CN104626151B - A kind of mechanical hand wafer centring means and method - Google Patents
A kind of mechanical hand wafer centring means and method Download PDFInfo
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Abstract
The present invention provides a kind of mechanical hand wafer centring means and method, and this device includes: High-speed I/O Acquisition Circuit, is used for gathering AWC sensor signal, generates High-speed I/O signal；FPGA module, for by High-speed I/O holding wire with become serial interrupt signal, export to embedded CPU module；This FPGA module is additionally operable to convert the address date of embedded CPU module to control signal to driver and exports, to correct the position of mechanical hand；Embedded CPU module, is used for receiving High-speed I/O signal and latching axis servomotor positional value, and calculates practical center and the off normal at teaching center in robotic transfer wafer process according to axis servomotor positional value, exports control instruction by address date.Mechanical hand wafer centring means provided by the invention and method integration many groups High-speed I/O signal acquisition circuit, compact conformation, trouble point are few, Acquisition Circuit flexibly configurable.
Description
Technical field
The invention belongs to Mechanical course field, be specifically related to a kind of mechanical hand wafer centring means and method.
Background technology
In the manufacturing process of quasiconductor, between each chamber or between station, mechanical hand is generally used to complete the transmission of wafer (wafer refers to the silicon wafer used by silicon semiconductor production of integrated circuits, owing to it is generally circular in shape, therefore is called wafer).In wafer transmission system, the generation of the objective factor such as off normal or wafer breakage during for avoiding picking and placeing, improves the accuracy that wafer picks and places, it is necessary to design and use AWC (ActiveWaferCentering) function to carry out detecting and correct.AWC wafer self-centering function, for the off normal situation of practical center in robotic transfer wafer process Yu teaching center, automatically corrects in the motor process of mechanical hand, it is ensured that wafer is accurately transported to appointment position.
AWC function uses one group of (2) sensor, is positioned over the station direction (between radial alignment and the crystal round fringes of motion) needing detection, and ensures that the line between two sensors is radially vertical with station.Mechanical hand is in the process performing GOTO instruction (GOTO instruction is for controlling the stretching of mechanical hand), when sensor has detected that wafer comes in and goes out, data can be gathered at once and preserve, calculate the deviation in the wafer center of circle and manipulator finger center according to 4 secondary data collected.According to this deviation calculated, while mechanical hand stretches and puts in place, this bias vector is compensated process by R axle (rotating shaft of mechanical hand) and T axle (telescopic shaft of mechanical hand) automatically, realize correction, until GOTO order fulfillment after deviation elimination, to ensure that wafer is sent to aiming station accurately.
In current semicon industry, the mechanical hand of application is all the high speed acquisition function being completed sensor in AWC by motion control card or driver.This function needs to use the High-speed I/O signal acquisition circuit of motion control card or driver, is latched the positional value of current robot axis servomotor by High-speed I/O circuit when the edge of wafer swept to by sensor.And in actually used, mechanical hand needs to transmit wafer at multiple stations, this is accomplished by mechanical hand can gather many group High-speed I/O signals, and the mechanical hand of some special construction needs multi-axial Simultaneous to gather High-speed I/O signal.And with it paradoxically, motion control card and driver can only gather at most two-way High-speed I/O signal, it is impossible to gather and organize sensor signal more.For solving this problem, common practices of the prior art is to increase an interface board with line and function, is linked on interface board by High-speed I/O signal, interface board export and signal is in motion control card or driver, then do collection latch process.This mode needs to increase interface board to the interconnection cable of motion control card or driver and adapter, and this results in robotic failure of the prior art point and increases, the problem that structure disperses is unfavorable for maintenance.Meanwhile, this mode still cannot solve its problem not supporting twin shaft or multi-axial Simultaneous to trigger and latch.
Summary of the invention
For above-mentioned technical problem of the prior art, the present invention provides a kind of mechanical hand wafer centring means and method, this mechanical hand wafer centring means and method integration many groups High-speed I/O signal acquisition circuit, its compact conformation, trouble point are less, Acquisition Circuit flexibly configurable, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
For solving the technical problem existed in above-mentioned prior art, the present invention provides a kind of mechanical hand wafer centring means, including:
High-speed I/O Acquisition Circuit, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal；
On-site programmable gate array FPGA module, for High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is gathered with becomes serial interrupt signal, output, to embedded CPU module, making described embedded CPU module have no progeny in responding and latching current servo shaft position value；This FPGA module is additionally operable to convert the address date of described embedded CPU module to control signal to driver and exports, to correct the position of mechanical hand；
Embedded CPU module, for receiving the High-speed I/O signal of described FPGA module output and latching axis servomotor positional value, and calculate in robotic transfer wafer process after the off normal situation of practical center and teaching center according to axis servomotor positional value, export control instruction by address date.
Wherein, this device also includes: EEPROM module, for storing AWC sensor group number information, and be connected with embedded CPU module by universal serial bus, after each mechanical hand wafer centring means powers on, the AWC sensor group number information of storage in EEPROM module is read, to predict the quantity that AWC sensor accesses for described embedded CPU module.
Wherein, this device also includes: bus communication circuit, mutual for the information between described mechanical hand wafer centring means and robot controller；Described bus communication circuit adopts open architecture；Described open architecture includes: Canopen, EhterCAT；
Driver interface circuit, mutual for the information between FPGA module and driver.
Wherein, this device also includes: power circuit, is used for controlling mechanical hand wafer centring means power supply, produces different voltage, the modules of supply mechanical hand wafer centring means.
Wherein, described FPGA module is connected with embedded CPU module by address date line.
Wherein, described control signal includes: read code device signal, driver is sent position command, speed command or torque instruction.
Wherein, described High-speed I/O Acquisition Circuit at least possesses 8 groups of signal input interfaces.
Wherein, the AWC sensor group number information in described EEPROM module can be revised by external communication bus online.
Accordingly, the present invention also provides for a kind of mechanical hand wafer spotting device, including:
High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal；
The High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is generated by FPGA module with become serial interrupt signal, output to embedded CPU module；
Embedded CPU module receives described High-speed I/O signal, latches axis servomotor positional value, and calculates in robotic transfer wafer process after the off normal situation of practical center and teaching center according to axis servomotor positional value, exports control instruction by address date；
FPGA module converts the address date of described embedded CPU module to control signal to driver and exports, to correct the position of mechanical hand.
Wherein, described High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, also include before generating High-speed I/O signal: this mechanical hand wafer centring means is started shooting, embedded CPU module reads the AWC sensor group number information of storage in EEPROM module after powering on, to predict the quantity that AWC sensor accesses.
Mechanical hand wafer centring means provided by the invention and method, integrated many group High-speed I/O signal acquisition circuits, its compact conformation, trouble point are less, Acquisition Circuit flexibly configurable, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
Accompanying drawing explanation
In order to be illustrated more clearly that the technical scheme in the embodiment of the present invention, below the accompanying drawing used required during embodiment is described is briefly introduced, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the premise not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is mechanical hand wafer centring means first embodiment structural representation provided by the invention；
Fig. 2 is mechanical hand wafer centring means the second example structure schematic diagram provided by the invention；
Fig. 3 is mechanical hand wafer spotting device embodiment schematic flow sheet provided by the invention.
Detailed description of the invention
In order to make the object, technical solutions and advantages of the present invention clearly, below in conjunction with accompanying drawing, the present invention is described in further detail, it is clear that described embodiment is only a part of embodiment of the present invention, rather than whole embodiments.Based on the embodiment in the present invention, all other embodiments that those of ordinary skill in the art obtain under not making creative work premise, broadly fall into the scope of protection of the invention.
It is mechanical hand wafer centring means first embodiment structural representation provided by the invention referring to Fig. 1.As it can be seen, this mechanical hand wafer centring means includes:
High-speed I/O Acquisition Circuit 1, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal；Preferably, described High-speed I/O Acquisition Circuit 1 at least possesses 8 groups of signal input interfaces.
Field programmable gate array (FPGA, Field-ProgrammableGateArray) module 2, for High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is gathered with become serial interrupt signal, output is to embedded CPU module 3, and make to have no progeny in the response of described embedded CPU module latch current servo shaft position value；This FPGA module 2 is additionally operable to convert the address date of described embedded CPU module 3 to control signal to driver and exports, to correct the position of mechanical hand.
Embedded CPU module 3, for receiving the High-speed I/O signal of described FPGA module 2 output and latching axis servomotor positional value, and calculate in robotic transfer wafer process after the off normal situation of practical center and teaching center according to axis servomotor positional value, export control instruction by address date.
Mechanical hand wafer centring means provided by the invention, is possible not only to integrated many group High-speed I/O signal acquisition circuits, and its compact conformation, trouble point are less, Acquisition Circuit flexibly configurable, and supports that twin shaft or multi-axial Simultaneous trigger and latch application.
Referring to Fig. 2, for mechanical hand wafer centring means the second example structure schematic diagram provided by the invention.In the present embodiment, the function of the structure of this mechanical hand wafer centring means and all parts be will be described in greater detail.As in figure 2 it is shown, this mechanical hand wafer centring means includes:
High-speed I/O Acquisition Circuit 1, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal；Preferably, described High-speed I/O Acquisition Circuit 1 at least possesses 8 groups of signal input interfaces.
Field programmable gate array (FPGA, Field-ProgrammableGateArray) module 2, for High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is gathered with become serial interrupt signal, output is to embedded CPU module 3, and make to have no progeny in the response of described embedded CPU module latch current servo shaft position value；This FPGA module 2 is additionally operable to convert the address date of described embedded CPU module 3 to control signal to driver and exports, to correct the position of mechanical hand.More specifically, described control signal includes: read code device signal, driver is sent position command, speed command or torque instruction.Based on this, it will be appreciated by persons skilled in the art that the mechanical hand integrated motor control of wafer centring means that the embodiment of the present invention provides and the hardware configuration organizing High-speed I/O signals collecting more.
Embedded CPU module 3, for receiving the High-speed I/O signal of described FPGA module 2 output and latching axis servomotor positional value, and calculate in robotic transfer wafer process after the off normal situation of practical center and teaching center according to axis servomotor positional value, export control instruction by address date.Concrete, described FPGA module is connected with embedded CPU module by address date line.
Bus communication circuit 4, mutual for the information between described mechanical hand wafer centring means and robot controller；More specifically, described bus communication circuit adopts open architecture, for instance Canopen, EhterCAT etc..
Driver interface circuit 5, mutual for the information between FPGA module 2 and driver.It will be appreciated by persons skilled in the art that in various embodiments of the present invention, described driver includes motion control card and/or servo-driver.
Preferably, the mechanical hand wafer centring means that the embodiment of the present invention provides also includes EEPROM module 6.EEPROM module 6 is used for storing AWC sensor group number information, and be connected with embedded CPU module 3 by universal serial bus, after each mechanical hand wafer centring means powers on, the AWC sensor group number information of storage in EEPROM module 6 is read, to predict the quantity that AWC sensor accesses for described embedded CPU module 3.Further, the AWC sensor group number information in described EEPROM module 6 can be revised by external communication bus online.Based on this, it will be appreciated by persons skilled in the art that mechanical hand wafer centring means that the embodiment of the present invention provides can Configuration Online AWC sensor group number flexibly.
It will be appreciated by persons skilled in the art that the mechanical hand wafer centring means that the embodiment of the present invention provides also includes power circuit 7, be used for controlling mechanical hand wafer centring means power supply, produce different voltage, the modules of supply mechanical hand wafer centring means.
Mechanical hand wafer centring means provided by the invention, is possible not only to integrated many group High-speed I/O signal acquisition circuits, and its compact conformation, trouble point are less, Acquisition Circuit flexibly configurable, and supports that twin shaft or multi-axial Simultaneous trigger and latch application.
In order to make the public be better understood from technical scheme, the mechanical hand wafer spotting device flow process that existing detailed description is capable of based on the mechanical hand wafer centring means that the present invention embodiment provides.Referring to Fig. 3, for mechanical hand wafer spotting device embodiment schematic flow sheet provided by the invention.As it can be seen, this mechanical hand wafer spotting device includes:
Step S101, High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal；
Step S102, the High-speed I/O holding wire that described High-speed I/O Acquisition Circuit is generated by FPGA module with become serial interrupt signal, output to embedded CPU module；
Step S103, embedded CPU module receives described High-speed I/O signal, latches axis servomotor positional value；
Step S104, embedded CPU module calculates in robotic transfer wafer process after the off normal situation of practical center and teaching center according to axis servomotor positional value, exports control instruction by address date；
Step S105, FPGA module converts the address date of described embedded CPU module to control signal to driver and exports, to correct the position of mechanical hand.
Preferably, also including step S100 before step S101, this mechanical hand wafer centring means is started shooting, and embedded CPU module reads the AWC sensor group number information of storage in EEPROM module after powering on, to predict the quantity that AWC sensor accesses.
To sum up, mechanical hand wafer centring means provided by the invention and method, it is possible not only to integrated many group High-speed I/O signal acquisition circuits, and its compact conformation, trouble point are less, Acquisition Circuit flexibly configurable, and support that twin shaft or multi-axial Simultaneous trigger and latch application.
Although preferred embodiments of the present invention have been described, but those skilled in the art are once know basic creative concept, then these embodiments can be made other change and amendment.So, claims are intended to be construed to include preferred embodiment and fall into all changes and the amendment of the scope of the invention.
Obviously, the present invention can be carried out various change and modification without deviating from the spirit and scope of the present invention by those skilled in the art.So, if these amendments of the present invention and modification belong within the scope of the claims in the present invention and equivalent technologies thereof, then the present invention is also intended to comprise these change and modification.
Claims (10)
1. a mechanical hand wafer centring means, it is characterised in that including:
High-speed I/O Acquisition Circuit, for gathering AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal；
On-site programmable gate array FPGA module, for High-speed I/O signal that described High-speed I/O Acquisition Circuit is gathered with becomes serial interrupt signal, output, to embedded CPU module, making described embedded CPU module have no progeny in responding and latching current servo shaft position value；This FPGA module is additionally operable to convert the address date of described embedded CPU module to control signal to driver and exports, to correct the position of mechanical hand；
Embedded CPU module, for receiving the High-speed I/O signal of described FPGA module output and latching axis servomotor positional value, and calculate in robotic transfer wafer process after the off normal situation of practical center and teaching center according to axis servomotor positional value, export control instruction by address date.
2. mechanical hand wafer centring means as claimed in claim 1, it is characterised in that this device also includes:
EEPROM module, for storing AWC sensor group number information, and be connected with embedded CPU module by universal serial bus, after each mechanical hand wafer centring means powers on, the AWC sensor group number information of storage in EEPROM module is read, to predict the quantity that AWC sensor accesses for described embedded CPU module.
3. mechanical hand wafer centring means as claimed in claim 1, it is characterised in that this device also includes: bus communication circuit, mutual for the information between described mechanical hand wafer centring means and robot controller；Described bus communication circuit adopts open architecture；Described open architecture includes: Canopen, EhterCAT；
Driver interface circuit, mutual for the information between FPGA module and driver.
4. mechanical hand wafer centring means as claimed in claim 1, it is characterised in that this device also includes: power circuit, is used for controlling mechanical hand wafer centring means power supply, produces different voltage, the modules of supply mechanical hand wafer centring means.
5. the mechanical hand wafer centring means as according to any one of Claims 1-4, it is characterised in that described FPGA module is connected with embedded CPU module by address date line.
6. the mechanical hand wafer centring means as according to any one of Claims 1-4, it is characterised in that described control signal includes: read code device signal, driver is sent position command, speed command or torque instruction.
7. the mechanical hand wafer centring means as according to any one of Claims 1-4, it is characterised in that described High-speed I/O Acquisition Circuit at least possesses 8 groups of signal input interfaces.
8. mechanical hand wafer centring means as claimed in claim 2, it is characterised in that the AWC sensor group number information in described EEPROM module can be revised by external communication bus online.
9. a mechanical hand wafer spotting device, it is characterised in that including:
High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, generates High-speed I/O signal；
The High-speed I/O signal that described High-speed I/O Acquisition Circuit is generated by FPGA module with become serial interrupt signal, output to embedded CPU module；
Embedded CPU module receives described High-speed I/O signal, latches axis servomotor positional value, and calculates in robotic transfer wafer process after the off normal situation of practical center and teaching center according to axis servomotor positional value, exports control instruction by address date；
FPGA module converts the address date of described embedded CPU module to control signal to driver and exports, to correct the position of mechanical hand.
10. mechanical hand wafer spotting device as claimed in claim 9, it is characterised in that described High-speed I/O Acquisition Circuit gathers AWC sensor signal by high-speed isolated type photoelectrical coupler, also includes before generating High-speed I/O signal:
Embedded CPU module reads the AWC sensor group number information of storage in EEPROM module after powering on, to predict the quantity that AWC sensor accesses.
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106737655A (en) * | 2015-11-20 | 2017-05-31 | 沈阳新松机器人自动化股份有限公司 | A kind of configurable manipulator wafer centring means |
| CN106783712B (en) * | 2015-11-24 | 2019-07-02 | 沈阳新松机器人自动化股份有限公司 | The method of dynamic wafer centre deviation position is verified in AWC system |
| US10910249B2 (en) * | 2017-11-13 | 2021-02-02 | Taiwan Semiconductor Manufacturing Co., Ltd. | Systems and methods for automated wafer handling |
| CN108581239B (en) * | 2018-04-10 | 2020-03-20 | 上海柏楚电子科技股份有限公司 | Method for measuring offset and compensating cutter path in real time in square tube laser cutting |
| CN110091340B (en) * | 2019-05-07 | 2020-10-20 | 芯导精密(北京)设备有限公司 | Wafer picking and placing manipulator |
| CN112992746B (en) * | 2021-01-31 | 2022-03-11 | 江苏亚电科技有限公司 | Positioning device and positioning method for conveying mechanism of wafer cleaning equipment |
| CN115112013B (en) * | 2021-05-07 | 2023-03-28 | 沈阳新松机器人自动化股份有限公司 | Sensor-based FPD manipulator dynamic glass deviation correction method |
| CN115167198B (en) * | 2022-06-21 | 2023-03-21 | 沈阳新松机器人自动化股份有限公司 | Wafer deviation rectifying system and method of double-end mechanical arm |
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