhesive layer, be provided between the heat transfer layer and the heat dissipating layer third filling adhesive layer, the heat dissipation
The 4th filling adhesive layer of setting between layer and the protective layer；
The first filling adhesive layer includes each component of following mass parts：300 parts~1000 parts of nano alumina particles,
5 parts~30 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicon trees
1 part~20 parts of fat；
The second filling adhesive layer includes each component of following mass parts：200 parts~800 parts of nano alumina particles,
10 parts~40 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicon trees
1 part~20 parts of fat；
The third filling adhesive layer includes each component of following mass parts：200 parts~700 parts of nano alumina particles,
10 parts~40 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicon trees
1 part~20 parts of fat；
The 4th filling adhesive layer includes each component of following mass parts：150 parts~700 parts of nano alumina particles,
15 parts~45 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicon trees
1 part~20 parts of fat.
The first filling adhesive layer includes each component of following mass parts in one of the embodiments,：It is nano oxidized
800 parts~1000 parts of alumina particles, 20 parts~30 parts of methyl vinyl silicone rubber, 40 parts~50 parts of vinyl silicone oil, dimethyl-silicon
15 parts~20 parts of 80 parts~100 parts of oil and MQ silicones.
The first filling adhesive layer includes each component of following mass parts in one of the embodiments,：It is nano oxidized
20 parts of 900 parts of alumina particles, 25 parts of methyl vinyl silicone rubber, 45 parts of vinyl silicone oil, 85 parts of dimethicone and MQ silicones.
The second filling adhesive layer includes each component of following mass parts in one of the embodiments,：It is nano oxidized
500 parts~700 parts of alumina particles, 20 parts~30 parts of methyl vinyl silicone rubber, 30 parts~40 parts of vinyl silicone oil, dimethicone
50 parts~80 parts and 10 parts~15 parts of MQ silicones.
The second filling adhesive layer includes each component of following mass parts in one of the embodiments,：It is nano oxidized
15 parts of 600 parts of alumina particles, 15 parts of methyl vinyl silicone rubber, 35 parts of vinyl silicone oil, 65 parts of dimethicone and MQ silicones.
The 4th filling adhesive layer includes each component of following mass parts in one of the embodiments,：It is nano oxidized
150 parts~450 parts of alumina particles, 15 parts~25 parts of methyl vinyl silicone rubber, 10 parts~25 parts of vinyl silicone oil, dimethicone
80 parts~100 parts and 1 part~10 parts of MQ silicones.
The 4th filling adhesive layer includes each component of following mass parts in one of the embodiments,：It is nano oxidized
5 parts of 250 parts of alumina particles, 18 parts of methyl vinyl silicone rubber, 20 parts of vinyl silicone oil, 95 parts of dimethicone and MQ silicones.
The insulating layer includes each component of following mass parts in one of the embodiments,：40 parts~70 parts of silicon carbide,
13 parts~55 parts of alundum (Al2O3), 2 parts~15 parts of silica, 3 parts~25 parts of binder, 2 parts~20 parts of kaolin, magnesia
0.5 part~2 parts, Dongyang is 0.5 part~2 parts native, 0.2 part~0.5 part of 0.5 part~2 parts of light weight calcium and rare earth oxide.
The heat-conducting layer includes each component of following mass parts in one of the embodiments,：80 parts~95 parts of graphene,
0.1 part~20 parts of 0.1 part~20 parts of carbon nanotube and carbon nano-fiber.
The first filling adhesive layer, the second filling adhesive layer, third filling in one of the embodiments,
The thickness ratio of adhesive layer and the 4th filling adhesive layer is 1~1.5：2~2.5：3~3.5：4~4.5.
Insulating layer, heat-conducting layer, heat transfer layer, heat dissipating layer and protective layer is arranged by being sequentially overlapped in above-mentioned composite radiating structure,
It can obtain that good insulating, the coefficient of expansion are low, thermal coefficient is big, good heat dissipation effect and light advantage.
Description of the drawings
Fig. 1 is the structural schematic diagram of the composite radiating structure of an embodiment of the present invention；
Fig. 2 is the partial structural diagram of the composite radiating structure of another embodiment of the present invention；
Fig. 3 is the partial structural diagram of the composite radiating structure of another embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the composite radiating structure of another embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the LED lamp of an embodiment of the present invention.
Specific implementation mode
In order to make the foregoing objectives, features and advantages of the present invention clearer and more comprehensible, below in conjunction with the accompanying drawings to the present invention
Specific implementation mode be described in detail.Many details are elaborated in the following description in order to fully understand this hair
It is bright.But the invention can be embodied in many other ways as described herein, those skilled in the art can be not
Similar improvement is done in the case of violating intension of the present invention, therefore the present invention is not limited by following public specific embodiment.
For example, the composite radiating structure of an embodiment of the present invention, including：Be sequentially overlapped the insulating layer of setting, heat-conducting layer,
The first filling adhesive layer, the heat-conducting layer is arranged in heat transfer layer, heat dissipating layer and protective layer between the insulating layer and the heat-conducting layer
The second filling of setting adhesive layer, it is viscous to be provided with third filling between the heat transfer layer between the heat transfer layer and the heat dissipating layer
Layer is closed, the 4th filling adhesive layer is set between the heat dissipating layer and the protective layer；The first filling adhesive layer includes as follows
The each component of mass parts：300 parts~1000 parts of nano alumina particles, 5 parts~30 parts of methyl vinyl silicone rubber, vinyl silicon
1 part~20 parts of 10 parts~50 parts of oil, 10 parts~100 parts of dimethicone and MQ silicones；Described second, which fills adhesive layer, includes
The each component of following mass parts：200 parts~800 parts of nano alumina particles, 10 parts~40 parts of methyl vinyl silicone rubber, ethylene
1 part~20 parts of 10 parts~50 parts of base silicone oil, 10 parts~100 parts of dimethicone and MQ silicones；The third fills adhesive layer
Include each component of following mass parts：200 parts~700 parts of nano alumina particles, 10 parts~40 parts of methyl vinyl silicone rubber,
1 part~20 parts of 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicones；4th filling is viscous
Close each component that layer includes following mass parts：150 parts~700 parts of nano alumina particles, 15 parts of methyl vinyl silicone rubber~
45 parts, 10 parts~50 parts of vinyl silicone oil, 1 part~20 parts of 10 parts~100 parts of dimethicone and MQ silicones.
Referring to Fig. 1, its structural schematic diagram for the composite radiating structure 10 of an embodiment of the present invention.
Composite radiating structure 10 includes：It is sequentially overlapped insulating layer 100, heat-conducting layer 200, heat transfer layer 300, the heat dissipating layer of setting
400 and protective layer 500, i.e. insulating layer 100, heat-conducting layer 200, heat transfer layer 300, heat dissipating layer 400 and protective layer 500 be sequentially overlapped patch
It is attached, that is to say, that heat-conducting layer 200 is attached on insulating layer 100, and heat transfer layer 300 is attached on heat-conducting layer 200, and heat dissipating layer 400 pastes
It invests on heat transfer layer 300, protective layer 500 is attached on heat dissipating layer 400.
It should be noted that the insulating layer of an embodiment of the present invention is directly contacted with pyrotoxin, for example, described exhausted
Edge layer is contacted with LED light, i.e., LED light is directly installed on the insulating layer, for another example, the base of the insulating layer and mounted LED lamp
Plate contacts, and for another example, LED light is located in the cavity that the insulating layer surrounds, to ensure that the luminous heat generated of LED light can be direct
It is transferred to the insulating layer, certainly, LED light is not limited to the above situation with the position of the insulating layer and structural relation, the present invention
The position of the insulating layer and LED light in embodiment and structural relation can also be had using well known to those skilled in the art
The other embodiment of same effect, details are not described herein.
For example, the insulating layer of an embodiment of the present invention, good with insulation effect, thermal coefficient is big and coefficient of thermal expansion
Low advantage, in this way, when the heat of LED light is directly delivered to the insulating layer, the insulating layer can quickly and in time
The heat for guiding the aggregation of LED light near zone, to ensure the normal work of LED light.Secondly as the insulating layer and LED light
The distance between recently, the heat conduction load undertaken is maximum, when the coefficient of thermal expansion of the insulating layer is low, so that it may to avoid institute
It states and generates gap between insulating layer and the heat-conducting layer, and the insulating layer itself is avoided to generate gap, and then can be to avoid this
The problem of thermal coefficient generated behind gap and gap filling air reduces.Finally, due between the insulating layer and LED light
Distance recently, is easy to happen the problem of electric elements are directly contacted with the insulating layer, when the insulation effect of the insulating layer is good
When, so that it may it is powered to avoid insulating layer, to improve the security performance of the composite radiating structure, safety standard is higher.
For example, the insulating layer of an embodiment of the present invention comprising each component of following mass parts：Silicon carbide 40 parts~70
Part, 13 parts~55 parts of alundum (Al2O3), 2 parts~15 parts of silica, 3 parts~25 parts of binder, 2 parts~20 parts of kaolin, oxygen
Change 0.2 part~0.5 part of 0.5 part~2 parts of magnesium, 0.5 part~2 parts of Dongyang soil, 0.5 part~2 parts of light weight calcium and rare earth oxide.
Above-mentioned insulating layer mixes remaining raw material that can be used for preparing ceramics using silicon carbide as primary raw material,
So that above-mentioned insulating layer has been provided simultaneously with, thermal coefficient height, good insulation preformance, coefficient of thermal expansion are low and heat resistance is preferable
The advantages of, in addition, above-mentioned insulating layer also has the advantages that be readily produced manufacture and manufacturing cost is low.
Preferably, the insulating layer of an embodiment of the present invention includes each component of following mass parts：Silicon carbide 50 parts~60
Part, 30 parts~50 parts of alundum (Al2O3), 0 part~15 parts of silica 1,10 parts~20 parts of binder, 15 parts~20 parts of kaolin,
0.3 part~0.4 part of 1 part~1.5 parts of magnesia, 1 part~1.5 parts of Dongyang soil, 1 part~1.5 parts of light weight calcium and rare earth oxide.
Preferably, the insulating layer of an embodiment of the present invention includes each component of following mass parts：55 parts of silicon carbide, three oxygen
Change 40 parts of two aluminium, 3 parts of silica 1,15 parts of binder, 18 parts of kaolin, 1.5 parts of magnesia, 1.5 parts of Dongyang soil, light weight calcium
1.5 parts and 0.3 part of rare earth oxide.
For example, the present invention also provides a kind of preparation methods of the insulating layer of any of the above-described embodiment comprising such as
Lower step：By said ratio by silicon carbide, alundum (Al2O3), silica, binder, kaolin, magnesia, Dongyang is native, gently
Matter calcium and rare earth oxide mixing；Above-mentioned insulating layer is obtained after plasticizing, extrusion forming, cooling and demoulding.
It should be noted that because above-mentioned heat-conducting layer is directly bonded with the insulating layer, then the insulating layer can will be from LED
The heat that lamp is absorbed into is directly passed to the heat-conducting layer, and this requires the heat-conducting layers to have high thermal coefficient, can be with
It will be rapidly transmitted on the heat-conducting layer from the heat that the insulating layer is absorbed into, in addition, also require the heat-conducting layer while having
There are preferable heat dissipation performance and lower coefficient of thermal expansion.
For example, the heat-conducting layer of an embodiment of the present invention, with thermal coefficient height, perfect heat-dissipating and good mechanical property
The advantages of, in this way, when the heat being absorbed into from LED light is directly passed to the heat-conducting layer by the insulating layer, then described exhausted
The heat that edge layer is absorbed into can be rapidly transmitted on the heat-conducting layer, and during heat conduction, be based on the heat-conducting layer
Excellent heat dissipation performance, can also will be in the heat loss on the heat-conducting layer to extraneous air.Secondly as the heat conduction
For layer also at a distance from LED light relative close, the temperature of itself also can be higher, still, lower based on the heat-conducting layer
Coefficient of thermal expansion, so that it may generate gap to avoid between the heat-conducting layer and the heat transfer layer, it is ensured that the two is bonded close
Property.
For example, the heat-conducting layer of an embodiment of the present invention comprising each component of following mass parts：Graphene 80 parts~95
Part, 0.1 part~20 parts of 0.1 part~20 parts of carbon nanotube and carbon nano-fiber.
Above-mentioned heat-conducting layer is primary raw material by using graphene so that its thermal coefficient is greatly improved, and leads
Thermal effect is preferable.In addition, again heat dissipation channel can be formed, heat dissipation performance is also preferable by adding carbon nanotube and carbon fiber.
Herein it is emphasized that since above-mentioned heat-conducting layer uses the preferable material of this conductive effect of graphene, because
This, the conductive layer is bonded by the present invention with the insulating layer, the circuit element inside LED lamp is isolated, to avoid
It states heat-conducting layer directly to charge, and then improves the security performance of the composite radiating structure, safety standard is higher.
Preferably, heat-conducting layer includes each component of following mass parts：85 parts~90 parts of graphene, carbon nanotube 5 parts~15
5 parts~15 parts of part and carbon nano-fiber.
Preferably, heat-conducting layer includes each component of following mass parts：90 parts of graphene, 10 parts of carbon nanotube and Nano carbon fibers
10 parts of dimension.
It should be noted that two layers before passing through because of the luminous heat generated of LED light, i.e., the described insulating layer and the heat-conducting layer
Afterwards, understand in the heat loss of some to extraneous air.Further, since the cost of the heat-conducting layer is higher, it is main former
Because being, the primary raw material of the heat-conducting layer is the higher graphene of manufacturing cost, therefore, heat transfer based on the heat transfer layer and
In the case that heat dissipation burden is relatively small, the heat transfer layer can use the most common metal heat dissipation material in current market, to reach
To the effect for reducing cost and the preferable heat transfer property of acquisition.
For example, the heat transfer layer of an embodiment of the present invention, with thermal coefficient height, perfect heat-dissipating, good mechanical property
And lower-cost advantage, in this way, when the heat transfer of the heat-conducting layer gives the heat transfer layer, then the heat-conducting layer is inhaled
The heat received can be relatively rapidly transmitted on the heat transfer layer, and during heat transfer, and the heat transfer layer can also
The heat of part is directly delivered in extraneous air.
For example, the heat transfer layer of an embodiment of the present invention comprising each component of following mass parts：93 parts~97 parts of copper,
2 parts~4.5 parts of aluminium, 0.1 part~0.3 part of nickel, 0.2 part~1.2 parts of vanadium, 0.1 part~0.4 part of manganese, 0.1 part~0.3 part of titanium, chromium
0.1 part~0.3 part and 0.1 part~0.3 part of niobium.
Above-mentioned heat transfer layer, which contains copper (Cu), can make the heat conductivility of heat transfer layer be maintained at a relatively high level.Work as copper
Mass parts be 93 parts~97 parts when, the coefficient of heat conduction of the heat transfer layer can reach 380W/mK or more, can be more quickly
The heat being transmitted on the heat-conducting layer is passed, and then is evenly dispersed in the structure of the heat transfer layer entirety, to prevent
It is only accumulated on contact position of the heat between the heat-conducting layer and the heat transfer layer, causes the generation of hot-spot phenomenon.And
And the density of the heat transfer layer but only has 8.0kg/m3~8.1kg/m3, the far smaller than density of fine copper in this way can be effectively
Mitigate the weight of the heat transfer layer, more conducively installation manufacture, while also greatly reducing cost.In addition, the heat transfer layer contains
Have mass parts be 2 parts~4.5 parts of aluminium, 0.1 part~0.3 part of nickel, 0.2 part~1.2 parts of vanadium, 0.1 part~0.4 part of manganese,
0.1 part~0.3 part of titanium, 0.1 part~0.3 part of chromium and 0.1 part~0.3 part of niobium vanadium.Relative to fine copper, heat transfer layer
Ductility, toughness, intensity and high temperature resistance are improved significantly, and not easy-sintering.
In order to make the heat transfer layer that there is preferably performance, for example, it is 0.1 part~0.3 that the heat transfer layer, which contains mass parts,
The nickel (Ni) of part, can improve the high temperature resistance of heat transfer layer.For another example, heat transfer layer contains the vanadium that mass parts are 0.2 part~1.2 parts
(V) heat transfer layer crystal grain can be inhibited to grow up, obtains more uniform tiny grain structure and is changed with reducing the brittleness of the heat transfer layer
It is apt to the mechanical property of the heat transfer layer entirety, to improve toughness and intensity.For another example, it is 0.1 part that the heat transfer layer, which contains mass parts,
~0.3 part of titanium (Ti), can make the crystal grain miniaturization of the heat transfer layer, to improve the ductility of the heat transfer layer；Again
Such as, it is 1 part~2.5 parts of silicon (Si) that the heat transfer layer, which further includes mass parts,, can be with when the heat transfer layer contains suitable silicon
Under the premise of not influencing the heat transfer layer heat conductivility, the hardness and abrasion resistance of the heat transfer layer are effectively promoted.But through more
Secondary theory analysis and experiment evidence are found, when the quality of silicon in heat transfer layer is too many, such as mass percent is more than 15 parts or more,
The appearance of heat transfer layer can be made to be distributed black particles, and ductility reduces, be unfavorable for the production molding of the heat transfer layer.
Preferably, the heat transfer layer includes each component of following mass parts：94 parts~96 parts of copper, 3 parts~4 parts of aluminium, nickel 0.2
0.2 part of part~0.3 part, 0.5 part~1 part of vanadium, 0.2 part~0.3 part of manganese, 0.2 part~0.3 part of titanium, 0.2 part~0.3 part of chromium and niobium
~0.3 part.
Preferably, the heat transfer layer includes each component of following mass parts：95 parts of copper, 3.5 parts of aluminium, 0.3 part of nickel, vanadium 0.8
Part, 0.2 part~0.3 part of manganese, 0.2 part~0.3 part of titanium, 0.2 part~0.3 part of chromium and 0.2 part~0.3 part of niobium.
It should be noted that when the heat that LED light generates passes through three first layers, i.e., the respectively described insulating layer, the heat conduction
After layer and the heat transfer layer, has relatively large a part of heat and scatter and disappear in air medium, further, since described in transmission
The primary raw material of heat transfer layer be copper, heavier mass, therefore, based on the heat dissipating layer heat dissipation burden it is relatively small in the case of,
The heat dissipating layer can use heat dissipation effect preferable, and lighter in weight, lower-cost material reduce cost and weight to reach,
And obtain the effect of preferable heat dissipation performance.
For example, the heat dissipating layer of an embodiment of the present invention, preferable with heat dissipation effect, lighter in weight and lower-cost
Advantage, in this way, described in the heat transfer of the heat transfer layer when heat dissipating layer, then the heat dissipating layer can be by the warm of the overwhelming majority
Amount is scattered and disappeared in air medium, to coordinate the insulating layer, the heat-conducting layer and the heat transfer layer to complete the effect of gradient heat transfer,
In this way, different heat region can be directed to, i.e., measured with the distance with LED light distance, realize the gradient of heat transmit and
Lost effect, it is poor to solve traditional heat sinks insulation resistance, of high cost, quality weight, the problem of heat conduction and heat dissipation effect difference.
For example, the heat dissipating layer of an embodiment of the present invention comprising each component of following mass parts：47 parts~50 parts of copper,
49 parts~52 parts of aluminium, 0.2 part~0.7 part of magnesium, 0.2 part~0.7 part of iron, 0.2 part~0.5 part of manganese, 0.1 part~0.3 part of titanium, chromium
0.05 part~0.1 part and 0.1 part~0.3 part of vanadium.
It is 47 parts~50 parts of copper and 49 parts~52 parts of aluminium that above-mentioned heat dissipating layer, which contains mass parts, can make described dissipate
The coefficient of heat conduction of thermosphere is maintained at 300W/mK~350W/mK, to ensure that the heat dissipating layer can will be transmitted by the heat transfer layer
The heat to come over rapidly scatters and disappears in air medium, and then prevents heat from being accumulated on the heat dissipating layer, causes hot-spot
Phenomenon generates.Compared with the existing technology, merely use price costly and the larger copper of quality, above-mentioned heat dissipating layer, which both has, to be dissipated
Thermal effect is good, can rapidly by heat loss to air, and with lighter weight, to be easily installed casting, price less expensive
Advantage.Meanwhile compared with the existing technology, the aluminium alloy for merely using heat dissipation effect poor, above-mentioned heat dissipating layer have more preferably
Heat transfer property.In addition, it is 0.2 part~0.7 part of magnesium, 0.2 part~0.7 part of iron, 0.2 part~0.5 that heat dissipating layer, which contains mass parts,
The manganese, 0.1 part~0.3 part of titanium, 0.05 part~0.1 part of chromium and 0.1 part~0.3 vanadium of part improve bending for heat dissipating layer
Take intensity, tensile strength and high temperature resistance.For example, finding that heat dissipating layer contains matter through many experiments evidence and theory analysis
The magnesium that part is 0.2 part~0.7 part is measured, heat dissipating layer yield strength and tensile strength can be assigned to a certain extent.
Preferably, the heat dissipating layer includes each component of following mass parts：48 parts~49 parts of copper, 50 parts~52 parts of aluminium, magnesium
0.2 part~0.5 part, 0.2 part~0.5 part of iron, 0.3 part~0.5 part of manganese, 0.2 part~0.3 part of titanium, 0.05 part~0.08 part of chromium and
0.2 part~0.3 part of vanadium.
Preferably, the heat dissipating layer includes each component of following mass parts：48 parts of copper, 51 parts of aluminium, 0.3 part of magnesium, iron 0.3
Part, 0.4 part of manganese, 0.4 part of titanium, 0.08 part of chromium and 0.3 part of vanadium.
In order to further mitigate the weight of the heat dissipating layer, and preferable heat dissipation effect is obtained, for example, the present invention also provides
One auxiliary heat dissipation layer, the auxiliary heat dissipation layer are set to the heat dissipating layer far from the heat transfer layer one side.
For example, the auxiliary heat dissipation layer of an embodiment of the present invention comprising each component of following mass parts：Aluminium 88 parts~93
Part, 5.5 parts~10.5 parts of silicon, 0.3 part~0.7 part of magnesium, 0.05 part~0.3 part of copper, 0.2 part~0.8 part of iron, manganese 0.2 part~0.5
Part, 0.05 part~0.3 part of titanium, 0.05 part~0.1 part of chromium and 0.05 part~0.3 part of vanadium.
The aluminium that above-mentioned auxiliary heat dissipation layer is 88 parts~93 parts containing mass parts, can make the heat transfer system of auxiliary heat dissipation layer
Number is maintained at 200W/mK~220W/mK, and heat dissipation effect is preferable, can meet the need being transmitted to after-heat in air dielectric
It wants, meanwhile, quality is lighter, more conducively transports.In addition, auxiliary heat dissipation layer containing mass parts be 5.5 parts~10.5 parts silicon,
0.3 part~0.7 part of magnesium, 0.05 part~0.3 part of copper, 0.2 part~0.8 part of iron, 0.2 part~0.5 part of manganese, 0.05 part~
0.3 part of titanium, 0.05 part~0.1 part of chromium and 0.05 part~0.3 part of vanadium can significantly improve dissipating for auxiliary heat dissipation layer
Hot property.For example, auxiliary heat dissipation layer containing mass parts be 5.5 parts~10.5 parts of silicon and 0.05 part~0.3 part of copper, can be true
Protecting auxiliary heat dissipation layer has the advantages that good mechanical properties and lighter weight, at the same time it can also further improve auxiliary heat dissipation layer
Heat dissipation performance.For another example, auxiliary heat dissipation layer further includes the lead (Pb) that mass parts are 0.3 part~0.6 part, when auxiliary heat dissipation layer contains
0.3 part~0.6 part of lead can improve the tensile strength of auxiliary heat dissipation layer, be cast auxiliary heat dissipation layer in this way, can prevent from working as
When making punching press slabbing or membranaceous structure, is pullled stress by excessive punching press and be broken.For another example, auxiliary heat dissipation layer further includes
The niobium (Nb) that mass parts are 0.02 part~0.04 part can greatly improve auxiliary and dissipate when the mass parts of niobium are more than 0.02 part
The antioxygenic property of thermosphere can cause the magnetism of auxiliary heat dissipation layer drastically to increase however, when the mass parts of niobium are more than 0.04 part
Add, the other component in LED lamp can be had an impact.For another example, it is 0.02 part~0.03 that auxiliary heat dissipation layer, which further includes mass parts,
The germanium (Ge) of part can play the raising of the heat dissipation performance of auxiliary heat dissipation layer and expect not when the mass parts of germanium are more than 0.02 part
The effect arrived and can make the crisp of auxiliary heat dissipation layer however, the quality accounting when germanium is excessive, such as when the mass parts of germanium are more than 2 parts
Degree increases.
It should be noted that because LED light shine generate heat pass through before four layers, i.e., the described insulating layer, the heat-conducting layer,
After the heat transfer layer and the heat dissipating layer, the heat of a greatly part has been lost in extraneous air.Therefore, it is based on the guarantor
The heat dissipation of sheath bear relatively small and self-temperature it is lower in the case of, the influence of the larger generation of coefficient of thermal expansion is minimum
In the case of, the heat transfer layer can use the most common plastic material in current market, reduce cost and weight to reach, and obtain
Obtain preferable surface protection performance.
For example, the protective layer of an embodiment of the present invention, good with surface protection performance, lighter in weight, cost are relatively low
Advantage can have preferable heat dissipation performance in this way, when the protective layer is located at the outermost layer of the composite radiating structure,
Preferable surface protection performance, lighter weight and lower cost.
For example, the protective layer of an embodiment of the present invention comprising each component of following mass parts：The protective layer includes
The each component of following mass parts：20 parts~40 parts of graphite, 20 parts~30 parts of carbon fiber, 40 parts~60 parts of polyamide, water-soluble silicon
10 parts~20 parts of hydrochlorate, 1 part~8 parts of hexagonal boron nitride, 2 parts~5 parts of bismaleimide, 0.5 part~2 parts of silane coupling agent,
0.25 part~1 part of antioxidant.
It, under the high temperature conditions can be total with the generation of polyamide when above-mentioned water-soluble silicate is mixed with graphite and carbon fiber
Poly- reaction, forms heat dissipation channel, to improve heat dissipation performance, and the structure of more fluffy sky, quality are lighter.Further, since being added to
Carbon fiber, surface protection performance and mechanical performance are more preferable, for example, it is more anti-oxidant, more resistant to soda acid, more resistant to corrosion.
Preferably, the protective layer includes each component of following mass parts：30 parts~35 parts of graphite, carbon fiber 25 parts~30
Part, 45 parts~50 parts of polyamide, 15 parts~20 parts of water-soluble silicate, 4 parts~6 parts of hexagonal boron nitride, 3 parts of bismaleimide
~4 parts, 1 part~1.5 parts of silane coupling agent, 0.5 part~1 part of antioxidant.
Preferably, the protective layer includes each component of following mass parts：35 parts of graphite, 28 parts of carbon fiber, polyamide 45
Part, 18 parts of water-soluble silicate, 5 parts of hexagonal boron nitride, 3.5 parts of bismaleimide, 1.8 parts of silane coupling agent, antioxidant 0.7
Part.
In order to preferably so that the insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and the protective layer
Heat conduction and sinking path more optimize, therefore, considering cost, weight, heat conduction and heat dissipation effect and surface protection
In the case of performance, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and the protection thickness of an embodiment of the present invention
Degree is than being 1~1.5：8~12：5~7：6~10：2~2.5, in this way, can make the insulating layer, heat-conducting layer, described
Heat transfer layer, the heat conduction of the heat dissipating layer and the protective layer and sinking path more optimize.
In order to enable each layer structure of the composite radiating structure, i.e., the described insulating layer, the heat-conducting layer, the heat transfer
Layer, the heat dissipating layer and the protective layer are preferably fixed together, to improve structural stability can, for example, as shown in Fig. 2,
It is all provided between the insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and the adjacent interfaces two-by-two of the protective layer
It is equipped with inserted tooth 110 and caulking groove 120, when adjacent two layers structure is bonded, inserted tooth 110 can make in this way in caulking groove 120
Each layer structure of the composite radiating structure, i.e., the described insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and institute
It states protective layer to be preferably fixed together, to improve structural stability can.For another example, as shown in figure 3, the insulating layer, described leading
Buckle 210 and card slot are both provided between thermosphere, the heat transfer layer, the heat dissipating layer and the adjacent interfaces two-by-two of the protective layer
220, when adjacent two layers structure is bonded, buckle 210 can make the composite radiating structure in this way in card slot 220
Each layer structure, i.e., the described insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and the protective layer are preferably solid
It is scheduled on together, to further increase structural stability can.
In order to further such that the insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and the protective layer
It is fixed together, to further increase structural stability, and reduces the shadow to the composite radiating structure heat conduction and heat transfer property
It rings.
For example, referring to Fig. 4, the first filling adhesive layer 600, heat-conducting layer are arranged between insulating layer 100 and heat-conducting layer 200
The second filling of setting adhesive layer 700, is provided with third between heat transfer layer 300 and heat dissipating layer 400 and fills out between 200 and heat transfer layer 300
Adhesive layer 800 is filled, the 4th filling adhesive layer 900 is set between heat dissipating layer 400 and protective layer 500.It is appreciated that insulating layer 100,
Between heat-conducting layer 200, heat-conducting layer 200, heat transfer layer 300, heat dissipating layer 400 and the adjacent interfaces two-by-two of protective layer 500 there is
Structure is small and a fairly large number of gap, reason essentially consist in, due to the binding face defective tightness of above layers material, and lead to
It crosses setting the first filling adhesive layer 600, second and fills adhesive layer 700, the third filling filling adhesive layer of adhesive layer 800 and the 4th
900 can preferably fill these gaps, while also function to the effect of bonding.
For example, the first filling adhesive layer of an embodiment of the present invention comprising each component of following mass parts：It receives
300 parts~1000 parts of alumina particle of rice, 5 parts~30 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, diformazan
1 part~20 parts of 10 parts~100 parts of base silicone oil and MQ silicones.
Preferably, the first filling adhesive layer includes each component of following mass parts：800 parts of nano alumina particles~
1000 parts, 20 parts~30 parts of methyl vinyl silicone rubber, 40 parts~50 parts of vinyl silicone oil, 80 parts~100 parts of dimethicone
With 15 parts~20 parts of MQ silicones.
Preferably, the first filling adhesive layer includes each component of following mass parts：900 parts of nano alumina particles,
20 parts of 25 parts of methyl vinyl silicone rubber, 45 parts of vinyl silicone oil, 85 parts of dimethicone and MQ silicones.
For example, the second filling adhesive layer of an embodiment of the present invention comprising each component of following mass parts：It receives
200 parts~800 parts of alumina particle of rice, 10 parts~40 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, diformazan
1 part~20 parts of 10 parts~100 parts of base silicone oil and MQ silicones；
Preferably, the second filling adhesive layer includes each component of following mass parts：500 parts of nano alumina particles~
700 parts, 20 parts~30 parts of methyl vinyl silicone rubber, 30 parts~40 parts of vinyl silicone oil, 50 parts~80 parts of dimethicone and
10 parts~15 parts of MQ silicones.
Preferably, the second filling adhesive layer includes each component of following mass parts：600 parts of nano alumina particles,
15 parts of 15 parts of methyl vinyl silicone rubber, 35 parts of vinyl silicone oil, 65 parts of dimethicone and MQ silicones.
For example, the third of an embodiment of the present invention fills adhesive layer comprising each component of following mass parts：It receives
200 parts~700 parts of alumina particle of rice, 10 parts~40 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, diformazan
1 part~20 parts of 10 parts~100 parts of base silicone oil and MQ silicones.
Preferably, the third filling adhesive layer includes each component of following mass parts：200 parts of nano alumina particles~
600 parts, 20 parts~40 parts of methyl vinyl silicone rubber, 20 parts~50 parts of vinyl silicone oil, 30 parts~100 parts of dimethicone and
5 parts~10 parts of MQ silicones.
Preferably, the third filling adhesive layer includes each component of following mass parts：500 parts of nano alumina particles,
8 parts of 25 parts of methyl vinyl silicone rubber, 25 parts of vinyl silicone oil, 30 parts of dimethicone and MQ silicones.
For example, the 4th filling adhesive layer of an embodiment of the present invention comprising each component of following mass parts：It receives
150 parts~700 parts of alumina particle of rice, 15 parts~45 parts of methyl vinyl silicone rubber, 10 parts~50 parts of vinyl silicone oil, diformazan
1 part~20 parts of 10 parts~100 parts of base silicone oil and MQ silicones.
Preferably, the 4th filling adhesive layer includes each component of following mass parts：150 parts of nano alumina particles~
450 parts, 15 parts~25 parts of methyl vinyl silicone rubber, 10 parts~25 parts of vinyl silicone oil, 80 parts~100 parts of dimethicone and
1 part~10 parts of MQ silicones.
Preferably, the 4th filling adhesive layer includes each component of following mass parts：250 parts of nano alumina particles,
5 parts of 18 parts of methyl vinyl silicone rubber, 20 parts of vinyl silicone oil, 95 parts of dimethicone and MQ silicones.
Above-mentioned first filling adhesive layer 600, second fills adhesive layer 700, the third filling filling of adhesive layer 800 and the 4th is glued
Layer 900 is closed using organic siliconresin as basis material, and adds the nano alumina particles with preferable heat-conducting effect.By
Organic silicon resin-based internal addition conduction powder nano aluminium oxide, stronger so as to prepare bonding force, thermal coefficient height is filled out
Jointing material is filled, and then can be preferably so that the insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and institute
It states protective layer to be fixed together, to further increase structural stability.
Require emphasis when, the first filling adhesive layer 600, second fills adhesive layer 700, third filling adhesive layer 800 and
The content of nano alumina particles is successively decreased successively in 4th filling adhesive layer 900, is because heat load is also from insulating layer, leads
Thermosphere, heat transfer layer, heat dissipating layer to the protective layer successively decrease successively, in this way, the effect of gradient heat conduction and heat dissipation can preferably be got
Fruit.
The insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and the protection are held in order to preferably viscous
Layer, while avoiding increasing excessive thickness, and the influence to heat conduction and heat dissipation performance is reduced, for example, the first filling bonding
The thickness ratio that layer, the second filling adhesive layer, third filling adhesive layer and the 4th fill adhesive layer is 1~1.5：2~
2.5：3~3.5：4~4.5, for another example, the thickness ratio of the first filling adhesive layer and the insulating layer is 1：50~80.
Above-mentioned composite radiating structure 10 is by being sequentially overlapped setting insulating layer 100, heat-conducting layer 200, heat transfer layer 300, heat dissipation
Layer 400 and protective layer 500, can obtain that good insulating, the coefficient of expansion are low, thermal coefficient is big, good heat dissipation effect and light excellent
Point.
One example is that the present invention also provides a kind of LED lamps comprising the composite radiating of any embodiment
Structure.
For example, referring to Fig. 5, LED lamp 20 includes composite radiating structure 10 and LED light 30, LED light 30 is set to insulation
On layer 100, composite radiating structure 10 is set as columnar structured.
Several embodiments of the invention above described embodiment only expresses, the description thereof is more specific and detailed, but simultaneously
Cannot the limitation to the scope of the claims of the present invention therefore be interpreted as.It should be pointed out that for those of ordinary skill in the art
For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention
Protect range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of composite radiating structure, which is characterized in that including：It is sequentially overlapped the insulating layer of setting, heat-conducting layer, heat transfer layer, dissipates
Thermosphere and protective layer,
The first filling of setting adhesive layer, sets between the heat-conducting layer and the heat transfer layer between the insulating layer and the heat-conducting layer
Set the second filling adhesive layer, be provided between the heat transfer layer and the heat dissipating layer third filling adhesive layer, the heat dissipating layer with
The 4th filling adhesive layer of setting between the protective layer；
The first filling adhesive layer includes each component of following mass parts：300 parts~1000 parts of nano alumina particles, methyl
1 part of 5 parts~30 parts of vinylsiloxane rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicones
~20 parts；
The second filling adhesive layer includes each component of following mass parts：200 parts~800 parts of nano alumina particles, methyl
10 parts~40 parts of vinylsiloxane rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicones 1
Part~20 parts；
The third filling adhesive layer includes each component of following mass parts：200 parts~700 parts of nano alumina particles, methyl
10 parts~40 parts of vinylsiloxane rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicones 1
Part~20 parts；
The 4th filling adhesive layer includes each component of following mass parts：150 parts~700 parts of nano alumina particles, methyl
15 parts~45 parts of vinylsiloxane rubber, 10 parts~50 parts of vinyl silicone oil, 10 parts~100 parts of dimethicone and MQ silicones 1
Part~20 parts；
Wherein, the boundary adjacent two-by-two of the insulating layer, the heat-conducting layer, the heat transfer layer, the heat dissipating layer and the protective layer
Inserted tooth and caulking groove are both provided between face, when adjacent two layers structure is bonded, the inserted tooth is in the caulking groove；
The heat transfer layer includes each component of following mass parts：93 parts~97 parts of copper, 2 parts~4.5 parts of aluminium, nickel 0.1 part~0.3
Part, 0.2 part~1.2 parts of vanadium, 0.1 part~0.4 part of manganese, 0.1 part~0.3 part of titanium, 0.1 part~0.3 part of chromium and niobium 0.1 part~0.3
Part；
The heat dissipating layer includes each component of following mass parts：47 parts~50 parts of copper, 49 parts~52 parts of aluminium, magnesium 0.2 part~0.7
Part, 0.2 part~0.7 part of iron, 0.2 part~0.5 part of manganese, 0.1 part~0.3 part of titanium, 0.05 part~0.1 part of chromium and vanadium 0.1 part~0.3
Part；
Further include auxiliary heat dissipation layer, the auxiliary heat dissipation layer is set to the heat dissipating layer far from the heat transfer layer one side, described
Auxiliary heat dissipation layer includes each component of following mass parts：88 parts~93 parts of aluminium, 5.5 parts~10.5 parts of silicon, 0.3 part~0.7 part of magnesium,
0.05 part~0.3 part of copper, 0.2 part~0.8 part of iron, 0.2 part~0.5 part of manganese, 0.05 part~0.3 part of titanium, 0.05 part~0.1 part of chromium
And 0.05 part~0.3 part of vanadium.
2. composite radiating structure according to claim 1, which is characterized in that the first filling adhesive layer includes following matter
Measure each component of part：800 parts~1000 parts of nano alumina particles, 20 parts~30 parts of methyl vinyl silicone rubber, vinyl silicon
15 parts~20 parts of 40 parts~50 parts of oil, 80 parts~100 parts of dimethicone and MQ silicones.
3. composite radiating structure according to claim 1, which is characterized in that the first filling adhesive layer includes following matter
Measure each component of part：900 parts of nano alumina particles, 25 parts of methyl vinyl silicone rubber, 45 parts of vinyl silicone oil, dimethyl-silicon
20 parts of 85 parts of oil and MQ silicones.
4. composite radiating structure according to claim 1, which is characterized in that the second filling adhesive layer includes following matter
Measure each component of part：500 parts~700 parts of nano alumina particles, 20 parts~30 parts of methyl vinyl silicone rubber, vinyl silicone oil
30 parts~40 parts, 10 parts~15 parts of 50 parts~80 parts of dimethicone and MQ silicones.
5. composite radiating structure according to claim 1, which is characterized in that the second filling adhesive layer includes following matter
Measure each component of part：600 parts of nano alumina particles, 15 parts of methyl vinyl silicone rubber, 35 parts of vinyl silicone oil, dimethyl-silicon
15 parts of 65 parts of oil and MQ silicones.
6. composite radiating structure according to claim 1, which is characterized in that the 4th filling adhesive layer includes following matter
Measure each component of part：150 parts~450 parts of nano alumina particles, 15 parts~25 parts of methyl vinyl silicone rubber, vinyl silicone oil
10 parts~25 parts, 1 part~10 parts of 80 parts~100 parts of dimethicone and MQ silicones.
7. composite radiating structure according to claim 1, which is characterized in that the 4th filling adhesive layer includes following matter
Measure each component of part：250 parts of nano alumina particles, 18 parts of methyl vinyl silicone rubber, 20 parts of vinyl silicone oil, dimethyl-silicon
5 parts of 95 parts of oil and MQ silicones.
8. composite radiating structure according to claim 1, which is characterized in that the insulating layer includes each of following mass parts
Component：40 parts~70 parts of silicon carbide, 13 parts~55 parts of alundum (Al2O3), 2 parts~15 parts of silica, 3 parts~25 parts of binder,
2 parts~20 parts of kaolin, 0.5 part~2 parts of magnesia, 0.5 part~2 parts of Dongyang soil, 0.5 part~2 parts of light weight calcium and rare-earth oxidation
0.2 part~0.5 part of object.
9. composite radiating structure according to claim 1, which is characterized in that the heat-conducting layer includes each of following mass parts
Component：0.1 part~20 parts of 80 parts~95 parts of graphene, 0.1 part~20 parts of carbon nanotube and carbon nano-fiber.
10. composite radiating structure according to claim 1, which is characterized in that the first filling adhesive layer, described second
The thickness ratio for filling adhesive layer, third filling adhesive layer and the 4th filling adhesive layer is 1~1.5：2~2.5：3~3.5：4
~4.5.
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