CN104703407A - On-PCB bonding pad middle holing process - Google Patents
On-PCB bonding pad middle holing process Download PDFInfo
- Publication number
- CN104703407A CN104703407A CN201510068350.6A CN201510068350A CN104703407A CN 104703407 A CN104703407 A CN 104703407A CN 201510068350 A CN201510068350 A CN 201510068350A CN 104703407 A CN104703407 A CN 104703407A
- Authority
- CN
- China
- Prior art keywords
- pcb
- bonding pad
- lamp beads
- pad middle
- conductive copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an on-PCB bonding pad middle holing process. The on-PCB bonding pad middle holing process comprises the following steps of (A) printing conductive copper foils designed according to a line on a PCB substrate and forming solder resisting areas among the conductive copper foils; (B) arranging bonding pads at the ends of the conductive copper foils; (C) forming through holes in the solder resisting areas among adjacent bonding pads by using a drilling device. After punching conducted in the solder resisting areas among adjacent bonding pads, temperature rise of lamp beads in work is effectively reduced through heat transfer of air, and testing proves that the temperature rise of welding points of the lamp beads is reduced by about 10 DEG C under the condition of common normal-temperature heat dissipation, and the service life of the LED lamp beads can be prolonged by almost one time.
Description
Technical field
The present invention relates to all pcb board sheet materials (various glass-fiber-plate and various paper base plates etc.) the lamp pearl patch products except aluminium base, via hole technique in the middle of pad on especially a kind of pcb board.
Background technology
The circuit board structure of existing design, the heat transfer of LED chip can only be dispelled the heat by the capacity of heat transmission of pcb board itself, and the thermal heat transfer capability of common pcb board sheet material is very limited, so just hinders the radiating effect of LED chip significantly.
Summary of the invention
For solving the problems of the technologies described above, the object of this invention is to provide the middle via hole technique of pad on a kind of pcb board.
The technical solution used in the present invention is:
On a kind of pcb board, via hole technique in the middle of pad, comprises the following steps: A) described PCB substrate is printed copper-foil conducting electricity by line design, form welding resistance district between copper-foil conducting electricity; B) pad is equipped with in the end of copper-foil conducting electricity; C) through hole is offered with the welding resistance district of rig between adjacent pad.
Beneficial effect of the present invention:
1. significantly reduce the temperature rise at work of lamp pearl by the heat transfer of air after the welding resistance district punching of the present invention in the middle of pad, after tested, under common normal temperature radiating condition, the temperature rise of lamp bead weld point all can reduce about about 10 DEG C, makes the working life of LED lamp bead improve similar one times;
2. when only requiring the original design life-span in longevity maintaining LED lamp bead, then can improve the operating current of LED lamp bead, the light output ability of LED lamp bead be maximized, reaches the effect improving whole luminous flux; Also can be lowered into by minimizing LED lamp bead quantity and originally reach intrinsic whole luminous flux requirement, be the former or the latter all improve product in the market unexpectedly strive power.
3. this new technology is particularly suitable for, adopting the application in plastic casing LED product, decreasing the dependence of LED lamp panel to other radiator, reaching equally and reduce costs and improve whole lamp life requirements.
Accompanying drawing explanation
Below in conjunction with accompanying drawing, the specific embodiment of the present invention is described further.
Fig. 1 is the pcb board schematic diagram with holes adopting present invention process.
Embodiment
As shown in Figure 1, for the pcb board with holes of via hole technique in the middle of application pad of the present invention, described pcb board 10 is provided with some copper-foil conducting electricities 101 of printed wiring, it is welding resistance the district 102 and end of copper-foil conducting electricity 101 is provided with pad 103 between described copper-foil conducting electricity 101, described paster LED lamp pearl crosses over two ends, welding resistance district 102 when mounted and is connected with adjacent two pads 103 respectively by tin cream, and the welding resistance district 102 below described LED lamp bead offers through hole 104.
The foregoing is only preferred embodiments of the present invention, the present invention is not limited to above-mentioned execution mode, as long as the technical scheme realizing the object of the invention with basic same approach all belongs within protection scope of the present invention.
Claims (1)
1. a via hole technique in the middle of pad on pcb board, is characterized in that: comprise the following steps: A) described PCB substrate is printed copper-foil conducting electricity by line design, form welding resistance district between copper-foil conducting electricity; B) pad is equipped with in the end of copper-foil conducting electricity; C) through hole is offered with the welding resistance district of rig between adjacent pad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510068350.6A CN104703407A (en) | 2015-02-09 | 2015-02-09 | On-PCB bonding pad middle holing process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510068350.6A CN104703407A (en) | 2015-02-09 | 2015-02-09 | On-PCB bonding pad middle holing process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104703407A true CN104703407A (en) | 2015-06-10 |
Family
ID=53350056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510068350.6A Pending CN104703407A (en) | 2015-02-09 | 2015-02-09 | On-PCB bonding pad middle holing process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104703407A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167251A (en) * | 2018-02-10 | 2019-08-23 | 欣强电子（清远）有限公司 | A kind of optical module circuit board structure and preparation method thereof with acceleration hole |
| CN112713230A (en) * | 2020-12-29 | 2021-04-27 | 安徽黑洞科技有限公司 | Manufacturing method of LED transparent screen |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543765A (en) * | 2012-01-13 | 2012-07-04 | 迈普通信技术股份有限公司 | Method for designing bonding pad of surface mounted component, bonding pad structure and printing circuit board |
| CN102869196A (en) * | 2012-09-24 | 2013-01-09 | 广东威创视讯科技股份有限公司 | Method for preventing solder ball of PCB (printed circuit board) heat radiation pad and PCB heat radiation device with function of solder ball prevention |
| US20140326486A1 (en) * | 2013-05-02 | 2014-11-06 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Printed circuit board |
-
2015
- 2015-02-09 CN CN201510068350.6A patent/CN104703407A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102543765A (en) * | 2012-01-13 | 2012-07-04 | 迈普通信技术股份有限公司 | Method for designing bonding pad of surface mounted component, bonding pad structure and printing circuit board |
| CN102869196A (en) * | 2012-09-24 | 2013-01-09 | 广东威创视讯科技股份有限公司 | Method for preventing solder ball of PCB (printed circuit board) heat radiation pad and PCB heat radiation device with function of solder ball prevention |
| US20140326486A1 (en) * | 2013-05-02 | 2014-11-06 | Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. | Printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110167251A (en) * | 2018-02-10 | 2019-08-23 | 欣强电子（清远）有限公司 | A kind of optical module circuit board structure and preparation method thereof with acceleration hole |
| CN112713230A (en) * | 2020-12-29 | 2021-04-27 | 安徽黑洞科技有限公司 | Manufacturing method of LED transparent screen |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150610 |