CN104685553B - The manufacture method of display device - Google Patents
The manufacture method of display device Download PDFInfo
- Publication number
- CN104685553B CN104685553B CN201380049620.8A CN201380049620A CN104685553B CN 104685553 B CN104685553 B CN 104685553B CN 201380049620 A CN201380049620 A CN 201380049620A CN 104685553 B CN104685553 B CN 104685553B
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- polyimide layer
- display device
- polyimide
- layer
- manufacture method
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- 238000000034 method Methods 0.000 title claims abstract description 139
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 74
- 239000011347 resin Substances 0.000 claims abstract description 120
- 229920005989 resin Polymers 0.000 claims abstract description 120
- 239000000463 material Substances 0.000 claims abstract description 53
- 238000000926 separation method Methods 0.000 claims abstract description 19
- 229920001721 polyimide Polymers 0.000 claims description 395
- 239000004642 Polyimide Substances 0.000 claims description 381
- 239000010410 layer Substances 0.000 claims description 345
- 239000011521 glass Substances 0.000 claims description 47
- 239000000758 substrate Substances 0.000 claims description 30
- 238000010438 heat treatment Methods 0.000 claims description 23
- 239000004952 Polyamide Substances 0.000 claims description 21
- 229920002647 polyamide Polymers 0.000 claims description 21
- 230000015572 biosynthetic process Effects 0.000 claims description 19
- 229910052731 fluorine Inorganic materials 0.000 claims description 16
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000576 coating method Methods 0.000 claims description 15
- 125000001153 fluoro group Chemical group F* 0.000 claims description 15
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 150000003949 imides Chemical class 0.000 claims description 13
- 150000002466 imines Chemical class 0.000 claims description 11
- 239000002253 acid Substances 0.000 claims description 10
- 150000001412 amines Chemical class 0.000 claims description 9
- 239000002243 precursor Substances 0.000 claims description 9
- 239000011737 fluorine Substances 0.000 claims description 8
- 125000000962 organic group Chemical group 0.000 claims description 8
- 239000004215 Carbon black (E152) Substances 0.000 claims description 7
- 229930195733 hydrocarbon Natural products 0.000 claims description 7
- 238000010276 construction Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 239000007789 gas Substances 0.000 claims description 4
- 125000003545 alkoxy group Chemical group 0.000 claims description 3
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 3
- 150000001335 aliphatic alkanes Chemical class 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 239000010408 film Substances 0.000 description 33
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- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 15
- 150000004985 diamines Chemical class 0.000 description 12
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 12
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 8
- 238000005520 cutting process Methods 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 206010013786 Dry skin Diseases 0.000 description 7
- MHABMANUFPZXEB-UHFFFAOYSA-N O-demethyl-aloesaponarin I Natural products O=C1C2=CC=CC(O)=C2C(=O)C2=C1C=C(O)C(C(O)=O)=C2C MHABMANUFPZXEB-UHFFFAOYSA-N 0.000 description 7
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 7
- 229940113088 dimethylacetamide Drugs 0.000 description 7
- 238000001035 drying Methods 0.000 description 7
- 239000002904 solvent Substances 0.000 description 7
- 238000003892 spreading Methods 0.000 description 7
- 230000007480 spreading Effects 0.000 description 7
- 238000010030 laminating Methods 0.000 description 6
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- NVKGJHAQGWCWDI-UHFFFAOYSA-N 4-[4-amino-2-(trifluoromethyl)phenyl]-3-(trifluoromethyl)aniline Chemical compound FC(F)(F)C1=CC(N)=CC=C1C1=CC=C(N)C=C1C(F)(F)F NVKGJHAQGWCWDI-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
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- 239000004033 plastic Substances 0.000 description 4
- 238000007711 solidification Methods 0.000 description 4
- 230000008023 solidification Effects 0.000 description 4
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical class NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- 101100008049 Caenorhabditis elegans cut-5 gene Proteins 0.000 description 3
- 102000004895 Lipoproteins Human genes 0.000 description 3
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- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- -1 tetracarboxylic acid acids Chemical class 0.000 description 3
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 241000196324 Embryophyta Species 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical class C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000008064 anhydrides Chemical group 0.000 description 2
- 238000013459 approach Methods 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000002788 crimping Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 229920000052 poly(p-xylylene) Polymers 0.000 description 2
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920006389 polyphenyl polymer Polymers 0.000 description 2
- 238000004064 recycling Methods 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 241000894007 species Species 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 238000010345 tape casting Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical class OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- QYIMZXITLDTULQ-UHFFFAOYSA-N 4-(4-amino-2-methylphenyl)-3-methylaniline Chemical compound CC1=CC(N)=CC=C1C1=CC=C(N)C=C1C QYIMZXITLDTULQ-UHFFFAOYSA-N 0.000 description 1
- CQMIJLIXKMKFQW-UHFFFAOYSA-N 4-phenylbenzene-1,2,3,5-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C(O)=O)=C1C1=CC=CC=C1 CQMIJLIXKMKFQW-UHFFFAOYSA-N 0.000 description 1
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 229920001621 AMOLED Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- 239000004713 Cyclic olefin copolymer Substances 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- 229920001646 UPILEX Polymers 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 150000003851 azoles Chemical class 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000002619 bicyclic group Chemical group 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 125000000623 heterocyclic group Chemical group 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- 229910052809 inorganic oxide Inorganic materials 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 150000002632 lipids Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000010422 painting Methods 0.000 description 1
- HLTMUYBTNSVOFY-UHFFFAOYSA-N pentylcyclohexane Chemical compound CCCCCC1CCCCC1 HLTMUYBTNSVOFY-UHFFFAOYSA-N 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 1
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- 230000009466 transformation Effects 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133305—Flexible substrates, e.g. plastics, organic film
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/441—Thermal treatment, e.g. annealing in the presence of a solvent vapour in the presence of solvent vapors, e.g. solvent vapour annealing
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Theoretical Computer Science (AREA)
- Mathematical Physics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Liquid Crystal (AREA)
- Laminated Bodies (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Optical Filters (AREA)
Abstract
It is an object of the invention to provide being formed on resin base material integrated with supporter in advance after defined display part, the manufacture method of the display device of display device can be easily obtained easily from supporter separation resin base material.The manufacture method of the display device is characterised by, in the state of the first resin bed (7) and the second resin bed (8) are laminated on supporter (1), display part (4) as defined in being formed on the second resin bed, thereafter, separated in the first resin bed with the boundary face of the second resin bed, obtain the display device for possessing display part on the resin base material being made up of the second resin bed.
Description
Technical field
The present invention relates to the manufacture method of display device, specifically, it is related to liquid crystal display device, organic EL display
The manufacture method of display device of the display part formation on resin base material in.
Background technology
The display devices such as liquid crystal display device, organic EL display are used for this giant display of TV, portable electric
The various display applications such as the miniscopes such as words, PC, smart mobile phone.It is used as the representative of display device, organic EL
Display device, for example, the organic EL display makes in the following way：Formed on the glass substrate as supporting base material
Thin film transistor (TFT) (following, TFT), sequentially forms electrode, luminescent layer, electrode, finally with other glass substrate, plural layers etc.
It is gas-tight seal.
Here, by the way that resin base material will be transformed into as the glass substrate of supporting base material from existing glass substrate, can
Slim light flexible is realized, can further expand the purposes of display device.However, resin is compared with glass, generally
Dimensional stability, the transparency, heat resistance, moisture-proof, barrier properties for gases equal difference, therefore be currently under conceptual phase and carry out
Various researchs.
For example, patent document 1 is related on as flexible display plastic base useful polyimides and its precursor
Invention, report anti-using the tetracarboxylic acid acids containing ester ring type structure as cyclohexyl phenyl tetrabasic carboxylic acid etc. and various diamines
Polyimides is transparent excellent obtained by answering.In addition, have also been attempted using flexible resin as supporting base material light-duty to realize
Change, for example, in following non-patent literatures 1 and 2, it is proposed that the high polyimides of the transparency is used for organic EL of supporting base material
Display device.
So, it is known that the resin film of polyimides etc. is useful with plastic base for flexible display, but display dress
The manufacturing process put is carried out using glass substrate, and its production equipment is largely to be designed using premised on glass substrate
's.Accordingly, it is desirable to be able to produce display device while existing production equipment is effectively applied flexibly.
It is used as a concrete example of its research, it is known to following manufacture method：Resin film is laminated with the glass substrate
In the state of complete as defined in display device manufacturing process, glass substrate is removed thereafter, thus manufacture on resin base material have
The display device of standby display part (with reference to patent document 2, non-patent literature 3, non-patent literature 4).Moreover, in the case of these, must
Must the display part (display portion) being formed on resin base material is not caused damage on the premise of separation resin base material and glass.
That is, in non-patent literature 3, it is being coated on glass substrate and fixed resin base material forms defined display part
Afterwards, using referred to as EPLaR (laser release modeling base electronics：Electronics on Plastic by Laser Release)
The method of technique irradiates laser from glass side, forces to separate the resin base material for possessing display part from glass.But, which is not only
The laser aid of costliness, and separation consuming time are needed, therefore has the shortcomings that productivity ratio is low.Also, it is possible to pair during separation
The surface texture of resin base material, display part mounted thereto have undesirable effect.
On the other hand, the method that non-patent literature 4 is recorded is the method for the shortcoming for improving EPLaR methods, and this method is as follows：
Coating is formed after peel ply on the glass substrate, polyimide resin is coated with peel ply, in the system of organic EL display
Make after the completion of process and to peel off polyimide film from peel ply.Here, it is organic to show that non-patent literature 4 is recorded in Fig. 1, Fig. 2
The manufacture method of EL display devices.This method is as follows：Formed after peel ply 2, enclosed the land than peel ply 2 big one on glass substrate 1
Polyimide layer 3 is formed, thereafter, the PROCESS FOR TREATMENT of defined TFT and organic EL processes is carried out, forms TFT/ organic EL panels portion
After (display part) 4, peel ply 2 is cut to along the line of cut 5 of the inner side of peel ply 2, by polyimide layer 3 and the organic EL faces of TFT/
Plate portion (display part) 4 is peeled off from peel ply 2.However, which kind of material etc. do not used on the peel ply in non-patent literature 4
It is specific to record.Therefore, not knowing actually from the separation of peel ply needs the power of which kind of degree, and the polyimides separated
Which kind of state the surface texture of layer 3 is in.Further, since need to make the area of peel ply smaller than the area of polyimide layer, institute
It is limited with the area that formed of organic EL display, productivity ratio is problem.If increasing stripping to prevent productivity ratio from reducing
The area of absciss layer, then reduce in the area of the peripheral part of the peel ply polyimide layer Nian Jie with glass, exist because in process
The problem of stress is easily peeling-off etc.
In addition, the method that patent document 2 is recorded is as follows：Formed on the glass substrate by parylene
(Parylene) or after the peel ply of cyclic olefin copolymer composition, than stripping in the same manner as the method that non-patent literature 4 is recorded
Absciss layer big one encloses the land to form polyimide layer, after the making of electronic equipment is carried out thereon, peels off polyimide layer.Display is used
The formation of TFT needed for way, which is generally required, reaches 400 DEG C or so of annealing operation, but in the method, resistance to due to peel ply
It is hot poorer than polyimides, so maximum temperature when there is the heat treatment temperature of polyimide layer, making electronic equipment is limited
Problem as heat resistance in peel ply.Further, since between glass and peel ply and peel ply and polyimide layer it
Between bonding it is weak, so holding the stress that can't stand in process, the reason for being likely to become stripping.And the thermal coefficient of expansion of peel ply
Bigger than polyimides, the difference of thermal coefficient of expansion is likely to become the factor of bending caused by the difference by resin types.
In addition, having recorded a kind of manufacture method of semiconductor device in patent document 3：Across peel ply on supporting substrate
Resin film is formed, after forming semiconductor element on the upper strata of the resin film, supporting substrate is peeled off from resin film.The patent document 3
In, as resin film, disclose polyphenyl simultaneouslyAzoles.In general, polyphenyl is simultaneouslyAzoles is compared with polyimides, with other materials
Fissility it is excellent.Here, in general, in order to ensure the good fissility with other materials, preferably contacting glued
Heat treatment time in the state of thing is short, but is polyimides benzoIn the case of azoles, because heterocycle and aromatic rings use are common
Planar structure, so crystallinity is easily uprised, for the volatile concentration that completes to react and fully remained in reduction film, it is necessary to
The heat treatment of long period is carried out at high temperature.However, in the patent document 3, which kind of degree needed from the separation of peel ply
Power is simultaneously indefinite, but discloses the stripping of peel ply and resin film and can be realized by being impregnated in warm water.Further, since crystallization
Property height so film easily becomes fragile, if in order to prevent from becoming fragile and importing the ester ring type structure of flexible structure, there is heat resistance drop
Low etc the problem of.It is difficult to reduce in addition, the importing of ester ring type structure also results in thermal expansivity.
Method described in these patent documents 2~3 and non-patent literature 3~4 uses glass as supporter, and
It is fixed on the resin base material of glass and forms display part, operability, dimensional stability thus, it is possible to ensure resin base material, and
With can directly use glass on manufacture liquid crystal display device, original production line of the display device such as organic EL display
The advantage of glass substrate.If it is possible to separate after display part as defined in formed extremely simplely and not to resin base material, aobvious
The portion of showing is impacted, then is not only the excellent method of production, and can further promote from glass substrate to resin base material
Transformation.
Prior art literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2008-231327 publications
Patent document 2：Japanese Unexamined Patent Publication 2010-67957 publications
Patent document 3：Japanese Unexamined Patent Publication 2009-21322 publications
Non-patent literature
Non-patent literature 1：S.An et.al.“2.8-inch WQVGA Flexible AMOLED Using High
Performance Low Temperature Polysilicon TFT on Plastic Substrates”,
SID2010DIGEST, p706 (2010)
Non-patent literature 2：Oishi et.al.,“Transparent PI for flexible display”,IDW’
11FLX2/FMC4-1
Non-patent literature 3：E.I.Haskal et.al.“Flexible OLED Displays Made with the
EPLaR Process”,Proc.Eurodisplay’07,pp.36-39(2007)
Non-patent literature 4：Cheng-Chung Lee et.al.“A Novel Approach to Make Flexible
Active Matrix Displays”,SID10Digest,pp.810-813(2010)
The content of the invention
Therefore, it is defined aobvious it is an object of the invention to provide being formed on resin base material integrated with supporter in advance
Show behind portion, can be easily from supporter separation resin base material, the method that can easily obtain display device.
Present inventors etc. are studied to solve above-mentioned problem, are as a result found by the first resin bed and the second tree
In the state of lipid layer is laminated on supporter, on the second resin bed formed as defined in display part, thereafter, the first resin bed with
The boundary face of second resin bed is separated, and can obtain having on the resin base material being made up of the second resin bed extremely simplely
The display device of standby display part, so as to complete the present invention.
That is, main points of the invention are as follows.
(1) a kind of manufacture method of display device, it is characterised in that be laminated in branch in the first resin bed and the second resin bed
In the state of on support body, formed on the second resin bed as defined in display part, thereafter, in the first resin bed and the second resin bed
Boundary face is separated, and obtains the display device for possessing display part on the resin base material being made up of the second resin bed.
(2) manufacture method of the display device according to (1), it is characterised in that by the first resin bed and the second resin
The stacked film that layer is directly laminated is fitted with supporter, i.e. by the first resin aspect of above-mentioned stacked film and above-mentioned supporter
One side via adhesive linkage fit after, on stacked film formed as defined in display part, thereafter, in the first resin bed and the second resin
The boundary face of layer is separated, and obtains the display device for possessing display part on the resin base material being made up of the second resin bed.
(3) manufacture method of the display device according to (2), wherein, constitute the first resin bed and second of stacked film
Resin bed is made up of polyimides respectively.
(4) manufacture method of the display device according to (1), it is characterised in that the first polyamides is formed on supporter
After imine layer and the second polyimide layer, defined display part is further formed, it is thereafter, poly- in the first polyimide layer and second
The boundary face of imide layer is separated, and obtains possessing display part on the polyimide base material being made up of the second polyimide layer
Display device.
(5) manufacture method of the display device according to (4), wherein, support is removed after display part as defined in being formed
Body, is separated thereafter with the boundary face of the second polyimide layer in the first polyimide layer, is obtained on polyimide base material
Possesses the display device of display part.
(6) according to the manufacture method of the display device described in (4) or (5), wherein, carry out the by being laminated polyimide film
The formation of one polyimide layer, the second polyimides is carried out by the resin solution for being coated with polyimides or polyimide precursor
The formation of layer.
(7) according to the manufacture method of the display device described in (4) or (5), wherein, by be coated with heating polyimides or
The resin solution of person's polyimide precursor carries out the formation of the first polyimide layer and the second polyimide layer.
(8) manufacture method of the display device according to any one of (4)~(7), wherein, the second polyimide layer
A part is stretched out from the periphery of the first polyimide layer, and the extension of second polyimide layer is fixed on supporter.
(9) according to the manufacture method of the display device any one of (4)~(7), wherein, the first polyimide layer or
A part for the layer of a side in the polyimide layer of person second is stretched out from the periphery of other layers.
(10) manufacture method of the display device according to any one of (4)~(9), wherein, along the periphery of display part
Behind the first resin bed incision gap, the separation of the first resin bed and the second resin bed is carried out.
(11) manufacture method of the display device according to (6) or (7), by sub- in coating polyimides or polyamides
When the formation to carry out the second polyimide layer is heated after the resin solution of amine precursor, when the high temperature of the second polyimide layer is kept
Between be less than 60 minutes.
(12) manufacture method of the display device according to any one of (1)~(11), wherein, supporter is glass base
Plate.
(13) manufacture method of the display device according to any one of (1)~(12), wherein, the heat of the first resin bed
The coefficient of expansion is below 25ppm/K.
(14) manufacture method of the display device according to any one of (1)~(13), wherein, the heat of the second resin bed
The coefficient of expansion is below 25ppm/K.
(15) manufacture method of the display device according to any one of (1)~(14), wherein, the second resin bed exists
The transmissivity of 440nm~780nm wavelength region is more than 80%.
(16) manufacture method of the display device according to any one of (1)~(15), wherein, display part is across gas
Barrier layer is formed, and the difference of the thermal coefficient of expansion of the second resin bed and gas-barrier layer is below 10ppm/K.
(17) manufacture method of the display device according to any one of (1)~(16), wherein, display part is colour filter
Layer.
(18) according to the manufacture method of the display device any one of (1)~(17), wherein, the first resin bed and the
The peel strength of two resin beds is below 200N/m.
(19) according to the manufacture method of the display device any one of (1)~(18), wherein, the first resin bed or
At least one party in second resin bed is made up of the polyimides of the construction unit represented with following formulas (1).
[in formula, Ar1Represent the organic group of 4 valencys with aromatic rings, Ar2The divalent represented for following formulas (2) or (3)
Organic group.
(here, the R in formula (2) or formula (3)1~R8It is each independently hydrogen atom, fluorine atom, carbon number 1~5
Alkyl or alkoxy or fluorine substituted hydrocarbon radical, the R of formula (2)1~R4In at least one and formula (3) R1~R8In
At least one be fluorine atom or fluorine substituted hydrocarbon radical.〕]
According to the present invention, by being pre-formed the first resin bed and the second resin bed is laminated in state on supporter, energy
It is enough to form defined display part while operability, dimensional stability is ensured.After display part is formed, it is not necessary to especially swashed
Light irradiation etc., can be just easily separated using the interface of the first resin bed and the second resin bed, therefore, it is possible to extremely simple
Obtain display device.Certainly need not moreover, will not be impacted after separation to the second resin bed, display part as resin base material
Say, nor supporter can be damaged, therefore also can recycle supporter in the manufacture of display device, can go far towards
Reduce manufacturing cost.
Brief description of the drawings
Fig. 1 is the sketch for the manufacture method for illustrating organic EL display of the prior art.
Fig. 2 is the sketch for the manufacture method for illustrating organic EL display of the prior art.
Fig. 3 is the sketch for the manufacture method for illustrating display device of the present invention.
Fig. 4 is the sketch for the manufacture method for illustrating display device of the present invention.
Fig. 5 is the sketch (partial enlarged drawing) for the manufacture method for illustrating display device of the present invention.
Fig. 6 is the sketch for the manufacture method for illustrating display device of the present invention.
Fig. 7 is the sketch for the manufacture method for illustrating display device of the present invention.
Fig. 8 is the sketch for the manufacture method for illustrating display device of the present invention.
Fig. 9 is the sketch for the manufacture method for illustrating display device of the present invention.
Embodiment
Hereinafter, the present invention will be described in more detail referring to the drawings, and the invention is not restricted to following record.
The manufacture method of display device in the present invention is characterised by, is laminated in the first resin bed and the second resin bed
In the state of on supporter, defined display part is formed on the second resin bed, thereafter, in the first resin bed and the second resin bed
Boundary face separated, obtain the display device for possessing display part on the resin base material being made up of the second resin bed.In detail
Content is described below.It should illustrate, Xia Shuzhong, will be equal to the first resin bed and the second resin bed as preferred example
Situation about being formed by polyimides is illustrated, but at least one resin bed can also be formed by the resin beyond polyimides.
In the manufacture method of the display device of the present invention, using possessing the first polyimide layer and the on supporter in advance
The part of two polyimide layers.Then, defined display part is formed in the second polyimide layer side, it is thereafter, sub- in the first polyamides
Amine layer is separated with the boundary face of the second polyimide layer, thus, it is possible to manufacture in the resin being made up of the second polyimide layer
Possesses the display device of display part on base material (polyimide base material).
More specifically, first, as shown in figure 3, preparing the display part in liquid crystal display device, organic EL display etc.
Manufacturing process in turn into pedestal supporter 1.As long as the supporter 1 possesses the display part for being resistant to form various display devices
Manufacturing process in chemical strength, the mechanical strength of thermal history, atmosphere etc. be just not particularly limited, can illustrate glass substrate,
Metal substrate, preferably uses glass substrate.Glass substrate is for example using usually used in the manufacture of organic EL display
Glass substrate.But, in display device produced by the present invention, the supporting base material of display part is by the second polyimide layer 8
The polyimide base material of composition.In other words, referred herein to glass substrate be on polyimide base material formed display part when from
To the part of the effect of pedestal, operability, dimensional stability of polyimide base material etc. are ensured in the manufacturing process of display part,
But it is final to be removed without constituting display device.Should illustrate, supporter can carry out be used for control the first polyimide layer 7,
The surface treatment of the fissility of second polyimide layer 8.
In the present invention, first polyimide layer and the second polyimide layer be set on the supporter 1, be used as its side
Method, can be the either method in following method：1) the first polyimide layer and the second polyimide layer are laminated in advance, then will
The folded method (laminating) formed on supporter of polyimides stacking film layer of the stacking；2) by be coated with polyimides or
The resin solution of polyimide precursor (hereinafter also referred to as " polyamic acid ") carries out the first polyimide layer and the second polyimides
The method (rubbing method) of the formation of layer；3) in supporter upper strata laminated polyimide film the first polyimide layer of formation, coating is passed through
The resin solution of polyimides or polyimide precursor carries out the method (and usage) of the formation of the second polyimide layer.Separately
Outside, here, the polyimide layer of supporter 1 and first can directly be bonded stacking, or as shown in figure 3, via bonding layer stackup.
It should illustrate, can be by the random layer in the first polyimide layer and the second polyimide layer at least in the present invention
The mode that a part is stretched out from the periphery of other layers is formed.Set by the periphery in the outside in the part for forming display part
The part of the thickness of thin of polyimide layer, the stress that can be produced in dispersion step, can prevent supporter and polyimide layer
Peeled off in process.Outreach is not particularly limited, preferably the first polyimide layer and the second polyimide layer it is total
More than thickness, it is more preferably more than 10 times of its aggregate thickness.
Hereinafter, 3 kinds of above-mentioned methods are illustrated respectively.
＜ laminatings ＞
Fig. 3 is to represent to attach polyimides stacking film using adhesive linkage 6 on supporter 1, is further laminated display part
The figure of state.Here, polyimides stacking film is made up of the first polyimide layer 7 and the second polyimide layer 8, the first polyamides is sub-
The polyimide layer 8 of amine layer 7 and second is the structure being directly laminated in advance.In order to obtain such polyimides stacking film, for example,
Polyamic acid of the coating as the second polyimide layer 8 on the polyimide film as the first polyimide layer 7 can be enumerated
Resin solution, thereafter, is dried, the method (the tape casting) of imidizate by heat treatment.It should illustrate, as adhesive linkage 6,
In addition to the resin system bonding agent such as epoxy resin, acrylic resin, it is also possible to use and the two sides of support membrane is provided with adhesive layer
Bonding film etc..In addition, having used adhesive linkage 6 in the Fig. 3, but as shown in fig. 7, also can directly it be made by heating the modes such as crimping
The side bonds of first polyimide layer 7 are in supporter 1.
Here, the thickness for constituting the second polyimide layer 8 of stacked film is preferably 3 μm~50 μm.If the second polyamides is sub-
The thickness of amine layer 8 is then difficult to ensure that the electrical insulating property during resin base material to form display device, prevents external factor less than 3 μm
Caused resin bed infringement etc., it is opposite if it exceeds 50 μm of then possible reductions such as the flexibility of display device, transparency.The opposing party
Face, the first polyimide layer 7 due to not directly constituting display device, if so be considered as operability of stacked film etc., it is excellent
Elect more than 10 μm as.The upper limit of thickness is not particularly limited, if considering cost-effectivenes etc., preferably less than 100 μm.
As described above, polyimides is laminated film to be layered on supporter 1 via adhesive linkage 6 or not via adhesive linkage 6
And the state of integration, continue to be transferred to the process for forming display part.Here, for example existing for the process for forming display part
The PROCESS FOR TREATMENT of the organic EL processes of TFT/ as defined in referring in the case of organic EL display, the TFT being consequently formed, comprising electricity
Pole, organic EL element of luminescent layer etc. are equivalent to display part.Herein, it is also proposed that combine colour filter in white luminous organic EL
Device and the organic EL for carrying out colored display.By with the approach different from the organic EL processes of TFT/ be made after the colour filter by its with
TFT/ fits and manufactured in organic EL sides, and the colour filter also corresponds to display part.In addition, referring in the case of liquid crystal display device
The PROCESS FOR TREATMENT of TFT, the TFT being consequently formed, drive circuit, the colour filter formed as needed etc. are equivalent to display part.
That is, in addition to organic EL display, liquid crystal display device, in addition to the various display dresses such as electronic paper, MEMS display
Including putting, the process for forming display part was referring to be formed the various functions layers that are formed on glass substrate in the past, that is, mirror as defined in
The process of part needed for image (animation or image), comprising being referred to as display part including thus obtained part.By this
Process, is laminated to form display part 4 in the side of the second polyimide layer 8 integrated with the first polyimide layer 7.Then, if entirely
The display part lamination process in portion terminates, then carries out cutting into the cutting action of given size.
Wherein, Fig. 4 is the figure for representing cutting action.In the present invention, what cutting action was not required, according to the dress of manufacture
Put, the mode of process is arbitrarily implemented.If being illustrated by taking the manufacture of organic EL display as an example, cut along shown in Fig. 4
Line of cut 5 is carried out to display part (TFT/ organic EL panels portion) 4 and the second polyimide layer 8 completely.Now, as represented, Fig. 4 shows
Shown in Fig. 5 of the enlarged drawing of the cutting zone 9 gone out, if side makes line of cut 10 reach near the center of the first polyimide layer 7,
Gap is cut in the periphery of edge display part in the first resin bed, then can not cause mechanical damage to TFT/ organic EL panels portion 4
The second polyimide layer 8 reliably and is easily separated from the boundary face with the first polyimide layer 7 in the case of evil.
Here, in order to which the second polyimide layer 8 is easily separated from the boundary face with the first polyimide layer 7,
Need to make polyimide boundary face turn into the state being easily peeled off.Its mode is not particularly limited, and can enumerate first or second and gather
Either one in imide layer uses the polyimides with specific chemical constitution.
In general, polyimides is typically that will polymerize what is obtained with diamines as the acid anhydrides of raw material, by following formulas (1)
Represent.
In formula, Ar1It is denoted as the organic group of 4 valencys of anhydride residue, Ar2It is the organic group of the divalent as diamines residue
Group, but from the viewpoint of heat resistance, preferably Ar1、Ar2In at least one party be aromatic residue.
The polyimide resin preferably used as the first polyimide layer or the second polyimide layer in the present invention,
For example, the polyimides with following constitutional repeating units can be enumerated,
Particularly preferably there is the polyimides of following constitutional repeating units.
In addition, in addition, fluorinated polyimide can be enumerated.Here, fluorinated polyimide refers in polyimides knot
There is the polyimides of fluorine atom in structure, contain as having at least one composition in the acid anhydrides and diamines of polyimides raw material
Fluorin radical.As such fluorinated polyimide, for example, following compound can be enumerated：The polyamides that above-mentioned formula (1) represents is sub-
In amine, the Ar in formula1For the organic group of 4 valencys, Ar2For the organic group of the divalent shown in following formulas (2) or (3).
R in above-mentioned formula (2) or formula (3)1~R8It is each independently hydrogen atom, fluorine atom, carbon number 1~5
Alkyl or alkoxy or fluorine substituted hydrocarbon radical, the R of formula (2)1~R4Middle at least one be fluorine atom or fluorine substituted hydrocarbon radical, separately
Outside, the R of formula (3)1~R8Middle at least one is fluorine atom or fluorine substituted hydrocarbon radical.
Wherein, as R1~R8Preferred concrete example ,-H ,-CH can be enumerated3、-OCH3、-F、-CF3Deng, but preferred formula (2)
Or at least one substituent is-F or-CF in formula (3)3In any one.
In addition, being used as the Ar in the formula (1) when forming fluorinated polyimide1Concrete example, for example, can enumerate following
The anhydride residue of 4 valencys.
In addition, when forming fluorinated polyimide, if considering the transparency of polyimides and the fissility of other layers etc., making
To assign the Ar in formula (1)2Specific diamines residue, preferably enumerate following group.
If such fluorinated polyimide, even if with fluorinated polyimide beyond the polyamides with other structures
The interface of imines can also show good separation property (certainly, if both first and second polyimide layers are fluorine-containing
Polyimides, then the separation property at interface further improve).In addition, in such fluorinated polyimide with 80 moles of % with
On ratio when there is any one of construction unit that the following formula (4) enumerated or (5) represent, the transparency and fissility are excellent
Different, thermal expansivity is low in addition, excellent in dimensional stability, therefore is preferably used as being formed the polyimides of the second polyimide layer.
Here, when making polyimides for formula (4) or the polyimides of the structure of (5), in addition to the polyimides
Can be not particularly limited in other polyimides of ratio addition of the maximum less than 20 moles of %, can be used common acid anhydrides and
Diamines.Wherein as the acid anhydrides preferably used, pyromellitic acid anhydride, 3 can be enumerated, 3 ', 4,4 '-biphenyl tetracarboxylic dianhydride, 1,
4- cyclohexane dicarboxylic acids, 1,2,3,4- cyclobutane tetracarboxylic dianhydride, 2,2 '-bis- (3,4- dicarboxyphenyis) hexafluoropropane dianhydrides
Deng.On the other hand, as diamines, DDS, anti-form-1,4- diaminocyclohexanes, 4,4 '-diamino can be enumerated
Butylcyclohexyl methane, 2,2 '-bis- (4- aminocyclohexyls)-HFC-236fas, 2,2 '-bis- (trifluoromethyls) -4,4 '-diamino bicyclics
Hexane etc..
The various polyimides of described above are that polyamic acid is carried out obtained by imidizate, here, polyamic acid
Resin solution can use the diamines and acid dianhydride as raw material by substantial equimolar, make they react in organic solvent and
.More specifically, can by making diamines be dissolved in after the organic polar solvents such as DMA under nitrogen flowing, plus
Enter tetracarboxylic dianhydride, react 5 hours or so and obtain at room temperature.From the uniform film thickness and gained polyimide film during coating
From the viewpoint of mechanical strength, the weight average molecular weight of gained polyamic acid is preferably 10,000~300,000.It should illustrate, polyimides
Layer preferred molecular weight ranges be also and polyamic acid identical molecular weight ranges.
In the present invention, preferably make the polyamides that the second polyimide layer 8 is the construction unit represented with formula (4) or (5)
Imines, so as to form polyimide layer of the thermal coefficient of expansion for below 25ppm/K, preferably below 10ppm/K, is suitable as
To form the polyimide base material of display device.In addition, the polyimides with these construction units shows more than 300 DEG C of glass
Glass transition temperature (Tg), the transmissivity of 440nm~780nm wavelength region shows more than 80%.
As described above, in order to using defined polyimides, in the first polyimide layer and the second polyimide layer
Interface be mutually easily separated, at least any one polyimide layer is formed by fluorinated polyimide.By making at least
One polyimide layer is formed by fluorinated polyimide, so that the interface of the first polyimide layer and the second polyimide layer
Adhesive strength preferably turn into 1N/m~500N/m, more preferably as 5N/m~300N/m, further preferably as 10N/m~
200N/m, therefore possess the separation property for the degree that the hand of employment can be just easily peeled off.Moreover, in isolated display device
There is no fold, fracture etc. apparent bad as the second polyimide layer of polyimide base material, in addition, the second polyimides
(in general surface roughness Ra=1~80nm is left for the surface roughness that the parting surface of layer can maintain to obtain using the tape casting
It is right), therefore visuality of display device etc. will not also be had undesirable effect.
1) present invention except as defined in forming after display part, then in the first polyimide layer and the second polyimide layer
Outside the method that boundary face is separated, also comprising following method：2) after display part as defined in being formed, first, remove first and gather
The supporter of imide layer side, thereafter, is divided in the boundary face of remaining first polyimide layer and the second polyimide layer
From obtaining the display device for possessing display part on polyimide base material (the second polyimide layer).In above-mentioned method 2), remove
The first polyimide layer 7 for going after supporter 1 and the preferred side of separation of the second polyimide layer 8 with the second polyimide layer 8 and
The mode that the shape of display part 4 keeps constant in separation is fixed, and side separates the first polyimide layer 7.Thereby, it is possible to subtract
The stress that small display part 4 is born, even if in the case where making the second polyimide layer 8 thinner, can also reduce display part 4
The impaired possibility of equipment.Here, in above-mentioned method 2), the mode on removing supporter, as long as not to display part 4, the
Two polyimide layers 8, which cause damage, to be just not particularly limited, and can use the method described as follows.That is, due to based on Fig. 3's
The example using adhesive linkage 6 is shown in described above, so on this point, will be mended in the explanation of the rubbing method based on Fig. 6
Fill.But, in laminating, if it is possible to directly carried out on the first polyimide layer 7 and support with modes such as heating crimping
The bonding of body 1, then need adhesive linkage 6 like that not necessarily like Fig. 3, in this case can using with identical side by the way of aftermentioned record
Method removes supporter 1.
Next, the application examples to the rubbing method using the present invention is illustrated.
＜ rubbing methods ＞
Fig. 6 is to represent to sequentially form the first polyimide layer 7, the second polyimide layer 8 on supporter 1 with rubbing method,
Thereafter, further it is laminated the figure of the state of display part 4.In this method, first, prepare supporter 1, first is turned into coating thereon
The resin solution of the polyamic acid of polyimide layer 7, dry, imidizate is completed by being heat-treated, and forms the first polyimides
Layer 7.Next, the resin of polyamic acid of the coating as the second polyimide layer 8 is molten on above-mentioned first polyimide layer 7
Liquid, dry, imidizate is completed by being heat-treated, and forms the second polyimide layer 8.Thereby, it is possible to be formed on supporter 1 according to
It is secondary to be formed with the first polyimide layer 7, the substrate of the second polyimide layer 8.Thereafter, after continuing for display part formation process
Process.The later process of display part formation process is identical with above-mentioned laminating, therefore omits detailed content, on it is above-mentioned 2)
The removing of supporter 1 in method, is simply illustrated below.
As described above, Fig. 6 is to represent to be laminated with the first polyimide layer 7, the and of the second polyimide layer 8 on supporter 1
The figure of the state of display part 4., can be from the state in the first polyimide layer 7 and the second polyimide layer 8 in the present invention
Supporter 1 is removed before the process that boundary face is separated, here, as the method for removing supporter 1, can illustrate such as lower section
Method：Using the polyimide material easily peeled off from supporter 1 as the first polyimide layer 7, or use the metals such as copper foil
Paper tinsel, metal substrate remove them as supporter 1, and with etching solution.
In addition, as the method for removing supporter 1, known other methods can also be used.I.e., it is possible to utilize non-patent
The peel ply in laser irradiation or non-patent literature 4 in document 3 removes supporter 1.Supporter 1 is removed by laser irradiation
When, the first polyimide layer absorbs laser, the harmful effect that can prevent laser from being caused to the 2nd polyimide layer, display part.Profit
When removing supporter 1 with peel ply, the stress produced when the first polyimide layer is to antistripping plays work(as stress relaxation layer
Can, to the decrease in yield caused by the infringement of display part when can prevent from peeling off.
However, in Japanese Unexamined Patent Application Publication 2007-512568 publications, the yellow film that polyimides etc. is formed on glass is disclosed,
Next formed on the yellow film after thin-film electronic element, UV laser is irradiated to the bottom surface of yellow film through glass, thus, it is possible to
It is enough to peel off glass and yellow film.However, also disclosing different from yellow film, UV laser is not absorbed when being transparent plastic, therefore
Need to set absorption/peel ply as non-crystalline silicon under film in advance.On the other hand, Japanese Unexamined Patent Application Publication 2012-511173 publications
In, disclose to irradiate the stripping for carrying out glass and polyimide film by UV laser, it is necessary to using 300~410nm's
Laser in the range of spectrum.
In the present invention, using laser from the first polyimide layer remove supporter when, the first polyimide layer is preferably used
Coloured polyimides.It is coloured polyimides to make the first polyimide layer, and makes the second polyimide layer be clear polyimides
It is one of preferred mode of the present invention.
In rubbing method, the resin solution of polyamic acid of the coating as the first polyimide layer 7, is carried out on supporter 1
Heat treatment, at the moment, carrying out imidizate to the first polyimide layer using sufficient heat treatment makes the second polyimide layer
Separation becomes easy, thus preferably.In addition, in rubbing method, it is same with the record in laminating, it is also preferred that the first or second polyamides
At least one party in imine layer uses the polyimides with specific chemical constitution.The first polyimide layer and second can be made
Polyimide layer turns into the polyimides of identical chemical constitution.
In rubbing method, the first polyimide layer, the second polyimide layer are by heat treatment after coating resin solution
Be dried or dry solidification and obtain, the present invention in, in above-mentioned heat treatment from than heating when maximum heating temperature (most
Height reach temperature) low 20 DEG C temperature to maximum temperature reached high-temperature heating temperature province heat time it is (hereinafter referred to as high
The warm retention time) it is more short better in the range of required characteristic is obtained.This is due in high-temperature heating temperature province in rubbing method
The purpose for keeping the first and/or second polyimide layer is by promoting the complete removing of residual solvent, polyimide resin
Orientation etc. and obtain the characteristic required by original polyimide layer.If however, when the high temperature of the second polyimide layer is kept
Between it is especially long, then have with the reduction of the fissility of the first polyimide layer, or because coloring etc. causes the trend of decrease in transmission.Most
Good high temperature hold time according to mode of heating, polyimide thickness, the species of polyimides and it is different, preferably 0.5 minute
Less than 60 minutes, more preferably 0.5 minute less than 30 minutes.
Next, folded to the film layer using the present invention and resin solution coating and usage application examples is illustrated.
＜ and usage ＞
Fig. 8 is to represent to attach the first polyimide layer 7 on supporter 1 using adhesive linkage 6, and the second polyamides is laminated thereon
The figure of the state of imine layer 8 and display part 4, wherein, the first polyimide layer 7 is cut into a circle smaller than supporter 1.
In this method, first, prepare supporter 1, attached thereon as the first polyimide layer 7 using adhesive linkage 6
Polyimide film.This step can be used and above-mentioned laminating identical polyimide film, using identical method.
Next, coating turns into the resin of the polyamic acid of the second polyimide layer 8 on above-mentioned first polyimide layer 7
Solution, is dried by heat treatment and completes imidizate, forms the second polyimide layer 8.This step can be used and above-mentioned painting
Cloth method identical resin solution, using identical method.The first polyamides Asia is sequentially formed with thus, it is possible to be formed on supporter 1
The substrate of the polyimide layer 8 of amine layer 7 and second.Thereafter, the process later for display part formation process is continued.Display part is formed
The later process of process is identical with above-mentioned operation, therefore omits.
And in usage, after the first polyimide layer 7 and supporter 1 are fitted, the poly- of the second polyimide layer 8 will be assigned
The resin solution of amic acid is coated on the first polyimide layer 7 with the state of varnish and covers its whole face.The polyamide of coating
The resin solution of acid is dried through Overheating Treatment, imidizate, the second polyimide layer 8 is formed, as shown in figure 8, in the state
The lamination surface of lower second polyimide layer 8 than the first polyimide layer greatly, the second polyimide layer 8 not with the first polyimides
At least a portion in the part that layer 7 connects connects with supporter 1.That is, a part for the second polyimide layer 8 is from the first polyamides
The periphery of imine layer 7 stretches out, and the extension of second polyimide layer 8 is fixed on supporter 1.In this method, the second polyamides
The polyimide layer 7 of imine layer 8 and first is also constituted in the way of being easily peeled off, but the second polyimide layer 8 and supporter 1 can lead to
The extension for crossing the second polyimide layer 8 is bonded securely, therefore, it is possible to improve cementability on supporter periphery, is further ensured that
Stability in process.It should illustrate, be formed after display part, carried out in the same manner as cutting action as described above, for example
If as shown in figure 9, the polyimide layer 8 of display part 4 and second is cut along the line of cut 5 for cutting display part 4, in the first polyamides Asia
Amine layer 7 is separated with the boundary face of the second polyimide layer 8, then can be obtained in gathering for being made up of the second polyimide layer 8
Possesses the display device of display part 4 on acid imide base material.
In the present invention, including the situation using 3 kinds of methods as described above and the feelings using the method beyond these methods
Including condition, the first polyimide layer can all be separated after, so the function to display device is not helped, if but considering
Temperature change of the display part in manufacturing process, the then characteristic before separating turns into key factor, considers from this viewpoint, and first gathers
The thermal coefficient of expansion of imide layer is preferably below 25ppm/K.In addition, glass transition temperature Tg is preferably more than 300 DEG C.Make
For the concrete example of such first polyimide layer, for example, the knot to be made up of biphenyl tetracarboxylic dianhydride and phenylenediamine can be enumerated
Structure unit is polyimides of principal component etc..As commercially available product, for example, usable Ube Industries, Ltd UPILEX-S,
DU PONT-TORAY Co. Ltd. systems KAPTON, Toyo Boseki K.K XENOMAX.
In addition, in the present invention, when forming display part, it is possible to use by silica, aluminum oxide, carborundum, siloxicon, carbon
The compositions such as the inorganic oxide films such as silicon nitride, silicon nitride, silicon oxynitride, the gas that possesses barrier to oxygen, vapor etc.
Barrier layer.Now, in order to reduce warpage etc. of gained display device, preferably the second polyimide layer and gas-barrier layer it is hot swollen
The difference of swollen coefficient is below 10ppm/K.
In the method that the first or second polyimide layer uses beyond the polyimides with specific chemical constitution, it is
First polyimide layer 7 and the second polyimide layer 8 can be easily separated from its boundary face, be used for example, can enumerate
The method for the stacked film being made in the following way：Carry out heat treatment of the first polyimide layer 7 etc. and change the first polyimides
The surface state of layer 7 and reduce after wettability of the surface, the rapid coating for carrying out the second polyimide layer 8.The heat treatment it is suitable
When temperature it is different according to the species of the first polyimide layer 7, make the first polyimide layer 7 be PONT-TORAY plants of formulas of DU
During the polyimide films such as commercial firm KAPTON, Ube Industries, Ltd UPILEX, preferably 300 DEG C~500 DEG C.
In the present invention, in the boundary face of the first polyimide layer and the second polyimide layer after display part as defined in being formed
In the method separated, pass through the stacking of supporter and the first polyimide layer obtained from the second polyimide layer is separated
First polyimide layer side of body forms the second polyimide layer again, so that recycling supporter and the first polyimide layer
Layered product.During reuse, the layer of supporter and the first polyimide layer can be carried out after the second polyimide layer is separated
The cleaning of stack.Alternatively, it is also possible to reduce first being supported the heat treatment of the layered product of body and the first polyimide layer
After the wettability of the surface of polyimide layer, the coating of the second polyimide layer is carried out.
In addition, being used as the other methods or such as the layered product for reusing supporter and the first polyimide layer
Lower method：The first polyamides of the layered product of supporter and the first polyimide layer is sub- obtained from the second polyimide layer is separated
Amine layer side, forms the first polyimide layer again, is subsequently formed the second polyimide layer.
In addition, in the present invention, the supporter removed from the first polyimide layer can be recycled.Before recycling, Ke Yijin
Cleaning, heat treatment, the surface treatment of row supporter.
Embodiment
Hereinafter, the present invention is further illustrated based on embodiment.It should illustrate, the invention is not restricted in following embodiments
Hold.
The evaluation method of physical property etc. is shown in following embodiments.
(transmissivity (%))
Obtain with U4000 type spectrophotometers light transmittance of the polyimide film (50mm × 50mm) in 440nm~780nm
Average value.
(glass transition temperature (Tg))
Glass transition temperature is obtained as follows：Utilize viscoelastic analyzer (F.E. plants of Rheometric Scientific
Formula commercial firm RSA-II), using the sample of 10mm width, while impose 1Hz vibration, while with 10 DEG C/min of speed from room temperature
400 DEG C are warming up to, the maximum of the loss tangent (Tan δ) when thus is obtained.
(thermal coefficient of expansion (CTE))
Apply 5.0g load to the polyimide film of 3mm × 15mm sizes using thermo-mechanical analysis (TMA) device, simultaneously
Temperature range with certain programming rate (20 DEG C/min) at 30 DEG C~260 DEG C carries out tension test, by polyimide film pair
The elongation of temperature is answered to determine thermal coefficient of expansion (× 10-6/K)。
[embodiment 1]
Will by the obtained polyamic acid of PDA (1,4- phenylenediamines) and BPDA (3,3 ', 4,4 '-biphenyl tetracarboxylic dianhydride) tree
Lipoprotein solution using the thickness after solidifying be 20 μm, spreading area glass as supporter is coated in the way of 300mm × 380mm
On base material, the solvent (DMAc in 130 DEG C of heat dryings remove resin solution：DMAC N,N' dimethyl acetamide).Next, from
160 DEG C to 360 DEG C are heat-treated with about 1 DEG C/min of programming rate and carry out imidizate, form the first of 20 μm of thickness
Polyimide layer (surface roughness Ra=1.3nm, Tg=355 DEG C).
Will by PMDA (pyromellitic acid anhydride), 6FDA (2,2 '-bis- (3,4- dicarboxyphenyis) hexafluoropropane dianhydrides) and
The resin solution for the polyamic acid that TFMB (2,2 '-bis- (trifluoromethyl) -4,4 '-benzidine) is obtained, with than the first polyamides
The spreading area of imine layer is greatly and the first polyimide layer of covering entirety, spreading area are the thickness after 310mm × 390mm, solidification
The mode spent for 25 μm is coated on first polyimide layer, the solvent in 130 DEG C of heat dryings remove resin solution
(DMAc：DMAC N,N' dimethyl acetamide).Next, being carried out from 160 DEG C to 360 DEG C with about 20 DEG C/min of programming rate from hot
Manage and carry out imidizate, form the second polyimide layer of 25 μm of thickness.High temperature hold time now is 1 minute.Should
Illustrate, in the synthesis of above-mentioned polyamic acid, diamine component and acid dianhydride component substantially equimolar, PMDA/6FDA ratio is 85/
15。
Thus the layered product that the first and second polyimide layers are sequentially laminated with glass is formed in, the of the layered product
Two polyimide layer sides form the EL element as display part.Thereafter, in the second polyimide layer in the way of surrounding display part
Otch is cut, peel separation is carried out at the interface of the first polyimide layer and the second polyimide layer, obtains by the second polyamides
There is the display device of EL element on the polyimide base material that imine layer is constituted.Now, it is poly- in the first polyimide layer and second
Between imide layer, in the case where not caused damage to the equipment of the display parts such as TFT, electrode, the side such as laser lift-off is not used
Formula, is artificially peeled off, thus, it is possible to be easily separated.The peel strength of first polyimide layer and the second polyimide layer
For 3.5N/m.It should illustrate, in above-described embodiment, the linear expansion coefficient of the first polyimide layer is 12.0ppm/K, the second polyamides
The linear expansion coefficient of imine layer is 9.7ppm/K.In addition, the second polyimide layer 440nm~780nm wavelength region it is saturating
It is 83.5% to penetrate rate.
[embodiment 2]
Will by the obtained polyamic acid of PDA (1,4- phenylenediamines) and BPDA (3,3 ', 4,4 '-biphenyl tetracarboxylic dianhydride) tree
Lipoprotein solution using the thickness after solidifying be 20 μm, spreading area glass as supporter is coated in the way of 310mm × 390mm
On base material, the solvent (DMAc in 120 DEG C of heat dryings remove resin solution：DMAC N,N' dimethyl acetamide).Next, from
130 DEG C to 360 DEG C are heat-treated with about 1 DEG C/min of programming rate and carry out imidizate, form the first of 25 μm of thickness
Polyimide layer (surface roughness Ra=1.3nm, Tg=355 DEG C).
Will by PMDA (pyromellitic acid anhydride), 6FDA (2,2 '-bis- (3,4- dicarboxyphenyis) hexafluoropropane dianhydrides) and
The resin solution for the polyamic acid that TFMB (2,2 '-bis- (trifluoromethyls) -4,4 '-benzidine) is obtained using spreading area as
Thickness after 310mm × 390mm, solidification is coated on first polyimide layer for 5 μm of mode, in 130 DEG C of heat dryings
And remove the solvent (DMAc in resin solution：DMAC N,N' dimethyl acetamide).Next, from 160 DEG C to 360 DEG C with about 20 DEG C/
The programming rate of minute is heat-treated and carries out imidizate, forms the second polyimide layer of 5 μm of thickness.It should illustrate,
In the synthesis of above-mentioned polyamic acid, diamine component and acid dianhydride component substantially equimolar, PMDA/6FDA ratio is 60/40.
Thus the layered product that the first and second polyimide layers are sequentially laminated with glass is formed in, the of the layered product
Two polyimide layer sides form the EL element as display part.Thereafter, along the first polyimide layer in the way of surrounding display part
Otch is cut with the thickness direction of the second polyimide layer, after the glass for removing the first polyimide layer side is peeled off, first
The interface of polyimide layer and the second polyimide layer is peeled off, and is obtained in the polyimides being made up of the second polyimide layer
There is the display device of EL element on base material.Now, between glass and the first polyimide layer and the first polyimide layer with
Between second polyimide layer, in the case where not caused damage to the equipment of the display parts such as TFT, electrode, laser is not used to shell
From etc. mode, artificially peeled off, thus, it is possible to be easily separated.The stripping of first polyimide layer and the second polyimide layer
It is 4.0N/m from intensity.It should illustrate, in above-described embodiment, the linear expansion coefficient of the first polyimide layer is 7.0ppm/K, the
The linear expansion coefficient of two polyimide layers is 20.4ppm/K.In addition, the second polyimide layer is in 440nm~780nm wavelength zone
The transmissivity in domain is 86.7%.
(embodiment 3)
In order to recycle the supporter and the first polyimides that are obtained in embodiment 1 from the second polyimide layer peel separation
Layer layered product, remove residual the second polyimide layer periphery after, cleaned with pure water, further 100 DEG C, 200 DEG C,
300 DEG C, 360 DEG C of progress heat treatment in 2 minutes respectively at each temperature.
On first polyimide layer, polyamic acid resin is coated with the same manner as the second polyimide layer of embodiment 1
Solution, is thermally dried at 130 DEG C, next, heated up from 160 DEG C to 360 DEG C with about 20 DEG C/min of speed,
360 DEG C are kept for 60 minutes, form the second polyimide layer of 25 μm of thickness.High temperature hold time now is 61 minutes.
Thus the layered product that the first polyimide layer and the second polyimide layer are sequentially laminated with glass is formed in, according to
Similarly to Example 1 the step of, obtains display device.It should illustrate, the stripping of the first polyimide layer and the second polyimide layer
Intensity is 10.0N/m, and the hand of employment can be just easily separated.In addition, the linear expansion coefficient of the second polyimide layer is
9.3ppm/K, the second polyimide layer is 78.5% in the transmissivity of 440nm~780nm wavelength region.
(embodiment 4)
Will by m-TB (2,2 '-dimethylbenzidine) 17.70g, TPE-R (double (4- amino-benzene oxygens) the benzene 4.3g of 1,3- and
The polyamic acid that PMDA (pyromellitic acid anhydride) 17.20g, BPDA (3,3 ', 4,4 '-biphenyl tetracarboxylic dianhydride) 5.8g is obtained
Resin solution, using the thickness after solidification be 25 μm, spreading area is coated in the way of 310mm × 390mm and is used as supporter
On glass baseplate, the solvent (DMAc in 120 DEG C of heat dryings remove resin solution：DMAC N,N' dimethyl acetamide).Connect down
Come, be heat-treated from 130 DEG C to 160 DEG C with about 15 DEG C/min of programming rate and carry out imidizate, form 25 μm of thickness
The first polyimide layer (surface roughness Ra=1.0nm, Tg=360 DEG C).
On first polyimide layer, using spreading area as 306mm in the same manner as the second polyimide layer of embodiment 1
× 386mm mode is coated with polyamic acid resin solution, is thermally dried at 130 DEG C, next, from 160 DEG C to 360 DEG C with
About 20 DEG C/min of speed is heated up, and is kept for 30 minutes at 360 DEG C, forms the second polyimide layer of 25 μm of thickness.Now
High temperature hold time be 31 minutes.
Thus the layered product that the first polyimide layer and the second polyimide layer are sequentially laminated with glass is formed in, according to
Similarly to Example 2 the step of, obtains display device.The peel strength of first polyimide layer and the second polyimide layer is
110N/m, the hand of employment can just be separated.It should illustrate, the linear expansion coefficient of the first polyimide layer is 20.0ppm/K, second
The linear expansion coefficient of polyimide layer is 9.5ppm/K.In addition, wavelength region of second polyimide layer in 440nm~780nm
Transmissivity be 80.5%.
(embodiment 5)
Will by the obtained polyamic acid of PDA (1,4- phenylenediamines) and BPDA (3,3 ', 4,4 '-biphenyl tetracarboxylic dianhydride) tree
Lipoprotein solution is coated on copper foil by the thickness after solidifying in the way of 20 μm, in 130 DEG C of heat dryings remove resin solution
Solvent (DMAc：DMAC N,N' dimethyl acetamide).Next, being carried out from 160 DEG C to 360 DEG C with about 1 DEG C/min of programming rate
Be heat-treated and carry out imidizate, on copper foil formed 20 μm of thickness the first polyimide layer (surface roughness Ra=
1.3nm, Tg=355 DEG C).
Will by PMDA (pyromellitic acid anhydride), 6FDA (2,2 '-bis- (3,4- dicarboxyphenyis) hexafluoropropane dianhydrides) and
The resin solution for the polyamic acid that TFMB (2,2 '-bis- (trifluoromethyls) -4,4 '-benzidine) is obtained is with the thickness after solidifying
It is coated on for 25 μm of modes on first polyimide layer, the solvent in 130 DEG C of heat dryings remove resin solution
(DMAc：DMAC N,N' dimethyl acetamide).Next, being carried out from 160 DEG C to 360 DEG C with about 20 DEG C/min of programming rate from hot
Manage and carry out imidizate, form the second polyimide layer of 25 μm of thickness.It should illustrate, in the synthesis of above-mentioned polyamic acid,
Diamine component and acid dianhydride component substantially equimolar, PMDA/6FDA ratio is 85/15.
Etched by iron chloride and remove the layered product being made up of the polyimide layer of the polyimide layer of copper foil/first/second
Foil section, obtain the stacked film being made up of the polyimide layer of the first polyimide layer/second.
It is bonded in the stacked film with epoxide resin adhesive as on the glass substrate of supporter, it is poly- second thereafter
Imide layer side forms the EL element as display part.Thereafter, by peeling off the first polyimide layer and the second polyimides
The interfacial separation of layer, obtains the display device on polyimide base material with EL element.First polyimide layer and second gathers
Imide layer can be easily separated in the case where not caused damage to the equipment of the display parts such as TFT, electrode.It should illustrate,
In above-described embodiment, the linear expansion coefficient of the first polyimide layer is 12.0ppm/K, the linear expansion coefficient of the second polyimide layer
For 9.7ppm/K.In addition, the second polyimide layer is 83.5% in the transmissivity of 440nm~780nm wavelength region.
Symbol description
1 glass substrate
2 peel plies
3 polyimide layers
4 display parts (TFT/ organic EL panels portion)
5 lines of cut
6 adhesive linkages
7 first polyimide layers
8 second polyimide layers
9 cutting zones
10 cut surfaces
Claims (17)
1. a kind of manufacture method of display device, it is characterised in that the first polyimide layer and second is formed on supporter and is gathered
After imide layer, further formed on the second polyimide layer as defined in display part, thereafter, in the first polyimide layer and the
The boundary face of two polyimide layers is separated, and obtains possessing aobvious on the polyimide base material being made up of the second polyimide layer
Show the display device in portion,
A part for second polyimide layer is stretched out from the periphery of the first polyimide layer, the stretching of second polyimide layer
Supporter is fixed in portion.
2. a kind of manufacture method of display device, it is characterised in that the first polyimide layer and second is formed on supporter and is gathered
After imide layer, further formed on the second polyimide layer as defined in display part, thereafter, in the first polyimide layer and the
The boundary face of two polyimide layers is separated, and obtains possessing aobvious on the polyimide base material being made up of the second polyimide layer
Show the display device in portion,
A part for the layer of a side in first polyimide layer or the second polyimide layer is stretched out from the periphery of other layers.
3. a kind of manufacture method of display device, it is characterised in that the first polyimide layer and second is formed on supporter and is gathered
After imide layer, further formed on the second polyimide layer as defined in display part, thereafter, in the first polyimide layer and the
The boundary face of two polyimide layers is separated, and obtains possessing aobvious on the polyimide base material being made up of the second polyimide layer
Show the display device in portion,
Along the periphery of display part behind the first polyimide layer incision gap, the first polyimide layer and the second polyimides are carried out
The separation of layer.
4. according to the manufacture method of display device according to any one of claims 1 to 3, it is characterised in that by the first polyamides
The stacked film that imine layer and the second polyimide layer are directly laminated is fitted with supporter, i.e. by the first of the stacked film
After polyimides aspect is fitted with the one side of the supporter via adhesive linkage, defined display part is formed on stacked film, its
Afterwards, separated, obtained by the second polyimide layer structure with the boundary face of the second polyimide layer in the first polyimide layer
Into polyimide base material on possess the display device of display part.
5. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, forming defined show
Supporter is removed behind portion, is separated in the first polyimide layer with the boundary face of the second polyimide layer thereafter, is obtained poly-
Possesses the display device of display part on acid imide base material.
6. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, by being laminated polyimides
Film carries out the formation of the first polyimide layer, and second is carried out by the resin solution for being coated with polyimides or polyimide precursor
The formation of polyimide layer.
7. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, it is poly- by being coated with heating
The resin solution of acid imide or polyimide precursor carries out the formation of the first polyimide layer and the second polyimide layer.
8. the manufacture method of display device according to claim 7, wherein, by sub- in coating polyimides or polyamides
When the formation to carry out the second polyimide layer is heated after the resin solution of amine precursor, when the high temperature of the second polyimide layer is kept
Between be less than 60 minutes.
9. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, supporter is glass substrate.
10. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, the first polyimide layer
Thermal coefficient of expansion is below 25ppm/K.
11. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, the second polyimide layer
Thermal coefficient of expansion is below 25ppm/K.
12. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, the second polyimide layer exists
The transmissivity of 440nm~780nm wavelength region is more than 80%.
13. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, display part hinders across gas
Interlayer is formed, and the difference of the thermal coefficient of expansion of the second polyimide layer and gas-barrier layer is below 10ppm/K.
14. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, display part is colour filter
Layer.
15. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, the first polyimide layer with
The peel strength of second polyimide layer is below 200N/m.
16. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, the first polyimide layer or
At least one party in the polyimide layer of person second is made up of the polyimides of the construction unit represented with following formulas (1),
In formula, Ar1Represent the organic group of 4 valencys with aromatic rings, Ar2The divalent represented for following formulas (2) or (3) it is organic
Group,
Wherein, the R in formula (2) or formula (3)1~R8It is each independently hydrogen atom, fluorine atom, the alkane of carbon number 1~5
Base or alkoxy or fluorine substituted hydrocarbon radical, the R of formula (2)1~R4In at least one and formula (3) R1~R8In extremely
Few 1 is fluorine atom or fluorine substituted hydrocarbon radical.
17. according to the manufacture method of display device according to any one of claims 1 to 3, wherein, the first polyimide layer or
At least one party in the polyimide layer of person second is made up of the polyimides of the construction unit represented with following formulas (6),
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| JP2013011345 | 2013-01-24 | ||
| PCT/JP2013/075992 WO2014050933A1 (en) | 2012-09-27 | 2013-09-26 | Display device production method |
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| KR20140122207A (en) | 2013-04-09 | 2014-10-17 | 주식회사 엘지화학 | A laminate structure and a device comprising a substrate manufactured by using same |
| WO2015012339A1 (en) * | 2013-07-24 | 2015-01-29 | ユニチカ株式会社 | Laminate, method for processing same, and method for manufacturing flexible device |
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| CN107728358A (en) | 2018-02-23 |
| KR102087647B1 (en) | 2020-03-11 |
| TWI664087B (en) | 2019-07-01 |
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| JP2016145987A (en) | 2016-08-12 |
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| JPWO2014050933A1 (en) | 2016-08-22 |
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| KR102094729B1 (en) | 2020-03-30 |
| KR20200026322A (en) | 2020-03-10 |
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