CN104640430A - Substrate backflow fixture and backflow method - Google Patents
Substrate backflow fixture and backflow method Download PDFInfo
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- CN104640430A CN104640430A CN201410048014.0A CN201410048014A CN104640430A CN 104640430 A CN104640430 A CN 104640430A CN 201410048014 A CN201410048014 A CN 201410048014A CN 104640430 A CN104640430 A CN 104640430A
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Abstract
The invention discloses a substrate backflow fixture and a backflow method. According to the embodiments of the invention, the substrate backflow fixture comprises a first plate arranged above a substrate provided with a hole and a solder, wherein the hole is provided with pins for the insertion of an electronic part and the solder is arranged to surround the periphery of the hole; a plurality of first through holes formed in the first plate; a plurality of extrusion units configured to be inserted into the top surface of the electronic part so as to support the electronic part; and a locking unit configured to move inside the first through holes through locking or unlocking the plurality of extrusion units.
Description
The cross reference of related application
This application claims and submit to the rights and interests of No. 10-2013-0135490th, the korean patent application of Korean Intellectual Property Office on November 8th, 2013, by reference its full content is incorporated into this.
Technical field
The present invention relates to for the fixture of substrate backflow and the method for substrate backflow.
Background technology
Welding (soldering, soldering) is a kind of brazing (brazing), is manufacturing joint method (jointing method) required in electronic device.Welding is following methods, and wherein, two kinds of different metal materials melt in hot environment.
Perform welding so that by engaging two kinds of different metals and providing the joint of high conductance to carry out mechanically stable position.
This type of welding a kind of is reflow method, wherein, printing cream solder and after two kinds of Metal Contact, these two kinds of metals are through refluxing unit.In this case, when then cream solder fusing solidifies, welding completes.
Can produce used heat and waste gas in refluxing unit, therefore refluxing unit can have the blast pipe that is formed in wherein effectively to discharge used heat and waste gas.
Correlation technique of the present invention discloses No. 2010-0022814 (REFLOW DECIVE in Korean Patent; On March 3rd, 2010 is open) in open.
Summary of the invention
The invention provides the fixture for substrate backflow, wherein, the electronic unit on multiple squeeze unit supporting substrate.
The present invention is also provided for the method for substrate backflow, and the method uses has multiple squeeze unit fixture heated substrates wherein.
An aspect of of the present present invention is provided for the fixture of substrate backflow, and this fixture comprises: the first plate, is placed on the surface comprising hole and solder, and wherein, hole has electronic unit insertion pin wherein, and solder is formed along the circumferential exterior in hole; Multiple first through hole, is formed in the first plate; Multiple squeeze unit, is configured to the end face extruding electronic unit by inserting multiple first through hole respectively, so that support electronic components; And lock cell, be configured to locking or unlock the up/down of multiple squeeze unit in the first through hole move.
Fixture for substrate backflow can also comprise: the second plate, this second plate is coupled to the first plate with between the first plate and substrate, and this second plate have be formed in wherein correspond to the second through hole of the first through hole to allow squeeze unit to run through from it.
Second plate can be arranged to and be separated with the first plate.
Squeeze unit can comprise pin component.
Squeeze unit can have the scotch being formed in top.
Lock cell can comprise: board member, is arranged in the face of the first plate and can moves horizontally to be coupled to the first plate; Lockhole, is formed in board member so that corresponding with the position of the first through hole; And regulon, be coupled to board member so that the moving horizontally of adjustable plate component.
The area of section of lockhole can be greater than the area of section of squeeze unit.
Difference between regulon can be configured to the latitude area of the area of section of the latitude length of the area of section of lockhole and squeeze unit is to move horizontally board member.
Board member can be arranged to and be separated with the first plate.
Fixture for substrate backflow can also comprise the coupler member being constructed to the first plate and substrate to couple.
First plate comprises the cover plate that couples with the first plate to cover the top of squeeze unit, and coupler member can be constructed to cover plate and substrate to couple.
Another aspect of the present invention is provided for the method for substrate backflow, and the method comprises: arrange the substrate comprising solder, solder is formed along the circumferential exterior in hole, and hole has electronic unit insertion pin wherein; Arrange the first plate in surface, the first plate comprises and has multiple squeeze unit and insert multiple first through holes wherein respectively, makes multiple squeeze unit extrude the end face of electronic unit in this way; The up/down of the multiple squeeze unit of locking unit locks in through hole is made to move so that support electronic components; And heated substrates makes solder fusing and engages with pin.
Be arranged in surface by the first plate, squeeze unit can be inserted in the second through hole in the second plate between the first plate and substrate.
Squeeze unit can comprise pin component.
Lock cell can comprise: board member, is coupled to the first plate so that in the face of the first plate; Lockhole, is formed in board member so that corresponding with the position of the first through hole; And regulon, be coupled to board member so that the moving horizontally of adjustable plate component.In making the up/down of the multiple squeeze unit of locking unit locks in through hole move, regulon can be constructed to move horizontally board member, makes the first through hole and lockhole misplace mutually in this way.
The area of section of lockhole can be greater than the area of section of squeeze unit.
Difference between regulon can be constructed to the latitude area of the area of section of the latitude length of the area of section of lockhole and squeeze unit is to move horizontally board member.
Method for substrate backflow can also comprise, and makes after the up/down of the multiple squeeze unit of locking unit locks in through hole move, and puts upside down the first plate and substrate makes electronic unit be placed on above the squeeze unit of locking.
Arrange that the first plate can comprise in surface by coupler member, the first plate and substrate to be coupled.
Method for substrate backflow can also comprise, after heated substrates, and cooling base.
Utilize embodiments of the present invention, because the electronic unit of various sizes can be supported easily, effectively can perform welding.
Accompanying drawing explanation
Fig. 1 shows the fixture for substrate backflow according to the embodiment of the present invention.
Fig. 2 and Fig. 3 shows locking and the release of the squeeze unit of the fixture for substrate backflow according to the embodiment of the present invention.
Fig. 4 shows the flow chart of the method for substrate backflow according to the embodiment of the present invention.
Fig. 5 to Fig. 8 shows the method for substrate backflow according to the embodiment of the present invention.
Embodiment
Hereinafter, certain execution mode according to plate-type cooling device of the present invention is described in detail with reference to accompanying drawing.Be described with reference to the drawings in the present invention, will same reference number given to any identical or corresponding element, and the description to its redundancy can not be provided.
The term of such as " first " and " second " can only for distinguishing identical with other or the corresponding element of element, but said elements can not be confined to above-mentioned term.
When description element " couples " to another element, not only refer to the physics between these elements, directly contact, also should comprise another element and put into each possibility contacted with another described element with these elements between these elements.
Fig. 1 shows the fixture for substrate backflow according to the embodiment of the present invention, and Fig. 2 and Fig. 3 shows locking and the release of the squeeze unit of the fixture for substrate backflow according to the embodiment of the present invention.
With reference to figure 1, the fixture 100 for substrate backflow according to the embodiment of the present invention can comprise the first plate 110, squeeze unit 120, lock cell 130, second plate 140 and coupler member 150.
First plate 110 is arranged in the plate above substrate 10.
Here, substrate 10 can comprise hole 13 and solder 14.Hole 13 can have electronic unit 11 and insert pin (lead) 12 wherein.Solder 14 can be formed on the lower surface of substrate 10 along the circumferential exterior in hole 13.Solder 14 can print on the substrate 10.Multiple electronic unit 11 with different size and height can be set.Be placed into reflux along with substrate 10 and heat in reflux, solder 14 can melt and engage with pin 12.
First plate 110 can have the first through hole 111 be formed in wherein.Multiple through hole 111 can be set, and can be arranged in parallel through hole 111 in the longitudinal direction of whole first plate 110 and broadwise.
First plate 110 can be formed to make its area of section be greater than the area of section of substrate 10.In addition, the first plate 110 can be made up of the metallic material of bag.
Squeeze unit 120 is inserted the first through hole 111 and can be extruded the end face of electronic unit 11 so that support electronic components 11 on the substrate 10.Multiple squeeze unit 120 can inserting multiple through hole 111 respectively can be set.Squeeze unit 120 can move up and down from the first plate 110.In this case, squeeze unit 120 can be guided by the first through hole 111.
Multiple electronic unit 11 size and highly different from each other time, multiple squeeze unit 120 can extrude multiple electronic unit 11 respectively.Therefore, highly how the no matter size and of electronic unit 11, on the substrate 10 can support electronic components 11.
When arranging multiple electronic unit 11 separably, some squeeze unit 120 can extrude the end face of electronic unit 11, and other squeeze unit 120 can extrude the upper surface of substrate 10.
Squeeze unit 120 can comprise pin component, and this pin component can be less than the area of section of electronic unit 11 for cylindrical shape and area of section.Squeeze unit 120 can have the scotch 121 being formed in its top.Scotch 121 can be greater than the head of the area of section of the first through hole 111 for area of section.Utilize scotch 121, even if squeeze unit 120 moves down along the first through hole 111, squeeze unit 120 also can not depart from the first plate 110.
Lock cell 130 can be locked or unlock multiple squeeze unit 120 and be moved by the up/down of the first through hole 111.When squeeze unit 120 extrude electronic unit 11 end face in case support electronic components 11, the up/down that lock cell 130 can lock squeeze unit 120 moves so that the state of fixed press unit 120.
Meanwhile, when (such as) reflux technique terminates, the up/down that lock cell 130 can unlock squeeze unit 120 moves.In this case, squeeze unit 120 can freely move up and down.
Utilize lock cell 130, the reliability increasing squeeze unit 120 support electronic components 11 becomes possibility.
Referring to figs. 2 and 3, lock cell 130 can comprise board member 131, lockhole 132 and regulon 133.
Board member 131 can be arranged in the face of the first plate 110 and can be coupled to the first plate 110 with moving horizontally.Board member 131 and the first plate 110 can be arranged in each other and can be fixed by the post of both take-through plate component 131 and the first plate 110.Post can be positioned at the edge side of board member 131 and the first plate 110.
Board member 131 can be arranged to and be separated with the first plate 110, and in this case, cylinder can have formation on its outer surface for the projection of supporting bracket component 131.By the board member 131 be separated, when board member 131 moves horizontally, the friction reduced between board member 131 and the first plate 110 becomes possibility.
Board member 131 can be formed as identical with the thickness of the first plate 110, and can be made up of the material identical with the first plate 110.
Can form multiple lockhole 132 in board member 131, and multiple lockhole is corresponding with the position of multiple first through hole 111 respectively.Here, term " correspondence " refers to and can be communicated with up and down in the mode of linear line.Because lockhole 132 corresponds to the first through hole 111, squeeze unit 120 can insert lockhole 132 and the first through hole 111.
Lockhole 132 can be formed the area of section that area of section is greater than squeeze unit 120.When squeeze unit 120 is pin components of cylindrical shape, the diameter of lockhole 132 can be greater than the diameter of pin component.
When board member 131 moves horizontally, the size in the region that lockhole 132 and the first through hole 111 overlap each other changes.In fig. 2, the size in region that lockhole 132 and the first through hole 111 overlap each other is greater than the size in the region that lockhole 132 in Fig. 3 and the first through hole 111 overlap each other.
Such as, as shown in Figure 2, when the diameter that the diameter of the squeeze unit 120 of cylindrical shape is A and lockhole 132 and the first through hole 111 is B, the region that lockhole 132 and the first through hole 111 overlap each other becomes B in fig. 2.Meanwhile, in figure 3, after board member 131 has moved horizontally, A has been down in the region that lockhole 132 and the first through hole 111 overlap each other.
The change of the size that can overlap each other according to lockhole 132 and the first through hole 111 carrys out the locking and unlocking squeeze unit 120.That is, in fig. 2, unlock squeeze unit 120 and freely move up and down to make it, and lock moving up and down of squeeze unit 120 in figure 3.
The regulon 133 moved horizontally of adjustable plate component 131 can be coupled to board member 131, the specifically side of board member 131.
When the area of section of lockhole 132 is greater than the area of section of squeeze unit 120, regulon 133 can move horizontally board member 131 with the difference between the latitude length of the area of section of the latitude length of the area of section of lockhole 132 and squeeze unit 120.
In other words, when squeeze unit 120 is pin components of cylindrical shape, regulon 133 can move horizontally board member 131 with the difference between the diameter of lockhole 132 and the diameter of squeeze unit 120.Such as, referring to figs. 2 and 3, board member 131 can move horizontally (B – A) by regulon 133.
Meanwhile, regulon 133 can comprise main body 134 and adjustment screw 135.
Main body 134 is coupled to the first plate 110 and has the adjustment screw 135 be contained in wherein.Adjustment screw 135 is coupled to board member 131 and can moves horizontally board member 131 by rotation.
Second plate 140 is between the first plate 110 and substrate 10 thus in the face of the first plate 110.Second plate 140 can have the second through hole 141 be formed in wherein.Second through hole 141 is formed corresponding with the first through hole 111, and here, term " correspondence " refers to and can be communicated with up and down in the mode of linear line.
By introducing the second plate 140, squeeze unit can be inserted the second through hole 141 and the first through hole 111 and can be guided by the second through hole 141 and the first through hole 111 when squeeze unit moves up and down.Therefore, the second plate 140 can improve the reliability of the mobile route of squeeze unit.
Second plate 140 can be arranged to and be separated with the first plate 110.Be separated with the first plate 110 because the second plate 140 is arranged to, for guiding the hole of squeeze unit 120 elongated, and therefore squeeze unit 120 can move up and down in more stable mode.
In addition, when lock cell 130 comprises board member 131, board member 131 can between the first plate 110 and the second plate 140.Here, the first plate, board member 131 and the second plate 140 can be connected to each other by a post.In addition, board member 131 can move horizontally between the first plate 110 and the second plate 140.
When the regulon 133 of lock cell 130 comprises main body 134, to couple the first plate 110 and the second plate 140 on the side surface that main body 134 can be formed in the first plate 110 and the second plate 140.First plate 110 and the second plate 140 are fixed, and the region of the first through hole 111 and the second through hole 141 overlap does not change.
Coupler member 150 is the parts for substrate 10 being coupled to the first plate 110.Coupler member 150 can be clamp and can the both sides of supporting substrate 10.Coupler member 150 can be hinged to the first plate 110 to enclose the predetermined angular that pivots.
In addition, coupler member 150 can have be coupled to it elastic component 151 to improve the compact power between the first plate 110 and substrate 10.
When coupler member 150 fixing base 10, squeeze unit 120 can supporting substrate 10 more easily.In addition, when electronic unit 11 supports on the substrate 10 ideally, moving or putting upside down substrate 10 becomes possibility.
When put upside down when electronic unit 11 supports on the substrate 10 ideally substrate 10 become possible, substrate 10 can be inputted reflux when substrate 10 is put upside down, and the solder 14 be therefore formed on the lower surface of substrate 10 can melt and engage with pin 12 in more firm mode.
First plate 110 can comprise the cover plate 160 that is formed in above the first plate 110 to cover the top of squeeze unit 120.Cover plate 160 can be arranged in the face of the first plate 110 and couple with the first plate 110.By introducing cover plate 160, squeeze unit 120 can not depart from the upside of the first plate 110.
When the first plate 110 comprises cover plate 160, coupler member 150 can be installed as and connect cover plate 160 and substrate 10.In this case, the space of cover plate 160 can more be effectively utilized.
As mentioned above, the fixture for substrate backflow according to the embodiment of the present invention can fix the electronic unit of various sizes easily, makes it possible to the reliability improving each electronic unit of welding.
Arrive this, describe the fixture for substrate backflow according to the embodiment of the present invention.Hereinafter, the method being used for substrate backflow according to the embodiment of the present invention will be described.
Fig. 4 shows the flow chart of the method for substrate backflow according to the embodiment of the present invention, and Fig. 5 to Fig. 8 shows the method for substrate backflow according to the embodiment of the present invention.
With reference to figure 4, the method for substrate backflow according to the embodiment of the present invention can comprise: arrange substrate 10(S110); Side arranges the first plate 110(S120 on the substrate 10); The up/down being locked squeeze unit 120 by lock cell 130 is moved (S130); Put upside down the first plate 110 and substrate 10(S140); Heated substrates 10(S150); And cooling base (S160).
With reference to figure 5, in the step (S110) that substrate 10 is set, be provided as the substrate 10 of reflow object.Substrate 10 has electronic unit 11 and inserts pin 12 wherein and have the solder 14 be formed in towards the outside of pin 12 on base lower surface.The description of substrate 10 is same as described above.
With reference to figure 6, be arranged in by the first plate 110 in the step (S120) above substrate 10, the first plate 110 is arranged in above substrate 10 and makes multiple squeeze unit 120 extrude the end face of electronic unit 11.First plate 110 can comprise multiple first through hole 111, and each through hole can make squeeze unit 120 insert wherein.Squeeze unit 120 can be guided by the first through hole 111 and move up and down.
Squeeze unit 120 can comprise pin component.In addition, the area of section of the first through hole 111 can be greater than the area of section of pin component.
Above substrate 10, arrange that the step (S120) of the first plate 110 can comprise the first plate 110 and substrate 10 are coupled by coupler member 150, coupler member can be clamp for the first plate 110 and substrate 10 being coupled and can the both ends of supporting substrate 10.
As shown in Figure 6, the first plate 110 can have the cover plate 160 of the side of being formed thereon, and coupler member 150 can be formed on cover plate 160.In this case, cover plate 160 and substrate 10 can couple by coupler member 150.
With reference to figure 7, in the step (S130) of up/down movement being locked squeeze unit 120 by lock cell 130, lock cell 130 locks the up/down of multiple squeeze unit 120 in the first through hole 111 and moves so that support electronic components 11.
Lock cell 130 can comprise board member 131, lockhole 132 and regulon 133.Board member 131 is coupled to the first plate 110 so that in the face of the first plate 110.Lockhole 132 is formed in board member 131 so that corresponding with the position of the first through hole 111.Regulon 133 is coupled to board member 131 so that the moving horizontally of adjustable plate component 131.
When lock cell 130 comprise board member 131, lockhole 132 and regulon 133, in the step (S130) of up/down movement being locked squeeze unit 120 by lock cell 130, regulon 133 can move horizontally board member 131 and first through hole 111 and lockhole 132 are misplaced mutually.That is, along with regulon 133 moves horizontally board member 131, the region of the first through hole 111 and lockhole 132 overlap narrows.
In this case, board member 131 can be moved horizontally the difference between the latitude length of area of section of similar lockhole 132 and the latitude length of the area of section of squeeze unit 120 by regulon 133.
With reference to figure 8, in the step (S140) putting upside down the first plate 110 and substrate 10, the first plate 110 and substrate 10 are reversed and electronic unit 11 are placed on above the squeeze unit 120 of locking.In this case, the solder 14 be formed on the lower surface of substrate 10 become be placed on substrate 10 upper surface on.Therefore, when solder 14 is placed on the upper surface of substrate 10, by substrate 10 is put into reflux, even if solder 14 melts, also can prevent solder 14 from departing from substrate 10.Therefore, the reliability of welding can be improved.
In the step (S150) of heated substrates 10, substrate 10 to be inputted in reflux and heating makes solder 14 melt.The step (S150) of heated substrates 10 can comprise; By pre-hot substrate 10 to keep below the temperature of target temperature; And temperature is increased to target temperature.
In the step (S160) of cooling base 10, carry out solidified solder 14 by cooling rapidly the substrate 10 with the solder 14 of fusing.
As mentioned above, utilize the method for substrate backflow according to the embodiment of the present invention, processing backflow during firm fixing of the electronic unit on substrate, and therefore can improve the reliability of welding.
Although to being described herein some embodiments of the present invention, but for it will be appreciated by those skilled in the art that, when not departing from technical conceive of the present invention, technical conceive of the present invention should be defined by the following claims, and can carry out various amendment and change by supplementing, revising, delete and/or increase element to the present invention.Be also to be understood that this modification and/or change and be also included in the scope of protection of present invention.
Claims (20)
1., for a fixture for substrate backflow, comprising:
First plate, is placed on the surface comprising hole and solder, and wherein, described hole has pin, and electronic unit inserts described pin, and described solder is formed along the circumferential exterior in described hole;
Multiple first through hole, is formed in described first plate;
Multiple squeeze unit, is configured to the end face extruding described electronic unit by inserting described multiple first through hole respectively, to support described electronic unit; And
Lock cell, is configured to locking or unlocks the up/down of described multiple squeeze unit in described first through hole move.
2. the fixture for substrate backflow according to claim 1, also comprise: the second plate, described second plate is coupled to described first plate with between described first plate and described substrate, and described second plate has the second through hole of described first through hole of corresponding to be formed in wherein passes to make described squeeze unit.
3. the fixture for substrate backflow according to claim 2, wherein, described second plate is arranged to and is separated with described first plate.
4. the fixture for substrate backflow according to claim 1, wherein, described squeeze unit comprises pin component.
5. the fixture for substrate backflow according to claim 4, wherein, described squeeze unit has the scotch being formed in described squeeze unit top.
6. the fixture for substrate backflow according to claim 1, wherein, described lock cell comprises:
Board member, is arranged in the face of described first plate and can be coupled to described first plate with moving horizontally;
Lockhole, is formed in described board member to correspond to the position of described first through hole; And
Regulon, is coupled to described board member to regulate moving horizontally of described board member.
7. the fixture for substrate backflow according to claim 6, wherein, the area of section of described lockhole is greater than the area of section of described squeeze unit.
8. the fixture for substrate backflow according to claim 7, wherein, described regulon is configured to the difference between the latitude length of the latitude length of the described area of section described board member being moved horizontally described lockhole and the described area of section of described squeeze unit.
9. the fixture for substrate backflow according to claim 6, wherein, described board member is arranged to and is separated with described first plate.
10. the fixture for substrate backflow according to claim 1, also comprises: coupler member, is configured to couple described first plate and described substrate.
11. fixtures for substrate backflow according to claim 10, wherein, described first plate comprises the cover plate coupling the top covering described squeeze unit with described first plate, and
Wherein, described coupler member is configured to couple described cover plate and described substrate.
12. 1 kinds, for the method for substrate backflow, comprising:
Arrange the substrate comprising solder, described solder is formed along the circumferential exterior in hole, and described hole has electronic unit insertion pin wherein;
Side arranges the first plate on the substrate, and described first plate comprises multiple first through hole, and multiple squeeze unit inserts described multiple first through hole respectively, makes described multiple squeeze unit extrude the end face of described electronic unit;
The up/down of multiple squeeze unit in described through hole described in locking unit locks is made to move to support described electronic unit; And
Heat described substrate make described solder fusing and engage with described pin.
13. methods for substrate backflow according to claim 12, wherein, be arranged in described surface by described first plate, described squeeze unit is inserted in the second through hole in the second plate between described first plate and described substrate.
14. methods for substrate backflow according to claim 12, wherein, described squeeze unit comprises pin component.
15. methods for substrate backflow according to claim 12, wherein, described lock cell comprises:
Board member, is coupled to described first plate so that in the face of described first plate;
Lockhole, is formed in described board member with corresponding with the position of described first through hole; And
Regulon, is coupled to described board member to regulate moving horizontally of described board member, and
Wherein, make during described in described locking unit locks, the up/down of multiple squeeze unit in described through hole moves, described regulon is configured to move horizontally described board member and misplaces mutually to make described first through hole and described lockhole.
16. methods for substrate backflow according to claim 15, wherein, the area of section of described lockhole is greater than the area of section of described squeeze unit.
17. methods for substrate backflow according to claim 16, wherein, described regulon is configured to the difference between the latitude length of the latitude length of the described area of section described board member being moved horizontally described lockhole and the described area of section of described squeeze unit.
18. methods for substrate backflow according to claim 12, also comprise, to make described in described locking unit locks after the up/down of multiple squeeze unit in described through hole moves, putting upside down described first plate and described substrate makes described electronic unit be placed on above the described squeeze unit of locking.
19. methods for substrate backflow according to claim 12, wherein, side arranges that described first plate comprises on the substrate: couple described first plate and described substrate by coupler member.
20. methods for substrate backflow according to claim 12, also comprise, and after the described substrate of heating, cool described substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20130135490 | 2013-11-08 | ||
| KR10-2013-0135490 | 2013-11-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104640430A true CN104640430A (en) | 2015-05-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410048014.0A Pending CN104640430A (en) | 2013-11-08 | 2014-02-11 | Substrate backflow fixture and backflow method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104640430A (en) |
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| CN106211629A (en) * | 2016-08-30 | 2016-12-07 | 无锡市同步电子制造有限公司 | The method carrying out high-temperature soldering in printed circuit board (PCB) processing |
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