CN104681468A - Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag - Google Patents
Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag Download PDFInfo
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- CN104681468A CN104681468A CN201510072751.9A CN201510072751A CN104681468A CN 104681468 A CN104681468 A CN 104681468A CN 201510072751 A CN201510072751 A CN 201510072751A CN 104681468 A CN104681468 A CN 104681468A
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- base
- rfid
- head structure
- chip
- main body
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- 238000007731 hot pressing Methods 0.000 title claims abstract description 15
- 230000007246 mechanism Effects 0.000 claims description 11
- 239000012212 insulator Substances 0.000 claims description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 8
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 4
- 238000010438 heat treatment Methods 0.000 abstract description 6
- 238000003825 pressing Methods 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000013475 authorization Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002457 bidirectional effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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- Lining Or Joining Of Plastics Or The Like (AREA)
Abstract
The invention discloses an inverted package hot pressing device of an RFID (Radio Frequency Identification) electronic tag, which comprises an upper hot pressing head structure arranged at the bottom of an upper base, and a lower hot pressing head structure arranged at the top of a lower base, wherein a chip hot pressing area is formed between the upper hot pressing head structure and the lower hot pressing head structure; the upper base or/and the lower base is/are a lifting base or lifting bases; the upper hot pressing head structure comprises a support cylinder with an opening at the bottom, a pressure main body configured in an inner cavity of the support cylinder in a floating manner, and an upper heating body arranged at the bottom of the pressure main body; the top of the support cylinder is movably configured at the bottom of the upper base; the pressure main body is in clearance fit with an inner wall of the support cylinder; the lower hot pressing head structure comprises a lower support body and a lower heating body arranged at the top of the lower support body; and the bottom end of the lower support body is movably configured on the lower base. When the upper heating body is pressed on a chip, the chip suffers constant pressure from a pressing article at the top of the chip, and binding capacitance consistency of the chip is further ensured.
Description
Technical field
The present invention relates to RFID packaging system field, particularly a kind of RFID encapsulates hot-press arrangement.
Background technology
Current RFID label tag encapsulation hot-press arrangement is all generally adopt upper and lower thermal head Bidirectional heating, unidirectional pattern of exerting pressure, and adopts cylinder controlled pressure.Be illustrated in figure 1 lower thermal head to exert pressure, lower thermal head 10 is arranged on piston rod 41 top of cylinder 40, the air pressure that exported by air valve 42 is promoted piston rod 41 and moves upward, and then drives lower thermal head 10 to move upward, until lower thermal head 10 by chip 30 hot pressing bottom upper thermal head 11.Now can draw chip 30 pressures=air valve pressure-lower thermal head weight-piston rod and air cavity inwall frictional force, because piston rod and air cavity inwall frictional force can not accurately control, and the order of magnitude of the error that piston rod and air cavity inwall frictional force produce is the same order of magnitude with pressure needed for chip package, have a strong impact on pressure and apply precision, between the chip that each thermal head is encapsulated and antenna, gap is unequal, the distributed capacitance dispersiveness of each finished product label is caused to become large, also encapsulation is easily caused loosely when pressure is too small, chip even can be made when pressure is excessive to produce slight crack, serious harmful effect is all produced to label quality.
Also have Chinese patent Authorization Notice No. CN202695395U (authorized announcement date 2013.01.23) to disclose a kind of RFID label tag encapsulation hot-press arrangement at present, this RFID label tag encapsulation hot-press arrangement by being provided with the constant voltage cylinder making electro-heat equipment movement between upper thermal head body and electro-heat equipment.Owing to being provided with constant voltage cylinder between upper thermal head body and electro-heat equipment, upper thermal head to coordinate with lower thermal head chip and antenna are solidified time, the pressure of each constant voltage cylinder is identical, even if when the spacing on one or more between thermal head with lower thermal head is not identical, also thermal head can be made identical with the pressure of lower thermal head to chip, avoid the error of the inconsistent generation of pressure between multiple upper thermal head and multiple lower thermal head.But above-mentioned patent needs multiple constant voltage cylinder cooperating, considerably increase the cost of equipment and add the difficulty of work synchronism.Further, above-mentioned patent does not solve accurate control cylinder internal friction problem yet.
Summary of the invention
The object of the invention is to for shortcomings and deficiencies of the prior art, the RFID label tag simple and practical by a kind of structure encapsulates hot-press arrangement, to solve the problem.
Technical problem solved by the invention can realize by the following technical solutions:
A kind of RFID encapsulates hot-press arrangement, comprise the upper thermal head structure be arranged on bottom top base and the lower thermal head structure being arranged on bottom base top, chip hot pressing region is formed between described upper thermal head structure and described lower thermal head structure, it is characterized in that, described top base is or/and described bottom base is the pedestal of elevation type;
Described upper thermal head structure comprises:
Bottom has the carrying cylinder of opening, and the top of described carrying cylinder is configured on bottom described top base movably,
Float and be configured in the pressure main body of described carrying cylinder inner chamber, the inwall matched in clearance of described pressure main body and described carrying cylinder,
Be arranged on the upper calandria of described pressure bottom part body;
Described lower thermal head structure comprises:
Lower supports, the bottom of described lower supports is configured on described bottom base movably,
Be arranged on the lower calandria at described lower supports top;
When described upper calandria is pressed on chip, chip is subject to its top and exerts pressure the constant pressure of thing one.
In a preferred embodiment of the invention, the two side that described carrying cylinder is relative offers perpendicular bar hole respectively, and described pressure main body is passed by the two ends alignment pin be arranged in described perpendicular bar hole that floats.
In a preferred embodiment of the invention, the top of described pressure main body does not have flexible rope to be connected with between carrying cylinder inner cavity top by one.
In a preferred embodiment of the invention, described top base and described bottom base are made by magnetisable material, and the top of described carrying cylinder and the bottom of described lower supports are configured on upper bottom described top base and described bottom base top movably respectively by permanent magnet.
In a preferred embodiment of the invention, described upper calandria and lower calandria are heated at constant temperature body.
In a preferred embodiment of the invention, described heated at constant temperature body is ceramic PTC.
In a preferred embodiment of the invention, between described upper calandria and described pressure main body, be provided with insulator, between described lower calandria and described lower supports, be provided with lower insulator.
In a preferred embodiment of the invention, described top base is the pedestal of elevation type, described bottom base is fixed pedestal, described top base is connected with a straight line movement driving mechanism, described straight line movement driving mechanism drives described top base to be elevated, and the lifting travel of the range of described straight line movement driving mechanism and described top base is suitable, to ensure that upper calandria can be pressed on chip completely.
In a preferred embodiment of the invention, the adjustment cavity of configurable balancing weight is left between described carrying cylinder top and pressure body top.
Owing to have employed technical scheme as above, pressure main body of the present invention float and gap configuration at carrying cylinder inner chamber, when upper calandria is pressed on chip, frictional force is there is not between pressure main body and carrying cylinder inwall, make chip be subject to its top to exert pressure the constant pressure of thing one, ensure that the pressure suffered by all chips is equal, and then ensure the consistency of properties of product, reduce the loss of encapsulation link, improve product yield.In addition, the present invention can also utilize the one direction mode of the downward thermal head structure motion of thermal head structure to carry out hot pressing, reduces the operation easier of synchronism.
Accompanying drawing explanation
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, be briefly described to the accompanying drawing used required in embodiment or description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the structural representation of the RFID label tag encapsulation hot-press arrangement of prior art.
Fig. 2 is the structural representation of the upper calandria of the embodiment of the present invention 1 when not being pressed on chip.
Fig. 3 is the I place enlarged section structural representation of Fig. 2.
Fig. 4 is the end view of Fig. 3.
Fig. 5 is the structural representation of the upper calandria of the embodiment of the present invention 1 when being pressed on chip.
Fig. 6 is the I place enlarged section structural representation of Fig. 5.
Fig. 7 is the end view of Fig. 6.
Fig. 8 is the structural representation of the upper calandria of the embodiment of the present invention 2 when not being pressed on chip.
Fig. 9 is the II place enlarged section structural representation of Fig. 8.
Figure 10 is the structural representation of the upper calandria of the embodiment of the present invention 2 when being pressed on chip.
Figure 11 is the II place enlarged section structural representation of Figure 10.
Embodiment
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, setting forth the present invention further below.
Embodiment 1
See shown in Fig. 2 to Fig. 7, a kind of RFID is fallen to encapsulate hot-press arrangement and is comprised top base 100, bottom base 200, upper thermal head structure 300 and lower thermal head structure 400, the quantity of upper thermal head structure 300 and lower thermal head structure 400 can set as required, upper thermal head structure 300 is arranged on bottom top base 100, lower thermal head structure 400 is arranged on bottom base 200 top, forms chip hot pressing region a between upper thermal head structure 300 and lower thermal head structure 400.
Top base 100 in the present embodiment is the pedestal of elevation type, bottom base 200 is fixed pedestal, top base 100 is connected with a straight line movement driving mechanism (not shown), straight line movement driving mechanism drives top base 100 to be elevated, and the lifting travel of the range of straight line movement driving mechanism and top base 100 is suitable, straight line movement driving mechanism in the present embodiment is motor-driven screw mandrel, other straight line movement driving mechanisms also easily can expected for those skilled in the art.
Upper thermal head structure 300 comprises carrying cylinder 310, pressure main body 320 and upper calandria 330, and the bottom of carrying cylinder 310 has opening 311, and the top of carrying cylinder 310 is configured on bottom top base 100 movably, to adapt to the distributing position of different chip.In the present embodiment, top base 100 is made up of magnetisable material, and the top of carrying cylinder 310 offers groove 313, permanent magnet 350 is embedded with in groove 313, by the suction-operated of permanent magnet 350 with top base 100, the top of carrying cylinder 310 can be made to be configured in movably on bottom top base 100.Certainly, other removable configuration modes that those skilled in the art easily expect can also be utilized, as sliding-rail sliding configuration mode.
Pressure main body 320 is floated and is configured in carrying cylinder 310 inner chamber, and the inwall matched in clearance of pressure main body 320 and carrying cylinder 310.Particularly, two side 310a, 310b that the carrying cylinder 310 in the present embodiment is relative offer perpendicular bar hole 314 respectively, and pressure main body 320 is passed by the alignment pin 321 that two ends are shelved in perpendicular bar hole 314.Conveniently change the weight of pressure main body 320, leave between carrying cylinder 310 top and pressure main body 320 top and adjust cavity 312, balancing weight can be increased at pressure main body 320 top, and adjust cavity 312 can accommodating balancing weight, certainly also can change the length of pressure main body 320, adjustment cavity 312 also can pressure main body 320 top portion of accommodating different length.
Be provided with calandria 330 bottom pressure main body 320, the upper calandria 330 in the present embodiment is ceramic PTC, compared with traditional heating wire, eliminates the monitoring of temperature sensor, and facilitates thermostatic control.In order to reduce thermal loss, reducing energy consumption, between upper calandria 330 and pressure main body 320, being provided with insulator 340.
Lower thermal head structure 400 comprises lower supports 410 and lower calandria 420, and the bottom of lower supports 410 is configured on bottom base 200 top movably.In the present embodiment, bottom base 200 is made up of magnetisable material, and the bottom of lower supports 410 offers groove 411, permanent magnet 440 is embedded with in groove 411, by the suction-operated of permanent magnet 440 with bottom base 200, the bottom of lower supports 410 can be made to be configured in movably on bottom base 200 top.Certainly, other removable configuration modes that those skilled in the art easily expect can also be utilized, as sliding-rail sliding configuration mode.
Lower supports 410 top is provided with lower calandria 420, and the lower calandria 420 in the present embodiment is ceramic PTC, compared with traditional heating wire, eliminates the monitoring of temperature sensor, and facilitates thermostatic control.In order to reduce thermal loss, reducing energy consumption, between lower calandria 420 and lower supports 410, being provided with lower insulator 430.
Operation principle of the present invention is as follows:
During work, chip 500 after a glue is delivered to surely in chip hot pressing region a, top base 100 is driven to move downward, when upper calandria 330 does not contact with chip 500, under the Action of Gravity Field of pressure main body 320, the two supports of alignment pin 321 bottom perpendicular bar hole 314 on (as shown in Figure 3 and Figure 4), when upper calandria 330 is pressed on chip 500, due to pressure main body 320 float and gap configuration at carrying cylinder 310 inner chamber, so the two ends of alignment pin 321 are no longer bearing in upper (as shown in Figure 6 and Figure 7) bottom perpendicular bar hole 314, now pressure main body 320, upper calandria 330, upper insulator 340 and alignment pin 321 form chip top and to exert pressure thing, pressure main body 320, upper calandria 330, the gravity of upper insulator 340 and alignment pin 321 is all pressed on chip 500, and not by the friction effects of vertical direction, so apply a constant pressure to chip 500, and then ensure that nation determines the consistency of electric capacity.
Embodiment 2
See shown in Fig. 8 to Figure 11, the structure of the present embodiment is roughly identical with embodiment 1, and its difference is that two side 310a, 310b that the carrying cylinder 310 in the present embodiment is relative do not offer perpendicular bar hole, and pressure main body 320 is not passed by alignment pin.Pressure main body 320 or float and gap configuration at carrying cylinder 310 inner chamber, the top of pressure main body 320 does not have elasticity with between carrying cylinder inner cavity top by one and to be lightweightly connected to almost negligible rope 360.So when upper calandria 330 does not contact with chip 500, pressure main body 320 is suspended in carrying cylinder 310 (as shown in Figure 9); When upper calandria 330 is pressed on chip 500, due to pressure main body 320 float and gap configuration at carrying cylinder 310 inner chamber, so now pressure main body 320, upper calandria 330 and upper insulator 340 form chip top and to exert pressure thing, the gravity of pressure main body 320, upper calandria 330 and upper insulator 340 is all pressed on chip 500, not by the friction effects of vertical direction, and rope 360 is now in relaxed state (as shown in figure 11), do not possess pulling force, so chip 500 is still subject to a constant pressure.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection range is defined by appending claims and equivalent thereof.
Claims (9)
1. a RFID encapsulates hot-press arrangement, comprise the upper thermal head structure be arranged on bottom top base and the lower thermal head structure being arranged on bottom base top, chip hot pressing region is formed between described upper thermal head structure and described lower thermal head structure, it is characterized in that, described top base is or/and described bottom base is the pedestal of elevation type;
Described upper thermal head structure comprises:
Bottom has the carrying cylinder of opening, and the top of described carrying cylinder is configured on bottom described top base movably,
Float and be configured in the pressure main body of described carrying cylinder inner chamber, the inwall matched in clearance of described pressure main body and described carrying cylinder,
Be arranged on the upper calandria of described pressure bottom part body;
Described lower thermal head structure comprises:
Lower supports, the bottom of described lower supports is configured on described bottom base movably,
Be arranged on the lower calandria at described lower supports top;
When described upper calandria is pressed on chip, chip is subject to its top and exerts pressure the constant pressure of thing one.
2. a kind of RFID as claimed in claim 1 encapsulates hot-press arrangement, it is characterized in that, the two side that described carrying cylinder is relative offers perpendicular bar hole respectively, and described pressure main body is passed by the two ends alignment pin be arranged in described perpendicular bar hole that floats.
3. a kind of RFID as claimed in claim 1 encapsulates hot-press arrangement, it is characterized in that, the top of described pressure main body does not have flexible rope to be connected with between carrying cylinder inner cavity top by one.
4. a kind of RFID as described in claim 1 or 2 or 3 encapsulates hot-press arrangement, it is characterized in that, described top base and described bottom base are made by magnetisable material, and the top of described carrying cylinder and the bottom of described lower supports are configured on upper bottom described top base and described bottom base top movably respectively by permanent magnet.
5. a kind of RFID as described in claim 1 or 2 or 3 encapsulates hot-press arrangement, it is characterized in that, described upper calandria and lower calandria are heated at constant temperature body.
6. a kind of RFID as claimed in claim 5 encapsulates hot-press arrangement, it is characterized in that, described heated at constant temperature body is ceramic PTC.
7. a kind of RFID as claimed in claim 6 encapsulates hot-press arrangement, it is characterized in that, is provided with insulator between described upper calandria and described pressure main body, is provided with lower insulator between described lower calandria and described lower supports.
8. a kind of RFID as described in claim 1 or 2 or 3 encapsulates hot-press arrangement, it is characterized in that, described top base is the pedestal of elevation type, described bottom base is fixed pedestal, described top base is connected with a straight line movement driving mechanism, described straight line movement driving mechanism drives described top base to be elevated, and the lifting travel of the range of described straight line movement driving mechanism and described top base is suitable, to ensure that upper calandria can be pressed on chip completely.
9. a kind of RFID as described in claim 1 or 2 or 3 encapsulates hot-press arrangement, it is characterized in that, leaves the adjustment cavity of configurable balancing weight between described carrying cylinder top and pressure body top.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510072751.9A CN104681468B (en) | 2015-02-11 | 2015-02-11 | A kind of RFID falls to encapsulate hot-press arrangement |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510072751.9A CN104681468B (en) | 2015-02-11 | 2015-02-11 | A kind of RFID falls to encapsulate hot-press arrangement |
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| Publication Number | Publication Date |
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| CN104681468A true CN104681468A (en) | 2015-06-03 |
| CN104681468B CN104681468B (en) | 2017-07-18 |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428257A (en) * | 2015-12-11 | 2016-03-23 | 湖北华威科智能技术有限公司 | Large-size RFID tag inverted packaging technology |
| CN105742217A (en) * | 2016-04-19 | 2016-07-06 | 刘宁 | Electronic tag packaging and hot-pressing mechanism |
| CN108107163A (en) * | 2018-02-02 | 2018-06-01 | 巨心物联网实验室（深圳）有限公司 | INLAY electronic label chip package experiment machines |
| CN110010529A (en) * | 2019-04-16 | 2019-07-12 | 深圳市先进连接科技有限公司 | A kind of pressing sintering for large power semiconductor device encapsulation |
| CN112786523A (en) * | 2021-01-11 | 2021-05-11 | 北京航空航天大学 | Hot-pressing sintering clamp for chip packaging and chip packaging method |
| CN112884112A (en) * | 2021-03-19 | 2021-06-01 | 德龙信息技术（苏州）有限公司 | Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag |
| CN117936435A (en) * | 2024-03-22 | 2024-04-26 | 泰姆瑞（北京）精密技术有限公司 | Detachable crimping device and hot pressing equipment |
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| CN101973011A (en) * | 2010-09-08 | 2011-02-16 | 中国科学院长春光学精密机械与物理研究所 | Crystal curing press head applied to electronic tag back-off encapsulation equipment |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105428257A (en) * | 2015-12-11 | 2016-03-23 | 湖北华威科智能技术有限公司 | Large-size RFID tag inverted packaging technology |
| CN105428257B (en) * | 2015-12-11 | 2017-10-20 | 湖北华威科智能技术有限公司 | One kind is directed to large scale RFID tag reverse packaging process |
| CN105742217A (en) * | 2016-04-19 | 2016-07-06 | 刘宁 | Electronic tag packaging and hot-pressing mechanism |
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| CN108107163B (en) * | 2018-02-02 | 2024-04-16 | 巨心物联网实验室（深圳）有限公司 | INLAY electronic tag chip packaging experiment machine |
| CN110010529A (en) * | 2019-04-16 | 2019-07-12 | 深圳市先进连接科技有限公司 | A kind of pressing sintering for large power semiconductor device encapsulation |
| CN112786523A (en) * | 2021-01-11 | 2021-05-11 | 北京航空航天大学 | Hot-pressing sintering clamp for chip packaging and chip packaging method |
| CN112786523B (en) * | 2021-01-11 | 2022-06-03 | 北京航空航天大学 | Hot-pressing sintering clamp for chip packaging and chip packaging method |
| CN112884112A (en) * | 2021-03-19 | 2021-06-01 | 德龙信息技术（苏州）有限公司 | Hot-pressing structure for inverted packaging of RFID (radio frequency identification) tag |
| CN117936435A (en) * | 2024-03-22 | 2024-04-26 | 泰姆瑞（北京）精密技术有限公司 | Detachable crimping device and hot pressing equipment |
| CN117936435B (en) * | 2024-03-22 | 2024-06-25 | 泰姆瑞（北京）精密技术有限公司 | Detachable crimping device and hot pressing equipment |
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|---|---|
| CN104681468B (en) | 2017-07-18 |
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Denomination of invention: Inverted package hot pressing device of RFID (Radio Frequency Identification) electronic tag Effective date of registration: 20200608 Granted publication date: 20170718 Pledgee: New Area Branch of Shanghai pilot free trade zone of Bank of Communications Co., Ltd Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2020310000025 |
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Date of cancellation: 20210621 Granted publication date: 20170718 Pledgee: New Area Branch of Shanghai pilot free trade zone of Bank of Communications Co., Ltd Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2020310000025 |
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Denomination of invention: A reverse packaging hot pressing device for RFID tag Effective date of registration: 20210624 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2021310000041 |
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Date of cancellation: 20220616 Granted publication date: 20170718 Pledgee: Bank of Communications Limited Shanghai pilot Free Trade Zone Branch Pledgor: SHANGHAI BOYING INFORMATION TECHNOLOGY Co.,Ltd. Registration number: Y2021310000041 |