CN111471306A - Heat-conducting silica gel cement for heat interface joint filling - Google Patents
Heat-conducting silica gel cement for heat interface joint filling Download PDFInfo
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- CN111471306A CN111471306A CN202010472323.6A CN202010472323A CN111471306A CN 111471306 A CN111471306 A CN 111471306A CN 202010472323 A CN202010472323 A CN 202010472323A CN 111471306 A CN111471306 A CN 111471306A
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- heat
- silicone rubber
- silica gel
- methyl vinyl
- joint filling
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention relates to heat-conducting silicon cement for thermal interface joint filling, which comprises 10-90 wt% of methyl vinyl silicone rubber, 10-90 wt% of dimethyl silicone oil and 300-2000 wt% of aluminum oxide. Compared with the currently common encapsulating silica gel, the heat-conducting silica gel mud for heat interface joint filling is solid, can be directly adhered to the heat interface of an electronic product, is convenient to use, adopts the methylvinyl silicone rubber, the dimethyl silicone oil and the aluminum oxide which are all cheap materials, has low cost and can be repeatedly used; the hardness can be adjusted by adjusting the contents of the methyl vinyl silicone rubber and the dimethyl silicone oil, and the higher the content of the methyl vinyl silicone rubber is, the higher the hardness is; the heat conduction effect is adjusted by adjusting the content of the alumina.
Description
Technical Field
The invention relates to the technical field of heat-conducting filling materials, in particular to heat-conducting silica gel cement for heat interface joint filling.
Background
Interface joint filling heat conduction materials of products such as a switching power supply, a battery box and the like generally adopt potting silica gel. Because the encapsulating silica gel is a liquid material, when sealing, the encapsulating silica gel is stirred, vacuumized to remove bubbles, heated and cured at low temperature, and then filled between the heating electronic element and the shell, plays a role in heat conduction and fixation, and is troublesome to use.
Disclosure of Invention
Therefore, it is necessary to provide a heat-conducting silica gel paste for thermal interface caulking aiming at the problem of inconvenient use of encapsulating silica gel.
The heat-conducting silicon cement for thermal interface joint filling comprises 10-90 wt% of methyl vinyl silicone rubber, 10-90 wt% of dimethyl silicone oil and 300-2000 wt% of aluminum oxide.
In one embodiment, the methyl vinyl silicone rubber is 450000-500000 molecular weight methyl vinyl silicone rubber.
In one embodiment, the dimethicone is a dimethicone having a viscosity of not less than 20000.
Compared with the currently common encapsulating silica gel, the heat-conducting silica gel mud for filling joints on the thermal interface is solid, can be directly adhered to the thermal interface of an electronic product, is convenient to use, adopts the methylvinyl silicone rubber, the dimethyl silicone oil and the aluminum oxide which are all cheap materials, has low cost and can be repeatedly used; the hardness can be adjusted by adjusting the contents of the methyl vinyl silicone rubber and the dimethyl silicone oil, and the higher the content of the methyl vinyl silicone rubber is, the higher the hardness is; the heat conduction effect is adjusted by adjusting the content of the alumina.
Detailed Description
The present invention will be described in detail with reference to the following embodiments in order to make the aforementioned objects, features and advantages of the invention more comprehensible. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
The heat-conducting silicon cement for thermal interface joint filling comprises 10-90 wt% of methyl vinyl silicone rubber, 10-90 wt% of dimethyl silicone oil and 300-2000 wt% of aluminum oxide. The methyl vinyl silicone rubber is 450000-500000 molecular weight methyl vinyl silicone rubber. The common methyl vinyl silicone rubber has a molecular weight of 550000-600000, and can cause oil leakage, and the methyl vinyl silicone rubber with a molecular weight of 450000-500000 is adopted to avoid oil leakage. The dimethyl silicone oil is the dimethyl silicone oil with the viscosity not less than 20000, and the viscosity effect is good.
Compared with the currently common encapsulating silica gel, the heat-conducting silica gel mud for filling joints on the thermal interface is solid, can be directly adhered to the thermal interface of an electronic product, is convenient to use, adopts the methylvinyl silicone rubber, the dimethyl silicone oil and the aluminum oxide which are all cheap materials, has low cost and can be repeatedly used; the hardness can be adjusted by adjusting the contents of the methyl vinyl silicone rubber and the dimethyl silicone oil, and the higher the content of the methyl vinyl silicone rubber is, the higher the hardness is; the heat conduction effect is adjusted by adjusting the content of the alumina.
Wherein, the methyl vinyl silicone rubber and the dimethyl silicone oil with the molecular weight of 450000-500000 are methyl vinyl silicone produced by Hangzhou and Shu science and technology Limited.
Example 1: the preparation method adopts a conventional preparation method, 10 parts of methyl vinyl silicone rubber with the molecular weight of 450000 and 90 parts of dimethyl silicone oil with the viscosity of 20000 are added and stirred for 50 minutes, 300 parts of alumina is added and then stirred for 20 minutes, and after uniform stirring, the mixture is vacuumized to remove bubbles to form the heat-conducting silica gel paste. The heat-conducting silica gel mud is low in hardness and suitable for heat interface heat conduction with the heat productivity of 1J/s.
Example 2: the preparation method adopts a conventional preparation method, 90 parts of methyl vinyl silicone rubber with the molecular weight of 500000 and 10 parts of dimethyl silicone oil with the viscosity of 21000 are added into a vacuum kneader and stirred for 50 minutes, 1000 parts of alumina is added and then stirred for 20 minutes, and after uniform stirring, the mixture is vacuumized to remove bubbles to form the heat-conducting silica gel paste. The heat-conducting silica gel mud has high hardness and is suitable for heat conduction of a thermal interface with the calorific value of 5J/s.
Example 3: the preparation method adopts a conventional preparation method, 50 parts of methyl vinyl silicone rubber with molecular weight of 480000 and 50 parts of dimethyl silicone oil with viscosity of 220000 are added into a vacuum kneader and stirred for 50 minutes, 700 parts of alumina is added and then stirred for 20 minutes, and after uniform stirring, the mixture is vacuumized to remove bubbles, thus forming the heat-conducting silica gel paste. The heat-conducting silica gel mud is low in hardness and suitable for heat interface heat conduction of 3J/s heat productivity.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (3)
1. The heat-conducting silicon cement for thermal interface joint filling is characterized by comprising 10-90 wt% of methyl vinyl silicone rubber, 10-90 wt% of dimethyl silicone oil and 300-2000 wt% of aluminum oxide.
2. The thermally conductive silicone paste according to claim 1, wherein said methyl vinyl silicone rubber is a methyl vinyl silicone rubber having a molecular weight of 450000 to 500000.
3. The thermally conductive silicone paste according to claim 1, wherein said dimethylsilicone oil is a dimethylsilicone oil having a viscosity of not less than 20000.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010472323.6A CN111471306A (en) | 2020-05-29 | 2020-05-29 | Heat-conducting silica gel cement for heat interface joint filling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010472323.6A CN111471306A (en) | 2020-05-29 | 2020-05-29 | Heat-conducting silica gel cement for heat interface joint filling |
Publications (1)
| Publication Number | Publication Date |
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| CN111471306A true CN111471306A (en) | 2020-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010472323.6A Pending CN111471306A (en) | 2020-05-29 | 2020-05-29 | Heat-conducting silica gel cement for heat interface joint filling |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115404051A (en) * | 2022-09-24 | 2022-11-29 | 宁波聚力新材料科技有限公司 | High-thermal-conductivity easily-molded heat-conducting mud and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102134474A (en) * | 2010-12-29 | 2011-07-27 | 深圳市优宝惠新材料科技有限公司 | Thermal grease composition |
| CN103333655A (en) * | 2013-06-13 | 2013-10-02 | 浙江汇杰有机硅有限公司 | Method for preparing large power LED (light-emitting diode) high thermal conductivity silicone grease |
| CN104713054A (en) * | 2015-03-27 | 2015-06-17 | 东莞市闻誉实业有限公司 | Combination heat dissipation structure |
| CN105754348A (en) * | 2016-03-08 | 2016-07-13 | 安徽大学 | Low-filling high-heat-conductivity organic-inorganic compound |
| CN109206912A (en) * | 2017-07-06 | 2019-01-15 | 河北高富氮化硅材料有限公司 | A kind of insulating heat conductive silicon grease composition |
| CN110669478A (en) * | 2019-09-25 | 2020-01-10 | 无锡易佳美电子科技有限公司 | Preparation method of high-reliability heat-conducting silicone grease |
| CN111019357A (en) * | 2019-12-27 | 2020-04-17 | 广州市白云化工实业有限公司 | High-performance silicon-based heat-conducting mud and preparation method thereof |
-
2020
- 2020-05-29 CN CN202010472323.6A patent/CN111471306A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102134474A (en) * | 2010-12-29 | 2011-07-27 | 深圳市优宝惠新材料科技有限公司 | Thermal grease composition |
| CN103333655A (en) * | 2013-06-13 | 2013-10-02 | 浙江汇杰有机硅有限公司 | Method for preparing large power LED (light-emitting diode) high thermal conductivity silicone grease |
| CN104713054A (en) * | 2015-03-27 | 2015-06-17 | 东莞市闻誉实业有限公司 | Combination heat dissipation structure |
| CN105754348A (en) * | 2016-03-08 | 2016-07-13 | 安徽大学 | Low-filling high-heat-conductivity organic-inorganic compound |
| CN109206912A (en) * | 2017-07-06 | 2019-01-15 | 河北高富氮化硅材料有限公司 | A kind of insulating heat conductive silicon grease composition |
| CN110669478A (en) * | 2019-09-25 | 2020-01-10 | 无锡易佳美电子科技有限公司 | Preparation method of high-reliability heat-conducting silicone grease |
| CN111019357A (en) * | 2019-12-27 | 2020-04-17 | 广州市白云化工实业有限公司 | High-performance silicon-based heat-conducting mud and preparation method thereof |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115404051A (en) * | 2022-09-24 | 2022-11-29 | 宁波聚力新材料科技有限公司 | High-thermal-conductivity easily-molded heat-conducting mud and preparation method thereof |
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