CN1047043C - 表面安装型电子元件 - Google Patents
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- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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Abstract
不使用将焊接用假金属部件固定在外壳上用的粘接剂,就能获得表面安装型电子元件。从外壳的一端引出输入端子、接地端子和输出端子,在另一端设置焊接用假金属部件。在假金属部件的两端分别设有防止拔出用卡爪。该防止拔出用卡爪连接在设在外壳上的凹部的倾斜部上,将假金属部件和外壳牢固地固定。
Description
本发明涉及安装在印刷电路板等表面上、构成各种电子电路的表面安装型电子元件。
大家知道,作为表面安装型电子元件,以往只在外壳的一端设置引线端子。具有这种结构的电子元件在往印刷电路板等上焊接时,容易产生位置偏移,焊接后在外部应力的作用下,引线端子处会产生裂纹,存在零件翘起来等不良现象。
作为其对策,有这样一种方法,即在外壳的另一端涂布一种导电性的膏,使其硬化后形成焊接用的假电极。但是,这种方法除了涂布导电性的膏的工序及硬化工序复杂之外,电极的机械强度也弱,另外,导电性的膏有可能附着在不必要的地方。
于是作为另一种对策,提出了在外壳的另一端用粘接剂固定焊接用的假金属部件的方法。这种方法虽然能解决上述焊接用的假电极的缺点-工序复杂、机械强度弱的问题,但仍然存在粘接剂还会附着在不必要的部分及粘接剂的涂布量难以控制的问题。
因此,本发明的目的在于提供一种不使用粘接剂就能将焊接用的假金属部件固定在外壳上的表面安装型电子元件。
为了达到上述目的,与本发明有关的表面安装型电子元件的特征是:备有
(a)内装电功能元件的外壳;
(b)从外壳的一端引出的引线端子;以及
(c)有防止拔出的焊接用假金属部件,另外,
(d)前述防止拔出部配合设置在外壳另一端的连接部上,焊接用假金属部件和外壳固定。作为电功能元件可任意选择压电谐振器、电阻元件、电感元件、电容元件等。
在上述结构中,梯型滤波器等电子元件用引线端子和焊接用的假金属部件焊接,固定在印刷电路板等上面。焊接用假金属部件的防止拔出部啮合在外壳上的连接部上,焊接用假金属部件被牢固地固定在外壳上。
图1是表示与本发明有关的表面安装型电子元件的一个实施例的组装透视图;
图2是图1所示的表面安装型电子元件的局部剖视图;
图3是图2所示的表面安装型电子元件的等效电路图;
图4是耐落下冲击试验结果曲线图;
图5是另一个耐落下冲击试验结果曲线图。
下面参照附图说明与本发明有关的表面安装型电子元件的一个实施例。在本实施例中,将梯型滤波器作为电子元件的一个例子进行说明。
如图1及图2所示,梯型滤波器由外壳1、4个压电谐振器6、7、8、9、输入端子10、接地端子11、输出端子12、中继端子13、弹簧端子14、以及焊接用假金属部件20构成。众所周知,压电谐振器6~9将振动电极分别设在内外表面上。
外壳1的一端有开口1a,表面上形成各端子10、11、12定位用的凹部2、3、4和焊接用假金属部件20定位用的凹部5。在凹部5的两端设有两段倾斜部5a、5b。倾斜部5a、5b的形状与后面所述的防止拔出用的卡爪21的形状一致,用来与防止拔出用卡爪21配合。倾斜部5b兼有容易将假金属部件20装到凹部5上的功能。开口1a上还设有倾斜部1b。该倾斜部1b是为了用端子10~14将压电谐振器6~9夹住后能容易地一并***外壳内而设的。
输入端子10有接触片部分10a和外部连接部分10b,设在接触片部分10a上的凸起压接在压电谐振器6上。
接地端子11有接触片部分11a、弯折成双层的接触片部分11b和外部连接部分11c。设在接触片部分11a上的凸起压接在压电谐振器8上,设在接触片部分11b上的凸起压接在压电谐振器7上。
输出端子12有接触片部分12a、弯折成双层的接触片部分12b和外部连接部分12c。设在接触片部分12a上的凸起压接在压电谐振器8上,设在接触片部分12b上的凸起压接在压电谐振器9上。
中继端子13有接触片部分13a、13d、弯折成双层的接触片部分13b和中继片部分13c。设在接触片部分13a上的凸起压接在压电谐振器7上,设在接触片部分13b上的凸起压接在压电谐振器6上,设在接触片部分13d上的凸起压接在压电谐振器9上。
这些压电谐振器6~9及端子10~14收容在外壳1中。弹簧端子14夹在外壳1和端子10之间,用来使压电谐振器6~9和端子10~13之间产生适当的压接力。在外壳1的开口1a处的台阶上设有绝缘纸17,用树脂等密封材料18填充在该开口1a处,将外壳1的内部封装起来。
另一方面,焊接用假金属部件20呈形,两端分别设有防止拔出用卡爪21。该假金属部件20是在例如磷青铜板上镀银或在钢板上镀锡等后经过冲切加工制作而成的。假金属部件20通过防止拔出用卡爪21啮合在外壳1的倾斜部5a、5b上而固定在外壳1上。
下面说明利用自动安装设备组装具有如上结构的梯型滤波器的方法。
用端子10~14夹住压电谐振器6~9,从外壳1的开口1a***。开始将压电谐振器6~9和端子10~14从外壳1的开口1a***收容部时,既使多少偏离了正规位置,但这些零件6~14沿外壳1的倾斜部1b平滑地***时,位置的偏移能得到修正。
另一方面,焊接用假金属部件20安装在外壳1上形成的凹部5上。随着假金属部件20的安装,防止拔出用卡爪21一边与凹部5的倾斜部5b的斜面接触,一边产生弹性形变。这时,最初既使沿上下方向多少有些偏离正规位置将假金属部件装在凹部5上,但假金属部件20沿倾斜部5b平滑地被夹持上,位置偏移得到修正。而且防止拔出用卡爪21经过倾斜部5b而到达倾斜部5a后,由于防止拔出用卡爪21有弹性,所以这时恢复原状,从而防止拔出用卡爪21便啮合在倾斜部5a、5b上而被嵌合。结果假金属部件20被牢固地固定在外壳1上。因此不使用粘合剂,就能将焊接用假金属部件20和外壳1固定在一起。
其次,在使引出端子10~12的外部连接部10b、11c、12c用的外壳1的开口1a朝上的状态下,将环氧树脂等填充到开口1a中后,待彻底硬化后作为密封材料18。在密封材料18彻底硬化后,将各端子10~12的外部连接部分10b、11c、12c沿外壳1的表面弯折(参见图2),构成表面安装型。
这样获得的梯型滤波器如图2所示,端子10~12及焊接用假金属部件20通过软钎焊28分别连接固定在印刷电路板25等上面设置的电路导体26上。
图3是梯型滤波器的等效电路图。压电谐振器6和9串联在输入端子10和输出端子12之间,而压电谐振器7和8并联在输入端子10和输出端子12之间。
另外,对制成的梯型滤波器进行了耐落下冲击试验。试验所使用的滤波器的焊接用假金属部件20的材料是采用在磷青铜上镀银的材料。
图4是通过回流焊接将滤波器安装在印刷电路板上、再将该印刷电路板以水平状态落下10次后对滤波器进行外观检查的结果(参见实线35)。图5是通过固定焊将滤波器固定在重130g的落下样板上,使该落下样板沿滤波器的纵向(X方向)、横向(Y方向)及厚度方向(Z方向)依次各落下一次作为一个循环,反复进行10个循环后,对滤波器进行外观检查的结果(实线38)。为了进行比较,将原有的滤波器的试验结果也一并表示出来(参见图4中的虚线36及图5中的虚线39)。该原有的滤波器是用粘接剂将焊接用假金属部件(采用在钢板上镀锡的材料)固定的。
在本实施例中的滤波器的情况下,根据图4及图5虽然不能完全了解假金属部件的变形或脱落的不良情况,但原有的滤波器随着落下高度的增加,出现不良情况的次数也增加。即本实施例中的滤波器与原有的相比较,假金属部件和外壳的固定强度提高了。
与本发明有关的表面安装型电子元件不限定于上述实施例中的电子部件,在本发明的技术范围内可以进行种种变形。
焊接用假金属部件上的防止拔出部的形状是任意的,例如也可以是半圆球形的凸起。在这种情况下,外壳上的连接部呈半球形的凹坑。
作为电子元件,不限于梯型滤波器,如果是将引线端子配置在外壳一端的电子元件,也可以是振荡器或LC滤波器等。另外,引线端子的个数是任意的。
由以上说明可知,如果采用本发明,由于将防止拔出部设在焊接用假金属部件上,同时在外壳上设有连接部,所以防止拔出部啮合在连接部上,焊接用假金属部件便牢固地固定在外壳上。因此不使用将焊接用假金属部件固定在外壳上用的粘接剂,就能获得表面安装型电子元件。
另外,假金属部件和外壳的固定强度也优于原有的滤波器。
只要将焊接用假金属部件啮合在外壳上的连接部就可以了,因此容易自动组装。由于外壳上的连接部有2段倾斜结构,所以自动组装时即使假金属部件的位置多少有些偏移,也能将假金属部件平滑地夹持在外壳上,更能适合于自动组装。
Claims (2)
1.一种表面安装型电子元件,它备有内装电功能元件的外壳、从前述外壳的一端引出的引线端子、以及有防止拔出部的焊接用假金属部件,其特征为:上述防止拔出部嵌合在设在外壳另一端的连接部上,使得焊接用假金属部件同外壳固定。
2.一种表面安装型梯型滤波器,它备有大致呈箱形的外壳;装在外壳内的压电谐振器;有接触片部和外部连接部、接触片部收容在外壳内、外部连接部从外壳的一端引出的引线端子;以及有防止拔出部的焊接用假金属部件,其特征为:上述防止拔出部嵌合在设在外壳的另一端上的连接部上,使得焊接用假金属部件同外壳固定。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5314613A JPH07170144A (ja) | 1993-12-15 | 1993-12-15 | 表面実装型電子部品 |
JP314613/93 | 1993-12-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1111043A CN1111043A (zh) | 1995-11-01 |
CN1047043C true CN1047043C (zh) | 1999-12-01 |
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Application Number | Title | Priority Date | Filing Date |
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CN94119054A Expired - Fee Related CN1047043C (zh) | 1993-12-15 | 1994-12-15 | 表面安装型电子元件 |
Country Status (5)
Country | Link |
---|---|
US (1) | US5821672A (zh) |
JP (1) | JPH07170144A (zh) |
KR (1) | KR0146389B1 (zh) |
CN (1) | CN1047043C (zh) |
TW (1) | TW256986B (zh) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US5872493A (en) * | 1997-03-13 | 1999-02-16 | Nokia Mobile Phones, Ltd. | Bulk acoustic wave (BAW) filter having a top portion that includes a protective acoustic mirror |
US6233133B1 (en) * | 1999-05-05 | 2001-05-15 | Shui-Te Weng | Capacitor |
DE102016003866A1 (de) * | 2015-04-10 | 2016-10-13 | Marquardt Gmbh | Baugruppe |
Citations (2)
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US4223177A (en) * | 1977-08-11 | 1980-09-16 | Murata Manufacturing Co., Ltd. | Structure and method for sealing electronic parts |
US5265316A (en) * | 1987-02-27 | 1993-11-30 | Seiko Epson Corporation | Method of manufacturing a pressure seal type piezoelectric oscillator |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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US2416876A (en) * | 1945-01-04 | 1947-03-04 | Walter E Kuenstler | Casing for piezoelectric crystals |
US2577576A (en) * | 1950-11-30 | 1951-12-04 | Mannes N Glickman | Hermetic crystal holder |
US3697789A (en) * | 1970-06-23 | 1972-10-10 | Citizen Watch Co Ltd | Mechanical oscillator |
US5274529A (en) * | 1990-03-05 | 1993-12-28 | Murata Manufacturing Co., Ltd. | Electronic device with molded case |
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1993
- 1993-12-15 JP JP5314613A patent/JPH07170144A/ja active Pending
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1994
- 1994-12-07 TW TW083111359A patent/TW256986B/zh active
- 1994-12-15 KR KR1019940034323A patent/KR0146389B1/ko not_active IP Right Cessation
- 1994-12-15 CN CN94119054A patent/CN1047043C/zh not_active Expired - Fee Related
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1997
- 1997-01-13 US US08/782,580 patent/US5821672A/en not_active Expired - Fee Related
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4223177A (en) * | 1977-08-11 | 1980-09-16 | Murata Manufacturing Co., Ltd. | Structure and method for sealing electronic parts |
US5265316A (en) * | 1987-02-27 | 1993-11-30 | Seiko Epson Corporation | Method of manufacturing a pressure seal type piezoelectric oscillator |
Also Published As
Publication number | Publication date |
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CN1111043A (zh) | 1995-11-01 |
JPH07170144A (ja) | 1995-07-04 |
US5821672A (en) | 1998-10-13 |
KR950023248A (ko) | 1995-07-28 |
TW256986B (zh) | 1995-09-11 |
KR0146389B1 (ko) | 1998-10-01 |
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