CN104681468B - A kind of RFID falls to encapsulate hot-press arrangement - Google Patents
A kind of RFID falls to encapsulate hot-press arrangement Download PDFInfo
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- CN104681468B CN104681468B CN201510072751.9A CN201510072751A CN104681468B CN 104681468 B CN104681468 B CN 104681468B CN 201510072751 A CN201510072751 A CN 201510072751A CN 104681468 B CN104681468 B CN 104681468B
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- 238000007731 hot pressing Methods 0.000 claims abstract description 36
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000007667 floating Methods 0.000 claims abstract description 4
- 230000007246 mechanism Effects 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000005538 encapsulation Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000012544 monitoring process Methods 0.000 description 2
- 235000008331 Pinus X rigitaeda Nutrition 0.000 description 1
- 235000011613 Pinus brutia Nutrition 0.000 description 1
- 241000018646 Pinus brutia Species 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
Fall to encapsulate hot-press arrangement the invention discloses a kind of RFID, including the lower hot pressing header structure for being arranged on the upper hot pressing header structure of top base bottom He being arranged at the top of bottom base, chip hot pressing region, top base or/and the pedestal that bottom base is lift are formed between upper hot pressing header structure and lower hot pressing header structure；Upper hot pressing header structure includes：Bottom had and be movably arranged at the top of the supporting cylinder of opening, supporting cylinder on top base bottom, and pressure main body of the configuration in supporting tube inner chamber of floating, pressure main body and the inwall gap of supporting cylinder coordinate, and are arranged on the upper calandria of pressure bottom part body；Lower hot pressing header structure includes：Lower supports, the bottom of lower supports is movably arranged on bottom base, is arranged on the lower calandria at the top of lower supports；When upper calandria is pressed on chip, chip is ensured the electric capacity uniformity of chip bonding by its top pressure one constant pressure of thing.
Description
Technical field
The present invention relates to RFID packaging system field, more particularly to a kind of RFID falls to encapsulate hot pressing
Device.
Background technology
Current RFID label tag encapsulation hot-press arrangement is typically all thermal head Bidirectional heating above and below using, unidirectionally press mould
Formula, using cylinder control pressure.Pressed as shown in Figure 1 for lower thermal head, lower thermal head 10 is arranged on the piston rod 41 of cylinder 40
Top, the air pressure exported by air valve 42 promotes piston rod 41 to move upwards, and then drives lower thermal head 10 to move upwards, until
Lower thermal head 10 is by the hot pressing of chip 30 in the upper bottom of thermal head 11.Can now draw 30 pressures of chip=air valve pressure-under
Thermal head weight-piston rod and air cavity inwall frictional force, because piston rod and air cavity inwall frictional force are unable to precise control, and live
The order of magnitude of error produced by stopper rod and air cavity inwall frictional force is the same order of magnitude, serious shadow with pressure needed for chip package
Ring pressure and apply precision, gap is unequal between making the chip and antenna that each thermal head is encapsulated, and causes point of each finished product label
Cloth electric capacity dispersiveness becomes big, is also easy to cause encapsulation loosely when pressure is too small, chip is produced slight crack when pressure is excessive,
Serious harmful effect is all produced to label quality.
There is Chinese patent Authorization Notice No. CN202695395U (authorized announcement date 2013.01.23) to disclose one at present
RFID label tag encapsulation hot-press arrangement is planted, RFID label tag encapsulation hot-press arrangement passes through between upper thermal head body and electro-heat equipment
Provided with the constant pressure cylinder for moving electro-heat equipment.Due to being provided with constant pressure cylinder between upper thermal head body and electro-heat equipment,
Upper thermal head and lower thermal head coordinate when solidifying chip and antenna, and the pressure of each constant pressure cylinder is identical, even in one or
When spacing between multiple upper thermal heads and lower thermal head is differed, it is also possible that upper thermal head and lower thermal head are to chip
Pressure is identical, it is to avoid the error of the inconsistent generation of pressure between multiple upper thermal heads and multiple lower thermal heads.But above-mentioned patent
Multiple constant pressure cylinder cooperatings are needed, the cost of equipment is considerably increased and adds the difficulty of work synchronism.Also,
Above-mentioned patent does not solve the problems, such as precise control cylinder internal friction yet.
The content of the invention
The purpose of the present invention is to solve the shortcomings of the prior art and defect, by a kind of simple in construction and practical
RFID label tag falls to encapsulate hot-press arrangement, to solve the above problems.
Technical problem solved by the invention can be realized using following technical scheme：
A kind of RFID, which is fallen, encapsulates hot-press arrangement, including is arranged on the upper hot pressing header structure of top base bottom and sets
The lower hot pressing header structure at the top of bottom base is put, chip heat is formed between the upper hot pressing header structure and the lower hot pressing header structure
Intermediate pressure section, it is characterised in that the top base or/and the pedestal that the bottom base is lift；
The upper hot pressing header structure includes：
Bottom had and be movably arranged at the top of the supporting cylinder of opening, the supporting cylinder on the top base bottom,
The inwall gap for pressure main body of the configuration in the supporting tube inner chamber, the pressure main body and the supporting cylinder of floating
Coordinate,
It is arranged on the upper calandria of the pressure bottom part body；
The lower hot pressing header structure includes：
Lower supports, the bottom of the lower supports is movably arranged on the bottom base,
It is arranged on the lower calandria at the top of the lower supports；
When the upper calandria is pressed on chip, chip is by its top pressure one constant pressure of thing.
In a preferred embodiment of the invention, the relative two side of the supporting cylinder offers perpendicular bar hole respectively,
The pressure main body is passed through by the alignment pin that two ends floating is arranged in the perpendicular bar hole.
In a preferred embodiment of the invention, pass through between the top of the pressure main body and supporting tube inner chamber top
One rope without elasticity is connected.
In a preferred embodiment of the invention, the top base and the bottom base are made by magnetisable material,
The top of the supporting cylinder and the bottom of the lower supports are movably arranged in the top base bottom by permanent magnet respectively
On in portion and at the top of the bottom base.
In a preferred embodiment of the invention, the upper calandria and lower calandria are heated at constant temperature body.
In a preferred embodiment of the invention, the heated at constant temperature body is ceramic PTC.
In a preferred embodiment of the invention, it is provided between the upper calandria and the pressure main body heat-insulated
Body, lower insulator is provided between the lower calandria and the lower supports.
In a preferred embodiment of the invention, the top base is the pedestal of lift, and the bottom base is fixation
The pedestal of formula, the top base is connected with a straight line movement driving mechanism, and the straight line movement driving mechanism drives the upper base
Seat is lifted, and the range of the straight line movement driving mechanism is adapted with the lifting travel of the top base, with guarantee
Calandria can be fully pressed against on chip.
In a preferred embodiment of the invention, left at the top of the supporting cylinder between pressure body top configurable
The adjustment cavity of balancing weight.
As a result of technical scheme as above, pressure main body of the invention is floated and gap configuration is in supporting tube inner chamber,
When upper calandria is pressed on chip, frictional force is not present between pressure main body and supporting cylinder inwall so that chip is pushed up by it
Portion's pressure one constant pressure of thing, it is ensured that the pressure suffered by all chips is equal, and then ensures properties of product
Uniformity, reduction encapsulation link loss, improves product yield.In addition, the present invention can also be hot downwards using upper hot pressing header structure
The one direction mode of pressure head structure motion carries out hot pressing, reduces the operation difficulty of synchronism.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
The accompanying drawing to be used needed for having technology description is briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is that the RFID label tag of prior art encapsulates the structural representation of hot-press arrangement.
Fig. 2 is that the upper calandria of the embodiment of the present invention 1 is not pressed in structural representation when on chip.
Fig. 3 is enlarged section structural representation at Fig. 2 I.
Fig. 4 is Fig. 3 side view.
Fig. 5 is that the upper calandria of the embodiment of the present invention 1 is pressed in structural representation when on chip.
Fig. 6 is enlarged section structural representation at Fig. 5 I.
Fig. 7 is Fig. 6 side view.
Fig. 8 is that the upper calandria of the embodiment of the present invention 2 is not pressed in structural representation when on chip.
Fig. 9 is enlarged section structural representation at Fig. 8 II.
Figure 10 is that the upper calandria of the embodiment of the present invention 2 is pressed in structural representation when on chip.
Figure 11 is enlarged section structural representation at Figure 10 II.
Embodiment
In order that technological means, creation characteristic, reached purpose and effect that the present invention is realized are easy to understand, enter below
One step illustrates the present invention.
Embodiment 1
Referring to shown in Fig. 2 to Fig. 7, a kind of RFID, which falls to encapsulate hot-press arrangement, includes top base 100, bottom base
200th, the quantity of upper hot pressing header structure 300 and lower hot pressing header structure 400, upper hot pressing header structure 300 and lower hot pressing header structure 400 can
To set as needed, upper hot pressing header structure 300 is arranged on the bottom of top base 100, and lower hot pressing header structure 400 is arranged on lower base
The top of seat 200, forms chip hot pressing region a between upper hot pressing header structure 300 and lower hot pressing header structure 400.
Top base 100 in the present embodiment is the pedestal of lift, and bottom base 200 is fixed pedestal, top base 100
It is connected with a straight line movement driving mechanism (not shown), straight line movement driving mechanism driving top base 100 is lifted, and straight line
The range of motion driving mechanism is adapted with the lifting travel of top base 100, the linear motion driving machine in the present embodiment
Structure is motor-driven screw mandrel, or other straight line movement driving mechanisms that those skilled in the art are readily apparent that.
Upper hot pressing header structure 300 includes supporting cylinder 310, pressure main body 320 and upper calandria 330, supports the bottom of cylinder 310
With opening 311, the top of supporting cylinder 310 is movably arranged on the bottom of top base 100, to adapt to the distribution of different chips
Position.In the present embodiment, top base 100 is made up of magnetisable material, and the top for supporting cylinder 310 opens up fluted 313, recessed
Permanent magnet 350 is embedded with groove 313, by the suction-operated of permanent magnet 350 and top base 100, can to support cylinder 310
Top is movably arranged on the bottom of top base 100.It is of course also possible to other being readily apparent that using those skilled in the art
Removable configuration mode, such as sliding-rail sliding configuration mode.
Pressure main body 320, which is floated, to be configured in supporting cylinder 310 inner chamber, and pressure main body 320 and the inwall gap of supporting cylinder 310
Coordinate.Specifically, supporting cylinder 310 in the present embodiment relative two side 310a, 310b offer perpendicular bar hole 314 respectively,
Pressure main body 320 is passed through by the alignment pin 321 that a two ends are shelved in perpendicular bar hole 314.Change pressure main body 320 for convenience
Weight, adjustment cavity 312 is left between supporting cylinder 310 top and the top of pressure main body 320, can be at the top of pressure main body 320
Increase balancing weight, and balancing weight can be housed by adjusting cavity 312, can also change the length of pressure main body 320 certainly, adjust cavity
312 can also house the top portion of pressure main body 320 of different length.
The upper calandria 330 that the bottom of pressure main body 320 is provided with calandria 330, the present embodiment is ceramic PTC, with
Traditional heating wire is compared, and eliminates the monitoring of temperature sensor, and facilitates thermostatic control.In order to reduce heat loss, energy is reduced
Consumption, insulator 340 is provided between upper calandria 330 and pressure main body 320.
Lower hot pressing header structure 400 includes lower supports 410 and lower calandria 420, and the bottom of lower supports 410 is movably
Configuration is on the top of bottom base 200.In the present embodiment, bottom base 200 is made up of magnetisable material, and the bottom of lower supports 410
Portion opens up fluted 411, and permanent magnet 440 is embedded with groove 411, is made by the absorption of permanent magnet 440 and bottom base 200
With can make it that the bottom of lower supports 410 is movably arranged on the top of bottom base 200.It is of course also possible to utilize ability
Other removable configuration modes, such as sliding-rail sliding configuration mode that field technique personnel are readily apparent that.
The lower calandria 420 that the top of lower supports 410 is provided with lower calandria 420, the present embodiment is ceramic PTC, with
Traditional heating wire is compared, and eliminates the monitoring of temperature sensor, and facilitates thermostatic control.In order to reduce heat loss, energy is reduced
Consumption, lower insulator 430 is provided between lower calandria 420 and lower supports 410.
The operation principle of the present invention is as follows：
During work, the chip 500 after dispensing is delivered in chip hot pressing region a surely, driving top base 100 is moved downward,
When upper calandria 330 is not contacted with chip 500, under the Action of Gravity Field of pressure main body 320, the two ends branch of alignment pin 321
Hold on the perpendicular bottom of bar hole 314 (as shown in Figure 3 and Figure 4)；When upper calandria 330 is pressed on chip 500, due to pressure master
Body 320 floats and gap configuration is in supporting cylinder 310 inner chamber, so the two ends of alignment pin 321 are no longer supported on the perpendicular bottom of bar hole 314
In portion (as shown in Figure 6 and Figure 7), now pressure main body 320, upper calandria 330, upper insulator 340 and alignment pin 321 constitute core
Pressure thing at the top of piece, pressure main body 320, upper calandria 330, the gravity of upper insulator 340 and alignment pin 321 are all pressed in chip
On 500, and not by the friction effects of vertical direction, so applying a constant pressure to chip 500, and then ensure bonding
The uniformity of electric capacity.
Embodiment 2
Referring to shown in Fig. 8 to Figure 11, the structure of the present embodiment is substantially same as Example 1, and its difference is the present embodiment
In relative two side 310a, the 310b of supporting cylinder 310 do not offer perpendicular bar hole, and pressure main body 320 is not positioned
Pin through.Pressure main body 320 is still floated and gap configuration is in supporting cylinder 310 inner chamber, top and the supporting cylinder of pressure main body 320
By one without elastic and lightweight connected to almost negligible rope 360 between inner cavity top.So when upper calandria
330 with chip 500 when not contacted, and pressure main body 320 is suspended in supporting cylinder 310 (as shown in Figure 9)；When upper calandria 330
When being pressed on chip 500, because pressure main body 320 is floated and gap configuration is in supporting cylinder 310 inner chamber, so now pressure main body
320th, upper calandria 330 and upper insulator 340 constitute pressure thing at the top of chip, pressure main body 320, upper calandria 330 and on every
The gravity of hot body 340 is all pressed on chip 500, and not by the friction effects of vertical direction, and rope 360 is now in pine
Relaxation state (as shown in figure 11), does not possess pulling force, so chip 500 also suffers from a constant pressure.
The general principle and principal character and advantages of the present invention of the present invention has been shown and described above.The technology of the industry
Personnel are it should be appreciated that the present invention is not limited to the above embodiments, and the simply explanation described in above-described embodiment and specification is originally
The principle of invention, without departing from the spirit and scope of the present invention, various changes and modifications of the present invention are possible, these changes
Change and improvement all fall within the protetion scope of the claimed invention.The claimed scope of the invention by appending claims and its
Equivalent thereof.
Claims (9)
1. a kind of RFID, which is fallen, encapsulates hot-press arrangement, including is arranged on upper hot pressing header structure and the setting of top base bottom
Lower hot pressing header structure at the top of bottom base, forms chip hot pressing between the upper hot pressing header structure and the lower hot pressing header structure
Region, it is characterised in that the top base or/and the pedestal that the bottom base is lift；
The upper hot pressing header structure includes：
Bottom had and be movably arranged at the top of the supporting cylinder of opening, the supporting cylinder on the top base bottom,
Configuration of floating is matched somebody with somebody in the pressure main body for supporting tube inner chamber, the pressure main body and the inwall gap for supporting cylinder
Close,
It is arranged on the upper calandria of the pressure bottom part body；
The lower hot pressing header structure includes：
Lower supports, the bottom of the lower supports is movably arranged on the bottom base,
It is arranged on the lower calandria at the top of the lower supports；
When the upper calandria is pressed on chip, chip is by its top pressure one constant pressure of thing.
2. a kind of RFID as claimed in claim 1 falls to encapsulate hot-press arrangement, it is characterised in that the supporting cylinder phase
To two side offer perpendicular bar hole respectively, the pressure main body is floated by a two ends and is arranged on determining in the perpendicular bar hole
Position pin through.
3. a kind of RFID as claimed in claim 1 falls to encapsulate hot-press arrangement, it is characterised in that the pressure main body
Top and supporting tube inner chamber at the top of between pass through one without elasticity rope connection.
4. a kind of RFID as described in claim 1 or 2 or 3 falls to encapsulate hot-press arrangement, it is characterised in that on described
Pedestal and the bottom base are made by magnetisable material, and the top of the supporting cylinder and the bottom of the lower supports lead to respectively
Cross permanent magnet be movably arranged on the top base bottom and the bottom base at the top of on.
5. a kind of RFID as described in claim 1 or 2 or 3 falls to encapsulate hot-press arrangement, it is characterised in that on described
Calandria and lower calandria are heated at constant temperature body.
6. a kind of RFID as claimed in claim 5 falls to encapsulate hot-press arrangement, it is characterised in that the heated at constant temperature
Body is ceramic PTC.
7. a kind of RFID as claimed in claim 6 falls to encapsulate hot-press arrangement, it is characterised in that the upper calandria
Insulator is provided between the pressure main body, is provided with down between the lower calandria and the lower supports heat-insulated
Body.
8. a kind of RFID as described in claim 1 or 2 or 3 falls to encapsulate hot-press arrangement, it is characterised in that on described
Pedestal is the pedestal of lift, and the bottom base is fixed pedestal, and the top base and a straight line movement driving mechanism connect
Connect, the straight line movement driving mechanism drives the top base lifting, and the range of the straight line movement driving mechanism with
The lifting travel of the top base is adapted, to ensure that upper calandria can be fully pressed against on chip.
9. a kind of RFID as described in claim 1 or 2 or 3 falls to encapsulate hot-press arrangement, it is characterised in that the branch
Hold the adjustment cavity for leaving configurable balancing weight at the top of cylinder between pressure body top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510072751.9A CN104681468B (en) | 2015-02-11 | 2015-02-11 | A kind of RFID falls to encapsulate hot-press arrangement |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510072751.9A CN104681468B (en) | 2015-02-11 | 2015-02-11 | A kind of RFID falls to encapsulate hot-press arrangement |
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| Publication Number | Publication Date |
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| CN104681468A CN104681468A (en) | 2015-06-03 |
| CN104681468B true CN104681468B (en) | 2017-07-18 |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428257B (en) * | 2015-12-11 | 2017-10-20 | 湖北华威科智能技术有限公司 | One kind is directed to large scale RFID tag reverse packaging process |
| CN105742217A (en) * | 2016-04-19 | 2016-07-06 | 刘宁 | Electronic tag packaging and hot-pressing mechanism |
| CN108107163B (en) * | 2018-02-02 | 2024-04-16 | 巨心物联网实验室（深圳）有限公司 | INLAY electronic tag chip packaging experiment machine |
| CN110010529A (en) * | 2019-04-16 | 2019-07-12 | 深圳市先进连接科技有限公司 | A kind of pressing sintering for large power semiconductor device encapsulation |
| CN112786523B (en) * | 2021-01-11 | 2022-06-03 | 北京航空航天大学 | Hot-pressing sintering clamp for chip packaging and chip packaging method |
| CN112884112A (en) * | 2021-03-19 | 2021-06-01 | 德龙信息技术（苏州）有限公司 | Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag |
| CN117936435B (en) * | 2024-03-22 | 2024-06-25 | 泰姆瑞（北京）精密技术有限公司 | Detachable crimping device and hot pressing equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
| CN202225442U (en) * | 2011-09-19 | 2012-05-23 | 广东宝丽华服装有限公司 | Thermal head for thermofixation of RFID (radio frequency identification) tags |
| CN202695395U (en) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | RFID tag packaging hot-pressing device |
| CN203141861U (en) * | 2013-01-29 | 2013-08-21 | 广东宝丽华服装有限公司 | Hot pressing device for heat curing of RFID (Radio Frequency IDentification) tags |
| CN103434134A (en) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | Hot pressure head for encapsulation of RFID (Radio Frequency Identification) tag |
| CN204516728U (en) * | 2015-02-11 | 2015-07-29 | 上海博应信息技术有限公司 | A kind of RFID encapsulates hot-press arrangement |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5519823A (en) * | 1978-07-27 | 1980-02-12 | Nec Corp | Semoconductor element mounting device |
-
2015
- 2015-02-11 CN CN201510072751.9A patent/CN104681468B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
| CN202695395U (en) * | 2011-04-22 | 2013-01-23 | 深圳才纳半导体设备有限公司 | RFID tag packaging hot-pressing device |
| CN202225442U (en) * | 2011-09-19 | 2012-05-23 | 广东宝丽华服装有限公司 | Thermal head for thermofixation of RFID (radio frequency identification) tags |
| CN203141861U (en) * | 2013-01-29 | 2013-08-21 | 广东宝丽华服装有限公司 | Hot pressing device for heat curing of RFID (Radio Frequency IDentification) tags |
| CN103434134A (en) * | 2013-08-12 | 2013-12-11 | 华中科技大学 | Hot pressure head for encapsulation of RFID (Radio Frequency Identification) tag |
| CN204516728U (en) * | 2015-02-11 | 2015-07-29 | 上海博应信息技术有限公司 | A kind of RFID encapsulates hot-press arrangement |
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| CN104681468A (en) | 2015-06-03 |
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| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag Effective date of registration: 20200608 Granted publication date: 20170718 Pledgee: New Area Branch of Shanghai pilot free trade zone of Bank of Communications Co., Ltd Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2020310000025 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20210621 Granted publication date: 20170718 Pledgee: New Area Branch of Shanghai pilot free trade zone of Bank of Communications Co., Ltd Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2020310000025 |
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| PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A reverse packaging hot pressing device for RFID tag Effective date of registration: 20210624 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2021310000041 |
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Date of cancellation: 20220616 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2021310000041 |
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